Processes Involving An Ethylenically Unsaturated Material Derived From Poly 1,2-epoxide As Reactant Or A Solid Polymer; Or Compositions Thereof Patents (Class 522/100)
  • Patent number: 4631300
    Abstract: Photocurable polyacrylate or methacrylate compounds which exhibit extremely low, neat viscosities while at the same time maintaining the high cure response of other related photocurable materials may be represented by the general formula: ##STR1## wherein R is hydrogen or methyl, R' is C.sub.1 -C.sub.8 alkyl or C.sub.3 -C.sub.8 alkyl ether alkyl and A is the residue of a diol or dicarboxylic acid, preferably, a diphenol such as Bisphenol A. The process for preparing these materials involves reacting a C.sub.1 -C.sub.8 aliphatic alcohol or C.sub.3 -C.sub.8 aliphatic ether alcohol with a diglycidyl ether or ester and esterifying the remaining hydroxyl groups with acrylic or methacrylic acid.
    Type: Grant
    Filed: September 9, 1985
    Date of Patent: December 23, 1986
    Assignee: Interez, Inc.
    Inventor: Darrell D. Hicks
  • Patent number: 4628022
    Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: December 9, 1986
    Assignee: AT&T Technologies, Inc.
    Inventors: Jose A. Ors, Richard D. Small, Jr.
  • Patent number: 4623558
    Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) poly(phenylene oxide) (PPO) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer containing at least one ethylenically unsaturated group and (c) a mixture of (a) and (b); said liquid reactive plasticizer being capable of solvating the PPO at the fluxing temperature and being present in an amount ranging from 5 to 2,000 parts per 100 parts by weight of (1); and(3) 0.01 to 10% by weight of (2) of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset after the crosslinking reaction.
    Type: Grant
    Filed: May 29, 1985
    Date of Patent: November 18, 1986
    Assignee: W. R. Grace & Co.
    Inventor: Shiow C. Lin
  • Patent number: 4585534
    Abstract: Freshly drawn optical glass fiber is protected by coating it with an ultraviolet-initiated, cationically curable liquid coating composition comprising a cationically curable polyepoxide, a polysiloxane carrying a plurality of hydroxyalkyl groups, and a photoinitiator and/or photosensitizer for an ultraviolet-activated cationic cure. The coatings are of low modulus and retain a low modulus at temperatures as low as -60.degree. C.
    Type: Grant
    Filed: April 29, 1983
    Date of Patent: April 29, 1986
    Assignee: DeSoto, Inc.
    Inventors: George Pasternack, Timothy E. Bishop, Orvid R. Cutler, Jr.