Abstract: A method of cleaning and/or sanitizing jewelry and other small parts includes the steps of adding a microwavable fluid into a microwavable container and placing the container into a microwave oven. The microwavable fluid is heated in the microwave oven to a temperature of at least 170° F. The container is removed from the microwave oven when the desired temperature has been reached the jewelry and/or small parts are placed into the container to submerse the jewelry and/or small parts within the heated fluid and agitated, such as by spinning the container to mechanically remove contaminants from the surface of the items being cleaned and chemically cleaned with the use of a fluid that is a cleaning fluid.

Abstract: The primary objective of the present invention is to provide a composition solution for livestock water and feed which eliminates harmful bacteria and encourages consumption. In certain embodiments, this composition solution may also remove bacteria from produce, treat water flows, process oilfield wastewater, destroy taste and odor contaminants in potable and drinking water, remove destructive contaminants from a wide range of industries, and eliminate hazardous pollutants.

Abstract: Spacer fluid compositions comprising water, a clay, and a sulfur-containing polyether surfactant are disclosed, and such compositions often can further include a weighting additive, an antifoaming additive, and a co-solvent. These spacer fluid compositions can be used to treat metal casing and to remove drilling fluid residue for improved cement bonding in wellbore applications.

Abstract: A method for bonding PEBA plastic composition with dissimilar materials. Also, composite articles made in accordance with the method. The method uses only water-borne adhesive compositions.

Abstract: Disclosed are corrosion inhibitor compounds and compositions useful in applications relating to the production, transportation, storage, and separation of crude oil and natural gas. Also disclosed are methods of using the compounds and compositions as corrosion inhibitors, particularly in applications relating to the production, transportation, storage, and separation of crude oil and natural gas.

Abstract: A photoresist and post etch cleaning solution for semiconductor wafers comprising: A. a polar aprotic solvent, B. an inorganic base; C. a co-solvent for said inorganic base; D. a unsaturated cycloaliphatic compound having a ring ether group and at least one substituent bearing a primary hydroxyl group; E. an organic base comprising an amine compound; and F. a nonionic surfactant bearing at least one ether group. The wafer containing photoresist residue or post etch residue can be cleaned by contacting the solution in a spray or immersion.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: An aqueous compressed gas aerosol formulation in combination with a lined steel can, which may also optionally be tin plated, to provide corrosion stability, fragrance stability and color stability. An aerosol formulation of particular advantage for use is an air and/or fabric treatment formulation. The combination provides a compatibility which allows for the ability to use a broader fragrance pallet for the air and/or fabric treatment formulation which is aqueous based in major proportion. The formulation includes, in addition to an aqueous carrier, a fragrance, nonionic surfactant(s) or a blend of nonionic surfactant(s) and cationic surfactant(s), a compressed gas propellant(s), pH adjuster(s), and corrosion inhibitor(s). The formulation has a pH of about 8 to less than 10. The corrosion inhibitor(s) is(are) mild in strength and used in a minor amount.

Abstract: Use of a compound of Formula (I) as a metal surface corrosion activator, a formulation containing the same compound and a process by using the same compound for providing a clean metal surface. Said formulation may further comprise water, a solvent such as a dipolar aprotic solvent, a water miscible organic solvent, or an organic base.

Abstract: The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor—Cu film, in particular, a Cu-BTA film.

Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Abstract: An aqueous detergent according to the invention contains substantially no polyalkylene glycol, but contains a salt of at least one of the following carboxylic acids A, B and C: A: an aliphatic monobasic carboxylic acid having a total carbon number of 9 or 10 and including a branched alkyl group; B: sebacic acid; and C: an aromatic monobasic carboxylic acid having a total carbon number of 11 to 13.

Abstract: A stripping solution comprises a highly corrosive acid and an iron concentration of at least about 1.0 gram per liter (g/L). The stripping solution is air agitated to remove a coating from a metal article submerged therein.

Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.

