Abstract: Surfactant mixtures based on acyloxyalkanesulfonates prepared by reacting more than one mole of one or more fatty acids with one mole of a mixture of alkali metal and/or alkanline earth metal hydroxyalkanesulfonate and ammonium hydroxyalkanesulfonate in the presence of an esterification catalyst at a temperature from 100 to 260.degree. C.

Abstract: An aqueous-based, pleasant tasting, non-toxic bubble-making composition of at least one surfactant, at least one bubble-stabilizer functionally compatible with the selected surfactant(s) and other constituents of the composition, appearing in quantities relative to each other and the composition as a whole sufficient to produce bubbles of the desired form, size and stability but non-toxic if consumed orally in substantial quantities by a child, and at least one taste-enhancing agent functionally compatible with the composition as a whole in quantities relative thereto to produce a bubble-making composition which is relatively pleasant tasting.

Abstract: An aqueous hard surface cleaner with improved soil removal is provided and has, as components, the following:(a) either a nonionic or amphoteric surfactant with optionally, a quaternary ammonium surfactant, the total amount of the surfactants being present in a cleaning effective amount;(b) at least one water-soluble or dispersible organic solvent having a vapor pressure of at least 0.001 mm Hg at 25.degree. C., present in a solubilizing--or dispersion--effective amount;(c) Ammonium ethylenediamine--tetraacetate (ammonium EDTA) as a chelating agent, present in an amount effective to enhance soil removal in said cleaner, and(d) the remainder, water.

Abstract: A cleaning liquid for semiconductor devices comprising 1.0 to 5% by weight of a fluorine compound of the formula R.sub.4 NF, wherein R is a hydrogen atom or a C.sub.1 -C.sub.4 alkyl group, 72 to 80% by weight of an organic solvent soluble in water, and the remaining amount being water. The cleaning liquid can rapidly and completely at a low temperature remove resist residues left remaining after dry etching and ashing in the wiring step in the production of semiconductor integrated circuits, and the cleaning liquid does not corrode wiring materials.

Abstract: The present invention comprises a new, improved class of anionic gemini surfactants consisting of two hydrophilic groups and two hydrophobic moieties joined by a bridge that possess improved surfactant functionalities yet may be characterized as mild for use in personal care products and environmentally benign. These compounds may be represented by the general structural formula as follows: ##STR1## wherein R, R.sub.1, R.sub.2, and R.sub.3 are selected from the group consisting of straight or branched chain C.sub.1 to C.sub.22 alkyl, aryl or hydrogen, and each R moiety can be the same or different; R.sub.4 and R.sub.5 are selected from the group comprising a straight or branched chain C.sub.1 to C.sub.6 alkyl with the further proviso that when either is a C.sub.6 it may exist as a cyclohexyl ring; R.sub.6 and R.sub.7 are selected from the group consisting of straight or branched chain C.sub.2 to C.sub.6 alkyl or aryl with the further proviso that R.sub.6 and R.sub.

Abstract: Automatic dishwashing detergent compositions comprising a mixed surfactant system comprising low cloud point nonionic surfactant and charged surfactant selected from anionic surfactants, zwitterionic surfactants, and mixtures thereof

Abstract: An aqueous, coal dust suppression fluid comprising one or more surfactants and at least one high terpene-containing natural oil. The coal dust suppression fluid can be used in a formulation of water dosed with the aqueous dust suppression fluid for the abatement of coal dust. A method is described for the abatement of coal dust using the formulation.

Abstract: An aqueous dust suspression and dewatering fluid comprising one or more surfactants and at least one high terpene-containing natural oil. The fluid can be used in a formulation of water dosed with the aqueous dust suspression and dewatering fluid for the abatement of dust and dewatering of particulate material. Methods are described for the abatement of dust and dewatering of particulate material using the formulation.

Abstract: An aqueous hard surface cleaner with improved soil removal is provided and has, as components, the following:(a) either a nonionic or amphoteric surfactant with optionally, a quaternary ammonium surfactant, the total amount of the surfactants being present in a cleaning effective amount;(b) at least one water-soluble or dispersible organic solvent having a vapor pressure of at least 0.001 mm Hg at 25.degree. C., present in a solubilizing--or dispersion--effective amount;(c) Ammonium ethylenediamine-tetraacetate (ammonium EDTA) as a chelating agent, present in an amount effective to enhance soil removal in said cleaner; and(d) the remainder, water.

Abstract: A cleaning process which comprises contacting a printed circuit board to which a residue of a flux is attached with a cleaning composition containing a first solvent and an organic compound, and then with a second solvent. The first solvent is an aliphatic hydrocarbon solvent having 5 to 20 carbon atoms. The organic compound is a 1-alkyl-2-pyrrolidone having 3 to 18 carbon atoms, a tri-alkylphosphine oxide having 3 to 8 carbon atoms or a di-alkylsulfoxide having 3 to 8 carbon atoms. The organic compound is in an amount of 10 to 300 g per liter of the hydrocarbon solvent. The cleaning composition does not contain a halogen compound.

Abstract: Disclosed are hair conditioning compositions, including hair rinse and shampoo compositions, containing a silicone fluid hair conditioning compoentn with improved efficiency through the use of silicone resins, wherein the weight ratio of the silicone fluid component to silicone resin is from about 4:1 to about 400:1.

Abstract: An aqueous and acidic stripping and cleaning composition is provided which contains a polyhydric alcohol, ammonium fluoride, dimethylsulfoxide and water. The pH of the composition is greater than about 4 but less than 7. Also provided is a method of stripping and cleaning utilizing the compositions of the invention. Optionally, the composition may contain a phosphate buffer.

Abstract: An alkaline degreasing aqueous solution containing 0.01 to 10 g/l of a nonionic surface-active agent, and an organic substance exhibiting water solubility or water dispersibility at a pH value of at least 8, having a phenolic hydroxyl group with a molecular weight of at least 500, at a weight ratio of 0.1 to 2:1=(organic substance having a phenolic hydroxyl group):(nonionic surface-active agent). The alkaline degreasing aqueous solution has a pH value of at least 8.

Abstract: A noncorrosive post-etch residue cleaning composition containing:(a) 1-70% by weight of an organic polar solvent having a dipole moment of more than 3.5;(b) 1-70% by weight of selected amine compounds having at least one hydroxyl group and a boiling point higher than 150.degree. C. at atmospheric pressure;(c) 0.1-10% by weight of selected amino acid having at least one hydroxyl group;(d) 1-20% by weight of selected redox reagent having a redox potential in the range between +1.0 V and -2.0 V vs. SHE (at pH=7); and(e) 0-90% by weight of water.

Abstract: Concentrated, structured liquid detergent compositions in the form of lamellar surfactant droplets dispersed in an aqueous electrolytic continuous phase comprises a mixture of:a) from about 10 to 45% by weight of surfactant;b) at least one detergent builder;c) from about 0.01 to about 5% by weight of a deflocculating polymer composition containing polymer chains of the structure P-QR, wherein P represents a polymer chain segment of a hydrophilic polymer, and QR represents a hydrophobic end-cap group wherein R is an organic hydrophobic radical containing from about 4 to 28 carbon atoms, and Q is selected from the group consisting of O, S, SO, SO.sub.

Abstract: A low dosage, highly dense detergent product is provided. The detergent composition comprises: (a) from about 40% to about 80% by weight of spray dried detergent granules; (b) from about 20% to about 60% by weight of detergent agglomerates having a density of at least about 700 g/l; and (c) from about 1% to about 20% by weight of adjunct ingredients. The weight ratio of the granules to the agglomerates is from about 3:1 to about 1:3 and the composition has a density of at least about 650 g/l.

Abstract: A non-aqueous photoresist stripping composition for effectively preventing the redeposition of alkali metal ions, particularly sodium and potassium ions, on a substrate during the stripping operation is disclosed. The stripping composition comprises:(a) an organic polar solvent;(b) an organic aliphatic or aromatic amine, or an organic amino alcohol; and(c) either polyethylene glycol or polypropylene glycol in an amount to provide a caging effect. The composition also preferably includes a biodegradable organic solvent.

Abstract: A polish-lacquer remover is provided that includes a volatile organic solvent, a thickening agent and an electrolyte. The most preferable combination is that of an acrylate/vinyl acetate cross polymer and 2-ethylhexyl alkyl ammonium methosulfate. Compositions of this invention are thickened but do not suffer from tacky or sticky residues upon solvent evaporation and have good lacquer removing efficacy.

Abstract: The present invention is directed to compositions useful for removing products of metal corrosion from corroded metals which consists essentially of an aqueous liquid solution of malonic acid, a surfactant and an organic solvent selected from the group consisting of formamide, dimethylformamide, and dimethylsulfoxide.

Abstract: The present invention relates to a hard surface cleaning composition comprising from about 0.1 percent by weight to about 50 percent by weight, basis the total weight of the composition, of one or more secondary alkyl sulfate compounds.