Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

Abstract: A polishing pad, an apparatus for chemical mechanical polishing of semiconductor wafers and a method of making a device using the same are presented. The apparatus includes a first platform for mounting a semiconductor wafer; a second platform for mounting a polishing pad; a rotator for rotating the wafer against the polishing pad; and a diamond dresser for dressing the polishing pad. The polishing pad has a single groove of a width (w) surrounding the periphery of an undressed portion of the polishing pad thus eliminating contact of the undressed portion with the outer edge of the diamond dresser.

Abstract: A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.

Abstract: An ultrasonic trimming apparatus is composed of an articulated robot, a cutting apparatus, and a grindstone. The cutting apparatus is composed of an ultrasonic oscillator supported by the end portion of the robot, a cutter blade which is supported by the ultrasonic oscillator, and a workpiece securing portion which secures a workpiece. The grindstone is disposed within the movable range of the cutter blade driven by the robot and is placed in a position at which the cutter blade can pressure contact the cutter blade. The cutter blade is ultrasonically vibrated by the ultrasonic oscillator and is ground while being pressed against the grindstone by means of the articulated robot. The ultrasonic trimming apparatus efficiently cuts a sheet material composed of soft material such as plastic, fabric, or rubber, a composite material, or a material containing glass fiber even when the material has a three-dimensional shape.

Abstract: A truing and dressing machine for profiling an abrasive wheel. The truing and dressing machine includes a truing wheel assembly for positioning the truing wheel relative to an abrasive wheel mounted on an abrasive wheel spindle. The truing wheel assembly includes a truing wheel swivel located between a truing wheel spindle housing and a reciprocation slide that is attached to an infeed slide. An infeed slide swivel is located between the infeed slide and a bottom support swivel plate which is rotatably connected to a base plate. Utilization of both an infeed slide swivel and a truing wheel swivel allows for dressing both sides and the face of the abrasive wheel without having to remove, flip, and reinsert the abrasive wheel into the machine.

Abstract: A centerless grinding machine includes a frame with an upper base and includes a driven regulating wheel and a driven grinding wheel mounted to the frame. At least one of the wheels is mounted to the upper base and hangs downwardly from the upper base. At least one of the wheels is indexable laterally along an X direction. The wheels are for supporting and grinding a work piece placed between the grinding wheel and the regulating wheel. Preferably the upper base is spaced from and above the at least one wheel and the regulating wheel and the grinding wheel are operably mounted to the upper base such that the wheels hang downwardly from the upper base.

Abstract: The present disclosure relates to a method for the manufacture of a workpiece having a corrected gear geometry and/or a modified surface structure, in particular by a hard finishing process, in particular generation grinding or honing. Provision is made in this respect that it is achieved by a direct generation of a wobble movement and/or of an eccentricity of the tool that a modification, in particular a profile modification or profile waviness, and/or a defined periodic flank waviness is generated on the active surface of the workpiece machined therewith.

Abstract: Provided is a gear grinding machine which can dress a grinding stone while a gear is held attached to the machine regardless of the size of the gear. To this end, the gear grinding machine (1) engages and mutually rotates a work (W) and the grinding stone (17) to thereby grind the work (W), wherein the gear grinding machine is equipped with a turning table (22) which holds the work (W) and rotates around a work rotating shaft (C), and a pivot table (31) which is pivotably supported around the work rotating shaft (C); and a dresser (40) which is capable of dressing the grinding stone (17) is provided on the pivot table (31), the pivot table (31) being pivoted to move the dresser (40) between a dressing position (D1) and a retreat position (D2).

Abstract: A method of fabricating a polishing pad for polishing an article is described. The method includes providing a semi-finished polishing pad and then forming a moving track on the surface of the semi-finished polishing pad. The moving track substantially coincides with a polishing track of the article on the polishing pad.

Abstract: The present invention relates to a polishing apparatus for polishing an object to be polished (substrate) such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table configured to support a polishing pad, a polishing head having a top ring configured to press an object to be polished against the polishing pad while the object to be polished is rotated, and a dresser head having a dresser configured to dress the polishing pad. The polishing apparatus has a head cover having a purge gas introducing unit configured to introduce a purge gas into the head cover and an exhausting unit configured to exhaust the interior of the head cover. The pressure in the head cover is set to a pressure level slightly higher than the pressure outside the head cover, and main components of the polishing head are housed in the head cover.

Abstract: A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.

Abstract: The system for machining the bottom of skis comprises a machine frame, in which a ski is stationary supported by roller carriers. The machining is performed by machining tools on a carriage, which extends throughout under the ski. During the machining, the carrier rollers that are alternately arranged behind each other, take over the support of the ski. There are always so many carrier rollers directly under the ski that its bottom remains in a stationary position.

Abstract: A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.