Abstract: A method of cleaning a substrate having a metal layer including copper or a copper-containing alloy, the method including cleaning the substrate using a cleaning liquid that includes a mercapto compound represented by one or both of the following formulas (1) and (2), and a solvent containing water and a water-soluble organic solvent: in which R represents a substituent group; m is an integer of 1 to 3; and n is an integer of 0 to 3, when m is 2 or 3, R may be the same or different; HS—(CH2)x—OH??(2), in which x is an integer of no less than 3.

Abstract: A multi-phase surface cleaning composition. A first phase comprises an acidic cleaning formulation. A second phase comprises an alkaline cleaning formulation. The second phase includes a synthetic clay component.

Abstract: The present invention relates to a low VOC hard surface cleaning composition comprising a surfactant, a glycol ether organic solvent, an aminoalcohol and fragrance, having a pH from 10.0 to 12.0. The present invention further encompasses a process to prepare a low VOC hard surface cleaning composition. Furthermore, the present invention encompasses a process of cleaning a hard surface with a low VOC hard surface cleaning composition.

Abstract: The present invention includes methods and compositions that employ sodium carboxymethyl cellulose as a scale inhibitor. According to the invention, scale inhibiting compositions are disclosed which include, sodium carboxymethyl cellulose and a polymer such as polymaleic acid, polyacrylic acid or mixtures, copolymers or terpolymers of the same and optionally may also include a phosphonate. The scale control composition may be incorporated into a detergent/cleaning composition.

Abstract: A composition for dissolving and/or inhibiting deposition of scale on a surface of a system comprises an acidic component, a wetting agent, and a corrosion inhibitor. The composition may further comprise water. The acidic component comprises an alkanesulfonic acid, e.g. methanesulfonic acid (MSA). The wetting agent comprises a surfactant. The corrosion inhibitor comprises an amphoteric surfactant. The alkanesulfonic acid is present in an amount of at least about 50 weight percent (wt %), the surfactant is present in an amount of from about 0.1 to about 30 wt %, and the amphoteric surfactant is present in an amount of from about 0.025 to about 20 wt %, each based on 100 wt % of the alkanesulfonic acid, the surfactant, and the amphoteric surfactant combined. A method of dissolving and/or inhibiting deposition of scale on the surface of the system comprises the step of contacting the surface of the system with the composition.

Abstract: A method of conditioning the surface of a work piece, particularly of a strip or sheet, more particularly of a lithostrip or lithosheet, including an aluminum alloy is provided. The method for conditioning the surface of a work piece and a work piece including an aluminum alloy enabling an increasing manufacturing speed in electro-chemically graining and maintaining at the same time a high quality of the grained surface, includes a conditioning method which comprises at least the two steps, degreasing the surface of the work piece with a degreasing medium and subsequently cleaning the surface of the work piece by pickling.

Abstract: Disclosed herein is a cleaning solution composition for a solar cell, comprising: organic alkali compounds, water-soluble glycol ether compounds, percarbonates, organic phosphoric acids or salts thereof, and water.

Abstract: A novel cleaner and polish formulation that is eco friendly, that is, it is formulated without alcohols, organic solvents and without normal cleaning and polishing components, for example, amine functional materials, that are undesirable with regard to the environment.

Abstract: A detergent resistant car polish composition includes an alkoxy aminofunctional dialkylpolysiloxane, a long chain silicone quaternary blend, a silicone fatty amino quaternary polydimethylsiloxane, a carboxylic acid, a surfactant, a cosurfactant, and water.

Abstract: The present invention is directed to a metal cleaner polisher and anti-tarnish solution which comprises the following ingredients per 32 fluid ounces: 5.00 to 10.00 percent mineral spirits by volume; 1.50 to 4.50 percent ethanol by volume; 0.50 to 1.50 percent ammonia by volume; 0.50 to 1.50 percent thiourea by volume; 0.25 to 1.00 percent sulfamic acid by volume; less than 0.20 percent disodium cocoampho-diproprionate by volume; and deionized water. Optionally, the following ingredients may be added individually, in any combination or all together: thickening/suspension agents; abrasive additives; and a modifying/stabilizing agent; and optionally varying amounts of fragrance and colorizing agents.

