Abstract: A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: The present invention relates to the use of aromatic P—N-compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based onthermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides.

Abstract: The present invention relates to the use of aromatic P-piperazine-compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based on thermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: There is provided a resin composition that comprises a polycarbonate resin derived from an ether diol such as isosorbide and that is excellent in flame retardancy, heat resistance, thermal stability, rigidity, transparency and moldability. The resin composition is a flame-retardant resin composition comprising 1 to 60 parts by weight of phosphorus compound (component B) having a thermal decomposition temperature of not higher than 340° C.

Abstract: The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant.

Abstract: A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: wherein n is about 1 to about 10.

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract: The invention relates to the use of amino terminated phosphonamides and their oligomers, as flame retardant additives for a variety of polymers to impart flame retardancy while maintaining or improving processing characteristics and other important properties.

Abstract: The invention provides a fiber reinforced resin composition comprising a melt-kneaded product (A) prepared by melt-kneading a first resin (A1) and a second resin (A2) that has reactive functional group as well as a third resin (B) and a fibrous filler (C), wherein, with respect to the contents of the components, the first resin (A1), the second resin with a reactive functional group (A2), and the third resin (B) account for 0.1 to 75 wt %, 0.1 to 15 wt %, and 10 to 99.8 wt %, respectively, to form a resin composition while said fibrous filler (C) accounts for 0.1 to 300 parts by weight per 100 parts by weight of said resin composition, said first resin (A1) and said third resin (B) forming a matrix resin, said second resin (A2) being dispersed as particles in said matrix resin, and said particles having a number average particle diameter of 10 to 1,000 nm.

Abstract: Provided are a carbon fiber reinforced composite material which exhibits excellent flame retardance, fast curing properties, heat resistance, and mechanical characteristics. Also provided are an epoxy resin composition suitable for use in producing said carbon fiber reinforced composite material as well as a prepreg and housing for electronic/electrical components. The epoxy resin composition is characterized by comprising: [A] an epoxy resin containing at least 50 mass % of a compound as represented by general formula (I), [B] an organic nitrogen compound based curing agent, [C] a phosphoric acid ester, and [D] a phosphazene compound. In general formula (I), R1, R2, and R3 are either a hydrogen atom or a methyl group, and n is an integer of 1 or higher.

Abstract: The invention discloses a cross-linked epoxy resin with flame-retardant properties and method for producing the same. The polymeric material of the invention includes an epoxy resin, a curing agent and a modification agent. Particularly, the modification agent is a derivative of 9,10-Dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO). Moreover, the curing agent is 4,4?-diaminodiphenyl methane (DDM), or tris(4-aminophenyl)amine (NNH).

Abstract: The invention discloses a novel cross-linked epoxy resin with flame-retardant properties and method for producing the same. The polymeric material of the invention includes an epoxy resin, a curing agent and a modification agent. Particularly, the modification agent is a derivative of 9,10-Dihydro-9-oxa-10-phosphaphenanthrene 10-Oxide (DOPO). Moreover, the curing agent is 4,4?-diaminodiphenyl methane (DDM), or tris(4-aminephenyl)amine (NNH).

Abstract: The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.

Abstract: There is provided a resin composition that comprises a polycarbonate resin derived from an ether diol such as isosorbide and that is excellent in flame retardancy, heat resistance, thermal stability, rigidity, transparency and moldability. The resin composition is a flame-retardant resin composition comprising 1 to 60 parts by weight of phosphorus compound (component B) having a thermal decomposition temperature of not higher than 340° C. based on 100 parts by weight of polycarbonate resin (component A) that mainly comprises a recurring unit represented by the following formula (1).

Abstract: A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) (X is a single bond, CH2, C(CH3)2, SO2, S, 0, or O(CO)O; n is an integer of from 3 to 1000; d and e are numbers with 2d+e=2n), and a resin layer. The phosphazene compound is supported on the inorganic porous fine particle, and the resin layer coats the inorganic porous fine particle with the phosphazene compound supported thereon. The resin layer thermally decomposes to lose weight by 10% at a temperature of from 300° C. to 500° C., as measured by thermogravimetry in the air at a heating rate of 10° C./min.

Abstract: An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D): (A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the epoxy resin component, (B) a curing agent component comprising a novolak type phenol resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the curing agent component, (C) an organic phosphorus flame retarder, and (D) a curing catalyst, wherein the content of an organic phosphorus flame retarder as (C) is from 1.5 to 10% by weight based on the total weight of the epoxy resin composition.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110–130° C., wherein a, b and n are numbers satisfying 0<a?0.05n, 1.90n?b<2n, 2a+b=2n, and 3?n?6, the composition being substantially free of bromides and antimony compounds.

Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.

