Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: Apparatus and methods allow difficulty accessible sites of a structure to be sand-blasted. Preferred sand-blasting systems are provided which include a sand-blasting fixture to support the a sand-blasting nozzle and a distal portion of the supply hose in such a manner that the spray of grit particulates may be directed against the difficultly accessible site of the structure. The fixture most preferably includes rigid proximal and distal support tubes joined to one another so as to establish an angle therebetween (most preferably about 90°), and a rigid back-lash support member extending outwardly from the distal support tube. In such a manner, the distal portion of the supply hose is movably supported within the proximal and distal support tubes such that the nozzle positioned adjacent to the back-lash support member may be adjustable by means of the distal portion of the supply hose being further advanced into or retracted from within the proximal and distal support tubes.

Abstract: A method of forming an ink fill slot in a silicon substrate of an ink-jet printhead includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to form the ink fill slot in the silicon substrate.

Abstract: A method of abrading a portion of a silicon substrate includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to abrade the portion of the silicon substrate.

Abstract: A slurry distributor having a base section, a main body section, a distributing structure (sidewall section) and a connecting structure. The main body section is above the base section and the distributing structure is above the main body section. The distributing structure accommodates one or more types of slurry, mixes up the different slurry types and channels out the well-mixed slurry. The distributing structure also has a plurality of holes close to the main body section. The connecting structure is inside the base section for engaging with a chemical-mechanical polishing installation.

Abstract: An improved method and apparatus for media blasting a workpiece 20 is described. The media blasting apparatus 10 of the present invention includes a media reclaim and recycle system 35, which reduces media wastage, advantageously improves peening of a workpiece 20 and provides better coverage of the workpiece surface. The media blasting apparatus 10 also includes a pressure chamber 90 for creating a media blast stream, a media metering valve 105 for controlling media flow rate and a powered part hold-down apparatus 130 for holding the workpiece 20 in a predetermined position during a blasting operation. The controlled media flow rate in combination with the powered hold down of the workpiece 20 ensures even and thorough peening of a workpiece surface.

Abstract: A granule dishwashing apparatus with easily removable granule collectors and method of use. The dishwashing apparatus consists primarily of a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture consisting of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture at some point using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. In a multiple collector system, the granule collectors are connected to actuators so that the collectors can be placed in a release mode or a collect mode depending on the function desired.

Abstract: A slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus. The slurry supply system includes a wafer carrier configured to hold a semiconductor wafer to be polished; a supporting arm to support the wafer carrier; a slurry supplier connected to the supporting arm and located on the front edge of the rotating direction of the rotating platen so that the slurry supplier is positioned opposite the wafer carrier; and a plurality of openings formed on the slurry supplier to feed chemical mechanical polishing fluids, each of the openings individually supplied with individual control of the chemical mechanical polishing fluids.

Abstract: A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure.

Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

Abstract: The invention relates to a device for feeding blasting shots into the central area of a centrifugal wheel (1) in a shot blasting system via a feed pipe (3), whereby a distributing bushing (7) comprising a distributing opening (8) is provided in the central region thereof. An impeller (9) comprising discharge openings (11) rotates in the distributing bushing (7) together with the centrifugal wheel (1), wherein the shots which are to be accelerated enter in an axial direction, the feed pipe (3) for the shots discharges into the impeller (9) and is provided with a ring-shaped tongue (10) which protrudes into the impeller (9) in the region of the distributing opening (8).

Abstract: A method and apparatus are disclosed for abrading the inner surface at the intersection region of a branch outlet with the wall of a body having a passageway. Using abrasive flow machining, it is possible to abrade the intersection region to provide a smooth transition between the wall and the branch outlet.

Abstract: An apparatus for cleaning a passage in an engine block, such as the oil galley and oil galley legs, in which the passage includes an inlet and an outlet end. The apparatus includes a fixture having an interior passageway with an opening. The fixture is dimensioned to abut against the engine block so that the opening in the fixture registers with the engine block passage outlet. An air induction source is then fluidly connected to the fixture passageway so that, upon actuation of the air induction source, the air induction source inducts air through the engine block passage, through the fixture opening, and through the fixture passageway. A feeder containing abrasive shot is then coupled to the engine block passage inlet so that, upon actuation of the air induction source, the abrasive shot is inducted through the engine block passage and into the fixture passageway.

Abstract: A dry ice blasting system adapted for low gas flow rates at low pressures with small dry ice particles to produce a very small footprint on a surface being cleaned.

