Quaternary Ammonium Or Heavy Metal In The Component (e.g., Zn, Sn, Etc.) Patents (Class 510/259)
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Patent number: 11155770Abstract: The present invention relates to a hand dishwashing detergent composition including a surfactant system and at least one triblock co-polymer of Formula (I): (EO)x-(PO)y-(EO)x wherein each x is independently on average between about 5 and about 50.Type: GrantFiled: November 21, 2018Date of Patent: October 26, 2021Assignee: The Procter & Gamble CompanyInventors: Patrick Firmin August Delplancke, Robby Renilde Francois Keuleers, Nuray Yaldizkaya, Karl Ghislain Braeckman
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Patent number: 9441115Abstract: The present invention relates to a water-based pore sealing agent enhancing PCB coating anti-oxidation and anti-corrosion properties, consisting of, by weight, 4-12 parts of a corrosion inhibitor, 15-25 parts of a mixed surfactants system, 10-20 parts of an ion chelating agent, 6-15 parts of a pH regulator, 20-40 parts of a builder, and the rest being purified water. When used to perform pore sealing on a PCB, the water-based pore sealing agent is diluted with purified water first to be diluted 10-100 times, preferably, 100/8-100/3 times. The pH value is 7-11, and is preferably 7.5-9.5. The surface tension is 18-28 dyn/cm. The pore sealing treatment uses a immersion process, and preferably ultrasonic waves are added at the same time to assist in cleaning the pores. For the pore sealing treatment, the temperature is 20-60° C., and the time is 60-150 seconds. After pore sealing, the temperature for drying the coated piece is 80-150° C., and the time is 60-120 seconds.Type: GrantFiled: November 14, 2011Date of Patent: September 13, 2016Assignee: TANTZ ENVIRONMENTAL TECHNOLOGIES LTD.Inventors: Xiaoming Wu, Yong Lu, Hong Liu, Yinfeng Wu, Qianyuan Liu
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Patent number: 8883701Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.Type: GrantFiled: June 28, 2011Date of Patent: November 11, 2014Assignee: Air Products and Chemicals, Inc.Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
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Patent number: 8728540Abstract: Textiles coated with aqueous compositions of silane quaternary ammonium compounds and alkali metal bicarbonates are provided with deodorization properties and protection from allergens, irritants, molds, dust mites, bacteria, and fungi.Type: GrantFiled: October 26, 2011Date of Patent: May 20, 2014Assignee: Church & Dwight Co., Inc.Inventors: Steven Bolkan, Christine Beneciuk, Melvin H. Czechowski, Mark Ventura, David Stott, Nicole Nguyen, Steven T. Adamy
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Patent number: 8709168Abstract: Hard surfaces can be treated to improve soil resistance, particularly resistance to oily soils, by applying a composition of a quaternised, polyamine, polypropoxylate, polyethoxylate. The polyamine can be a polyethyleneimme, desirably having a molecular weight of from 10 to 50 kDa. The average length of the polypropylenoxy chains is desirably from 10 to 100 and the polyethylenoxy chains from 5 to 50 (each per NH group in the polyamine), particularly at a molar ratio of PO:EO of about 3:1. The degree of quaternization of the nitrogen atoms in the polyamine is desirably from 70 to 100%. The polymer will usually be used in solution in water or an aqueous formulation, which may include detergent and other detergent formulation components.Type: GrantFiled: October 4, 2010Date of Patent: April 29, 2014Assignee: Croda International PLCInventors: Alan Geoffrey Waite, Trevor Graham Blease, Sean Alexander Robins
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Patent number: 8580724Abstract: In one embodiment, a metal loss inhibitor concentrate is provided which contains water, (A) a component of dissolved organic compounds and polymers that contain at least two hydroxy moieties per molecule and an average of at least 0.4 hydroxy moieties per carbon atom; (B) a thiourea component; and (C) a dissolved component containing aryl and quaternary ammonium moieties; and, optionally: (D) a wetting agent, such as a component of an ethoxylate of an alcohol. Such solutions form useful inhibitor concentrates when combined with aqueous chelating cleaning solutions, wherein such solutions, when contacted with a metal surface, are effective in removing scale, smut and other deposits from the metal surface but exhibit a reduced tendency to attack or unduly etch the metal itself, or to inhibit the subsequent desired oxidation and dissolution of metallic copper deposits.Type: GrantFiled: December 12, 2011Date of Patent: November 12, 2013Assignee: Henkel AG & Co. KGaAInventors: David R. McCormick, Ronald F. Dubs
