Abstract: Provided are an electron beam curable resin composition including polymethylpentene, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and a molecular weight is 1,000 or less, a resin frame for reflectors using the resin composition, a reflector, and a molding method using the resin composition.

Abstract: Provided are an electron beam curable resin composition including polymethylpentene, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and a molecular weight is 1,000 or less, a resin frame for reflectors using the resin composition, a reflector, and a molding method using the resin composition.

Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition which in turn includes a volume of polymer intermixed with a number of color balloons, at least a portion of the number of color balloons each including a shell enclosing a colored agent.

Abstract: A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

Abstract: Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (?m) to 100 micron (?m) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)].

Abstract: There is provided a polymer ceramic composite which includes one or more particulate ceramics and a mixture of polymers. There is further provided methods of manufacture and application of the polymer ceramic composition. The composition finds use as a mouldable armour strike face, particularly in personal protective equipment and in vehicle or aircraft armour.

Abstract: A product and method for repairing holes and cracks in roads, parking lots, sidewalks and other similar surfaces using a mixture of powder coating (i.e. dry paint) and a filler. The first step is to obtain the powder coating material. Any suitable powder coating material may be used, however, it is preferable to use the excess or waste powder coating material obtained from a powder coating operation. The next step is to mix the powder coating material with a filler, such as sand, pea gravel, or another suitable material. After the components are mixed together, it is applied to a surface needing repair such as a pothole in a road or a crack in a sidewalk. The mixture is cured by heating the mixture to the point where the powder coating melts and binds the powder coating with the filler and the surface needing repair. It may be cured before or after it is applied to the surface needing repair. After the mixture cures, the result is a high quality patched surface.

Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber.

Abstract: A composite forming material of the present invention in which a fiberglass and a thermoplastic resin are compounded, where the fiberglass is a glass wool and a surface treatment is performed on the glass wool by spraying a solution which includes a silane coupling agent and/or a film former, a weight percent of the silane coupling agent to the glass wool is 0.24 wt %, and a weight percent of the film former to the glass wool is 2.4 wt %, the mean length of the glass wool is 600 ?m, and the diameter is 3.4 ?m.

Abstract: The present invention relates to a reinforced composite material and a method for its production. The composite material comprises at least one cured resin having a reinforcing material. Preferably the reinforcing material is a plurality of glass fibres which are treated such that the properties of the interphase substantially surrounding each fibre are substantially equivalent to those of the bulk cured resin. The fibre treatment may be selected from the group consisting of a polymeric coating, a hydrophilic surface coating, a surface coating of a free radical inhibitor, or a reduction in the total surface area of the fibres. The reinforced composite material of the invention provides improved long-term mechanical properties compared to traditional glass fibre reinforced materials.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. Functionalized amine curing agents are cheaper and easier to produce from small amine precursors when compared to the cost and complexity of functionalizing bulky epoxy resins. Amine curing agents are incorporated into a cured epoxy network. However, many functional groups will affect the reactivity of the curing reaction due to electronegativity effects. By using small amounts of functionalized amines with a large amount of non-functionalized agent, the effect is small and in the case of migration, it can be advantageous for tribological, mechanical and other properties of epoxies and epoxy-containing materials.

Abstract: The present invention provides a method for producing a transparent plastic film, which comprises the steps of (a) preparing a glass flake particle; (b) preparing a curable epoxy resin in which a difference between a refractive index after the curable epoxy resin is cured and a refractive index of the glass flake particle is not more than 0.01; (c) mixing the curable epoxy resin and the glass flake particle with each other; and (d) curing a mixture of the curable epoxy resin and the glass flake particle to form an epoxy curing substance that includes the glass flake particle, and a transparent plastic film that is produced by using the same.

Abstract: A molding composition formulation includes a thermoset cross-linkable polymeric resin. Glass microspheroids are present such that upon cure of the resin the resulting article has a linear shrinkage of less than ±0.06% and a density of less than 1.65. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of 10 to 50 microns for facilitating overprinting of additional layers. The preferred embodiment comprises: (a) reactive organic resin component in which epoxy groups comprise the major reactive functionality; (b) amino-functional curing agent; (c) blocked polyisocyanate; and (d) 5 to 35 percent solid spherical particles having diameters of 10 to 50 microns.

Abstract: The invention describes a solid glass composite comprising glass granules and a binder resin which may be used in a wide range of applications, for example, flooring, furniture, lighting, work surfaces and architectural features.

Abstract: The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar mass of the epoxy or the average molar mass of the mixture of epoxies ranges from 250 to 1000 g/mol; (b) 0 to 80 wt. % of an epoxy or of a mixture of epoxies that differ from (a); (c) 3 to 85 wt. % of fillers; (d) 0.001 to 25 wt. % of initiators, retarders and/or accelerators, and; (e) 0 to 25 wt. % of auxiliary agents, whereby the specified percentages refer to the total weight of the preparation.

Abstract: The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobile body, or for collision safety, and which improve a bending strength and a rigidity of the sheet metal without causing a distortion to the sheet metal. The coating type reinforcement composition of sheet metal according to the present invention comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or higher, an amount of the inorganic filler contained being 20 to 50% by weight and the composition being a viscous preparation with a high viscosity.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy resin and a copolymerizable monomer having amide, acrylamide, or hydroxyl functionality, and may advantageously be devoid of any cationic catalyst ingredient.

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.

Abstract: The present invention relates to a composite made by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 30 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to less than 10% by weight of the composite; and (c) a reinforcing fiber at from 9.9 to 60% by weight of the composite, wherein the sum of the weight percentages of components (a)-(c) is equal to 100%, wherein the polymer (a) is not a polyamide. The invention further relates to a composite prepared by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 25 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to 10% by weight of the composite; (c) a reinforcing fiber at from 9.8 to 60% by weight of the composite, and (d) an epoxy compound at from 0.1 to 5% by weight of the composite, wherein the sum of the weight percentages of components (a)-(d) is equal to 100%.

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic filler having an average particle size of 4 to 100 &mgr;m and an average shell thickness of 1.5 &mgr;m or more, wherein the amounts of the component (A) and the component (B) are adjusted such that a total amount of X and Y (X+Y) is 350 or more, wherein X is an epoxy equivalent of the epoxy resin (A), and Y is a hydroxyl group equivalent of the phenolic resin (B); and a semiconductor device comprising a semiconductor element encapsulated by the epoxy resin composition.

Abstract: A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 &mgr;m and a mean particle size of 0.5-10 &mgr;m, (C) 0.1-6 parts of a reactive functional group-containing silicone compound, and (D) 0.01-10 parts of a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and eliminates voids and other defects.

Abstract: A &agr;,&ohgr;-methacrylate terminated epoxide-carboxylic acid macromonomer compound formed by reaction of at least one diepoxide, at least one dicarboxylic acid and at least one unsaturated mono-carboxylic acid and having the general formula 1: wherein R is an aromatic moiety formed from a diepoxide R′ is a substituted or unsubstituted aliphatic, araliphatic, cycloaliphatic or aromatic moiety formed from a dicarboxylic acid, R″ is hydrogen, a substituted or unsubstituted aliphatic, araliphatic, aromatic or cycloaliphatic moiety formed from a mono-carboxylic acid, and n is an integer from 1 to 20.

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic filler having an average particle size of 4 to 100 &mgr;m and an average shell thickness of 1.5 &mgr;m or more, wherein the amounts of the component (A) and the component (B) are adjusted such that a total amount of X and Y (X+Y) is 350 or more, wherein X is an epoxy equivalent of the epoxy resin (A), and Y is a hydroxyl group equivalent of the phenolic resin (B); and a semiconductor device comprising a semiconductor element encapsulated by the epoxy resin composition.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved interstitial infiltration and has a low modulus of elasticity in the cured state.

Abstract: An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crushing machine and a separating machine. The first crushing machine crushes the at least one electrical product to create at least one crushed electrical product. The first crushing machine has a first screen affixed thereto to regulate a first flow of the at least one first crushed electrical product from the first crushing machine. The second crushing machine crushes the at least one first crushed electrical product to create at least one second crushed electrical product. The second crushing machine has a second screen affixed thereto to regulate a second flow of the at least one second crushed electrical product from the second crushing machine.

Abstract: This invention is directed to the preparation of alloy articles consisting essentially of 65 wt. % or more glass and high temperature organic thermoplastic or thermosetting polymers having working temperatures which are compatible with that of the glass and/or the precursor glass for the glass-ceramic. The glass and polymer are combined at the working temperature to form an intimate mixture; i.e., the glass and polymer are in a sufficiently fluid state to be blended together to yield a body exhibiting an essentially uniform, fine-grained microstructure wherein, desirably, there is at least partial miscibility and/or a reaction between the glass and the polymer to promote adhesion and bonding therebetween. A body is shaped from the mixture and cooled to room temperature.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: A mold compound made from a polymer resin and an isorefringent, transparent filler is used to form optical electronic components (10, 20, 30). The mold compound can be used to form a lens (13) on a display device (10), to form the outer housing (21) of a waveguide (20), or to form a dome (34) that reflects light from a light emitting device (32) to a light detecting device (33).

Abstract: The present invention provides a modeling paste comprising a latent material which can be applied as a thick layer to a substrate and which after activation rapidly crosslinks to a machinable surface.

Abstract: The present invention relates to a composite made by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 30 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to less than 10% by weight of the composite; and (c) a reinforcing fiber at from 9.9 to 60% by weight of the composite, wherein the sum of the weight percentages of components (a)-(c) is equal to 100%, wherein the polymer (a) is not a polyamide. The invention further relates to a composite prepared by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 25 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to 10% by weight of the composite; (c) a reinforcing fiber at from 9.8 to 60% by weight of the composite, and (d) an epoxy compound at from 0.1 to 5% by weight of the composite, wherein the sum of the weight percentages of components (a)-(d) is equal to 100%.

Abstract: A matrix board coating composition for use in the formation of a mold in which flexographic printing plates are produced, the coating is a water-based, latex emulsion having a two step phenolic component to increase shelf life, reduce volatiles and improved flow properties of the coating.

Abstract: A ternary composite with thermal stability of up to at least 200.degree. C. Is formed using a thermally stable matrix resin, high tensile fibers, and borosilicate or sodium tetra borate glass particulates. The composite has stability to acids, toxic wastes and may be formed into sheets, shapes, tubes, containers, flooring materials and the like for use in aerospace, defense, automotive, industrial, nuclear containment or simply building material applications.

Abstract: The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives. Furthermore the dual curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives can be used in the optical industry, in optoelectronics and microelectronics, for example for the adhesion of complicated optical components in the combination glass/glass, glass/metal. Advantageous is the small shrinkage during polymerization and the good mechanical properties in combination with the possibility of step-wise or one-step polymerization.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

Abstract: An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

Abstract: A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.

Abstract: Disclosed herein is a precursor powder composition comprising a resin, a combination of zinc dust, zinc powder and zinc-coated microspheres and graphite, said powder being soluble in a solvent blend at a facility remote from the powder manufacturing facility, thereby, decoupling the powder manufacturing process from the end use of the powder which could be in a traditional solvent-based paint. Also disclosed are coating compositions for use in protecting metallic substrates from corrosion, comprising necessary additives and film forming substances including alkyl silicate, epoxy resins, powder and non-powder, and polyester resins, all the compositions being modified with about 4 to about 20 weight percent graphite powder based on total weight of the composition.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

Abstract: A simplified aqueous sizing composition utilizing a variety of components achieves improved stability, wettability and strength characteristics. The composition utilizes one or more aqueous, soluble, dispersible or emulsifiable bisphenol A type polyester film forming polymers with an epoxy containing film forming copolymer compatible with and soluble in the matrix polymer. One or more organo-silane coupling agents are also utilized. The sizing composition preferably includes a single nonionic surfactant in conjunction with a cationic amidated polyamine lubricant. One or more anti-static agents, generally cationic organic quaternary ammonium salts having one or more alkoxy moieties, are utilized in an effective anti-static amount. An anti-foaming agent may also be utilized for the prevention or suppression of foam during the mixing process. The improved stability and wettability characteristics of the aqueous sizing composition are preferably achieved through the use of a single epoxidized surfactant.