Abstract: A method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, is disclosed. The method includes providing a supply of slurry and delivering slurry to the semiconductor processing machine. The supply typically provides slurry from a location remote from the semiconductor processing machine to a location proximate the semiconductor processing machine, where the slurry at the location proximate the semiconductor processing machine is unpressurized. A delivery subsystem typically agitates slurry in the basin by flowing the slurry through the basin, thereby inhibiting the settling of suspended particles in the slurry.

Abstract: A fluid delivery line is configured to provide slurry to a planarization process, e.g., of a planarization machine. Slurry within the delivery line is provided successive forward and reverse flows. Preferably, the flow reversals are performed on a supply side of a metering pump which is used for dispensing slurry from the delivery line to a planarization pad of the planarization machine. In another embodiment, a slurry distribution system comprises a pump configured to flow slurry from a slurry reservoir to a forward delivery line. A plurality of drop lines tap into the forward line along its length. A return line returns slurry from the forward line to the slurry reservoir. A variable volume cavity is coupled in fluid communication with the return line, and is operated with plus/minus volume displacements. Additionally, a passive or active mixer may be disposed in-line with the return line and at a location between the slurry reservoir and the variable volume cavity.

Abstract: Apparatus and method for producing and metering dry ice pellets and particles selectively from the same apparatus without modification, by appropriate reversal of a production wheel and accompanying selection of dry ice in the form of block or of pellets for a supply to the production wheel.

Abstract: An improved apparatus for generating a high-pressure fluid jet includes an orifice mount having a frusto-conical surface that engages a frusto-conical wall in a cutting head, the geometry of the orifice mount and cutting head being selected to increase the stability of the mount and reduce deflection of the mount adjacent a jewel orifice, when subjected to pressure. Alignment of a nozzle body and the cutting head is improved by providing pilot diameters both upstream and downstream of threads on the nozzle body and bore of the cutting head, respectively. Accurate placement of a mixing tube in a cutting head is achieved by rigidly fixing a collar to an outer surface of the mixing tube, the collar engaging a shoulder and bore of the cutting head downstream of a mixing chamber, to precisely locate the mixing chamber axially and radially.

Abstract: The invention relates to an improved recovery system for blasting works, comprising a space below a perforated floor of the blasting works for receiving the blast material, and suction channels (21) for leading the blast material from the space below the floor to a classifier by using a blower; the recovery system comprises at least one elongated, substantially horizontal chute (17) opening upwards and arranged into the said space, the chute comprising two side walls (18, 19), and an elongated cover element (20) with two elongated free side edges (22, 23) arranged over the chute; the chute (17) and cover element (20) form between them a discharge channel (21) for the blast material; in addition, the system comprises pneumatic cylinders (26) for moving the cover element (20) in vertical direction between a lower and a raised position so that in the lower position, the side edges (22, 23) of the cover element engage the side walls (18, 19) of the chute and, in the raised position, the side edges (22, 23) of the

Abstract: A particle blast apparatus includes a hopper assembly which is mechanically isolated from the rest of the particle blast system. Energy is imparted to the hopper by an impulse assembly, which preferably is mounted directly to the hopper. The hopper is mounted to the apparatus on a slide assembly which allows the hopper to be moved to a second position at which particles may be discharged from the hopper exit away from the particle feeder.

Abstract: Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

Abstract: A particle blast apparatus includes a hopper assembly, which is mechanically isolated from the rest of the particle blast system. Energy is imparted to the hopper by an impulse assembly, which preferably is mounted directly to the hopper. The hopper is mounted to the apparatus on a slide assembly, which allows the hopper to be moved to a second position at which particles may be discharged from the hopper exit away from the particle feeder.

Abstract: A micro-dermabrasion system and method in which a handpiece includes an axially aligned treatment orifice and laterally offset particle supply and waste removal channels. At least a portion of the particle supply channel is angularly offset relative to the waste removal channel so the particle stream impinges substantially on the center of the treatment orifice. The handpiece employs tapered couplers to permit easy attachment and detachment of particle supply and waste removal lines in a handpiece having a small diameter. The particle supply container is designed to be pre-filled by a supplier, and disposed of when empty without disassembly. The supply container is also constructed to permit controlled aeration of the particles before delivery to the handpiece to reduce clogging of the particle lines and to facilitate continuous adjustment of particle flow rate.