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Patent number: 8460477Abstract: A cleaning composition including an ethoxylated alcohol and monoethoxylated quaternary amine blend, a water conditioning agent, an acid source, a solvent, and water. In one embodiment, the cleaning composition is substantially free of alkyl phenol ethoxylates. The cleaning composition is capable of removing soils including up to 20% proteins. The cleaning compositions include a biodegradable, volatile organic compound free, environmentally friendly alternative to nonyl phenol ethoxylates with substantially similar cleaning of food soils.Type: GrantFiled: August 23, 2010Date of Patent: June 11, 2013Assignee: Ecolab USA Inc.Inventors: Charles Allen Hodge, Erin Jane Dahlquist, Amanda Ruth Blattner
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Publication number: 20130109607Abstract: An anti-corrosive agent for washing of a metal with an acid, which comprises an amphoteric polymeric compound (P) having at least one cationic constituent unit (A) having a specific structure, at least one anionic constituent unit (B) having a specific structure and a specific sulfur-containing constituent unit (C).Type: ApplicationFiled: June 20, 2011Publication date: May 2, 2013Applicant: NITTO BOSEKI CO., LTD.Inventors: Hiroyuki Takayama, Yasuhito Nakata
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Patent number: 8389457Abstract: A cleaning composition including a primarily C12 quaternary functionalized alkyl polyglucoside, a water conditioning agent, an acid source, a solvent, and water. In one embodiment, the cleaning composition is substantially free of alkyl phenol ethoxylates. The cleaning composition is capable of removing soils including up to 20% proteins. The cleaning compositions include a biorenewable, environmentally friendly alternative to nonyl phenol ethoxylates and exhibit superior cleaning of food soils.Type: GrantFiled: September 22, 2010Date of Patent: March 5, 2013Assignee: Ecolab USA Inc.Inventors: Charles Allen Hodge, Erin Jane Dahlquist, Amanda Ruth Blattner
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Patent number: 8361953Abstract: The present invention is directed to rinse aid compositions with improved biodegradability that may be used in automated carwash operations to promote drying and improve the appearance of vehicles.Type: GrantFiled: February 8, 2008Date of Patent: January 29, 2013Assignee: Evonik Goldschmidt CorporationInventors: Andras Nagy, Saiid Mohammed, Dennis Parrish, Georg Schick, Ingo Hamann
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Patent number: 8354365Abstract: Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to ILD materials, and excellent removal performance in relation to a resist film and a bottom antireflective coating film, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water soluble organic solvent, water, and an inorganic base. The water soluble organic solvent contains a highly polar solvent having a dipole moment of no less than 3.0 D, a glycol ether solvent and a polyhydric alcohol, and the total content of the highly polar solvent and the glycol ether solvent is no less than 30% by mass relative to the total mass of the liquid for lithography.Type: GrantFiled: January 28, 2011Date of Patent: January 15, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takuya Ohhashi, Masaru Takahama, Takahiro Eto, Daijiro Mori, Shigeru Yokoi
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Patent number: 8343903Abstract: There is disclosed a cleaning composition comprising (i) 0.1 to 10 percent by weight of the cleaning composition of a biofilm removing detergent solution comprising a combination of an alkyl (C8-18) polysaccharide, a non-ionic surfactant and a nitrogen containing surfactant-biocide (ii) 2 to 80 percent by weight of the cleaning composition of one or more polar solvent (iii) 0.5 to 15 percent by weight of the cleaning composition of one or more primary amine (iv) two or more chelating agents (v) 0.1 to 5.0 percent by weight of the cleaning composition of an alkaline buffer system providing a pH of about 11.5 to 13.3 in aqueous solution (vi) 0.005 to 5.0 percent by weight of the cleaning composition of an alkoxyaminosilane. Also disclosed is a process of cleaning, decontaminating and/or passivating metallic surgical instruments and/or equipment using the composition of the invention.Type: GrantFiled: July 16, 2009Date of Patent: January 1, 2013Assignee: Whiteley Holdings Pty LtdInventor: Reginald Keith Whiteley
