Abstract: An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed.

Abstract: The invention relates to epoxide-amine adducts obtainable by reaction of one or more primary amines (A) of general formula (I) Q-NH2??(I) with one or more monoepoxides (B) of general formula (II) wherein Q is a radical Rt-[OEt]n[OPr]m[OBu]s-, in which Rt is a radical selected from alkyl radicals having 1 to 6 carbon atoms, OEt is an ethylene oxide radical, OPr is a propylene oxide radical and OBu is a butylene oxide radical, n is a number from 0 to 100, m is a number from 3 to 50 and s is a number from 0 to 20 and n+m+s=3 to 170, R is an organic radical selected from aliphatic radicals having 4 to 24 carbon atoms, aromatic radicals having 6 to 18 carbon atoms and araliphatic radicals having 7 to 34 carbon atoms, and p is 0 or 1, wherein (i) the primary amine(s) (A) and the monoepoxide(s) (B) are reacted in an equivalents ratio (A):(B) of from 1:2 to 1:1.

Abstract: Disclosed is a method of manufacturing a graphene conductive fabric, which includes mixing a first solvent, a second solvent and nano-graphene sheets, dispersing the nano-graphene sheets with a mechanical force to form a graphene suspension solution; adding at least a curable resin to the graphene suspension solution, dispersing the nano-graphene sheets and the curable resin with the mechanical force to form a graphene resin solution; coating or printing the graphene resin solution on a hydrophobic protective layer, curing the graphene resin solution to form a graphene conductive layer adhered to the hydrophobic protective layer; coating a hot glue layer on the graphene conductive layer; and attaching a fibrous tissue on the hot glue layer, heating and pressing the fibrous tissue to allow the hot glue layer respectively adhere to the graphene conductive layer and the fibrous tissue.

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: Calcium silicate powders are provided. The calcium silicate powders comprise porous calcium silicate particles and an additive, the additive being at least partially penetrated into the pores of the particles. The additive is present in an amount of between 1.5 and 50%w, wherein %w is the weight ratio, expressed as percentage, of the dry weight of the additive over the dry weight of the combination of the calcium silicate particles and additive.

Abstract: A method for making a pyrotechnic composition in accordance with an embodiment of the present technology includes flowing metal powder, polytetrafluoroethylene powder, and binder powder in separate respective feed streams toward an extruder. The binder powder includes adhesive material and polytetrafluoroethylene anticaking material coating the adhesive material. The method further includes interspersing the metal powder, the binder powder, and the fluoropolymer powder to form a mixture. This mixture is then subjected to an extrusion process during which the anticaking material coating the adhesive material is disrupted. This releases the adhesive material to bind together the metal powder and the polytetrafluoroethylene powder in the extrudate. The powder mixture includes no solvent at any time between being formed and being extruded, yet the extrudate is well-mixed and cohesive.

Abstract: The present invention relates to the technical field of composite materials comprising a thermosetting polymer matrix in which thermoplastic polymer and/or elastomer particles are dispersed. More precisely, the invention relates to a novel type of polymeric material obtained by using a particular ionic liquid as cross-linking agent for an epoxy resin mixed with a thermoplastic polymer and/or an elastomer. The invention also relates to a process for manufacturing said composite material and uses thereof, notably in the aeronautical, aerospace, automotive, maritime, wind power, electronics, or sports and leisure sectors.

Abstract: A jet ink composition, a jet ink coating method and a resulting jet ink coated article are all predicated upon the jet ink composition which includes in addition to a particulate pigment material and a solvent composition a resin composition. The resin composition includes an uncured silicone resin, an uncured epoxy resin and an uncured melamine resin. Upon thermal cure the uncured resin composition forms a cured resin composition with superior adhesion to substrates such as but not limited to glass substrates, ceramic substrates and metal oxide substrates.

Abstract: In one aspect, a coating for protecting a component exposed to a corrosive environment includes an epoxy phenolic resin and graphene nanoplatelets. In another aspect, a method of protecting a an article exposed to a corrosive environment includes applying a corrosion-resistant epoxy phenolic coating to a surface of the article exposed to a corrosive environment and curing the corrosion-resistant epoxy phenolic coating. The coating comprises 0.1 to 2.0 weight percent graphene nanoplatelets containing 5 to 15 atomic percent oxygen.

