Abstract: A system for wrapping a material around a bale in a baler includes a feed system to direct the material through a feed path. A knife mechanism with a fixed knife and a counter-knife alternately cuts the material, and moves out of the feed path for feed of the material. The feed system includes a roll element configured to direct the material between the fixed knife and the counter-knife when the counter-knife is moved out of the feed path. A cylindrical brush rotates freely and is disposed between the roll element and the knife mechanism, the brush having a cylindrical shape. The brush is configured to remove debris when rotated.

Abstract: A blasting system includes a pressure vessel, water pump, blast circuit, motor, orifice valve, and controller. The pressure vessel is configured to contain a pressurized blast media slurry. The water pump pumps water from a water supply to the pressure vessel. The blast circuit delivers the pressurized blast media slurry received from the pressure vessel. The motor drives the water pump. The orifice valve regulates a rate of flow of the blast media slurry to the blast circuit. The controller provides control commands to the water pump or the orifice valve based on a blast media flow rate set point and at least one sensed operating parameter.

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

Abstract: A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe.

Abstract: The present invention provides a surface processing system for a work piece in the mechanical technical field. The system comprises at least one group of polishing units. A manipulator and several polishers with different polishing precisions are provided on the polishing units. The polishers are arranged around the manipulator in turn. The work piece could be moved by the manipulator between the processing center and the polishing units. The machined work piece is loaded by the manipulator for one time when the manipulator is located at the processing center. When the manipulator is located at the polishing units, the manipulator keeps holding the work piece and transfers the work piece in a preset sequence to each polisher corresponding to the polishing unit where the manipulator is located. The surface of work pieces having different wall thicknesses and complex surfaces could be processed in a large batch with a high efficiency.

Abstract: According to one embodiment, a wafer processing device includes a processed number counting unit that counts a number of processed wafers, and a maintenance post-processing unit that executes a dummy lot process and a QC lot process after a maintenance process. A wafer preparation device prepares the dummy lot and the QC lot, when a first processed number is counted by the processed number counting unit. When a second processed number is counted by the processed number counting unit, a carrier device carries the dummy lot and the QC lot to the wafer processing device simultaneous with the maintenance process, before the maintenance process is completed.

Abstract: An apparatus including a first spindle group for chucking a first gear, whereby the first gear is mountable on the first spindle group so that it is rotatable, and a second spindle group for chucking a second gear, whereby the second gear is mountable on the second spindle group so that it is rotatable. The apparatus further defining a first linear axis oriented to perform a first linear displacement of the first spindle group relative to the second spindle group; a second linear axis oriented to perform a second linear displacement of the first spindle group relative to the second spindle group; and at least one of a swivel axis oriented to perform pivoting of the first spindle group thereabout, and a swivel axis oriented to perform pivoting of the second spindle group thereabout.

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.

Abstract: A processing machine that combines the functions of mounting press and grinding for metallographic analysis and includes a main frame at least one shaft and a drive device horizontally mounted on the main frame. A mounting press unit and a grind unit are mounted on the main frame. The grind unit including a base secured on the main frame and linearly corresponds to the mounting press unit and the corresponding line parallel to the at least one shaft. The grind unit includes a headstock slidably mounted on the at least one shaft the and reciprocally moved on the at least one shaft to selectively align with the base of the grind unit and the mounting press unit when the drive device is operated. A control unit disposed in the grind unit for controlling the mounting press unit and the grind unit.

Abstract: Provided is an abrasive apparatus with a drive shaft terminating with a working head, where this working head is removably attach to an abrasive attachment. Also provided is a drive system arranged to rotate the drive shaft, the drive system being connected to the drive shaft distal from the working head. The abrasive apparatus also includes at least one fluid supply conduit having an inlet and at least one outlet, with the at least one outlet being located adjacent to the working head of the drive shaft and arranged to deliver fluid to the abrasive attachment and/or an immediate working area.

Abstract: Method of removing backing adhesive from a carpet by steps: (1) sorting collected waste carpet into various types according to the surface fiber materials, such as, nylon, PP, PET and wool, (2) removing PP mesh base from the sorted carpet, and (3) passing the carpet without the PP mesh base through an active feeding device to a grinding wheel to remove the backing adhesive.