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Publication number: 20120316097Abstract: A detergent composition for metal according to the present invention contains a specific non-ionic surfactant, a specific nitrogen-containing organic compound, a specific carboxylic acid or salt thereof, and a specific alkanol amine, and has a pH of at least 9 that is measured at 25° C. when the detergent composition is diluted to 1% by mass of an aqueous solution. According to the present invention, the detergent composition for metal having excellent corrosion inhibition properties, excellent effluent treatment properties, excellent foaming suppressing properties and excellent liquid stability in addition to high detergent properties for metal, can be provided.Type: ApplicationFiled: February 23, 2011Publication date: December 13, 2012Applicant: LION CORPORATIONInventors: Shigeru Maeyama, Kei Tamura, Akira Shinohara, Keita Someya
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Patent number: 8278258Abstract: An acid inhibitor concentrate is provided which contains water, at least one polyamino-aldehyde resin such as a quaternized polyethylenepolyamine-glyoxal resin, and at least one compound selected from the group consisting of acetylenic alcohols, ethoxylated fatty amines, ethoxylated fatty amine salts, and aldehyde-releasing compounds (such as hexamethylenetetramine). Such concentrates form useful metal cleaning and pickling solutions when combined with aqueous acid, wherein such solutions, when contacted with a metal surface, are effective in removing scale, smut and other deposits from the metal surface but exhibit a reduced tendency for the aqueous acid to attack or etch the metal itself.Type: GrantFiled: August 22, 2008Date of Patent: October 2, 2012Assignee: Henkel AG & Co. KGaAInventors: David R. McCormick, Thomas S. Smith, II
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Patent number: 8206509Abstract: Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to tungsten, and excellent removal performance in relation to a resist film or the like, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water-soluble organic solvent, water, an inorganic salt and an anti-corrosion agent represented by a general formula (1) below. In the general formula (1), R1 represents an alkyl group or an aryl group having 1-17 carbon atoms, and R2 represents an alkyl group having 1-13 carbon atoms.Type: GrantFiled: December 1, 2010Date of Patent: June 26, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takahiro Eto, Takuya Ohhashi, Masaru Takahama, Daijiro Mori, Akira Kumazawa
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Patent number: 8148318Abstract: The present invention relates to home or fabric care compositions comprising certain dye-polymer complexes. Additionally, methods for coloration of home or fabric care compositions using said dye-polymer complexes are disclosed.Type: GrantFiled: September 4, 2008Date of Patent: April 3, 2012Assignee: BASF SEInventors: Zhiqiang Song, Bingham Scott Jaynes, Joseph Anthony Lupia, Xian-Zhi Zhou
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Publication number: 20120021963Abstract: A biodegradable concentrated neutral detergent composition comprises various chelate compounds, various corrosion inhibitors, an alkaline compound, at least one sequestrant, various surfactants and hydrotropes, and water. The detergent can be highly concentrated, has a good long term shelf life, and when diluted is very effective in cleaning metals such as surgical instruments and prevents corrosion resistance of the metal even in a hard water environment.Type: ApplicationFiled: June 29, 2011Publication date: January 26, 2012Applicant: AMERICAN STERILIZER COMPANYInventors: Ann Maria Kneipp, Nancy-Hope E. Kaiser, Althea Noel Johnson
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Patent number: 8088724Abstract: A cleaning composition for a hard surface is disclosed which provides for initial cleaning of the hard surface and provision of a hydrophilic coating or barrier layer on the surface which provides residual cleaning to the hard surface for an extended number of rinsings. The composition includes a hydrophilic polymer, at least one nonionic surfactant, at least one solvent, an acid and water, wherein the acid provides the composition with a pH of about 2 to 3.5 and the composition is provided in the absence of any anionic, cationic or amphoteric surfactant.Type: GrantFiled: May 18, 2010Date of Patent: January 3, 2012Assignee: S.C. Johnson & Son, Inc.Inventors: Robert D. Iverson, Francis J. Randall, Richard W. Avery, John R. Wietfeldt, Ashish Taneja, Tantiboro S. Ouattara
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Patent number: 7947633Abstract: Viscoelastic compositions are disclosed herein containing an effective amount of one or more random or structurally defined polycationic quaternary ammonium compounds for controlling the viscoelasticity of the composition. In at least one aspect, the present technology provides polycationic quaternary ammonium compounds comprising dissymmetric bis-quaternary compounds. In another aspect, the present technology provides viscoelastic compositions comprising polycationic quaternary ammonium compounds that comprise dissymmetric bis-quaternary compounds. In yet another aspect, the present technology provides polycationic quaternary ammonium compounds comprising a carboxylate functional polycationic quaternary ammonium compound. Preferred viscoelastic compositions of the present technology maintain viscoelasticity at a temperature greater than about 80° C., preferably greater than about 100° C. or about 110° C.Type: GrantFiled: July 29, 2010Date of Patent: May 24, 2011Assignee: Stepan CompanyInventor: Paul Knox
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Patent number: 7851427Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.Type: GrantFiled: February 1, 2010Date of Patent: December 14, 2010Assignee: Dynaloy, LLCInventors: Kimberly Dona Pollard, Michael T. Phenis
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Patent number: 7772165Abstract: Viscoelastic compositions are disclosed herein containing an effective amount of one or more random or structurally defined polycationic quaternary ammonium compounds for controlling the viscoelasticity of the composition. In at least one aspect, the present technology provides polycationic quaternary ammonium compounds comprising dissymmetric bis-quaternary compounds. In another aspect, the present technology provides viscoelastic compositions comprising polycationic quaternary ammonium compounds that comprise dissymmetric bis-quaternary compounds. In yet another aspect, the present technology provides polycationic quaternary ammonium compounds comprising a carboxylate functional polycationic quaternary ammonium compound. Preferred viscoelastic compositions of the present technology maintain viscoelasticity at a temperature greater than about 80° C., preferably greater than about 100° C. or about 110° C.Type: GrantFiled: April 7, 2008Date of Patent: August 10, 2010Assignee: Stephan CompanyInventor: Paul Knox
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Patent number: 7741265Abstract: A cleaning composition for a hard surface is disclosed which provides for initial cleaning of the hard surface and provision of a hydrophilic coating or barrier layer on the surface which provides residual cleaning to the hard surface for an extended number of rinsings. The composition includes a hydrophilic polymer, at least one nonionic surfactant, at least one solvent, an acid and water, wherein the acid provides the composition with a pH of about 2 to 3.5 and the composition is provided in the absence of any anionic, cationic or amphoteric surfactant.Type: GrantFiled: August 14, 2007Date of Patent: June 22, 2010Assignee: S.C. Johnson & Son, Inc.Inventors: Robert D. Iverson, Francis J. Randall, Richard W. Avery, John R. Wietfeldt, Ashish Taneja, Tantiboro S. Ouattara
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Patent number: 7655608Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.Type: GrantFiled: October 30, 2007Date of Patent: February 2, 2010Assignee: Dynaloy, LLCInventors: Kimberly Dona Pollard, Michael T. Phenis
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Patent number: 7498295Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.Type: GrantFiled: July 31, 2007Date of Patent: March 3, 2009Assignee: Air Liquide Electronics U.S. LPInventors: Matthew L. Fisher, Ashutosh Misra
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Patent number: 7442675Abstract: A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a buried material, a metallic residue from the surface of a semiconductor substrate.Type: GrantFiled: June 10, 2004Date of Patent: October 28, 2008Assignees: Tokyo Ohka Kogyo Co., Ltd., Intel CorporationInventors: Shigeru Yokoi, Kazumasa Wakiya, Takayuki Haraguchi, Makarem A. Hussein, Lana I. Jong, Shan Christopher Clark
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Patent number: 7435712Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.Type: GrantFiled: October 1, 2004Date of Patent: October 14, 2008Assignee: Air Liquide America, L.P.Inventors: Ashutosh Misra, Matthew L. Fisher
