Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofuctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper surface comprises applying the above composition to the copper surface, and polishing the surface in the presence of the composition.

Abstract: There is disclosed a cleaning liquid for producing a semiconductor device which comprises (A) fluorine-containing compound; (B) water-soluble or water-miscible organic solvent; and (C) inorganic acid and/or organic acid, optionally, further comprises (D) quaternary ammonium salt or (D') a specific organic carboxylic acid ammonium salt and/or an organic carboxylic acid amine salt; as well as a process for producing a semiconductor device by forming a resist pattern on a substrate equipped on the surface with an insulating film layer or a metallic electroconductive layer, forming a via hole or electric wiring by dry etching, removing the resist pattern by ashing treatment with oxygen plasma; and effecting an cleaning treatment with the above cleaning liquid. The above cleaning liquid and production process can readily remove the deposit polymer formed in the case of dry etching without impairing metallic film and insulating film.

Abstract: A blooming type, hard surface cleaning concentrate composition includes as a blooming system the following essential constituents: a cationic quaternary ammonium surfactant; an anionic carboxylated alcohol alkoxylate surfactant; a surfactant compatibilizing agent; and, water. Further optional constituents may also be included including additional anionic, cationic, nonionic, amphoteric and zwitterionic surfactants especially to provide a further detersive effect; organic solvents such as alcohols, ethers, glycol ethers to aid in stain solubilization, as well as conventional additves such as coloring agents including dyes, fragrances, and others. In preferred embodiment, the concentrate compositions and cleaning compositions also provide a germicidal effect to hard surfaces. The cleaning concentrates exhibit a charateristic bloom when admixed to a larger volume of water, yet are substantially clear and shelf stable as concentrate compositions.

Abstract: A process for inhibiting the corrosion of silver in a dishwashing detergent solution by adding to the solution an inorganic redox-active substance.

Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: An improved compound for use as a spray wax and drying aid in automatic vehicle-washing devices. The invention includes an olefin constituent having the general structural formula: ##STR1## wherein R.sub.1 is an alkyl group having between 4 to 28 carbon atoms and a first emulsifier having a cationic constituent. Certain preferred embodiments include a second emulsifier and a coupling agent.

Abstract: An pre-spotting composition which comprises by weight percent of about 0.1 to about 15 wt. % of ?(R).sub.3 N.sup.+ R'(OH).sup.- ! wherein R is a methyl or ethyl group, R' is an alkyl or ethoxylated alkyl group having about 10 to about 20 carbon atoms and water and optionally an alkali metal silicate, a cyclic nitrogen containing compound; an alknolamine; and a surfactant.

Abstract: A metal cleaning composition useful in an aqueous solution comprises an alkali metal salt and a corrosion inhibitor. The corrosion inhibitor is provided in the form of zinc phosphate compounds such as zinc orthophosphate.

Abstract: An aqueous and acidic stripping and cleaning composition is provided which contains a polyhydric alcohol, ammonium fluoride, dimethylsulfoxide and water. The pH of the composition is greater than about 4 but less than 7. Also provided is a method of stripping and cleaning utilizing the compositions of the invention. Optionally, the composition may contain a phosphate buffer.

Abstract: A metal cleaning composition useful in aqueous solution comprises an alkalinity providing agent and a corrosion inhibitor comprising magnesium ions, zinc ions or both. The corrosion inhibitor is provided in the form of magnesium or zinc compounds such as magnesium oxide or water soluble salts thereof.