Abstract: A method of conditioning the surface of a work piece, in particular of a litho-strip or litho-sheet, consisting of an aluminum alloy enables an increase in manufacturing speed in surface roughening while maintaining a high quality of the electro-chemical grained surface of the work piece with relative low effort related to facility equipment. The method of conditioning comprises at least the step of degreasing the surface of the work piece with a degreasing medium, wherein the degreasing medium contains at least 1.5 to 3% by weight of a composite of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3-8% of a composite of non-ionic and anionic surfactants and optionally 0.5 to 70% soda, wherein sodium hydroxide is added to the degreasing medium such that the concentration of sodium hydroxide in the aqueous degreasing medium is 0.01 to 5% by weight.

Abstract: The compositions and methods for the removal of residues and contaminants from metal or dielectric surfaces comprises at least one alkyl diphosphonic acid, at least one second acidic substance at a mole ratio of about 1:1 to about 10:1 in water, and pH is adjusted to from about 6 to about 10 with a metal ion free base, and a surfactant. Particularly, a composition and method of cleaning residues after chemical mechanical polishing of a copper or aluminum surface of the semiconductor substrates.

Abstract: The present invention relates to a composition having tarnish-removing and soil-removing and preventing properties for cleaning a metal surface and methods of using the compositions.

Abstract: The present invention generally relates to a biodegradable lubricating wipe, such as wet wipes. The wet wipes typically being fibrous sheet materials, pre-moistened with a solution for improved lubrication and/or protection of an area. In one embodiment the solution is comprised of a bio-based lubricant, a bio-based solvent and water. In one embodiment, the solution is comprised of mineral spirits and refined soybean oil. In another embodiment the solution is comprised of soy methyl ester and refined soybean oil. In yet another embodiment, the fibrous sheet material of the invention is biodegradable and the solution portion breaks down into a vaporizing component and a biodegradable carrier portion.

Abstract: A method of dissolving and/or inhibiting the deposition of scale on a surface of a system comprises the step of bringing the surface of the system into contact with a composition. The composition can comprise from about 3 to about 15 parts by weight of a chelating component. The chelating component is selected from the group of MGDA, NTA, HEDTA, GLDA, EDTA, DTPA, and mixtures thereof. The composition can further comprise from about 3 to about 15 parts by weight of an acidic component, which is different than the chelating component. The composition can further comprise at least about 60 parts by weight of water. Each of the parts by weight ranges above are based on 100 parts by weight of the composition. The composition may further comprise a surfactant component and/or a corrosion inhibitor.

Abstract: The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Abstract: The present invention relates to corrosion inhibitor systems, in particular to cleaning and corrosion inhibiting compositions for surfaces of aluminum or colored metals and alloys thereof under alkaline conditions, especially in the food and pharmaceutical industries. The cleaning and corrosion inhibiting compositions comprise as a corrosion inhibitor at least one alkyleneoxy alkylphosphate di- or triester having the general formula where Z is either —O-M or —O-(AO)n2-Alkyl wherein M is an ammonium, alkali metal or alkaline earth metal cation, Alkyl is a C5-C22 alkyl or alkylaryl group, AO is a C2-4-alkylene oxide unit and n1, n2 and n3 each are integers from 2 to 10.

Abstract: The present invention discloses an improved cleaning composition for cleaning metal surfaces such as aluminum and aluminum-containing alloys. The cleaning composition of the present invention comprises water and an ethoxylate of an alcohol having Formula R1—OH wherein R1 is a saturated or unsaturated, straight-chain or branched aliphatic having from 12 to 80 carbon atoms; an inorganic pH adjusting component; and at least one surfactant that is different than the ethoxylate set forth above. The cleaning composition of the present invention also has an average water-break-free percent reduction of less than 50% after 7 days aging of a working composition prepared from the cleaning composition. The present invention also provides a method of cleaning a metal surface with the cleaning composition of the invention.