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Patent number: 7199091Abstract: Recently, use is made of copper wiring as the wiring material for semiconductor devices, and of low dielectric constant films as the insulating film between the lines of wiring. In this connection, a photoresist stripper is in need which can inhibit corrosion or damage on the copper wiring or the Low-k film, and which has excellent property of removing ashed photoresist residues. The invention provides a photoresist stripper (hereinafter, referred to as the stripper of the invention) characterized in containing a tertiary amine compound, an alkaline compound, a fluoro compound, and an anionic surfactant; and a process for preparation of semiconductor devices using the stripper of the invention.Type: GrantFiled: April 19, 2005Date of Patent: April 3, 2007Assignee: Dongwoo Fine-Chem Co., Ltd.Inventor: Masayuki Takashima
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Patent number: 7186675Abstract: Surfactant combinations containing: (a) one or more alkyl ether sulfates; (b) at least one quaternary ammonium compound corresponding to formula I: in which EO is ethylene oxide, R and R? are the same or different and represent alkyl groups, n1 is 0–30 n2 is 0–30, and A is a counterion; (c) 0 to 50% of one or more alkyl and/or aryl sulfonates; (d) 0 to 15% of one or more alkyl sulfates; and (e) 0 to 20% of one or more amphoteric surfactants, and water-based cleaning composition containing such surfactant combinations.Type: GrantFiled: September 5, 2001Date of Patent: March 6, 2007Assignee: Henkel Kommanditgesellschaft auf Aktien (Henkel KGaA)Inventors: Georg Meine, Brigitte Giesen, Kerstin Ziganke, Felix Mueller, Ralf Klein, Joerg Peggau
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Patent number: 7078371Abstract: The cleaning composition of the present invention is characterized by containing N-hydroxyformamide. The cleaning composition is capable of easily removing patterned photoresist masks or resist residues remaining on substrates after the etching process or removing resist residues remaining after the etching process and the subsequent ashing process within a short period of time without causing the corrosion of wiring materials and insulating films, thereby ensuring the fine processing to provide high-precision wiring circuits.Type: GrantFiled: September 5, 2003Date of Patent: July 18, 2006Assignee: Mitsubishi Gas Chemical Company, Inc.Inventor: Kazuto Ikemoto
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Patent number: 6773873Abstract: A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic solvent, and a fluoride source.Type: GrantFiled: March 25, 2002Date of Patent: August 10, 2004Assignee: Advanced Technology Materials, Inc.Inventors: Ma. Fatima Seijo, William A. Wojtczak, David Bernhard, Thomas H. Baum, David Minsek
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Patent number: 6627587Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.Type: GrantFiled: April 19, 2001Date of Patent: September 30, 2003Assignee: ESC Inc.Inventors: Shahriar Naghshineh, Yassaman Hashemi
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Patent number: 6605584Abstract: The invention provides a, non- or minimized streaking/filming antimicrobial formulation, the cleaner containing: a. an akoxylated quaternary ammonium surfactant, present in a cleaning-effective amount; b. an alkoxylated short chain nonionic surfactant, also present in a cleaning-effective amount; c. alkanolamine as an alkalinity source, present in an amount effective to enhance soil removal in said cleaner; d. a quaternary ammonium compound in an amount present for antimicrobial efficacy; e. at least one water-soluble or dispersible organic solvent having a vapor pressure of at least 0.001 mm Hg at 25° C., said at least one organic solvent present in a solubilizing—or dispersion—effective amount; and f. the remainder, water.Type: GrantFiled: May 4, 2001Date of Patent: August 12, 2003Assignee: The Clorox CompanyInventors: Ronald A. Fong, Stephen B. Kong, David Peterson
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Patent number: 6558879Abstract: A stripping and cleaning composition for the removal of residue from metal and dielectric surfaces in the manufacture of semi-conductors and microcircuits. The composition is an aqueous system including organic polar solvents including corrosive inhibitor component from a select group of aromatic carboxylic acids used in effective inhibiting amounts. A method in accordance with this invention for the removal of residues from metal and dielectric surfaces comprises the steps of contacting the metal or dielectric surface with the above inhibited compositions for a time sufficient to remove the residues.Type: GrantFiled: September 25, 2000Date of Patent: May 6, 2003Assignee: Ashland Inc.Inventors: Darryl W. Peters, Floyd L. Riddle