Abstract: The invention relates to a device for dressing a grinding wheel, comprising a sleeve to hold a corundum rod laterally and to guide it along its longitudinal axis, a ram to apply constant thrust force onto the corundum rod held in place and guided in the sleeve, to bring it into contact with the grinding wheel, means of rigidly connecting the ram shaft to the end of the corundum rod, and linear guide means for the sleeve for translating the corundum rod parallel to the axis of the grinding wheel while keeping the rod pressed against the grinding wheel with a constant force. Application to a centreless grinder in which the grinding wheel is used to grind nuclear fuel pellets.

Abstract: A grinding machine for grinding a workpiece comprises a machine frame, a bearing device provided on the machine frame and movable along guides, in which a cup-shaped grinding wheel is rotatably drivable about a grinding wheel axis and electrically insulated. The grinding wheel is electrically connected to a generator. The device for profile dressing, sharpening and cleaning the grinding wheel consists of a single cup-shaped electrode, which is drivable about its central axis and is placed on a slide, which allows a working gap to exist between the machining surface of the cup-shaped electrode and the annular abrasive surface. A spark erosion discharge occurs in the gap when a voltage is applied. The grinding wheel can thereby be optimally conditioned by electric discharge machining.

Abstract: A wheel truing apparatus adapted for use in a cylindrical grinding machine wherein a work head with a work spindle for support of a workpiece and a wheel head with a grinding wheel for grinding the workpiece are mounted on a bed for relative movement in a Z-axis direction parallel with the rotation axis of the work spindle and in an X-axis direction crossing the Z-axis direction, characterized in that the wheel truing apparatus comprises a rotary drive portion mounted on the work head or a member united therewith, and a wheel truing tool supported on the rotary drive portion for rotation therewith, the wheel truing tool being provided at its outer periphery with a truing portion for truing a grinding surface of the wheel brought into contact therewith, wherein the rotary drive portion is placed in a position adjacent to said work head in a tooling area defined by a stroke of the relative movements of said wheel head and said work head in the Z-axis direction and apart from said work spindle radially outward a

Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

Abstract: A method of fabricating a semiconductor device includes dressing a surface of a polishing pad with a conditioning disk held by an arm while rotating a platen that holds the polishing pad in a chemical mechanical polishing apparatus, wherein the dressing is performed by pressing the conditioning disk to the polishing pad, and rotating the arm around a rotational axis of the arm thereby to move the conditioning disk substantially along a radius direction of the platen between a center part and a circumferential part of the platen, and wherein torque N applied to the arm is measured at plural positions of the conditioning disk along the substantial radius direction during the dressing, and it is determined whether maintenance to the arm is necessary in accordance with an average value <N> of the measured torques N and a fluctuation range Y of the measured torques N.

Abstract: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.

Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life.

Abstract: The present disclosure relates to a gear cutting machine, having a workpiece mount and a first tool mount for a respective workpiece and tool. The first tool mount can be set into rotation about a first axis of rotation of the gear cutting machine and the workpiece mount can be set into rotation about a second axis of rotation of the gear cutting machine. The first tool mount is arranged at a machining head which is movable parallel to the second axis of rotation of the workpiece mount at a machining head over at least one first linear movement axis of the gear cutting machine. In accordance with the present disclosure, the gear cutting machine furthermore has a second machining head having a second tool mount which is movable over a second linear movement axis parallel to the first linear movement axis independently of the first machining head.

Abstract: An ultrasonic trimming apparatus is composed of an articulated robot, a cutting apparatus, and a grindstone. The cutting apparatus is composed of an ultrasonic oscillator which is supported by the end portion of the articulated robot, a cutter blade which is supported by the ultrasonic oscillator, and a workpiece securing portion which secures a workpiece. The grindstone serving as a grinding member is disposed within the movable range of the cutter blade driven by the robot and is placed in a position at which the cutter blade can pressure contact the cutter blade. The cutter blade is ultrasonically vibrated by the ultrasonic oscillator and is ground while being pressed against the grindstone by means of the articulated robot.

Abstract: A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft is mounted to the adjustment device. The shaft defines a second axis that is generally parallel to the first axis when the adjustment device is coupled to the structure. The shaft is movable along a predetermined feed axis toward the grinding wheel. A carousel is rotatably connected to the shaft of the adjustment device. A contouring tool is rotatably connected to the carousel. The contouring tool has a contour surface. Movement of the shaft of the adjustment device along the feed axis is configured to translate the carousel and move the contouring tool into and out of engagement with the grinding wheel to facilitate dressing of the perimeter of the grinding wheel to a grinding wheel contour.

Abstract: Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad.

Abstract: A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines.

Abstract: The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing component, and a liquid carrier, and abrading at least a portion of the surface to polish the surface. The invention further provides a method for reconditioning a workpiece comprising tungsten carbide. The invention also provides a cutting tool insert having a highly polished surface.

Abstract: The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.

Abstract: A grinding device is provided which includes a dressing mechanism for dressing the grinder which is simple in structure and low in manufacturing cost. The grinding device includes a dresser head (7) provided at the front end of a spindle (1), and a dresser tool (8) mounted on the dresser head (7) for dressing the grinder (6), and the dresser tool (8) is configured such that while the workpiece (W) is being ground by the grinder (6), the dresser tool (8) is kept out of contact with the grinder (6), and while the grinder (6) is being dressed by the dresser tool (8), the chuck (3) is kept out of contact with the grinder (6). Thus it is possible to press the dresser tool (8) against the grinder (6) using the relative movement between the spindle (1) and the grinder shaft (4). The dresser head (7) can be rotated by rotating the spindle (1).

Abstract: Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.

Abstract: The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%?Ni+Fe?90% (provided that 0?Fe/(Ni+Fe)?0.4), 1%?Cr?25%, 2%?Si+B?15% (provided that 0?B/(Si+B)?0.8), and 0.1%?P?8%.

Abstract: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.

Abstract: A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.

Abstract: A ice skate blade sharpening machine comprises a skate holder which holds the blade in a releasably fixed position, a rotatable grinding wheel having a periphery and rotatable about a grinding wheel axis, and a contouring tool having a contour surface, moveable between an engaged position and a disengaged position, wherein in the engaged position the contouring tool is held in place with respect to the grinding wheel axis, the contour surface engages the rotating grinding wheel and grinds the periphery of the grinding wheel to define a grinding wheel contour, and wherein the grinding wheel contour grinds the blade to define a profile when the grinding wheel is rotating and the blade is held in the releasably fixed position.

Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.

Abstract: A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently along the surface of polishing pad to condition the entire surface of the rotating polishing pad.

Abstract: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Abstract: The present invention is a method and apparatus for accelerated pulling and fracturing of aggressive diamonds on a CMP diamond conditioner disc wherein aggressive diamonds of known position are pulled or fractured by contacting the diamond conditioner disc to a plate or sheet of a hard material or a plate or sheet containing discrete structures of hard material relative to which the diamond disc is in motion at a determinable and reproducible rate for a determinable and reproducible period of time and the number and position of the pulled or fractured aggressive diamonds are determined following the completion of said contact.

Abstract: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring.

Abstract: A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof through light, the presence of a slurry hinders the measurement. In measurement thereof with a contact type sensor, a problem that pollutants elute out is caused. In a CMP step in the invention, the height position of a dresser is measured while the dresser operates, thereby detecting the abrasion amount or the thickness of a polishing pad indirectly. In this way, the time for exchanging the polishing pad is made appropriate.

Abstract: A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased.

Abstract: The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the substrate; and a plurality of linear elastic members which have tip ends and are implanted into the pellets, wherein upon contact of the tip ends of the linear elastic members with the polishing pad, the linear elastic members elastically deform, so that a pressure necessary for conditioning the pad is generated in order to maintain a change in conditioning capability within a predetermined range and have a wide margin for adjusting a height of the conditioner.

Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

Abstract: The invention relates to a hard finishing machine (1). The machine has one tool (4) which is arranged on a tool spindle (3) and a rotary table (5) with an axis of rotation (6) which is aligned vertically, and a workpiece spindle (7) arranged on the rotary table (5) which carries the workpiece (2). To increase the flexibility of the machine, the rotary table (5) has a first rotational position (I) in which the workpiece (2) can be machined by the tool (4), a second rotational position (II) where the workpiece is loaded on the workpiece spindle (7) at a first station (8), and a third rotational position (III) where the workpiece is unloaded at a second station (9).

Abstract: A dresser for dressing a grind stone including two concentric solid wheel dressing elements. The dressing elements include an abrasive material within a matrix material. The grind stones dressed with the dressers of the invention operate at high removal rates thereby grinding substrates quickly and at low cost. The grind stones dressed with the dressers of the invention also produce favorable mechanical surface characteristics such as low waviness and flatness.

Abstract: A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a surface of the polishing pad, the conditioning step including the step of grinding the surface of said polishing pad by at least first and second conditioning disks of respective, different surface states.

Abstract: The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.

Abstract: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port, the apparatus may also include self-contained flushing means and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: The invention relates to a device (10) for truing a machining wheel (20), in particular grinding or eroding wheel, by means of a rotating truing tool (30), comprising: a first rotating spindle (18), which can be driven so as to rotate about a first axis of rotation (22), for attaching the machining wheel (20) and a second rotating spindle (28), which can be driven so as to rotate about a second axis of rotation (32), for attaching the truing tool (30), wherein, in order to true the machining wheel (20), the truing tool (30) rotatably driven by the second rotating spindle (28) can be brought into material-removing contact with the machining wheel (20) rotatably driven by the first rotating spindle (18). In this respect, in order to obtain uniform truing results, the first axis of rotation (22) is directed substantially orthogonally to the second axis of rotation (32) during the entire truing process.