Abstract: The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containing compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt. % based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt. % based on the total amount of components (A), (B), (C) and (D). The epoxy resin composition of the invention and a molded product are halogen-free and antimony-free and are excellent in flame retardancy. When an element for an electronic part such as LSI and VLSI is encapsulated by the epoxy resin composition of the invention, the obtained electronic part is outstanding in heat resistance, moisture resistance, thermal impact resistance and like properties.

Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.

Abstract: Adhesive compositions that include self-assembling molecules, adhesives and adhesive articles produced therefrom, and methods of making and using such adhesives.

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I):  wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.

Abstract: Adhesive compositions that include self-assembling molecules, adhesives and adhesive articles produced therefrom, and methods of making and using such adhesives.

Abstract: Combination compounds from curing agents/accelerators and flame-protection agents for the latent curing/acceleration of epoxide resin systems and their endowment with flame-retarding properties, the epoxide resin systems being able to be thermally cured, as well as the products prepared from the epoxide resin systems.

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Abstract: A polymer-based blend which may be cured to form a non-cementious concrete-like material. The polymer-based blend includes 90 to 100 parts by weight low viscosity epoxy resin, 1 to 10 parts by weight of an aliphatic glycidyl ether epoxy diluent, 40 to 50 parts by weight polyoxy-propyleneamine curing agent, 30 to 100 parts by weight intumescent powder, 90 to 110 parts by weight hollow ceramic microspheres having a density of between 0.30 and 0.60 grams per cubic centimeter and 0.01 to 0.10 part by weight air release agent. The hollow ceramic microspheres are dispersed uniformly throughout the polymer-based blend to provide a non-cementious material which, upon curing, becomes a concrete-like material. The non-cementious concrete-like material is well-suited for use as a substitute for concrete and may be used alone or in combination with reinforcing materials.

Abstract: Flame-retardant thermoplastic molding compositions compriseA) from 5 to 99% by weight of a thermoplastic polymer,B) from 0.1 to 50% by weight of a phosphazene of the general formula I(PN.sub.2-x H.sub.1-y).sub.z Iwhere the numerical values of x, y and z, independently of one another, are as follows:1>x>0.051>y>0.05z>1, andC) from 0 to 70% by weight of other additives and processing aids,where the total of the percentages by weight of components A) to C) is 100%.

Abstract: A flame-retardant resin composition which comprises (A) 100 parts by weight of an unhalogenated epoxy resin having at least two epoxy groups in one molecule, (B) 20 to 205 parts by weight of a maleimide compound having at least one maleimido group in one molecule, (C) 20 to 65 parts by weight of a curing agent having an amino group and (D) a phosphorus compound in a proportion of 0.5 to 4.5 parts by weight in terms of phosphorus element per 100 parts by weight of a total of the components (A), (B) and (C), provided that the proportion of nitrogen element contained in the composition is 2.0 to 10.0 parts by weight per 100 parts by weight of the total composition. The above flame-retardant resin composition has a high flame retardance without adding a halogen compound and does not deteriorate the characteristics of commercial products.

Abstract: The invention provides a thermosettable resin composition comprising (a) one or more thermosettable resins, (b) one or more of curatives, hardeners, and optionally catalysts for the curing of the thermosettable resin in an amount sufficient for the cure of the thermosettable resin, and (c) an effective amount of at least one non-functional cyclophosphazene to render said resin composition, when cured, flame retardant. The non-functional cyclophosphazene contains aryloxy group substitution and does not covalently bond with the resin network. As a result, the non-functional cyclophosphazene does not negatively impact key performance properties such as modulus, thermal stability, dielectric behavior, fracture toughness, moisture uptake or adhesion.

Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also contain a bishenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.

Abstract: Flame-retardant polymer compositions containing a flame-retardant system consisting of a phosphorus/nitrogen-component and aluminum hydroxide.

Abstract: An electrically conductive thermoplastic resin and coating composition comprising a diphosphonic acid derivative having the formula: ##STR1## wherein R represents an alkyl or aryl group and M.sup.1 to M.sup.4 independently represent hydrogen or a cation.The electrically conductive thermoplastic resin composition has excellent electrical conductivity and retains the electrical conductivity for extended periods without using expensive noble metals. Furthermore, the electrically conductive coating composition provides an excellent electrical conductivity and shielding property retention without using expensive noble metals.

Abstract: A coating composition for a metal substrate having excellent adhesion, corrosion resistance and welding property which comprises (A) an epoxy resin, (B) an organic phosphorus compound, (C) zinc powder, of which a portion being replaceable by (E) a solid electroconductive material, and (D) a magnesium compound dispersed in a liquid medium, the weight proportion of the components (A) and (B) being from 45:55 to 95:5, the content of the component (C) corresponding to from 30 to 95% by weight based on the total weight of the non-volatile components in the composition and the content of the component (D) being from 0.1 to 5% by weight based on the total weight of the non-volatile components in the composition.