Abstract: The present invention is a superior micro-abrasive blasting device (55) with a flow-control mechanism (65) and a flow-actuated discharge conduit seal (80). Flow-control is achieved through the deformation of discharge conduit (10) to control the opening of discharge conduit (10). The flow-control mechanism (65) provides for the continuous pressurization of the mixing chamber (23) to yield instantaneous flow start-up response and instantaneous flow shut-off response.

Abstract: A machine having a tool engages a workpiece to perform an operation includes a housing having an adapter secured thereto for supplying lubricating fluid. The adapter includes a split ring type mounting portion that engages the housing of the machine. The adapter further includes a lubrication conduit portion that is secured to or formed integrally with the mounting portion. The lubrication conduit portion has an inlet port formed therein that communicates with one or more outlet ports. When the mounting portion of the adapter is secured to the housing of the machine, the tool is located adjacent to the outlet ports of the adapter. A workpiece can then be engaged by the tool to perform the operation. A source of lubricating fluid is connected to the inlet port such that lubricating fluid can be sprayed from the outlet ports of the adapter directly into the region where the workpiece is engaged by the tool for reducing friction and heat during the operation.

Abstract: A hand-holdable apparatus useful for abrading a surface is provided. The invention is particularly useful for dental applications using a stream of abrasive particles suspended in a gas stream to abrade the surface of a tooth. The apparatus of the invention may be modified to easily minimize “bleed down” of the gas/abrasive stream using a pinch valve and to remove worn flexible conduits for routine maintenance and autoclaving of the apparatus. The apparatus of the invention also provides a novel pick-up assembly for delivery of abrasive particles.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.

Abstract: A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.

Abstract: An constant abrasive feeder of abrasive grains M is formed of a reservoir supply section 20 having a reservoir tank 21 and a buffer tank 31, a stirring hopper 40 for stirring abrasive grains S, and a vibration feeder 60 for supplying the abrasive grains S to an abrasive jet nozzle 5. The abrasive grains S recovered in a cyclone 1 is reserved in the reservoir tank 21 and the buffer tank 31 by a constant quantity, the abrasive grains S is sent from the buffer tank 31 and reserved in a reservoir 43, which is stirred by stirring bars 50, 51 and sent to a supply guide 45. Then, the abrasive grains S is sequentially supplied to a feeder body 61 of the vibration feeder 60 from an opening formed in the supply guide 45.

Abstract: The present invention is a superior micro abrasive blasting device (55) with an integral sealed reservoir (22) that converts into a mixing chamber (23). When not in use, the micro abrasive blasting device (55) forms a sealed reservoir (22) that protects the stored particulate matter (20) from contamination and spillage. When the device is setup for use, the sealed reservoir (22) transforms into an operational mixing chamber (23). A method is provided for easily unsealing reservoir (22) and turning it into the mixing chamber (23) in a single motion. In the preferred embodiment, a compliant closure cap (30) is displaced along the container side wall (15) in the direction of the container end wall (17) . The displacement causes the gas-delivery conduit (25) disposed within the reservoir (22) to protrude through the compliant closure cap (30) and to form a gas-receiving port (35).

Abstract: Apparatus to prepare an airstream laden with particles of solid dry ice. A rotor has passages which sequentially pass a source of particles and a source of air under pressure to prepare the airstream and send it to a nozzle. The rotor is held between pads whose force against the rotor is a function of air supply pressure. The speed of the rotor and of the particle feed are controllable, and the air feed persists after particle feed has stopped for a period of time sufficient to clear particles from the rotor.

Abstract: An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.

Abstract: Ice grains of uniform grain size are produced through the change of state of supercooled water and the ice grains are mixed into cold water for obtaining an ice slurry of proper concentration. The ice slurry is injected from an injection means to the surface of a workpiece. As the ice grains are fine and uniform and they are injected with water in the state of ice slurry of stable concentration, a surface processing of a soft workpiece susceptible to damage can be performed without causing damage, and the cleaning of the processed surface is performed concurrently with the surface processing, eliminating the necessity of after cleaning. The apparatus is compact and the initial cost is low. The energy needed for preparing the ice slurry is small.

Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

Abstract: An apparatus of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises a storage tank of the abrasive and a supply line for guiding the abrasive from the storage tank to a nozzle for supplying the abrasive to an object to be polished and said storage tank or supply line is provided with a device for furnishing ultrasonic wave to sonicate the abrasive. A process of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises sonicating the abrasive by ultrasonic wave before supplying it to an object to be polished. The apparatus and process of this invention for supplying an abrasive for use in the manufacture of semiconductors make it possible to supply an abrasive containing a minimized amount of abnormally agglomerated particles to the surface of an object to be polished in the manufacturing step of semiconductors and improve the yield of polished products.