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Patent number: 6503880Abstract: The present invention relates to cationic sugar surfactants with improved biodegradability that can be used as hydrotropes for surfactants, especially for nonionic alkylene oxide adducts in alkaline solutions, and as cleaners for hard surfaces. The cationic sugar surfactants contain at least one hydrocarbon group with 6-24 carbon atoms and at least one quaternary ammonium group where at least one substituent is an alkyleneoxy containing group which is connected to a saccharide residue by a glycosidic bond. They are obtained from ethoxylated quaternary ammounium compounds and reducing saccharides or alkyl glycosides.Type: GrantFiled: June 20, 2002Date of Patent: January 7, 2003Assignee: Akzo Nobel N.V.Inventors: Rolf Skold, Bodil Gustavsson
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Patent number: 6462011Abstract: This application discloses a composition for and a method of using the composition to disperse hydrocarbon based components into a liquid carrier. The composition is comprised of a lower alkyl ester of a fixed oil, such as a modified vegetable oil, in combination with at least one other compound which enhances the ability of the ester to form an aqueous emulsion which can separate and which can alter the wetting character of the ester. The method comprises contacting a material comprised of hydrocarbon based components with an effective amount of composition for a time and a temperature sufficient to disperse the material into a liquid carrier.Type: GrantFiled: January 25, 2000Date of Patent: October 8, 2002Assignee: United Laboratories International, LLCInventors: Bevan C. Collins, Larry D. Martin
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Patent number: 6462005Abstract: A cleaning agent for use in the manufacture of a semiconductor device comprising an aqueous solution containing a quarternary ammonium salt and a fluoro compound, or an aqueous solution containing a quarternary ammonium salt and a fluoro compound, as well as an organic solvent selected from the group consisting of amides, lactones, nitriles, alcohols and esters. In the semiconductor device manufacturing process, after forming a mask with a photoresist, a wiring structure is formed by dry etching of a conductive layer, wherein a protecting deposition film has been formed on side walls of the conductive layer. Use of the cleaning agent enables the protecting deposition film to be removed in a highly reliable manner with the surface of the conductive layer being decontaminated and cleaned such that no corrosion of the conductive layer occurs.Type: GrantFiled: January 5, 1995Date of Patent: October 8, 2002Assignees: Texas Instruments Incorporated, Mitsubishi Gas Chemical Company, Inc.Inventors: Hideto Gotoh, Tetsuo Aoyama, Rieko Nakano, Hideki Fukuda
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Patent number: 6448211Abstract: A composition for adding to an aqueous rinse which is applied to a ferrous metal surface after treatment of the ferrous metal surface with an aqueous acid solution is disclosed. The composition includes a base. The base is present in the composition in an amount sufficient to adjust the pH of the aqueous rinse to a value greater than 7.0 after the composition is added to the aqueous rinse. The composition also includes a salt of gluconic acid. The composition further includes a polyquaternium compound. An associated method for inhibiting stain formation on a ferrous metal surface is also disclosed.Type: GrantFiled: September 11, 2000Date of Patent: September 10, 2002Assignee: Crown Technology, Inc.Inventors: Joseph C. Peterson, Darren R. Bowman, Tucker D. Maurer
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Patent number: 6432907Abstract: The present invention relates to cationic sugar surfactants with improved biodegradability that can be used as hydrotropes for surfactants, especially for nonionic alkylene oxide adducts in alkaline solutions, and as cleaners for hard surfaces. The cationic sugar surfactants contain at least one hydrocarbon group with 6-24 carbon atoms and at least one quaternary ammonium group where at least one substituent is an alkyleneoxy containing group which is connected to a saccharide residue by a glycosidic bond. They are obtained from ethoxylated quaternary ammounium compounds and reducing saccharides or alkyl glycosides.Type: GrantFiled: February 25, 2000Date of Patent: August 13, 2002Assignee: Akzo Nobel N.V.Inventors: Rolf Skold, Bodil Gustavsson