Abstract: Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.

Abstract: A thermoplastic epoxy matrix formulation, based on 100 parts by weight of the thermoplastic epoxy matrix formulation, includes 0.1 to 95 parts by weight of a difunctional epoxy resin and 0.1 to 80 parts by weight of a latent hardener, wherein the latent hardener is an amine compound containing two reactive hydrogens.

Abstract: The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.

Abstract: The present invention provides a fiber sizing agent composition containing a polyester resin (A) and a reactive compound (B), wherein the polyester resin (A) is a polyester resin having an HLB of 4 to 18 and a viscosity at 30° C. of 10 to 1,000,000 Pa·s, the reactive compound (B) is at least one reactive compound selected from the group consisting of blocked isocyanates, tertiary amines, tertiary amine salts, quaternary ammonium salts, quaternary phosphonium salts, and phosphine compounds, and the weight ratio of the polyester resin (A) to the reactive compound (B) [(A)/(B)] in the fiber sizing agent composition is 99.9/0.1 to 10/90.

Abstract: A terrazzo composition containing a resin component; a hardener component; and an aggregate component, where the composition has a tensile strength of about 8500 psi to about 8900 psi, a compressive strength of about 2600 psi to about 3000 psi, a Shore D Hardness of about 50 to about 100, and a weight of about 0.60 pounds per square foot at 0.25 inch thickness to about 0.76 pounds per square foot at 0.25 inch thickness.

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.

Abstract: Provided is a thioepoxide functional polymerizable composition comprising a reaction product of thiourea and an epoxide functional, polymerizable composition. The epoxide functional, polymerizable composition comprises a reaction product prepared from a reaction mixture comprising: (a) a monomer comprising at least one ethylenically unsaturated ester functional monomer having an epoxide functional group; and (b) a compound having two or more thiol groups. The reactants (a) and (b) are reacted via a Michael addition reaction in the presence of a base to form an epoxide functional reaction product. Also provided are methods of preparing an optical article using the polymerizable compositions.

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are resistant to being washed off substrate surfaces prior to being cured. The incorporation of a solid diene-based rubber, in particular an acrylonitrile-butadiene copolymer rubber having a relatively high Mooney viscosity, significantly enhances the wash-off resistance of the adhesive, while still allowing the adhesive to be readily dispensed by pumping under high shear conditions.

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract: An adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in Fig. 1A wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C. using an E type viscometer is A2 (Pa·s), the range including values on the solid lines but not including values on the dashed line, and a blending amount of the curing agent is 5 to 150 parts by weight and a blending amount of the inorganic filler is 60 to 400 parts by weight based on 100 parts by weight of the curable compound.

Abstract: Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.

Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.

Abstract: For the purpose of improving rolling resistance and durability, the present invention provides a rubber composition for insulation of a tire comprising 0.2 to 4 parts by mass of (B) an alkylphenol-sulfur chloride condensate, and 20 to 59 parts by mass of (C) carbon black having a BET specific surface area of 25 to 50 m2/g based on 100 parts by mass of (A) a rubber component comprising 30 to 85% by mass of (a1) a natural rubber and/or an isoprene rubber, 0 to 70% by mass of (a2) at least one styrene butadiene rubber selected from the group consisting of an emulsion-polymerized styrene butadiene rubber, a solution-polymerized styrene butadiene rubber and a modified styrene butadiene rubber, and 0 to 60% by mass of (a3) a butadiene rubber, and a tire having insulation prepared from the rubber composition.

Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.

Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.

Abstract: A method for making a discontinuous fiber molding compound from carbon fiber tow. The method involves using remnants of carbon fiber tows from spent carbon fiber spools. The remnants are chopped into pieces to form an assembly of chopped carbon fiber tows that are from 1 cm to 10 cm long. The chopped carbon fiber tows are then mixed with a powdered resin to form a blend of chopped carbon fiber tows and powdered resin. The blend is heated to soften/melt the particles of resin and then cooled to form a discontinuous fiber molding compound.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: Heat-transfer fluids and lubricating fluids comprising deaggregated diamond nanoparticles are described herein. Also described are composites comprising deaggregated diamond nanoparticles, and methods of making such composites. Method of using deaggregated diamond nanoparticles, for example, to improve the properties of materials such as thermal conductivity and lubricity are also disclosed.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: The invention relates to an inorganic-organic hybrid material which comprises an inorganic component and an organic component, has a content of the inorganic component of 20-80% by mass, and has a refractive index of 1.60 or higher, wherein, when preparing a strip specimen having a thickness of 1,000 ?m, a width of 5 mm and a length of 70 mm by using the inorganic-organic hybrid material and winding the specimen by 180° on a cylindrical metal rod having a diameter of 10 mm at 25° C., the specimen does not crack.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: The invention relates to methods and a novel powdered curable monomer which may be used to manufacture bulk polymers, adhesives and coatings composite materials with high percentage weight inclusions of particulate filler materials, more specifically to fibre reinforced polymer composite materials with high percentage weight inclusions of particulate filler materials. The preferred particulate filler materials are carbon nanotubes. The method according to the invention allows greater than 0.5 wt % of carbon nanotubes, typically greater 10% wt of carbon nanotubes or other high aspect ratio fillers to be readily incorporated in the resin matrix, before being applied to the fibre reinforcing plys.

Abstract: The present disclosure provides curable compositions such as curable compositions including: (i) at least one epoxy resin comprising at least one aromatic or aromatic-derived moiety but not containing an aromatic amine moiety; (ii) an epoxide hardener system comprising: (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines have a difference in melting points of at least 10° C.; and (iii) a filler capable of reducing the density of the curable composition. Also provided are compositions obtainable by curing the curable composition and methods of using the curable composition to fill voids in honeycomb structures.

Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.

Abstract: The adhesive composition used in a medical instrument containing: a main agent which is an epoxy resin selected from the group consisting of bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and phenol novolac type epoxy resins; a curing agent comprising one or both of meta xylylene diamine and a derivative thereof; acrylic rubber, a filler which contains alumina.

Abstract: The disclosed is a carbon fibrous conjunct in a granule form which comprises carbon fibrous structures and a binder by which the carbon fibrous structures are bound together, wherein mean diameter of the carbon fibrous conjunct is in the range of 0.03 mm-5 mm, and density of the carbon fibrous conjunct is in the range of 0.003-0.5 g/cm3, and wherein each of the carbon fibrous structures comprises carbon fibers each having an outside diameter of 15-100 nm and a carbon granular part with which the carbon fibers are bound in the state that the carbon fibers extend outwardly from the granular part to form a three dimensional network of the carbon fibers, and wherein the granular part and the carbon fibers are bound together by carbon-carbon bonds.

Abstract: The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 ?m and a filler B having an average particle size of not less than 0.1 ?m and less than 1 ?m, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.

Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 ?m; (B) aluminum oxide particles having an average particle size (D50) of 1.5 ?m or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

Abstract: A clay-epoxy nanocomposite may be prepared by dispersing a layered clay in an alkoxy epoxy, such as a polypropylene oxide based epoxide before combining the mixture with an aromatic epoxy to improve the nanocomposite's thermal and mechanical properties.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: The invention relates to a process for the milling-drying of a raw mixture containing aluminum trihydroxide having an average particle size D50 in the range from 50 to 130 ?m and a specific BET surface area in the range from 0.01 to 0.5 m2/g and containing from 0.1 to 20% by weight of water, based on the raw mixture, which comprises the steps i) introduction of the raw mixture into a milling-drying apparatus, ii) introduction of a hot air stream having a temperature in the range from 20 to 100° C. into the milling-drying apparatus so as to flow through the milling-drying apparatus and iii) comminution of the aluminum trihydroxide present in the raw mixture in the milling-drying apparatus.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are capable of being easily pumped under high shear at temperatures around room temperature but are resistant to being washed off substrate surfaces prior to being cured.

Abstract: Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (?m) to 100 micron (?m) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)].