Abstract: A method of conditioning the surface of a work piece, particularly of a strip or sheet, more particularly of a lithostrip or lithosheet, including an aluminum alloy is provided. The method for conditioning the surface of a work piece and a work piece including an aluminum alloy enabling an increasing manufacturing speed in electro-chemically graining and maintaining at the same time a high quality of the grained surface, includes a conditioning method which comprises at least the two steps, degreasing the surface of the work piece with a degreasing medium and subsequently cleaning the surface of the work piece by pickling.

Abstract: The compositions and methods herein relate to the method for the removal of residues and contaminants from metal or dielectric surfaces. Particularly, a composition and method of cleaning residues after chemical mechanical polishing of a copper or aluminum surface of the semiconductor substrates.

Abstract: The compositions and methods for the removal of residues and contaminants from metal or dielectric surfaces comprises at least one alkyl diphosphonic acid, at least one second acidic substance at a mole ratio of about 1:1 to about 10:1 in water, and pH is adjusted to from about 6 to about 10 with a basic compound, and optionally a surfactant. Particularly, a composition and method of cleaning residues after chemical mechanical polishing of a copper or aluminum surface of the semiconductor substrates. One of the embodiment is the method of using the compositions in dilution, wherein the solution may be diluted with DI water at dilution ratios, for example, of up to 1:10, up to 1:50, up to 1:100, up to 1:150, up to 1:250, and up to about 1:500 or any ratios therein.

Abstract: A chelating composition suitable for low-temperature use or storage is disclosed. The chelating compositions include 20 to 70 wt. percent of a polar solvent and 30 to 80 wt. percent of a first component of the formula: wherein R is a hydroxyalkyl group and each R? is individually selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups, carbonyl-containing alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; R? is selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups; carbonyl-substituted alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; M1 and M2 are alkali metal ions, wherein the M1 has a higher atomic weight than M2; wherein x+y=n and the mole fraction of M1 is greater than 0.70 to 1. Methods of suppressing crystallization and methods of cleaning surfaces employing the compositions described herein are also disclosed.

Abstract: The present invention relates to corrosion inhibitor systems, in particular to cleaning and corrosion inhibiting compositions for surfaces of aluminum or colored metals and alloys thereof under alkaline conditions, especially in the food and pharmaceutical industries. The cleaning and corrosion inhibiting compositions comprise as a corrosion inhibitor at least one alkyleneoxy alkylphosphate di- or triester having the general formula (I) where Z is either —O-M or —O-(AO)n2— Alkyl wherein M is an ammonium, alkali metal or alkaline earth metal cation, Alkyl is a C5-C22 alkyl or alkylaryl group, AO is a C2-4-alkylene oxide unit and n1, n2 and n3 each are integers from 2 to 10.

Abstract: A chelating composition suitable for low-temperature use or storage is disclosed. The chelating compositions include 20 to 70 wt. percent of a polar solvent and 30 to 80 wt. percent of a first component of the formula: (I) wherein R is a hydroxyalkyl group and each R? is individually selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups, carbonyl-containing alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; R? is selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups; carbonyl-substituted alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; M1 and M2 are alkali metal ions, wherein the M1 has a higher atomic weight than M2; wherein x+y=n and the mole fraction of M1 is greater than 0.70 to 1. Methods of suppressing crystallization and methods of cleaning surfaces employing the compositions described herein are also disclosed.

Abstract: The invention relates to compositions and methods of removing silicon-based anti-reflective coatings/hardmask layers.

Abstract: A method of removing metallic copper from a steel surface defining a bore or cylinder of a gun is provided. The method involves contacting the surface with a composition comprising a polyphosphonic acid, a hydroxyl-substituted primary amine, and water.