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Publication number: 20020055066Abstract: An alkaline liquid developer suitable for development of an infrared radiation-presensitized plate for use in making a lithographic printing plate, which developer comprises at least one selected from the group consisting of amphoteric surfactants and cationic surfactants; a method for preparing a lithographic printing plate comprising the steps of imagewise light-exposing to infrared radiation, a presensitized plate for use in making a lithographic printing plate, said presensitized plate having an image-forming layer which comprises an IR-absorbing agent, and developing the light-exposed plate with an alkaline liquid developer comprising at least one selected from the group consisting of amphoteric surfactants and cationic surfactants. The alkaline liquid develper can provide a highly sharp and clear image in a lithographic printing plate without damages to the image areas, simultaneously exhibiting highly development performance to the non-image areas.Type: ApplicationFiled: August 23, 2001Publication date: May 9, 2002Inventor: Shuichi Takamiya
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Patent number: 6355605Abstract: A cleaning composition and method are provided for removing iron stains and scale from the external surfaces of duck decoys. An illustrative composition contains hydrochloric acid, stannous chloride, ammonium bifluoride, and water. The compositions are applied to the duck decoys with a pressurized sprayer to discolor and dislodge the stain and scale and thereafter the decoys are water rinsed with a garden hose or the like to remove the dislodged material.Type: GrantFiled: July 3, 2001Date of Patent: March 12, 2002Inventors: David L. Weller, Charles C. Hager, Jr.
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Patent number: 6339057Abstract: Disclosed are aqueous liquid cleaning compositions, the compositions being free of anionic surfactants and comprising: (a) linear alcohol ethoxylate; (b) amine oxide or betaine; and other, optional components, such as a cationic ammonium compound.Type: GrantFiled: August 25, 1999Date of Patent: January 15, 2002Assignee: Stepan CompanyInventors: Steven J. Knox, Arshad Malik
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Publication number: 20020000239Abstract: A stripping composition and a method of using the stripping composition to remove cured resins such as elastomeric silicone adhesive deposits from ceramic and metal surfaces of electronic modules to provide reworkability options in assembly processes including diagnostic parts, parts replacement and recovery of substrates from test vehicles is provided. The stripping compositions comprise a base preferably an organic base such as a quaternary ammonium hydroxide, a surfactant and a high boiling environmentally and chemically safe solvent such as di- or tri-propylene glycol alkyl ether. In another stripping composition, the base is used in combination with a mixture of N-alkyl pyrrolidone components, preferably an N-alkyl pyrrolidone and a N-cycloalkyl pyrrolidone. The stripping compositions are used to contact an electronic module having a cured resin such as a silicone adhesive residue deposit on the module surface to dissolve, remove or strip the deposit.Type: ApplicationFiled: September 27, 1999Publication date: January 3, 2002Inventors: KRISHNA G. SACHDEV, UMAR M. AHMAD, FAREED Y. AUDI, DANIEL G. BERGER, JOHN U. KNICKERBOCKER, CHON C. LEI
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Patent number: 6245155Abstract: A method for the removing of plasma etch residues on a substrate comprising the steps of: (i) contacting the substrate with a cleaning composition, and (ii) contacting the substrate with ozonated water. The preferred cleaning composition has a pH from 2 to 6 and comprises: (A) water; (B) at least one selected hydroxylammonium compound; and (C) at least one basic compound; and optionally (D) a chelating stabilizer; and optionally (E) a surfactant.Type: GrantFiled: April 6, 1998Date of Patent: June 12, 2001Assignee: Arch Specialty Chemicals, Inc.Inventors: Vincent G. Leon, Kenji Honda, Eugene F. Rothgery
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Patent number: 6218349Abstract: The present invention provides for a composition suitable for removing proteinaceous material comprising water, an emulsifier, a chelating agent, one or more mineral acids, and a surfactant; wherein: the emulsifier is a polyether nonionic emulsifier or an amine oxide; the chelating agent is an alkylaminophosphonic acid, a hydroxyalkylphosphonic acid, or an alkylphosphonic acid carboxylic acid; the one or more mineral acids are present in an mount such that the pH of the composition is less than about 4.Type: GrantFiled: March 17, 2000Date of Patent: April 17, 2001Assignee: Ecolab, Inc.Inventors: Joseph I. Kravitz, Richard O. Ruhr, Michael E. Besse
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Patent number: 6200941Abstract: Fully diluted hard surface cleaners are disclosed which are particularly effective on cleaning soap scum. The cleaners contain at least 0.45 eq/kg of a dissolved anion which reacts with calcium ion to form an insoluble salt. The cleaners also contain a particular amine oxide, or a different surfactant in conjunction with a solvent. Preferred embodiments include a bleach, which provide for a cleaner which is effective on soap scum and mold and mildew.Type: GrantFiled: September 5, 1996Date of Patent: March 13, 2001Assignee: S. C. Johnson & Son, Inc.Inventors: Gary M. Strandburg, Daniel H. Haigh, John M. Gardner, Kevin J. Wagers, Erin D. O'Driscoll
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Patent number: 6194369Abstract: The invention relates to an aqueous preparation for the pickling and activation of aluminum-steel composites prior to electroless dip tinning. Specifically, the invention provides pickling/activation solutions for the pretreatment of aluminum-steel composites prior to dip tinning which comprise sulfuric acid, hexafluorosilicic acid, at least one wetting agent, at least one transition metal cation and nitrate and/or nitrite ions.Type: GrantFiled: June 25, 1999Date of Patent: February 27, 2001Assignee: Th. Goldschmidt AGInventors: Jan Eberhardt, Dieter Guhl, Frank Honselmann
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Patent number: 6191086Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound; (ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.Type: GrantFiled: December 15, 1999Date of Patent: February 20, 2001Assignee: Arch Specialty Chemicals, Inc.Inventors: Vincent G. Leon, Kenji Honda, Eugene F. Rothgery
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Patent number: 6162302Abstract: A cleaning method for a quartz substrate includes mixing a rinsing solution and mixing a cleaning solution such that the solutions are electrically conductive. The rinsing solution is carbonated and is used in more than one step within the method. The cleaning solution includes ammonium hydroxide. As a result of the electrical conductivity of the solutions, the cleaning method is less susceptible to surface damage caused by electrostatic discharge. The sequence of steps includes rinsing the quartz substrate with the carbonated rinsing solution, removing loose contaminants by a high pressure application of the cleaning solution, and removing organic contaminants in a strong oxidation environment using a solution of sulfuric acid and hydrogen peroxide. The carbonated rinsing solution is again applied, followed by another high pressure application of the cleaning solution and a final rinse with the carbonated rinsing solution.Type: GrantFiled: November 16, 1999Date of Patent: December 19, 2000Assignee: Agilent TechnologiesInventors: Nadipuram V. Vijaya Raghavan, Elaine Lai-Yee Leung
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Patent number: 6057240Abstract: A method for forming a patterned metal layer within a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed over the substrate a blanket metal layer. There is then formed over the blanket metal layer a patterned photoresist layer. There is then etched through use of a plasma etch method while employing the patterned photoresist layer as a photoresist etch mask layer the blanket metal layer to form a patterned metal layer. The patterned metal layer so formed has a metal impregnated carbonaceous polymer residue layer formed upon a sidewall of the patterned metal layer. There is then stripped from the patterned metal layer the patterned photoresist layer through use of an oxygen containing plasma while simultaneously oxidizing the metal impregnated carbonaceous polymer residue layer to form an oxidized metal impregnated polymer residue layer upon the sidewall of the patterned metal layer.Type: GrantFiled: April 6, 1998Date of Patent: May 2, 2000Assignee: Chartered Semiconductor Manufacturing, Ltd.Inventors: Mei-Sheng Zhou, Jian-Hui Ye, Simon Chooi, Young-Tong Tsai
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Patent number: 6030932Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound;(ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.Type: GrantFiled: May 19, 1998Date of Patent: February 29, 2000Assignee: Olin Microelectronic ChemicalsInventors: Vincent G. Leon, Kenji Honda, Eugene F. Rothgery