Abstract: A cleaning system 210 having nozzle assembly 10 for a pressured fluid stream entrained with abrasive that includes a pressured fluid receiving portion 15 adapted to accommodate a pressured fluid dispenser 20. An abrasive entrainment chamber 25 is oriented to accept pressured fluid jetted thereacross from the pressured fluid dispenser. The abrasive entrainment chamber is adapted to establish a venturi suction responsive to pressured fluid being jetted thereacross. An access port 30 is provided in fluid communication with the abrasive entrainment chamber for permitting suction of abrasive into the abrasive entrainment chamber for entrainment in a pressured fluid being jetted thereacross. A spray enclosure 35 is positioned at the abrasive entrainment chamber and oriented to receive pressured fluid dispensed from the pressured fluid dispenser at the pressured fluid receiving portion.

Abstract: A polishing solution supply system can prevent precipitation of solutes on delivery pipes or interior walls of holding tanks so that a polishing solution of a constant solution concentration can be supplied to a polishing tool. The polishing solution supply system includes a stock solution supply source, a dilution solution supply source, and a mixing section for mixing a stock solution and a dilution solution to formulate the polishing solution. The mixing section is sealed hermetically to exclude external atmosphere. Delivery lines deliver the polishing solution to each of plural polishing sections.

Abstract: A disposable apparatus for propelling particulate matter against a surface of a target material includes, a mixing chamber having a chamber wall, a multi-conduit receiving port, a propellant-gas receiving conduit, a discharge conduit, and a flow through conduit. The gas delivery conduit extends from the propellant-gas receiving port into the chamber, a mixture discharge conduit extending from the mixture discharge port into the chamber, and a quantity of particulate matter inside the chamber. The flow through conduit(s) provide a means for transferring flow from the multi-conduit receiving port through the discharge wall to exit proximate the exit of the discharge port.

Abstract: A self-contained device is disclosed for directing a fluid stream containing particulate matter against a surface to abrade, etch, erase, cut, smooth, clean, polish and harden the surface. In tile preferred embodiments of the invention, the particulate matter is contained within the device and a carrier fluid, under pressure, introduced therein and mixes with the particles to produce a fluid stream that can be delivered to a target surface. The device can be powered and/or energized by a source of compressed gas which is coupled to the device through a fixture designed for that purpose. The invention also includes a method for delivery of a particle stream, under pressure, to a target surface, and, to tile selective modification of tile target surface depending upon the hardness of the particle, the velocity of impact thereof and the extent of the exposure of the target surface to tile particle stream.

Abstract: A granule dishwashing apparatus with easily removable granule collectors and method of use. The dishwashing apparatus consists primarily of a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture consisting of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture at some point using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. In a multiple collector system, the granule collectors are connected to actuators so that the collectors can be placed in a release mode or a collect mode depending on the function desired.

Abstract: The invention provides an apparatus and method for continuously delivering ice particulates at high velocity onto a substrate for treating the surface of the substrate. The apparatus includes a refrigerated curved surface that is brought into contact with water to form a thin, substantially uniform, ice sheet on the surface. This ice sheet is of such thickness as to contain stresses so that the sheet is predisposed to fracture into particulates. A doctor-knife is mounted to intercept a leading edge of the ice sheet and to fragment the ice sheet to produce ice particulates. These ice particulates enter into at least one ice-receiving tube that extends substantially along the length of the doctor-knife. Once in the tube, the ice particulates are fluidized by a constant flow of air and are carried into a hose for delivery through an ice-blasting nozzle under pressure.

Abstract: A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the first component in the mixture, and applying the mixture to the first layer. A chemical-mechanical polishing (CMP) system (100) for use in the method includes a vessel (110) having a first input port (111), a CMP slurry output port (113), and a CMP slurry sensing port (114). The CMP system also includes a refractometer (150) adjacent to the CMP slurry sensing port.

Abstract: Systems for abrasive action include machinery for creating a vacuum and positive pressure to enable flow control while providing adequate vacuum to both retrieve and capture the spent abrasive material and the abraded material. A first embodiment includes a vacuum and boost operation facilitated by the use of a foot control for high control of abrasion, cleaning and polishing. A second embodiment is for use with human tissue and includes a vacuum only system with filtered air. A third embodiment includes vacuum with automatic boost for skilled medical personnel use and uses a minimum vacuum level to trigger a pre-set boost operation. The system utilizes air filtration, ultra violet, heat oven sterilization and secure waste storage. A manual contact tool is used closely with the area to be abraded supplanting any other control other than the pressing of the manual contact tool against the surface to be abraded, to create sufficient vacuum to trigger boost operation.

Abstract: This invention is related to the cleaning of surfaces using the hydroblasting technique, where the surface to be cleaned is exposed to a cleaning fluid mixture of liquid and abrasives which is ejected under high pressure. More particularly, this invention is related to hydroblasting apparatus and methods for providing abrasive hydroblasting cleaning fluid which do not require the direct pumping of the abrasive component of the mixture thereby greatly increasing the operating life of the high pressure hydroblasting pump. A single reactor technique is disclosed for making, and delivering under pressure, abrasive hydroblasting cleaning fluid made by nucleation of hydrolyzed solution. A multiple tube embodiment of the invention is also disclosed, as well as supplemental nucleation means and means for controlling the temperature of the nucleation process.

Abstract: A method and apparatus for sensing a pierce-through condition of a material made by a piercing force in which a shield surrounding a source of the piercing force is supplied with a gas supply to create a pressure within the shield means. A decrease in pressure caused within the shield by a pierce-through condition created by the piercing force is then detected. A method and apparatus for detecting the distance between a nozzle assembly for a machining process and a workpiece to be machined in which gas is supplied to a shield surrounding a nozzle assembly. An increase in pressure in the shield is detected as an open end of the shield approaches a workpiece to be machined. A method and apparatus for obtaining and maintaining a predetermined gap distance between nozzle assembly and a workpiece for a machining process are provided by further detecting when the pressure within the shield means reaches a pressure corresponding values and ranges.

Abstract: Systems for abrasive action include machinery for creating a vacuum and positive pressure to enable flow control while providing adequate vacuum to both retrieve and capture the spent abrasive material and the abraded material. A first embodiment includes a vacuum and boost operation facilitated by the use of a foot control for high control of abrasion, cleaning and polishing. A second embodiment is for use with human tissue and includes a vacuum only system with filtered air. A third embodiment includes vacuum with automatic boost for skilled medical personnel use and uses a minimum vacuum level to trigger a pre-set boost operation. The system utilizes air filtration, ultra violet, heat oven sterilization and secure waste storage. A manual contact tool is used closely with the area to be abraded supplanting any other control other than the pressing of the manual contact tool against the surface to be abraded, to create sufficient vacuum to trigger boost operation.

Abstract: An improved method and apparatus for media blasting a workpiece 20 is described. The media blasting apparatus 10 of the present invention includes a media reclaim and recycle system 35 , which reduces media wastage, advantageously improves peening of a workpiece 20 and provides better coverage of the workpiece surface. The media blasting apparatus 10 also includes a pressure chamber 90 for creating a media blast stream, a media metering valve 105 for controlling media flow rate and a powered part hold-down apparatus 130 for holding the workpiece 20 in a predetermined position during a blasting operation. The controlled media flow rate in combination with the powered hold down of the workpiece 20 ensures even and thorough peening of a workpiece surface.

Abstract: A scheme for removing foreign material from the surface of a substrate by directing a high velocity aerosol of at least partially frozen particles against the foreign material to be removed. Different schemes are described for accelerating the frozen particles to very high velocities sufficient for particle removal, removal of organic layers (e.g., hard baked photoresist or ion implanted photoresist) and removal of metallic layers. In one embodiment, liquid droplets are entrained in a high velocity gas flow and the resulting gas/liquid mixture is passed through an expansion nozzle to produce a high velocity aerosol of frozen particles. In another embodiment, frozen aerosol particles are entrained in, e.g., a sonic or supersonic gas jet before impacting a surface to be cleaned. The cleaning aerosols may be applied to substrates inside a vacuum chamber or directly from a hand-held device.

Abstract: A dual-hopper system for liquid/abrasive jet material cutting systems wherein a primary hopper provides a reservoir and source for abrasive particles for mixing with high pressure liquid, and wherein a secondary hopper is interposed between the primary hopper and the nozzle for controlling the flow of abrasive particles from the primary hopper to the nozzle. The secondary hopper comprises a vertically disposed elongated vessel with opposed end walls and with an annular divider plate interposed between the end walls. The annular divider plate is provided with an orifice in the form of an elongated tube which projects into the lower vessel chamber. Particulate material is forced through the tube into the lower chamber, and a column of particles is formed which creates a floating air lock between the chambers. Particulate falls by gravity from the lower chamber and into the cutting head.