Abstract: Disclosed are radiation-curable or photopolymerizable compositions, processes for applying and curing the compositions and articles bearing a cured coating of the compositions utilizing radiation-curable compositions which contain, in addition to the typical components of radiation-curable compositions, a polymer derived from 3,4-epoxy-1-butene.

Abstract: Radiation curable adhesive comprising an epoxidized block copolymer, a saturated block copolymer and/or a rosin derived alcohol, and a photoinitiator.

Abstract: The invention relates to a binder for powder coating materials having an oligomeric or polymeric substructure which are curable thermally and/or by means of high-energy radiation, said binder comprising in each case terminally and/or laterally at least one vinyl ether group a) and at least one group b) which is different from the vinyl ether groups a) but is coreactive with said groups a), there being on average at least one vinyl ether group a) and one coreactive group b) per oligomer or polymer molecule. The invention also relates to powder coating materials comprising such a binder and to the use of said powder coating materials for coating surfaces, especially in the form of an automotive top coat and a coil coating material.

Abstract: Nonaqueous compositions comprising at least one product of the reaction between A) a linking agent of formula I R4(Y)3  (I) Wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups represent an epoxy oxygen atom, which is attached to two adjacent carbon atoms in the R4 group to form an epoxy group, and R4 is an alkanetriyl group containing from 3 to 10 carbon atoms; and B) a compound of formula II R3(EO)n(PO)m(BO)pX  (II) Wherein R3 is substituted or unsubstituted, saturated or unsaturated, organic oxy or thio group having from 1 to 36 carbon atoms or a primary or secondary amino group having from 1 to 36 carbon atoms; n is a number of from 0 to 50; m is a number of from 0 to 50; p is a number of from 0 to 50; and X is hydrogen, or X can be a mercapto group, an amino group, or a C1-C6 alkylamino group in place of a terminal —OH group, provided that when X is mercapto, amino or a C1-C6 alkylamino, the sum of n, m, and p must be at least 1; and the

Abstract: A practically excellent method for preserving a photosensitive composition Containing a photopolymerization initiator and a photopolymerizable monomer and/or oligomer, which comprises placing and preserving the photosensitive composition in a light shielding vessel, wherein the product of the void ratio (%) in the vessel and the oxygen partial pressure (hPa) in the void part is 1500 (%·hPa) or more is provided; and the method imparts remarkably improved preservation stability.

Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.

Abstract: A photosensitive resin obtained by reacting a reaction product (I) prepared from a biphenyl epoxy acrylate (a) of the formula (1) and a cyanate ester compound (b) with a polybasic acid anhydride (c), and a photosensitive resin and an epoxy compound, wherein each of R1 and R9 is a hydrogen atom or methyl, and n is an integer of 1 or more. The photosensitive resin and the photosensitive resin composition have excellent developability, has high heat resistance and particularly has excellent heat resistance and reliability on electric insulation under moisture absorption lasting for a long period of time.

Abstract: The present invention discloses an ultraviolet light curable mar resistant composition and method for making such a composition that may be used to produce an mar resistant layer. The disclosed composition does not contain any significant amount of volatile organic solvents that do not become incorporated in the active layer after curing.

Abstract: Subject

Abstract: In a process for improving the adhesive strength of radiation-cured films of acrylate resins which comprise compounds having at least one amine group and at least one unsaturated acrylate group and, in particular, an amino-modified acrylate resin having a molecular weight Mn of at least 300, on substrates, the acrylate resins are admixed with amine-hardenable polyepoxides having an epoxide value of from 1 to 15 mol/kg such as polyglycidyl esters or polyglycidyl ethers. Preferred curable mixtures of amine-modified acrylate resins with polyepoxides have amine numbers of from 1 to 250 mg KOH/g and epoxide values of from 0.1 to 4 mol/kg. The mixtures applied as coating films to metal substrates or plastics substrates, in particular, are radiation-cured with, e.g., UV light and an at least partial amine hardening of the polyepoxide compounds in the mixture is conducted by thermal conditioning at, e.g., from 50 to 120° C.

Abstract: A single component liquid heat-curable adhesive formulation that is stable at room temperature. The formulation includes from about 5 to about 70 wt % of at least one acrylate monomer, from about 5 to about 94 wt % of an acrylate oligomer, and from about 0.1 to about 10 wt % of a thermal initiator selected from the group consisting of diacyl peroxides, benzoyl peroxides and peroxy esters. A photo initiator may be included thereby rendering the stable liquid formulation to be both heat-curable and UV-curable.

Abstract: An Offset Lithographic Printing Process employing low VOC lithographic printing ink formulations containing monomeric diluents, curable by cationic polymerization in the presence of fountain solution and resin rheology modifiers compatible with cationic catalysts.

Abstract: Compositions comprising (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule; (B) at least one compound of formulas (I, II, III, IV, V or VI), wherein R1 inter alia is phenyl or alkyl; R2 is for example C2-C12alkonoyl which is unsubstituted or substituted or is benzoyl; R3, R4, R5, R6 and R7 independently of one another are for instance hydrogen, C1-C12alkyl, cyclohexyl or phenyl which is unsubstituted or substituted, or are benzyl, benzoyl, C2-C12alkanoyl or phenoxycarbonyl; R8 is for example hydrogen or C1-C12alkyl or a group (B); M is for example C1-C12alkylene, cyclohexylene or phenylene; M1 inter alia is a direct bond or C1-C12alkylenoxy; and Ar is a 5- or 6-membered aromatic heterocyclic ring; (C) a photopolymerizable reactive or unreactive diluent; and (D) as a thermosetting component an epoxy compound containing at least two epoxy groups in one molecule; are highly suitable as resists which are alkaline developable.

Abstract: A photocurable composition comprising (A) 100 parts by weight of a compound having an ethylenically unsaturated group, (B) from 0.001 to 5 parts by weight of a cationic dye having an absorption maximum wavelength in the wavelength region of from 400 to 1,200 nm represented by formula (1: D+·A1−  (1) wherein D+ represents a cation having an absorption maximum wavelength in the wavelength region of from 400 to 1,200 nm, and A1 31 represents an anion, and (C) from 0.

Abstract: A new method for crosslinking polyethylene oxide (PEO) by means of a dialkyl peroxide to form a gel, which can imbibe large amounts of water. Two separate ovens were used to crosslink PEO with the peroxide. The first oven is set at 85° C. for 2.5 minutes for melting the polymer and purging oxygen with acetone vapors and forming a shield around the sample to minimize oxygen diffusion from outside, meanwhile, trapping peroxides inside. A second oven was used to thermally decompose the peroxide. The crosslinking reaction proceeds at 160° C. for 15 minutes.

Abstract: A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol(meth)acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards.

Abstract: There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excel lent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.

Abstract: There are disclosed a frost-coating composition, which comprises (i) a hydrophobic silica particle or further comprises (ii) a polymer particle, in addition to a photocurable compound; and a frosted glass container coated with such a composition. The frosted glass container coated with such a composition is excellent in alkali resistance, or excellent both in alkali resistance and in impact resistance.

Abstract: An ultraviolet curable resin composition includes (A) an ultraviolet curable resin, (B) an epoxy compound having at least two epoxy groups in one molecule, (C) a photopolymerization initiator and (D) a diluent. The ultraviolet curable resin (A) is obtained by the steps of polymerizing an ethylenically unsaturated monomer component containing (a) an ethylenically unsaturated monomer having epoxy group and (b) a compound having at least two ethylenically unsaturated groups in one molecule to prepare a copolymer, reacting the copolymer with (c) an ethylenically unsaturated monomer having carboxyl group to prepare a chemical intermediate, and reacting the chemical intermediate with (d) one of saturated and unsaturated polybasic acid anhydrides. This resin composition will be preferably used to prepare a photo solder resist ink developable with diluted alkaline aqueous solution.

Abstract: A photocurable composition is provided which can be produced and cured by both free-radical and cationic polymerization modes, which provides a sufficient length of open time to be bonded to an adherend, and which exhibts a good adhesive property. A photocurable composition containing a compound (A) having at least one free-radically polymerizable unsaturated bond in a molecule, a compound (B) having at least one epoxy group in a molecule, a free-radical polymerization catalyst (C), a cationic polymerization catalyst (D) and a compound (E) represented by the following formula (1).

Abstract: A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.

Abstract: A novel photosensitive resistive ink composition, comprising

Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Abstract: This invention discloses compositions adapted to produce, through solid imaging means, excellent quality objects having material properties that simulate the look and feel of polypropylene articles.

Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Abstract: This invention discloses compositions adapted to produce, through solid imaging means, excellent quality objects having material properties that simulate the look and feel of polypropylene articles.

Abstract: A curable composition which comprises the following two components: (I) a vinyl polymer having at least one crosslinkable silyl group represented by the general formula (1) given below, and (II) an epoxy resin or a polyether polymer having at least one crosslinkable silyl group; —[Si(R1)2−b(Y)bO]m—Si(R2)3−a(Y)a  (1) {wherein R1 and R2 each represents an alkyl group containing 1 to 20 carbon atoms, an aryl group containing 6 to 20 carbon atoms, an aralkyl group containing 7 to 20 carbon atoms, or a triorganosiloxy group represented by the formula (R′)3SiO— (in which R′ represents a monovalent hydrocarbon group containing 1 to 20 carbon atoms and the three R's may be the same or different) and, when there are two or more R1 or R2 groups, they may be the same or different; Y represents a hydroxy group or a hydrolyzable group and, when there are two or more Y groups, they may be the same or different; a represents 0, 1, 2 or 3; b represents

Abstract: Disclosed is a photosensitive resin which can give a photosensitive resin composition having excellent heat durability and excellent developability and showing excellent heat durability and excellent electric insulation reliability in a humidified state. The photosensitive resin composition contains the above photosensitive resin which is a reaction product produced by reacting an epoxy acrylate with a cyanate ester compound to obtain a reaction product (A) and reacting the reaction product (A) with a polybasic acid anhydride, and an epoxy resin.

Abstract: This invention discloses compositions adapted to produce, through solid imaging means, excellent quality objects having material properties that simulate the look and feel of polypropylene articles.

Abstract: A photocurable resin composition suitable for photo-fabrication. The resin composition capable of being promptly cured by photo-irradiation, thereby reducing fabricating time and providing cured products having excellent mechanical strength and minimized shrinkage during curing to ensure high dimensional accuracy. The composition includes (A) an oxetane compound, (B) an epoxy compound, and (C) a cationic photo-initiator.

Abstract: A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable preferably, melt-processable resin containing an epoxy resin, an ethylene-vinyl acetate copolymer, and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The above binder precursors of the invention are preferably free of homopolymers and copolymers of olefinic monomers. In another aspect, the invention also describes an energy curable first binder precursor containing an epoxy resin, an ethylene-vinyl acetate copolymer, a polyfunctional acrylate component and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The invention also relates to a method of producing such coated abrasive articles and a surface-treated backing material.

Abstract: A radiation-curable composition in a liquid or solid form comprises at least one solid, non-crystalline radiation-transmissible material, dispersed in at least one cationic-curable or free-radical curable composition or mixture thereof. The solid, non-crystalline radiation-transmissible materials comprise glasses and other suitable materials that transmit (i.e., are transparent to) at least about 40% of radiation having a wavelength from about 180 to about 600 nanometers. The solid forms of the radiation-curable compositions of the invention are useful as powder coatings for coating decorative and functional objects and that would be cured by a thermal heating flow process followed by radiation exposure. The cured compositions of the invention are useful as coatings and inks for metal, paper, plastics, glass, ceramics, and wood, as adhesives, as sealants, and as composite materials and other articles and in biomedical and dental applications.

Abstract: The present invention relates to a process for the production of three-dimensional articles by stereolithography using a radiation-curable composition comprising a mixture of at least one cationically polymerizable compound and/or at least one free radical polymerizable compound, at least one filler material and at least one photoinitiator for cationic and/or radical polymerization. An organic viscosity stabilizer material may be brought into contact with the composition to substantially delay or prevent undesirable viscosity increase and subsequently premature polymerization. A filler material is optionally added to the composition in an effective amount to at least delay or prevent a significant increase in viscosity and polymerization. The process is particularly suitable for stabilizing resins in stereolithography baths.

Abstract: The invention relates to a thermosettable adhesive comprising a thermosettable polymer component, a thermoformable polymer component, an effective amount of a heat-activatable and/or photoactivatable curing system for curing the thermosettable polymer component, and from 0.5-20 wt. % with respect to the mass of the thermosettable adhesive of one or more hydroxides and/or hydroxyoxides of Al, Mg and/or Zr.

Abstract: This invention discloses compositions adapted to produce, through solid imaging means, excellent quality objects having material properties that simulate the look and feel of polypropylene articles.

Abstract: A UV-polymerizable formulation comprising a polymerizable formulation and an aluminum trihydrate filler with a particle size of from 1 to 10 micrometers. The formulation is intended for use in the production of coated abrasives can be used to produce a very much thicker coating if a UV-transparent filler is used.

Abstract: The invention relates to a photopolymerizable composite resin composition for dental restoration i) based on the multifunctional prepolymer mixture of 2,2-bis-(4-(2-hydroxy-3-methacryloyloxypropoxy)phenyl)propane (“Bis-GMA”) and multifunctional prepolymer formed by substituting hydrogen atoms in hydroxyl group with methacrylate groups in this Bis-GMA molecules, and ii) comprising a diluent, an inorganic filler, a photoinitiation system, and other additives. The photopolymerizable composite resin composition for dental restoration based on multifunctional prepolymer mixture has better physical and mechanical properties and biocompatibility than the conventional composition based on only Bis-GMA itself.

Abstract: An imide-based photosensitive resin composition comprised of (1) a photosensitive imidosiloxane oligomer comprised of a reaction product of an imidosiloxane oligomer having a functional group reactive with an epoxy group and an epoxy compound having a photosensitive group, (2) an isocyanate having an unsaturated bond, (3) a photopolymerization initiator, and (4) an organic solvent, an insulating film obtained by curing the same, and a process for production of such an insulating film.

Abstract: This invention relates to radiation-curable coating compositions which contain A) compounds having one or more free-radically polymerisable double bonds which additionally contain at least one further functional group reactive for the purposes of an addition and/or condensation reaction, B) compounds having one or more free-radically polymerisable double bonds, which additionally contain at least one further functional group reactive for the purposes of an addition and/or condensation reaction, wherein the additional reactive functional group is complementary to or reactive towards the additional reactive functional groups of component A), C) optionally at least one monomeric, oligomeric and/or polymeric compound having at least one functional group reactive towards the functional groups from component A) or component B) D) one or more photoinitiators as well as E) optionally solvents, water, pigments and/or extenders as well as conventional lacquer additives, wherein component A) and component B) diffe

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol (meth)acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards.

Abstract: The present invention relates to a composition for coating optical fibers which contains an oligomer capable of being polymerized, a monomer suitable to control the viscosity of the composition, and an adhesion promoter which includes a compound containing a cyclic structure interposed between at least two reactive silanes which are independently an alkoxysilane or a halosilane. Another composition of the present invention includes an oligomer capable of being polymerized, a monomer suitable to control the viscosity of the composition, an adhesion promoter which includes a compound containing a reactive silane group, and a carrier. The present invention also relates to optical fibers and methods of making such optical fibers using the compositions of the present invention.

Abstract: A bleeding or fugitive printing ink is disclosed and claimed which can be printed by the method of dry or wet offset or letterpress. This ink allows, when printed on security documents and dried, to prevent attempts of forgery or counterfeit in that the ink contains at least one dyestuff which is sensitive to organic solvents and other chemical reagents. The ink, when printed, forms a solid, polymerized or cross-linked binder matrix on the surface of the document when the printings are submitted to energy radiation, or by an oxypolymerization reaction. This matrix is formed near immediately, in the case of oxypolymerization within 24 hours, in contrast to conventional bleeding printing inks whose matrixes do not really dry and remain liquid in the interstices of the substrate.

Abstract: Disclosed is an ultraviolet-curable cellulosic coating composition comprising cellulose acetate, diepoxy compound and photo cationic polymerization catalyst. The objective is to provide a novel ultraviolet-curable cellulosic coating composition capable of forming a film excellent in the adherence to polar substrate, solvent resistance, gloss and impact resistance.

Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of an epoxy resin, acid, and tertiary amine; (B) a reactive diluent, and, optionally, (C) a curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.

Abstract: The invention concerns a novel method for preparing non-toxic resins crosslinkable under radiation in the presence of an initiator system. Said resins are prepared from compositions of an organic and/or silicon type comprising monomers, oligomers and/or polymers with organofunctional groups, and are cross-linked in the presence of an initiator system consisting of an onium salt with low toxicity whereof the cationic structure is [(CH(CH3)2—C6H4—)—I—(—R1)]+(I).

Abstract: A radiation curable resin composition capable of producing molded articles which have excellent transparency, small light-coloring resistance, high dimensional accuracy, high surface hardness, and high thermal resistance.

Abstract: This invention discloses compositions adapted to produce, through solid imaging means, excellent quality objects having material properties that simulate the look and feel of polyethylene articles.

Abstract: The present invention relates to an epoxy resin composition used for cap seal of a hard disc drive spindle motor, which hardly causes outgassing even when using in a hard disc for high-speed rotation and has high reliability. The composition comprises an epoxy resin having at least one glycidyl group in a molecule as a component (A), a monomer having at least one unsaturated bond group in a molecule (polyfunctional vinyl monomer or monofunctional vinyl monomer) as a component (B), an epoxy resin curing agent as a component (C), a photopolymerization initiator as a component (D), and a partially-esterified unsaturated epoxy resin wherein 10-90% of an epoxy equivalent of a bisphenol type epoxy resin is (meth)acrylated as a component (E).

Abstract: A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.