Abstract: The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.

Abstract: The present invention relates a grinding device 1 for the machine-based grinding of rotor blades 100 for wind energy systems, comprising a belt grinding unit 10 with a circulating grinding belt 12.

Abstract: A floor care apparatus is provided that utilizes at least one cylindrical pad to remove a floor finish. More specifically, a cylindrical pad having an abrasive surface is integrated onto a cylindrical scrubber brush or associated core or roller commonly used in the art. The main outwardly-facing surface of the pad contacts the floor to remove a predetermined amount of floor finish wherein generated debris is expelled away from the pad. After finish removal, a new layer of finish is applied to the floor. Thus, the need to remove all finish layers from a flooring surface is alleviated, which saves time and money.

Abstract: A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.

Abstract: This disclosure is directed to a chemical mechanical polisher and a polishing pad component thereof. The chemical mechanical polisher comprises a polishing platen having a flat surface, and the polishing platen comprises: an electromagnet disposed under the flat surface and configured to fix a polishing pad base on the flat surface; and a switch configured to control the power-on and power-off of the electromagnet. The polishing pad component comprises a polishing pad base, and the polishing pad base is formed of a ferromagnetic material. The chemical mechanical polisher of this disclosure and the polishing pad component thereof can make polishing pad replacement easy, and can also save polishing pads and thus reduce the consumable cost of the chemical mechanical polishing.

Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

Abstract: A multi-purpose machine for wall processing includes a base, a working member and a sliding device that drives the working member slide up and down relative to the base. The base includes a bottom board with moving wheels therebelow, a top board, and several parallel upright posts therebetween. The working member includes a cover and a roller set inside the cover. A built-in motor is set inside the roller. Wall processing tools are releasably fixed on the outside of the roller. A feeding hole is provided on the upper part of the cover and connected with a supply system or an absorbing system. The multi-purpose machine may perform operations including putty scraping, grinding and polishing, painting, cleaning and wall paper removing on the wall to replace human labor, thus realizing multiple purposes, reducing the labor strength, and improving the working efficiency.

Abstract: A scraper assembly for removing debris deposited on the surface of a porous work chuck during a wafer grinding process.

Abstract: An aspect of the present embodiment, there is provided a polishing apparatus, including a stage configured to be placed a semiconductor wafer thereon and to be rotated with the semiconductor wafer, a first polishing unit configured to contact a polishing tape to one portion of the semiconductor wafer on the stage, a second polishing unit configured to contact to other portion of the semiconductor wafer, the other portion being different from the one portion, a feed unit configured to feeding the polishing tape, and a recovery unit configured to recovery the polishing tape.

Abstract: System and method for CMP station cleanliness. An embodiment comprises a chemical mechanical polishing (CMP) station comprising a housing unit covering the various components of the CMP station. The CMP station further comprising various surfaces of a slurry arm shield, a slurry spray nozzle, a pad conditioning arm shield, a platen shield, a carrier head; and the interior, vertical surfaces of the housing unit. A cleaning liquid delivery system configured to dose a cleaning liquid on the various surfaces of the CMP station at set intervals.

Abstract: A complex geographical edge finishing system includes a fixture that holds an external part having a complex three-dimensional edge, a track disposed around the fixture and surrounding the edge of the part held in the fixture, and one or more finishing apparatuses that can sand, polish, buff, paint and/or apply coatings to the complex three-dimensional edge. The finishing apparatuses move about the track such that the three-dimensional edge of the part can be polished. The path of the track can substantially match, mimic or otherwise correspond to the path of the three-dimensional edge, such that special requirements for the finishing apparatuses are not required.

Abstract: A device and a method for machining, especially for polishing of an optical lens, are proposed, there being both a lens changing apparatus and also a separate tool changing apparatus. The lens changing apparatus is located between a working space and a conveyor apparatus for lenses and is pivotally mounted around a horizontal axis. The tool changing apparatus is located laterally next to the working space.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: There is disclosed a grinding apparatus for fabrication of a liquid crystal display device that is adaptive for improving the adsorption defect of a substrate onto a substrate stage. A grinding apparatus for fabrication of a liquid crystal display device disclosed in the present invention includes a plurality of substrate stage configured to make a linearly bi-directional movement; first and second grinding parts disposed in a series at an area to which the substrate stage moves; first to third aligning parts disposed at both ends of the first and second grinding parts and therebetween; and first and second cleaning parts disposed between the first and second grinding parts and the first and second aligning parts so as to clean the substrate stage.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.

Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

Abstract: A wine-glass polisher includes a base unit having a frustoconical cleaning chamber removably fastened thereto. A steam generator, an air heater and a vacuum pump are each in fluid communication with the cleaning chamber. A portion of the steam and hot air is directed to a channel formed in the chamber outer wall. An annular, U-shaped baffle surrounding the open top is in fluid communication with the channel for projecting the steam and hot air downwardly toward a wine glass below. A remaining portion of the heated air and steam is delivered directly to the upper surface of the base unit to clean and dry the interior surface of the glass. A controller first initiates a polishing cycle by activating the vacuum pump and steam generator. Upon expiration of the predetermined duration, the controller activates the blower to dry the exterior and interior surfaces of the glass.

Abstract: A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface with a profile determination device, optionally measuring the amount of material abraded from the surface and the gloss of the abraded surface, polishing a portion of the abraded surface with a polishing device at a controlled load for a pre-determined time and measuring the roughness and/or gloss of the polished surface followed by comparison thereof to the corresponding measurements of the unpolished, conditioned portion of the specimen surface. Polishing materials and devices may also be tested using the apparatus and method for polishing a standardized material.

Abstract: A surface cleaning system includes a retainer having a non-absorbing retaining surface and a surface cleaning compound retained at the retaining surface of the retainer and formed a cleaning surface overlapped thereat. The surface cleaning compound is a polymer having high density and high adhesive ability for removing imbedded contaminants from a working surface and grabbing the contaminants therefrom. The retainer is made of non-absorbing material that prevents lubricant and the surface cleaning compound being absorbed through the retainer.

Abstract: A polishing device is used for polishing at least one workpiece and includes a bracket, at least one loading device, a number of polishing tools having different roughness, a number of first driving devices, a supporting device, and a second driving device. The at least one loading device is positioned on the bracket, and is used for loading the at least one workpiece. Each first driving device is used for driving a respective one of the polishing tools to rotate to polish one workpiece. The supporting device is connected to the bracket, and is used for loading the polishing tools and the first driving devices. The second driving device is connected to the supporting devices, and is used for driving the supporting device to rotate to select a proper one of the polishing tools.

Abstract: A scraper and sandblaster assembly including a sandblaster and a scraper is presented. The sandblaster has a gun-like configuration, including a handle portion having a trigger mechanism; an air inlet portion operably coupled to the handle portion and to an air supply source; a nozzle portion distally disposed with respect to the handle portion; and a granular particle container mounted thereon for holding granular particles. The scraper is in cooperative engagement with the sandblaster, the scraper configured to operate concurrently or simultaneously with the sandblaster. The assembly also includes a debris collection cover encompassing at least a distal portion of the sandblaster and the scraper, the debris collection cover supported on the nozzle portion of the sandblaster.

Abstract: Embodiments of the invention generally relate to systems and methods to CMP substrates. The systems generally include a polishing system that has a polishing module and cleaning module. Each of the polishing module and the cleaning module can be partitioned into independently operable sections. Each section of the polishing module includes a platen, at least one load cup, and at least one polishing head. Each section of the cleaning module includes a cleaning station and one or more robots adapted to advance substrates through the cleaning station. The methods generally include polishing a plurality of substrates in a polishing system having independently operable sections. During the polishing of the substrates in one section, a second of the independently operable stations may be maintained or cleaned.

Abstract: A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of <150 ?m, especially <100 ?m, preferably <75 ?m, even more preferably <50 ?m, especially preferably <30 ?m, surface treatment of the flat side with means for reducing an especially structural intrinsic stress of the product wafer.

Abstract: Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

Abstract: An exemplary grinding device includes a fixed barrel, a rotatable barrel, a grinding plate, an actuator and a cleaning assembly. The fixed barrel defines a chamber and includes a number of inner sidewall substantially parallel to a central axis, each of which defines a holding groove for holding a workpiece. The rotatable barrel is received in the chamber and includes an outer side substantially parallel to the central axis and defines an installation groove. The grinding plate is installed in each of the installation grooves. The actuator is configured for driving the rotatable barrel to rotate and simultaneously move up and down in the first chamber, such that the grinding plates contact the workpieces and grind the workpieces. The cleaning assembly is situated under the fixed barrel for cleaning the workpieces.

