Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A method of plugging the ends of selected ducts (5) in a ceramic structure (1). A paste (8, 9) is prepared from a powder and a liquid. The powder comprises a glass whose coefficient of expansion is close to that of the ceramic structure. The liquid comprises a solvent, a plasticizer and an additive which reduces the adherence of the paste to a paste applying tool (6, 7). The tool is used to push paste into the ends of the selected ducts and the ceramic structure is subjected to heat treatment to ensure that the paste adheres to the walls of the ducts and then becomes solid.

Abstract: Thick film dielectric compositions suitable for screen-printing comprising a substituted perovskite, an inorganic dopant, and a low temperature-devitrifiable frit or glass. Upon firing the dielectric composition is highly hermetic.

Abstract: Thick film dielectric compositions suitable for screen-printing comprising a perovskite, a bismuth-substituted pyrochlore, and a low temperature melting-devitrifiable glass. Upon firing the dielectric composition is highly hermetic.

Abstract: Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component consisting of the oxides of cadmium, zinc, barium and antimony and a glass-forming component consisting of aluminum oxide, boron trioxide and silicon dioxide; a suitable organic vehicle and, if desired, a colorant oxide.

Abstract: A method of fabricating film circuits whereby thick film crossunders may be included with thin film capacitors (22) on a single substrate (10). At least one dielectric layer (12) is formed on the crossunder electrode (11) and a layer capable of smoothing irregularities (13) is also formed in the area of capacitor formation. Firing of the capacitor underlayer is compatible with the dielectric layer. A layer such as beta tantalum (14) is formed over essentially the entire circuit and etched from the contact areas (21) of the crossunder electrode. The layer is oxidized to form a protective layer (15) for the previously deposited layers as well as an underlay for subsequently formed thin film components.

Abstract: The coatings are glass compositions which consist essentially of from 18 to 45 mol % of the alkaline oxides CaO and one or both of Na.sub.2 O and K.sub.2 O and from 5 to 22 mol % of Al.sub.2 O.sub.3, the balance being B.sub.2 O.sub.3 and SiO.sub.2 in such amounts that the molar ratio of B.sub.2 O.sub.3 : (B.sub.2 O.sub.3 +SiO.sub.2) lies in the range from 0.575:1 to 0.85:1. The molar ratio of K.sub.2 O: (K.sub.2 O+Na.sub.2 O) is from 0.4:1 to 0.6:1 and CaO is 48 to 52 mole % of the alkaline oxides.These compositions are particularly suitable for use during the heat-treatment and hot-working of titanium and its alloys.

Abstract: A glass enamel composition and the method of its manufacture for use in providing a decorative glass or ceramic article and which composition comprises a glass frit mixed with a nacreous pigment, the mixture being dispersed in an application medium and adapted to be applied to the surface of a glass or ceramic article and fired at a temperature whereat the glass composition fuses to form a decorative and esthetic surface on said article.

Abstract: A glass composition is disclosed that is useful as a solder glass for sealing components together. However, the glass is also especially adapted for use as an electric resistance film for coating the inner neck or funnel portions of a cathode ray tube to reduce arcing. The glass composition includes primarily the oxides of vanadium and phosphorous with the preferred addition of either zinc oxide or lead oxide. Still other metal oxides may be optionally included such as oxides of barium, antimony, lithium, manganese, silicon, boron, molybdenum and mixtures thereof.

Abstract: The present invention is directed to ceramic frits for use in ceramic glazes and to the glazes themselves which when fired consist essentially of:______________________________________ Constituent % by Weight ______________________________________ Alkali (K.sub.2 O, Na.sub.2 O, Li.sub.2 O) 3.5 to 6.5 ZnO 6.0 to 12.5 CaO 6.0 to 12.0 MgO 0 to 0.7 BaO 0 to 5.0 SrO 1.7 to 4.0 B.sub.2 O.sub.3 2.0 to 6.0 Al.sub.2 O.sub.3 7.0 to 12.0 SiO.sub.2 53.0 to 61.0 ZrO.sub.2 0 to 8.

Abstract: A thermal barrier coating adapted to provide a thermally insulating protective barrier on a component, the coating being capable of being applied to the components by spraying methods and being ductile when exposed to high temperatures. The coating comprises a mixture containing constituents of finely divided hollow glass microspheres; a ceramic frit of finely divided particles of alkali silicate titanate glass; and a refractory filler material of finely divided partiles such as micronized mica; aluminum oxide of mullite. All of the constituents of the mixture are suspended in a high temperature resistant binder material such as potassium silicate, sodium silicate or aluminum orthophosphate.

Abstract: This invention is directed to the production of glazes exhibiting an earthenware appearance which are particularly suitable for decorating ceramic dinnerware. The glaze composition consists essentially of about 4-8% by weight SnO.sub.2 and 4-8% by weight TiO.sub.2, the total SnO.sub.2 +TiO.sub.2 being about 10-14%, and about 0.025-0.04% by weight MnO.sub.2 incorporated into a base frit consisting essentially, as analyzed in weight percent on the oxide basis, of about______________________________________ SiO.sub.2 37-49 Al.sub.2 O.sub.3 4-7 B.sub.2 O.sub.3 6.5-11 ZrO.sub.2 0-1.75 Na.sub.2 O 1.75-3.5 K.sub.2 O 0.75-2.5 PbO 21-32 CdO 0-0.75 CaO 1-9 TiO.sub.2 0-0.35 F 0-0.6 ______________________________________The fired glaze contains crystallites of rutile and cassiterite.

Abstract: A leadless glaze composition having properties that make lead oxide containing glazes so widely used as ceramic glazes. The glazes according to this invention are prepared to analyze more than about 0.53 to about 1.5 weight percent molybdenum trioxide with the source of the molybdenum trioxide either in the frit or as a mill addition being alkaline earth molybdenate, for example, calcium molybdenate (CaMoO.sub.4).

Abstract: A process for making glazed ceramic ware by applying plastic glaze-forming compositions onto the surface, of a clay body. The plastic composition may be molded or pressed on to a clay body. Additionally, the glaze-forming composition may be formed into a slurry by addition of water and applied to the clay body. The slurry may be directly applied to the clay body or indirectly applied using a porous body such as plaster of paris. The use of deflocculants is disclosed to minimize the amount of water necessary to form the slurry.

Abstract: A solder glass suspension for sealing glass or other ceramic parts is provided having the characteristics of a reversible gel, exhibiting high viscosity during storage and after extrusion onto a sealing surface, but relatively low viscosity under shear stress during extrusion. The use of the suspension for sealing glass or ceramic parts is also described.