Abstract: Low-foaming industrial cleaning compositions comprising water; (A) at least one carboxylic acid; (B) one or more aromatic, water soluble or dispersible, non-ionic surfactants; and optionally, one or more of the following: (C) one or more salts of carboxylic acids selected from the group consisting of carboxylic acids that are the same as component (A), different from component (A) and mixtures thereof; and (D) an amount of hydrotrope material sufficient to produce a stable homogeneous solution or dispersion of components (A) through (C) in water; (E) a pH adjuster; (F) one or more polyhydric alcohols; and (G) one or more preservatives.

Abstract: The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition comprising alkaline hydrogen peroxide; an alkali metal meta-silicate; and a magnesium salt.

Abstract: A stripping agent composition for a resist, containing (A) 0.1 to 10% by weight of an amine; (B) 80 to 99% by weight of an organic solvent having a Hansen's solubility parameter of from 18 to 33 MPa1/2; (C) 0.01 to 3% by weight of a sugar; and (D) 0 to 5% by weight of water; a method for stripping a resist, including the step of stripping the resist with the stripping agent composition; and a method for manufacturing a semiconductor device, including the step of stripping a resist with the stripping agent composition. By using the stripping composition of the present invention, for example, a high-quality IC or LSI semiconductor device circuit, especially a compound semiconductor device circuit can be more economically advantageously manufactured.

Abstract: An oxidizing cleaning composition comprises a low concentration of aqueous hydrogen peroxide that is environmentally friendly and has good stability in strong alkaline solutions. The aqueous hydrogen peroxide composition contains a synergistic combination of one or more hydrophilic surfactants having an HLB of 10 or greater, one or more hydrotropes, one or more UV-analyzable surfactants having an aromatic detectable functional group, and optionally a surfactant having an HLB of less than 10. The cleaning composition when mixed with an alkaline compound is very effective in removing dried or baked residues of polymers, modified or natural celluloses starches, natural gels, and the like at low concentrations and temperatures.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: An oxidizing cleaning composition comprises a low concentration of aqueous hydrogen peroxide that is environmentally friendly and has good stability in strong alkaline solutions. The aqueous hydrogen peroxide composition contains a synergistic combination of one or more hydrophilic surfactants having an HLB of 10 or greater, one or more hydrotropes, one or more UV-analyzable surfactants having an aromatic detectable functional group, and optionally a surfactant having an HLB of less than 10. The cleaning composition when mixed with an alkaline compound is very effective in removing dried or baked residues of polymers, modified or natural celluloses starches, natural gels, and the like at low concentrations and temperatures.

Abstract: An acidic post-CMP cleaning composition includes at least one polyamino-polycarboxylic acid, or salt thereof; at least one hydroxycarboxylic acid, or salt thereof; and the remainder being substantially water. The acidic cleaning composition also includes a surfactant. The acidic post-CMP cleaning composition has a pH of 1 to 5, and is useful for removing the contaminants from the wafer surface after a CMP process without making roughness worse.

Abstract: A method and aqueous composition are provided for removing at least a portion of a coating from the surface of a substrate. The coating comprises an insulative material, and is contacted with an aqueous composition. The aqueous composition comprises dimethyl formamide.

Abstract: There is provided an alkaline cleaning of aluminum alloy, in which the attained corrosion resistance is equal or superior to the acidic cleaning agent, and which mitigates the disadvantages of the acidic cleaning agent, such as corrosion of plant, processing of the waste liquid, and energy cost, and which attains improved productivity. The cleaning liquid from 0.5 to 40 g/L in total of one or more alkali builders selected from alkali metal hydroxide, alkali metal carbonate, inorganic alkali metal phosphate and alkali metal silicate, from 0.2 to 10 g/L of one or more of organic phosphonic acid and its salt (A), from 0.001 to 2 g/L of one or more metallic ions (B) selected from metallic ions having from 5.0 to 14.0 of stability constant with the organic phosphonic acid and its salt, and from 0.1 to 10 g/L of surfactant. Particularly, the weight ratio of (A):(B) is in a range of from 100:0.05˜20.

Abstract: Compositions containing certain organic solvents and a fluorine source are capable of removing photoresist and etching residue.