Abstract: The dental model trimmer includes a wheel having an abrasive surface, a motor for rotating the wheel, and ultraviolet light source powerful enough to inactivate bacteria. The components are located in an enclosure that has an opening to permit access to the abrasive surface of the wheel. The light source is mounted within the enclosure to illuminate a section of the abrasive surface of the wheel that is spaced from the access opening. The enclosure includes wall means interposed between the light source and the access opening for preventing direct light emitted from the UV light source from exiting the access opening. The enclosure is provided with an interlock switch that will automatically turn off the light source when the enclosure is opened. The same switch can be used to deactivate the motor and a source of water provided to the abrasive surface, if desired.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.

Abstract: A device and method for secure check processing in a paper check scanning device that scans the identification encoding characters on the surface of a paper check, creating an electronically digitized record of the scanned physical identification indicators, transmitting the digitized record of the indicators to a verification unit, and awaiting validation and acceptance of the digitized record. The digitized record may be validated and accepted either through an electronic processing system or manually by human validation personnel. After the digitized record has been accepted the acceptance notification is sent to the check scanner. Upon receipt of the validation and acceptance of the digitized record of the paper check, the secure check scanner moves the paper check into position and the encoded identification characters on the paper check are altered by removing the area of the paper check containing the identification characters to render the paper check unscannable.

Abstract: A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid is supplied to a polishing liquid passage that is provided in a central portion of the polishing member, and the polishing liquid is supplied to the substrate surface by rotating the polishing member while filtering the polishing liquid by a foam member provided on an outer periphery of the polishing liquid passage. Aperture diameters of the foam member are larger on the side of the polishing liquid passage than on the outside of the polishing member.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: The polishing apparatus is capable of continuously varying pressure distribution in a boundary area between concentric press regions and uniformly polishing a work. The polishing apparatus comprises: a polishing head for holding a work; a polishing plate having a polishing face, on which a polishing pad is adhered; and a driving mechanism for relatively moving the polishing head with respect to the polishing plate.

Abstract: An apparatus for removing scales from metal wires including: a liquid container tank 12 through which the metal wires 10 pass, mixing nozzles 14 disposed to allow the metal wirings to pass through the liquid container tank for injecting a high-pressure liquid toward the metal wires 10; a high-pressure pump 16 for feeding the high-pressure liquid to the mixing nozzles 14; and cyclone separators 20 which are slurry feeders for feeding a slurry of the liquid with which an abrasive scavenging agent is mixed to the mixing nozzles 14. The mixing nozzles 14 inject the slurry of the abrasive scavenging agent together with the high-pressure liquid so that the abrasive scavenging agent bombards the scales on the surfaces of the metal wires 10 to remove the scales.

Abstract: A coating and cylindrical grinding apparatus includes a main body defining a cavity, a roller device, a liquid jetting device, a heating device, a cylindrical grinding device, and a support device received in the cavity. The roller device includes a number of rollers positioned along a first direction and is used for coating a work-piece. The liquid jetting device is mounted above the roller device for ejecting coating liquid to the roller device. The heating device heats the work-piece. The cylindrical grinding device includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device includes a support plate for supporting the work-piece, the support device is capable of carrying the work-piece to contact the rollers or the grinding wheel.

Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

Abstract: A multi-purpose machine for wall processing includes a base, a working member and a sliding device that drives the working member slide up and down relative to the base. The base includes a bottom board with moving wheels therebelow, a top board, and several parallel upright posts therebetween. The working member includes a cover and a roller set inside the cover. A built-in motor is set inside the roller. Wall processing tools are releasably fixed on the outside of the roller. A feeding hole is provided on the upper part of the cover and connected with a supply system or an absorbing system. The multi-purpose machine may perform operations including putty scraping, grinding and polishing, painting, cleaning and wall paper removing on the wall to replace human labour, thus realizing multiple purposes, reducing the labour strength, and improving the working efficiency.

Abstract: A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal.