Abstract: A method of refurbishing a surface of a component for an electronic device includes: abrading a surface to be refurbished with an abrasive to remove a coating on the surface and provide an abraded surface; optionally firstly cleaning the abraded surface by contacting with a glass cleaner to provide a firstly cleaned surface; optionally secondly cleaning the firstly cleaned surface by contacting the firstly cleaned surface with a grease remover to provide a secondly cleaned surface; optionally contacting the secondly cleaned surface with an activator to provide an activated surface; and disposing a coating resin on the abraded and optionally activated surface; and curing the coating resin to provide a coated surface to refurbish the surface of the electronic device.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel. In some situations, it can be desirable to remove a portion of an upper surface of the overmold to, for example, better expose upper portions of shielding wirebonds. In some embodiments, an ablation system can include a blasting apparatus configured to provide a stream of ablating particles to a blasting region. A first transport section that moves a panel through the blasting region can be separate from a second transport section that feeds or removes the panel to or from the first transport section. Such a configuration can substantially isolate the second transport section from the stream of ablating particles.

Abstract: A device for removing a coating formed in a slot of a stator core. The device includes a carriage movably attached to a first guide rail assembly to enable movement of the carriage in a longitudinal direction. The device also includes a first drive screw wherein rotation of the first drive screw moves the first guide rail assembly in the longitudinal direction. In addition, the device includes a second guide rail assembly that is attached to the carriage wherein the second guide rail assembly enables movement of the carriage in a direction transverse to the longitudinal direction. Further, the device includes a second drive screw wherein rotation of the second drive screw moves the carriage in the transverse direction. The carriage includes a nozzle that moves within the slot in either or both the longitudinal or transverse directions wherein the nozzle sprays an abrasive media for removal of the coating.

Abstract: The present invention provides an apparatus for removing the unnecessary thin-film layer on the periphery of the substrate of the plate-like member having a square shape, on the surface of which substrate is formed a thin-film layer. The apparatus comprises a chamber to treat the peripheral part where the peripheral part of the plate-like member is inserted and where the unnecessary thin-film layer on the peripheral part of the plate-like member is removed; and a means to move the plate-like member. The chamber to treat the peripheral part comprises a cover to prevent the scattering of the sprayed particles and the dust for treating the peripheral part, the cover having one of its end-sides that forms a ceiling being closed and having the other end-side that is opposed to the ceiling being open and a suctioning cover for treating the peripheral part, having an opening that has the same shape as the opening of the cover to prevent the scattering of the dust.

Abstract: Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

Abstract: To provide a wafer preventing a breakage of a crack or a chip off from being brought about in a polishing step and a polishing apparatus and a polishing method of polishing the wafer, there is provided a wafer in a shape of a plate substantially in an angular rectangular shape used as a raw material of a piezoelectric vibrator. All of corner portions D1, D2, D3, D4 substantially in the angular shape are formed in shapes of curved faces by chamfering providing curvatures. The corner portions D1, D2, D3, D4 in the shapes of the curved faces at least include a first curved face portion and a second curved face portion chamfered by curvatures different from each other or the same curvature. A reference face of a crystal orientation of the raw material is specified by the first curved face portion or the second curved face portion.

Abstract: A method of depth routing an electronic layup comprised of a dielectric sandwiched between a metal layer and a metal substrate which is then laminated. The method involves first positioning a hardened mask so that the mask is interposed between the metal layer and at least one nozzle of a sandblasting machine, the mask having at least one aperture provided therein. Thereafter, the electronic layup is sandblasted through the at least one aperture by way of the sandblasting machine. The force, size and type of abrasive applied by the sandblasting machine are sufficient to erode the metal layer and the dielectric but not the substrate.

Abstract: To provide a wafer preventing a breakage of a crack or a chip off from being brought about in a polishing step and a polishing apparatus and a polishing method of polishing the wafer, there is provided a wafer in a shape of a plate substantially in an angular rectangular shape used as a raw material of a piezoelectric vibrator. All of corner portions D1, D2, D3, D4 substantially in the angular shape are formed in shapes of curved faces by chamfering providing curvatures. The corner portions D1, D2, D3, D4 in the shapes of the curved faces at least include a first curved face portion and a second curved face portion chamfered by curvatures different from each other or the same curvature. A reference face of a crystal orientation of the raw material is specified by the first curved face portion or the second curved face portion.

Abstract: Particularly, a thin-film solar cell panel or the like is processed without necessity of attaching and detaching of mask and washing steps with respect to a workpiece in a fine blasting employing a fine abrasive. A negative pressure space (20) and an opposing negative pressure space (40) having openings (22, 42) are opposed by being spaced at a movement allowable interval of the workpiece such as a thin-film solar cell panel or the like and so as to face one side edge in the same direction as a moving direction of the workpiece.

Abstract: A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transports it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), when another molded substrate is loaded.

Abstract: Particularly, a thin-film solar cell panel or the like is processed without necessity of attaching and detaching of mask and washing steps with respect to a workpiece in a fine blasting employing a fine abrasive. A negative pressure space (20) and an opposing negative pressure space (40) having openings (22, 42) are opposed by being spaced at a movement allowable interval of the workpiece such as a thin-film solar cell panel or the like and so as to face one side edge in the same direction as a moving direction of the workpiece.

Abstract: A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer.

Abstract: In a method of forming partitions of a plasma display panel, the partitions of the plasma display panel are formed by using a sandblasting method, and abrasive material and partition cutting powder are dispersed in liquid after the completion of sandblasting. Further, in a device for forming partitions of a plasma display panel, the partitions of the plasma display panel are formed by a sandblasting method, and the device has a dispersing tank in which abrasive material and partition cutting powder are dispersed in liquid after the completion of sandblasting.

Abstract: An apparatus for treating a substrate with a cryogenic impingement fluid includes a protective enclosure defining an internal cavity, a cryogenic fluid applicator positioned within the internal cavity and a snow generation system connected to the cryogenic fluid applicator. The snow generation system includes a condensing subsystem and a diluent or propellant gas subsystem. Each subsystem is connectable to a common gas source. The condensing subsystem includes a condenser for condensing liquid carbon dioxide into solid carbon dioxide particles, or dry ice snow. The condenser includes at least two segments of differing diameter connected to one another. Liquid carbon dioxide is introduced into the smaller diameter first segment and upon entering the larger diameter second segment, solidifies into dry ice particles. The dry ice particles, along with diluent or propellant gas produced from the diluent subsystem, are delivered to the cryogenic fluid applicator via a coaxial delivery tube.

Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.

Abstract: A sandblasting operation includes a nozzle (10) which receives sand from a pot (12). A signaling system (20) for the sandblasting operation includes a first switch (22) to initiate the operation and a second switch (24) located at the nozzle (10) to alert the operator of the pot (12) of the need for action and also of the type of action needed. If the second switch (24) is put in one position, an alarm (29) is sounded alerting the operator of the pot (12), and a first light (30) is illuminated to indicate the need for an increased amount of sand. If the second switch (24) is put in a second position, the alarm (29) is sounded and a second light (31) is illuminated to indicate the need for a decreased amount of sand.

Abstract: A method of forming fine partition walls by which fine partition walls with stable shape can be formed with good processing accuracy and at good grinding efficiency by a jet processing technique, a method of producing a planar display device by application of the method, and an abrasive for jet processing to be used in these methods, are disclosed. The fine partition walls are formed on the surface of a substrate by jet processing using an abrasive comprised of a powder of calcium carbonate coated with silicone on the surfaces thereof. Each of the particles constituting the abrasive has a three-dimensional shape comprised of a stack of different-sized triangular or more-angular polygonal layers.

Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).

Abstract: A fluid jet cutting method and apparatus for cutting an object from a sheet. In one embodiment, a fluid jet stream is directed against a glass sheet to cut an annular disk substrate for use in a data storage device. The sheet is supported by first, second and third support members. The support surfaces of the second and third support members are respectively positioned inside central openings in the first and second support members. A vacuum pulls the sheet against the support surface of at least the second support member. Preferably, plural central openings in the first support member accommodate plural second and third support members, whereby plural substrates are cut from the sheet. The sheet preferably includes plural layers removably adhered to one another, whereby plural substrates are simultaneously formed by a single fluid jet stream. A protective layer may cover at least one surface to the sheet.

Abstract: A liquid crystal display device, a liquid crystal display device cutting method, and a liquid crystal display device cutting apparatus that prevents damaging attached flexible conductive lines by providing a rounded water jet cut edge of a glass liquid crystal panel. The liquid crystal display device cutting apparatus includes a pump for increasing the pressure of a liquid, a nozzle with a throat that receives the pressurized liquid, a movable nozzle support that is movable at least in a plane parallel to the liquid crystal display, and a conveyor supporting the liquid crystal display device.

Abstract: A cup attaching apparatus for attaching a cup for eyeglass lens processing to a subject lens to be processed, includes: an imaging optical system, which obtains an image of the lens by illuminating the lens with rays of light shaped to be larger in diameter than the lens; a display; a display control unit, which displays, on the display, the obtained lens image and an alignment mark superimposed on the obtained lens image, the alignment mark having substantially the same contour as a small lens portion of a bifocal lens; a first input unit, which inputs an amount of offset of the alignment mark with respect to a cup attachment center; and a second input unit, which inputs layout data for layout of the lens with respect to a target lens shape, wherein the display control unit determines a display position of the alignment mark based on the inputted offset amount and layout data, and displays the alignment mark at the determined display position on the display.

Abstract: The present invention relates to a method of obtaining a pattern of concave spaces or apertures in a plate or layer of a brittle-like material, in which method a jet of abrasive powder particles from a nozzle is directed onto a surface of the plate or layer, which plate or layer is provided with a mask so as to define the region of impact of the abrasive powder particles on the surface. The present invention also relates to a brittle-like material provided with such a pattern of concave spaces or apertures, and to the special application of such a brittle-like material.

Abstract: A system having an array of nozzles is used to clean fabricated rows of magnetic heads. Each nozzle contains a pair of concentric tubes. The inner tube of the nozzle discharges a plume of fine dry material at a target. The outer tube of the nozzle simultaneously discharges a hollow tube of water that completely surrounds the plume discharged by the inner tube. This nozzle design prevents the dry material from mixing with the water during discharge so that the plumes remain dry until they strike the target with the tubes of water. As the nozzles pass over various portions of the target, the plumes remove most forms of process contamination, while the water serves multiple purposes. The leading stream of water in front of each plume loosens some contaminants and moistens the target prior to contact by the dry material. In addition, the trailing streams of water flush the target and removes any remaining contamination left behind after the plumes pass by.

Abstract: Methods and apparatus for marring a surface of a fiber optic substrate by sandblasting one or more sides of the substrate during movement of the substrate past one or more sandblasting nozzles to produce a specific illumination pattern. The nozzles may be operated intermittently to produce intermittent light emitting areas along the length of the substrate. Alternatively, the substrate may be moved past the nozzles at a variable speed, or the pressure of the nozzles or spacing of the nozzles from the surface of the substrate may be regulated during movement of the substrate past the nozzles in order to produce a specific illumination pattern. Also, a perforated plate may be placed between the nozzles and substrate in order to produce a specific illumination pattern. After the sandblasting operation, the substrate may be cleaned and cut to desired lengths, and permanently heat formed into any desired shape.

Abstract: An apparatus and method that enhances removal of contaminating particles from surfaces of a non-electrostatically sensitive components that are cleaned using a carbon dioxide cleaning spray. The apparatus includes a programmable power supply that is connected to ground and to the non-electrostatically sensitive component. The surface charge of the component is determined by cleaning the surface without adding any voltage or charge bias to the component. Then the surface is reversed-biased with a voltage having the opposite polarity by a large amount using the programmable power supply. The surface is then cleaned a second time, which removes the contaminating particles that were bound to the surface by electrostatic forces generated during the first cleaning. Thus, reversing the polarity of the charge on the surface that is to be cleaned removes the strong attraction between the contaminating particles and the surface and enhances removal of the contaminating particles from the surface.

Abstract: A method for measuring the machinability of a material which includes piercing a hole through a material to be tested while simultaneously measuring a pierce time duration, T, of the piercing step, and calculating a machinability number from the pierce time duration. Also provided are methods for determining the machining speed of a material and for machining a material which calculate a machining speed for a material based upon the machinability number of the material. The methods used to measure the machinability number and calculate a machining speed for a particular material can include any combination of machining operations, including but not limited to AWJ cutting processes. Also provided is an apparatus which detects the time duration a piercing force takes to create a pierce-through condition through a material. The apparatus includes any of a pressure sensor, an acoustic sensor, an optical sensor, a load cell, a mechanical switch, and combinations thereof to measure the pierce-time duration.

Abstract: Apparatus for cleaning, assembling, testing and inspecting contamination sensitive hardware. The apparatus includes an environmental process enclosure having an inner processing chamber, and a carbon dioxide jet spray cleaning system. The enclosure includes a loadlock pass-through having front and rear access doors for providing access to the inner processing chamber. A blower is disposed in the enclosure for circulating purified gas therethrough. A prefilter disposed prior to an inlet of the blower, and a high purity filter and laminar flow screen are disposed in the inner processing chamber. A heater is provided for heating the purified gas and a temperature controller is coupled to the heater for controlling the temperature of the purified gas. A table is disposed in the inner processing chamber upon which contamination sensitive hardware and testing and assembly apparatus may be placed.

Abstract: A fine grain milling method mixes powder into a high-pressure fluid, and injects the mixture to a work material covered with a mask to form the work material to a desired shape. In addition, the method injects anther high-pressure fluid to the powder adhered to the work material to remove the powder. The method can accurately transfer the mask pattern to the work material.

Abstract: A method is provided for cleaning an electronic circuit board having first and second opposing surfaces. The method includes directing a stream of carbon dioxide particles against the first surface. Steam is sprayed toward the first and second surfaces such that condensation of the steam caused by cooling from the CO.sub.2 particles forms a thin film of water on the first surface for conducting electrostatic charge away from the first surface. The CO.sub.2 particles substantially remove residue present on the first surface, thereby cleaning the circuit board.

Abstract: A method of fabricating a through-holed wiring board comprising a step of forming a through hole in a ceramic wiring board with a laser beam, and a step of removing an alteration layer, defined on an inner wall portion of the through hole by solidification after thermal melting, by sandblasting.

Abstract: A substrate cleaning assembly (10) and method for removing contaminant substances (11) from a surface (12) of a substrate (13) employed in microelectronics manufacturing. The cleaning assembly (10) includes a substance locator (15) adapted to locate and map at least one contaminant substance (11) on the surface (12) of the substrate (13) and a dispenser (16) formed and dimensioned to accurately dispense a substantially controlled, impinging stream (17) of cleaning agent along a path (18). A controller (20) is coupled to the map device (15) and the dispenser (16), and is adapted to control the impinging stream (17) such that the located contaminant substance (11) is positioned in the path (18) of the impinging stream (17) to enable substantially localized impingement and removal of the substance (11) from the substrate surface (12).

Abstract: An apparatus and method that enhances removal of contaminating particles from surfaces of a static-sensitive components that are cleaned using a carbon dioxide cleaning spray produced by a jet spray gun. The apparatus has a programmable power supply that is connected to ground, to the static-sensitive component, and to the jet spray gun. The static-sensitive component is cleaned using the cleaning spray and the surface charge generated on the surface of the component or substrate is simultaneously monitored to determine the amount and polarity of the charge that is generated thereon. The programmable power supply then applies a reverse bias to the jet spray gun that is equal to and has the opposite polarity of the charge that is generated on the surface of the static-sensitive component or substrate, which neutralizes the charge generated on the surface of the component.

Abstract: After a plate of electrically insulating, particularly hard and brittle material has been provided with a mask having a very large number of patterned apertures, it is exposed to at least one jet of abrasive powder particles, which jet is moved relative to the plate. In this way a plate is manufactured with a pattern of apertures and/or cavities which are eminently suitable for manipulating electron currents in electronic displays. Plates manufactured in this way may be used, for example, as control plates, spacer plates, or electron transport duct plates in electronic displays.

Abstract: A slurry blasting process employing a liquid carrier medium such as water contains a dispersed water-soluble particulate abrasive to enhance blast cleaning efficiency. Slurry blasting is performed at liquid pressures below 500 psi with an air to slurry mass ratio of generally at least about 0.05. The slurry can be recovered and continuously reused.

Abstract: After a plate or layer of non-metallic, particularly hard and brittle material has been provided with a (metal) mask having a plurality of apertures arranged in a pattern, it is exposed to at least one jet of abrasive powder particles, which jet is moved relative to the plate. The mask has its surface facing the surface on which the jet impinges secured to the plate or layer of non-metallic material by means of a layer of adhesive material having a thickness which is smaller than the size of the abrasive powder particles.

Abstract: A method of cleaning an integrated circuit chip module prior to attaching wire bonds thereto. The method involves disposing a module containing an integrated circuit chip and IC bond pads without wire bonds in an environmental process enclosure. A carbon dioxide jet spray cleaning system having a spray nozzle and orifice assembly is disposed the environmental process enclosure. A jet spray of carbon dioxide is generated using the jet spray cleaning system. The carbon dioxide jet spray is directed onto the surface of the module such that the spray impacts the IC bond pads and module bond pads to clean unwanted adhesive from the surface of the module and thus clean the IC and module bond pads.

Abstract: A thin film thermal printhead is provided which comprises a head substrate having a first longitudinal edge and a second longitudinal edge, a glaze layer formed on a surface of the head substrate, a patterned resistor layer formed as a thin film on the glaze layer to provide a strip of heating dots extending along the first longitudinal edge of the head substrate, and a patterned conductor layer formed on the resistor layer for selectively supplying power to the heating dots. The glaze layer extends from the first longitudinal edge toward the second longitudinal edge of the head substrate, and has a normal flat surface portion and a rounded marginal surface portion continuous with the normal flat surface. The rounded marginal surface portion extends along the first longitudinal edge of the head substrate and progressively approaches the head substrate toward the first longitudinal edge. The heating dots strip is located at least partially at the rounded marginal surface portion of the glaze layer.

Abstract: An object (12) may be cleaned by CO.sub.2 reduced ESD by directing a first water mist (23) at a surface (14) of the object while imparting a relative motion between the object board and the mist to form a film of water on the object surface. As the relative motion is imparted between the board and the first mist (23), a second water mist (32) is injected into a stream (30) of solid CO.sub.2 particles (27) directed at the object surface downstream of the first mist. Water droplets in the second mist in the second mist combine with the CO.sub.2 particles to create carbonic acid that disassociates into charged ions that increase the conductivity of the water film, allowing for increased charge dissipation, thus reducing the incidence of ESD.

Abstract: After a plate or layer of non-metallic, particularly hard and brittle material has been provided with a (metal) mask having a plurality of apertures arranged in a pattern, it is exposed to at least one jet of abrasive powder particles, which jet is moved relative to the plate. The mask has its surface facing the surface on which the jet impinges secured to the plate or layer of non-metallic material by means of a layer of adhesive material having a thickness which is smaller than the size of the abrasive powder particles.

Abstract: A fine grain milling method which mixes powder into a high-pressure fluid, and injects the mixture to a workpiece covered with a mask or pattern to process the workpiece to a desired shape. Another high-pressure fluid is injected to remove the powder adhering to the workpiece thereby enabling an accurate transfer of the mask or pattern to the workpiece.

Abstract: A method is provided for pretreating an electronic component manufacturing frame which is prepared by punching. The method comprises blasting abrasive particles entrained in a high speed air stream toward the frame, wherein the abrasive particles has an average diameter of no more than 200 micrometers, preferably no more than 100 micrometer, particularly no more than 50 micrometers. The abrasive particles may be advantageously made of glass.

Abstract: An improved apparatus and method adapted for use in removing trace contaminants from the surface of a chosen substrate, such as delicate surfaces or precision parts, by application of a stream or jet spray of expanded fluid to the substrate surface. The improvement consists of controlling electrostatic charges generated on or near the substrate surface during the cleaning process.

Abstract: A system for abrasively cleaning surfaces such as by sandblasting and including a vacuum arrangement for recovering the material abrasively removed from the surface as well as the abrasive material is provided with a control circuit operable to actuate an alarm and/or deactivate the abrasive cleaning operation by sensing a drop in the vacuum pressure at the blast head which is indicative of an inappropriate positioning of the blast head and thus discharge of the abrasively removed material and abrasive material to the surrounding environment.

Abstract: A system for cleaning test probes attached to a probe mat fixture by propelling CO.sub.2 pellets at the test probes, by rotating the fixture so that the pellets impact different sides of the test probes, and by providing electrostatic protection for active devices mounted on the probemat fixture. The CO.sub.2 pellets are propelled so that they strike the test probes at an angle to the horizontal plane of the test probe as mounted on the probemat fixture. Electrostatic protection is provided by connecting all electrical connections to the probemat fixture to ground and by reducing electrostatic charge build up on the probemat fixture by using an ionizer to direct ions at the probemat fixture.