Abstract: A method of modifying a polymeric material whereby the polymeric material is modified to give a highly durable surface without decreasing its strength. Namely, a polymeric material is modified by the method comprising a combination of an impregnation step, an activation step, a step of grafting a monomer and a step of a treatment with a hydrophilic polymer. Thus, the hydrophilic nature, adhesiveness, and so forth of polymeric materials such as polyolefins can be improved without causing any decrease in the practical strength. The thus obtained polymeric materials are usable in articles with a need for high water absorptivity and high adhesiveness, for example, water-absorbing materials and water-retaining materials for medical, sanitary, cosmetic articles or supplies, agricultural materials, synthetic papers, filters and fiber products for clothes, for improving adhesiveness of composite materials and the like.

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Abstract: Mixtures curable thermally and with actinic radiation and containing carbamate and/or allophanate groups, comprising (A) at least one of (A1) low molecular mass compounds, oligomers and polymers containing allophanate groups, carbamate groups, and carbamate and allophanate groups, and (A2) low molecular mass compounds, oligomers and polymers containing allophanate groups, carbamate groups, and carbamate and allophanate groups, and additionally allophanate- and/or carbamate-reactive functional groups, ?which are substantially or entirely free from reactive functional groups which contain at least one bond which can be activated with actinic radiation, and (C) at least one constituent containing on average per molecule at least one reactive functional group having at least one bond which can be activated with actinic radiation; with the proviso that if only (A1) is used, the mixtures further comprise (B) at least one of low molecular mass compounds, oligomers and polymers containing allophanate- and/or c

Abstract: The present invention provides a one-bottle dental bonding composition that provides a bonding layer excellent in bonding strength, independent of the skill of the practitioners, and, more preferably, that releases fluoride ion gradually into oral cavity over an extended period of time. The one-bottle dental bonding composition comprises a radical polymerizable monomer (A) having an acidic group in the molecule, another radical polymerizable monomer (B), a photopolymerization initiator (C) and a water-soluble organic solvent (D), and is substantially free of water.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: Crosslinkable resin compositions that are cured easily by irradiation with active energy beams and particularly cured quickly with ultraviolet ray are provided, which comprises a polymer containing a maleimido group and an ethylenically unsaturated group. The composition may be an aqueous composition. They provide cured films which are excellent in durability, free from coloring and odors, and also excellent in abrasion resistance, adhesion to substrates, surface smoothness, and chemical resistance.

Abstract: A method for producing a solvent resistant, low-extractable, film from an actinic radiation curable homogenous aqueous composition containing a water soluble compound, having at least one alpha, beta-ethylenically unsaturated radiation polymerizable double bond, and water as essential components.

Abstract: A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C?C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C?C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05 ?m and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05 ?m. The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.

Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: Active water compatible actinic radiation curable printing ink or coating compositions comprised of maleimide derivatives, water compatible resins and water, which are capable of curing at a practical intensity and energy level and a method for curing same.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

Abstract: A photoactive polymer from the class of polyimides, polyamide acids and esters thereof comprises as a side-chain a photocrosslinkable group of the general formula (I) wherein the broken line indicates the point of linkage to the polyimide main chain and wherein: B is a straight-chain or branched alkyl residue which is optionally substituted, wherein one or more non-adjacent CH2 groups may independently be replaced by a group Q; D represents an oxygen atom or —NR1— wherein R1 represents a hydrogen atom or lower alkyl; and S3 represents a spacer unit. The polymers may be used as orientation layers for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.

Abstract: A method of modifying a polymeric material which comprises the steps of activation-treatment and a hydrophilic polymer-treatment, or comprises the steps of activation-treatment, a hydrophilic polymer-treatment, and monomer grafting in this order, or comprises the step of a solvent-treatment followed by these steps. Thus, the polymeric material, e.g., polyolefin, is improved in hydrophilicity, adhesion, etc. without lowering the practical strength thereof. The polymeric material thus improved in adhesion and other properties can be used in many applications where water absorption and adhesion are required, such as an absorption material, e.g., a wiping/cleansing material, a water retention material, a material for microorganism culture media, a separator for batteries (or cells), a synthetic paper, a filter medium, a textile product for clothing, a medical/sanitary/cosmetic supply, and reinforcing fibers for composite materials.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: The invention is directed to the use of multifunctional thiol compounds as adhesion promoters and/or primers to enhance the adhesion of photo or electron beam curable polymers, coatings, adhesives, or sealants to gold, other precious metals, and their alloys. Actinic radiation and electron beam (“EB”) radiation can be used to cure such compositions. The resulting cured compositions are optically clear, low Tg (≦30° C.), high refractive index (>1.50 at 1541 nm), thermally, oxidatively, and hydrolytically stable adhesives and/or coatings for glass and/or metal. The adhesive compositions containing such multifunction thiols can survive, without delamination or separation, testing conditions of 85° C. and 85% relative humidity (“RH”) for a time in excess of 500 hours.

Abstract: The present invention discloses methods for enhancing the wear-resistance of polymers, the resulting polymers, and in vivo implants made from such polymers. One aspect of this invention presents a method whereby a polymer is irradiated, preferably with gamma radiation, then thermally treated, such as by remelting of annealing. The resulting polymeric composition preferably has its most oxidized surface layer removed. Another aspect of the invention presents a general method for optimizing the wear resistance and desirable physical and/or chemical properties of a polymer by crosslinking and thermally treating it. The resulting polymeric compositions is wear-resistant and may be fabricated into an in vivo implant.

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: 1

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.

Abstract: A semiconductive member such as a semiconductive belt or a semiconductive roll used with an image formation apparatus has a portion formed of a thermoplastic elastomer composition comprising a thermoplastic resin 73 as a matrix and rubber particles 72 at least some of which have conductivity and at least some of which are cross-linked as domain.

Abstract: A photoactive polymer of the general formula I: in which: P is a photoactive group which can photoisomerise and/or photodimerise; B represents an aromatic or alicyclic group, or B further represents a nitrogen atom or —CR2—; A, C, D each independently of the other represents an aromatic or alicyclic group; M represents a repeating monomer unit in a homo- or copolymer; S1, S2, S3, S4, S5 represent a single covalent bond or a spacer unit; n1, n2 are each independently a positive integer up to 2 with the proviso that n1+n2≦2; R1 is a hydrogen atom, or a straight-chain or branched alkyl residue wherein R2 represents a hydrogen atom or lower alkyl. The photoactive polymers may be used as orientation layers for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.

Abstract: A single solution bonding formulation for dental applications comprising a plurality of at least one self-polymerizable polyvinyl acidic monomer or at least two different polymerizable polyvinyl acidic monomers, a calcium phosphate filler, at least one photoinitiator, optionally an accelerator, optionally a solvent, and optionally a fluoride additive is provided. Additionally, a method for treating enamel, dentin, and/or pulp with the same single solution bonding formulation is provided. The single solution bonding formulation provides for the release of calcium, phosphate and/or fluoride ions which are sufficient in situ to form hydroxyapatite and/or fluorapatite.

Abstract: Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.

Abstract: A UV light-curable composition comprises: (a) a first component, said first component being UV light-polymerizable polymer having a first index of refraction; and (b) a second component, the second component being UV light-polymerizable monomer having a second index of refraction, the second index of refraction being higher than said first index of refraction; wherein the first component polymerizes slower upon exposure to UV radiation than the second component.

Abstract: Disclosed is a radiation-crosslinkable thermoplastic polymer composition, a process for the preparation thereof, an angioplasty balloon made using such a composition, and a method of using the angioplasty balloon. The composition contains a reactive monomer cross-linker, that facilitates cross-linking of the reaction product upon contact of the cross-linker-containing composition with a particle beam from a radiation source.

Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.

Abstract: A radiation-curable composition is comprised of the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate. The radiation-curable composition is a liquid at room temperature and does not undergo substantial volume contraction upon curing and exhibit excellent adhesion to porous and non porous substrates alike.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: A photoactive polymer from the class of polyimides, polyamide acids and esters thereof comprises as a side-chain a photocrosslinkable group of the general formula (I) 1

Abstract: A curable composition is placed on a candle, and then the composition is exposed to curing conditions such as ultraviolet light, to thereby cure the coating composition and provide a candle having a cured coating. The curable composition may be the reaction product of TMPTA (trimethylolpropanetriacrylate), itself the reaction product of trimethylolpropane and acrylic acid) and oleyl amine (an unsaturated primary amine having eighteen carbons). The candle may be made of wax or a gelled solvent, i.e., a mixture of gellant and solvent, particularly a hydrocarbon or other low polarity solvent. The undiluted coating may be applied by spraying on the oily surface of the candle. Ultraviolet cure of the coating occurs in 1-2 seconds.

Abstract: The novel photo-cross-linkable polymers are suitable as coating materials. The photo-cross-linkable polymers contain a biphenylene unit, which can be dimerized by exposure. Attached to the biphenyl unit are side chains of a polymer with a high temperature resistance and a high chemical stability. Through exposure, the biphenylene units dimerize, whereby the polymers are spatially cross-linked.

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: In order to offer coatings with improved resistance to solvents which can be prepared by cationic polymerization under irradiation, the choice is made of a composition comprising at least one monomer, oligomer or polymer of general formula (I): in which: A1 is chosen from polyester blocks, polyurethane blocks, hydrocarbon-comprising backbones of mono- or polycarboxylic acid and addition products of a polycarboxylic acid and of a cycloaliphatic diepoxide, m is a number from 1 to 6, R1 is a cycloaliphatic group carrying a hydroxyl group situated in the a position with respect to the oxygen atom to which R1 is bonded, R2 is a second cycloaliphatic group carrying an oxirane group situated at the chain end, and B is chosen from one or more covalent bonds, an oxygen atom and linear, branched or cyclic hydrocarbon-comprising radicals.

Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: The invention relates to novel crosslinkable, photoactive polymers from the class of polyimides, polyamide acids and esters thereof, and to their use as orientation layers for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems. The polymers contain as side-chains photo-crosslinkable groups of the following formula: The broken line indicates the point of linkage to the polymer main chain. In addition, A, B each independently of the other represents unsubstituted or optionally fluoro-, chloro-, cyano-, alkyl-, alkoxy-, fluoroalkyl- or fluoroalkoxy-substituted phenylene, pyridine-2,5-diyl, pyrimidine-2,5-diyl, cyclohexane-1,4-diyl, piperidine-1,4-diyl, piperazine-1,4-diyl; C represents unsubstituted or optionally fluoro-, chloro-, cyano-, alkyl-, alkoxy-, fluoroalkyl- or fluoroalkoxy-substituted phenylene, or pyrimidine-2,5-diyl, pyridine-2,5-diyl, 2,5-thiophenylene, 2,5-furanylene, 1,4- or 2,6-naphthylene.

Abstract: New imido(meth) acrylates of general formula (1), wherein R1, R2 and R3 may be the same or different and each represents H or CH3; R4 to R7 may be the same or different and each represents H or CmH2m+1 (in which m is 1 to 6); and n represents 1 to 4, and radiation-curable compositions prepared from them, easily cured by the irradiation with radiations, particularly ultraviolet rays, to form cured compositions excellent in weather resistance, abrasion resistance and adhesion to a base, and free from the problem of odor.

Abstract: Describes polymerizing with actinic radiation a cationically polymerizable organic composition comprising (a) at least one polyfunctional thiirane having at least two groups represented by the following general formula I, 1

Abstract: Disclosed is a composition comprising a polymer with a weight average molecular weight of from about 1,000 to about 100,000, said polymer containing at least some monomer repeat units with a first, photosensitivity-imparting substituent which enables crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer also containing a second, thermal sensitivity-imparting substituent which enables further crosslinking or chain extension of the polymer upon exposure to temperatures of about 140° C.

Abstract: A polyimide represented by the following general formula (1); wherein l, m, and n represent not the order of each repeating unit, but the numbers of each repeating unit existing in the molecule, E1 is a photosensitive group, E2 is a group comprising an alkyl group having 2 to 20 carbon atoms, —A(—E1)—, —A(—E2)—, and B each are a divalent organic group, X and Y each are a tetravalent organic group, X, Y, A, B, E1 and E2 may be identical or different among the repeating units, 1 is an integer of 1 or more, m and n each are an integer of 0 or more. The polyimide and polyimide compositions comprising it has thermoreactivity as well as photoreactivity and photosensitivity.

Abstract: In one aspect the invention provides an energy efficient polymerization method comprising irradiating a polymerizable composition and a photoinitiator with a source of essentially monochromatic radiation where the photoinitiator and the wavelength of the radiation source are selected such that the extinction coefficient of the photoinitiator at the peak wavelength of the source is greater than about 1000 M−1 cm−1 and such that the photoinitiator absorbs at least two percent of the actinic radiation incident on the coating.

Abstract: A molding composition comprises (A) an aggregate, at least one of (B) an unsaturated polyester and (C) an unsaturated polyester-polyamide, and (D) a radical generator comprising a peroxide represented by formula: