Phosphorus Dnrm Patents (Class 523/451)
  • Patent number: 10676493
    Abstract: A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: June 9, 2020
    Assignee: ELITE ELECTRONIC MATERAL (KUNSHAN) CO., LTD.
    Inventors: Yan Zhang, Rongtao Wang, Mingsheng Yuan, Ningning Jia
  • Patent number: 10611897
    Abstract: A flame retardant sugar-derived molecule, a process for forming a flame retardant sugar-derived molecule, and an article of manufacture comprising a flame retardant sugar-derived molecule are disclosed. The flame retardant sugar-derived molecule can be synthesized from arabitol, xylitol, arabic acid, or xylonic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame retardant sugar-derived molecule can include reacting arabitol, xylitol, arabic acid, or xylonic acid and a flame retardant phosphorus-based molecule to form the flame retardant sugar-derived molecule.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jason T. Wertz
  • Patent number: 10563006
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 18, 2020
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
  • Patent number: 10550264
    Abstract: A novel thermoplastic material including polylactic acid (PLA) and calcium hydroxide is provided, the material having an elevated glass transition temperature (Tg). Methods of making this novel material, and articles of manufacture made from it are also provided.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: February 4, 2020
    Inventor: Mark Pilipski
  • Patent number: 10487020
    Abstract: A process involving admixing a ligand and an alkanolamine. The process allows the use of ligand despite the presence of contaminating amounts of phosphorus acid, and improves the shelf life of premixed ligand solutions.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: November 26, 2019
    Assignee: Dow Technology Investments LLC
    Inventors: Michael A. Brammer, George R. Phillips, Glenn A. Miller, Donald L. Campbell, Jr.
  • Patent number: 10465292
    Abstract: A method of disposing a corrosion resistant system to a substrate may comprise applying a plating material to the substrate; forming a chemical conversion coating solution by combining a solvent, at least one corrosion inhibitive cation comprising at least one of zinc, calcium, strontium, magnesium, or aluminum, at least one corrosion inhibitive anion comprising at least one of phosphate, molybdate, or silicate, and a complexing agent; and applying the chemical conversion coating solution to the plating material on the substrate.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: November 5, 2019
    Assignee: GOODRICH CORPORATION
    Inventors: Michael A. Kryzman, Georgios S. Zafiris, Mark R. Jaworowski, Weilong Zhang, Roque Panza-Giosa, Marilea Manzini
  • Patent number: 10450201
    Abstract: A simple one pot sol-gel method for the synthesis of bi-metal nanostructures is based on non-noble metals (Fe, Co and Sn) and titanium. The method involves the synthesis of mixed metal nanoscale composites using low cost precursors which allow for the synthesis of desired nanocomposite materials with self-scarifying titanium or silica supports. The procedure does not require any surfactant or any need for pH controlled step. Applicants' method involves the in-situ generation of precursors and their simultaneous entrapment in a gel. This simple one pot synthesis allows for the synthesis of homogenous size, shape and distribution of targeted nanostructures. Further, this method can be applied for the preparation of various nanocomposite materials using different choices of metals and self-scarifying supports. Applicants also show that Pd, the noble metal based nanocomposite is feasible.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: October 22, 2019
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Manzar Sohail, Muhammad Sharif, Safyan A Khan, Muhammad Sher, Rajenahally V Jagadeesh
  • Patent number: 10030096
    Abstract: The present disclosure relates to a polycarbonate resin and a method of preparing the same, has an effect of providing a polycarbonate resin having superior chemical resistance and wear resistance due to application of a predetermined comonomer thereto, and a method of preparing the same.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: July 24, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Un Ko, Hyoung Min Bahn, Byoung Kyu Chun, Jung Jun Park, Ki Jae Lee, Young Wook Son, Moo Ho Hong, Young Young Hwang, Min Jeong Kim
  • Patent number: 9809715
    Abstract: A corrosion inhibition composition is disclosed comprising a cerium, a tungstate, a molybdate and silicate compounds. A corrosion inhibition composition is provided comprising a zinc oxide, a zinc hydroxide benzoate, a sodium benzoate, a molybdate and a silicate compound. A corrosion inhibition composition is provided comprising a zinc oxide, a zinc phosphate, a calcium silicate, an aluminum phosphate, a zinc calcium strontium aluminum orthophosphate silicate hydrate, a molybdate, and silicate compounds.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: November 7, 2017
    Assignee: GOODRICH CORPORATION
    Inventors: Weilong Zhang, Michael A. Kryzman, Georgios S. Zafiris, Mark R. Jaworowski, Roque Panza-Giosa, Marilea Manzini
  • Patent number: 9803077
    Abstract: A cast-molded article in a composite material comprising a cured polymeric binder incorporating embedded particles of filler, characterized in that the binder incorporates randomly distributed fibers of polyamide, wherein the fibers have a length of 5-20 mm and a diameter of 0.05-0.2 mm and the fibers comprise 0.02-0.5 wt % based on the overall mass of the cast-molded article.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: October 31, 2017
    Assignee: SCHOCK GMBH
    Inventors: Rudolf Paternoster, Xaver Pledl
  • Patent number: 9562063
    Abstract: This invention relates to a process for producing compounds derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). In particular, the invention relates to producing DOPO-derived compounds by reacting DOPO with diol compounds in the presence of a catalyst. This invention also relates to DOPO derived composition containing a high melting point diastereomer. The DOPO derived compounds may be useful as flame-retardants.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: February 7, 2017
    Assignee: Albemarle Corporation
    Inventors: Qiang Yao, Junuzo Wang, Arthur G. Mack
  • Patent number: 9546262
    Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: January 17, 2017
    Assignee: Chang Chun Plastics Co. Ltd.
    Inventors: An-Pang Tu, Szu-Fang Chen, Ping-Chieh Wang, Kuen-Yuan Hwang
  • Patent number: 9469724
    Abstract: A method for synthesizing poly(butylene succinate-co-butylene adipate) (PBSA), including: a) adding raw materials including succinic acid, adipic acid, and 1,4-butanediol into a reaction still; increasing the temperature in the reaction still to 130° C., and stirring the raw materials, then keeping the temperature in the reaction still at 170-200° C., and dehydrating for 1-3 hours at atmospheric pressure, to yield an oligomer of PBSA; and b) decreasing the temperature of the reaction still to 100° C., and adding a composite catalyst system, the total addition of the composite catalyst system accounting for one ten-thousandth to one ten-millionth of a total weight percentage of the raw materials; uniformly stiffing and mixing the composite catalyst system and reactants, slowly vacuum pumping the reaction still, heating the reaction still to a temperature of 200-240° C. and allowing the composite catalyst system and the reactants to react for 10-20 hrs.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 18, 2016
    Assignee: NANJING UNIVERSITY
    Inventors: Hong Li, Quanxing Zhang, Na Cheng, Tianrong Zhang, Wei Jiang, Bingcai Pan
  • Patent number: 9394398
    Abstract: The present invention provides a phosphorus-containing flame retardant epoxy resin that can constitute parts of electric or electronic equipment having low water absorptiveness and high heat resistance. The phosphorus-containing flame retardant epoxy resin is obtained by reacting an epoxy resin having at least three epoxy groups per molecule with an organophosphorus compound represented by Formula (I).
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: July 19, 2016
    Assignee: SANKO CO., LTD.
    Inventors: Naoki Komiya, Akira Inoue
  • Patent number: 9340700
    Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which R1 represents a hydroxyl group or an alkoxy group, R2 represents a hydrogen atom or a monovalent hydrocarbon group, and n is an integer of from 1 to 7; and (E) a release agent including at least one of the following (?) and (?): (?) a linear saturated carboxylic acid having a number average molecular weight of from 550 to 800, and (?) an oxidized polyethylene wax: R1CH2—CH2—OnR2??(1).
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: May 17, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Tomohito Iwashige, Tomoaki Ichikawa, Naoya Sugimoto
  • Patent number: 9200166
    Abstract: A corrosion inhibition composition is disclosed comprising a zinc oxide, a zinc hydroxide benzoate, a sodium benzoate, a molybdate compound and a silicate compound. Moreover, a corrosion inhibition composition is disclosed comprising a zinc oxide, a zinc phosphate, a calcium silicate, an aluminum phosphate, a zinc calcium strontium aluminum orthophosphate silicate hydrate, a molybdate, and a silicate compound.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: December 1, 2015
    Assignee: GOODRICH CORPORATION
    Inventors: Weilong Zhang, Michael A. Kryzman, Georgios S. Zafiris, Mark R. Jaworoski, Roque Panza-Giosa, Marilea Manzini
  • Publication number: 20150147542
    Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.
    Type: Application
    Filed: July 18, 2014
    Publication date: May 28, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok MOON, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim, Geum Hee Yun
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Patent number: 8987354
    Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 24, 2015
    Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
  • Patent number: 8962712
    Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: February 24, 2015
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Nobuhito Ito, Kazuyoshi Yoneda, Masao Arima
  • Publication number: 20150051318
    Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.
    Type: Application
    Filed: March 22, 2013
    Publication date: February 19, 2015
    Inventors: Franz Grohmann, Martin Breineder, Thomas Breineder
  • Publication number: 20150044451
    Abstract: Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness.
    Type: Application
    Filed: November 20, 2012
    Publication date: February 12, 2015
    Inventors: Masayoshi Kido, Yoshihide Sekito
  • Publication number: 20150025177
    Abstract: The present invention provides a floor coating composition comprising (A) and aqueous solvent; and (B) a chelating polymer which comprises units derived from one or more aminocarboxylate compounds or their salts, one or more other polymerizable monomers, one or more ethylenically unsaturated monomers and, optionally, one or more crosslinking monomers. For example, the aminocarboxylate compounds or their salts may be one or more of iminodiacetic acid (IDA), iminodisuccinic acid (IDS), ethylenediamine triacetic acid (ED3A) and ethylenediamine disuccinic acid (EDDS), or their salts. Suitable polymerizable monomers may be one or more of glycidyl methacrylate (GMA), allyl glycidyl ether (AGE), vinylbenzyl chloride (VBC), allyl bromide, and their derivatives.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 22, 2015
    Inventors: Afia Sarpong Karikari, Theodore Tysak
  • Publication number: 20150017428
    Abstract: Disclosed is an insulating film composition of a non-oriented electrical steel sheet. The insulating film composition of a non-oriented electrical steel sheet according to the present invention comprises a mixed metal phosphate consisting of aluminum phosphate (Al(H3PO4)x=1-3) and cobalt phosphate (Co(H3PO4)3), and an organic/inorganic composite consisting of epoxy resin and silica (SiO2) nanoparticle substituted on the functional group of the epoxy resin.
    Type: Application
    Filed: November 15, 2012
    Publication date: January 15, 2015
    Inventors: Jung-Woo Kim, Min Serk Kwon, Heon-Jo Choi
  • Publication number: 20150002254
    Abstract: The invention relates to a process for the impregnation of air core reactors or parts of air core reactors and impregnated air core reactors or parts thereof obtainable by said process.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 1, 2015
    Applicant: Huntsman International LLC
    Inventors: Astrid Beigel, Christian Beisele, Ulrich Massen
  • Publication number: 20140371343
    Abstract: A paint composition, which comprises a stanchion-encapsulated pigment such as titanium dioxide, can provide enhanced paint quality with reduced cost.
    Type: Application
    Filed: June 17, 2014
    Publication date: December 18, 2014
    Inventors: Nianxi YAN, John Charles DEBRAAL
  • Publication number: 20140364540
    Abstract: A particulate coating composition, preferably a powder coating composition comprising at least one epoxy containing compound, at least one polycarboxyl polymer, at least one organic Lewis acid and at least one organic Lewis base.
    Type: Application
    Filed: February 25, 2010
    Publication date: December 11, 2014
    Applicant: JOTUN POWDER COATINGS (N) AS
    Inventors: Bjorn Karlsen, Helge Hoff, Christer Lorentz Opstad
  • Publication number: 20140357765
    Abstract: A plastic article formed from a thermoplastic composition including a polycarbonate having repeating structural carbonate units according to the formula: in which at least 60 percent of the total number of R1 groups contain aromatic moieties and the balance thereof are aliphatic, alicyclic, or aromatic. The composition also includes an epoxy additive having at least two epoxy groups per molecule and a phenolic diphosphite derived from pentaerythritol. The thermoplastic composition exhibits a dE (2000hrs.) value of less than 1.5 after 2000 hours of heat aging at 130° C., measured according ISO 11664-4:2008(E)/CIE S 014-4/E:2007 using CIE illuminant D65 and a 2.5 mm thick molded plaque of the thermoplastic composition.
    Type: Application
    Filed: May 28, 2014
    Publication date: December 4, 2014
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventors: Joshua Arie van den Bogerd, Johannes de Brouwer
  • Publication number: 20140349120
    Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 27, 2014
    Applicant: Shengyi Technology Co., Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140342161
    Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 20, 2014
    Applicant: Shengyi Technology Co. Ltd.
    Inventor: Xianping Zeng
  • Patent number: 8883883
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 11, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Publication number: 20140329933
    Abstract: The invention relates to mixtures of at least one diphosphinic acid of the formula (I) in which R1, R2 are each H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl R4 is C1-C18-alkylene, C2-C18-alkenylene, C6-C18-arylene, C7-C18-alkylarylene with at least one alkylphosphinic acid of the formula (II) in which R3 is C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl. The invention also relates to a process for preparing these mixtures and to the use thereof.
    Type: Application
    Filed: December 8, 2012
    Publication date: November 6, 2014
    Inventors: Fabian Schneider, Frank Osterod, Harald Bauer, Martin Sicken
  • Patent number: 8877838
    Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphinates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: November 4, 2014
    Assignee: BASF SE
    Inventors: Sabine Fuchs, Thomas Weiβ
  • Patent number: 8877330
    Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: November 4, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Masato Honma, Atsuki Tsuchiya, Ryuji Sawaoka
  • Patent number: 8865026
    Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: October 21, 2014
    Assignee: Dexerials Corporation
    Inventor: Yasuhiro Fujita
  • Publication number: 20140309339
    Abstract: Mixtures of diphosphinic acids and alkylphosphonic acids, a process for preparation thereof and use thereof. The invention relates to mixtures of at least one diphosphinic acid of the formula (I) in which R1, R2 are each H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl R4 is C1-C18-alkylene, C2-C18-alkenylene, C6-C18-arylene, C7-C18-alkylarylene with at least one alkylphosphonic acid of the formula (II) in which R3 is H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl and/or C7-C18-alkylaryl; a process for preparation thereof and use thereof.
    Type: Application
    Filed: December 8, 2012
    Publication date: October 16, 2014
    Applicant: CLARIANT FINANCE (BVI) LIMITED
    Inventors: Fabian Schneider, Frank Osterod, Harald Bauer, Martin Sicken
  • Publication number: 20140309340
    Abstract: The invention relates to mixtures of at least one dialkylphosphinic acid of the formula (I) in which R1, R2 are the same or different and are each independently C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl, with at least one alkylphosphonic acid of the formula (II) in which R3 is C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl or C7-C18-alkylaryl; to a process for preparation thereof and to the use thereof.
    Type: Application
    Filed: December 8, 2012
    Publication date: October 16, 2014
    Applicant: CLARIANT FINANCE (BVI) LIMITED
    Inventors: Fabian SCHneider, Frank Osterod, Harald Bauer, Martin Sicken
  • Publication number: 20140303285
    Abstract: The present invention provides a biodegradable master batch and a preparation method thereof. The biodegradable master batch is prepared by in-situ polymerization of the components in the following formula in weight parts: 10-80 parts of biodegradable monomer or prepolymer, 0.01-5 parts of catalyst, 0.05-5 parts of reaction activator, 0.1-5 parts of thermal stabilizer, 0-80 parts of flame retardant, 0-80 parts of filler, 0-80 parts of antistatic agent, 0-80 parts of pigment, 0-80 parts of foaming agent, and 0-5 parts of surface coupling agent. Provided in the present invention are the biodegradable polymer master batch having good dispersion effect and excellent interface bonding property, and the preparation method thereof.
    Type: Application
    Filed: July 27, 2012
    Publication date: October 9, 2014
    Applicant: SHANGHAI ZAIHE INDUSTRIAL INVESTMENT CO., LTD.
    Inventor: Lianlong Hou
  • Publication number: 20140275346
    Abstract: Polyester compositions comprising: a) at least one semi-aromatic polyester resin; b) at least one reinforcing agent; c) hydroxyapatite; d) at least one epoxy component having two or more epoxy functional groups per molecule of the epoxy component; and optionally, at least one toughener, wherein the compositions exhibit the combined property of a desirable melt viscosity stability and a desirable hydrolysis resistance to articles molded from the compositions. Articles molded or extruded from these compositions especially, electric and electronic components. Methods of maintaining melt viscosity stability of a melt-mixed composition while simultaneously retaining tensile strength in the article prepared from the melt-mixed composition.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Judith Alison Peacock
  • Publication number: 20140249253
    Abstract: A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein RA and RB are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and RC is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R1-R4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.
    Type: Application
    Filed: May 1, 2012
    Publication date: September 4, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Anteneh Z. Worku, Michael J. Mullins
  • Patent number: 8822832
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: September 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Seong Hyun Yoo, Keun Yong Lee, Hyun Jun Lee
  • Patent number: 8808849
    Abstract: The present invention relates to composites comprising inorganic micro pigments and/or fillers in the form of surface-phosphated microparticles, whose surface is at least partially coated with finely divided with alkaline earth carbonate nanoparticles by means of binders based on copolymers comprising as the monomers one or more dicarboxylic acids and one or more monomers from the group of diamines, triamines, dialkanolamines or trialkanolamines and epichlorohydrin, a method for producing such composites, aqueous slurries thereof and the use thereof in papermaking or in the field of production of paints and plastics as well as the use of the binders for the coating of microparticles with nano alkaline earth carbonate.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: August 19, 2014
    Assignee: Omya International AG
    Inventors: Patrick A. C. Gane, Matthias Buri, René Vinzenz Blum, Catherine Jean Ridgway
  • Publication number: 20140221529
    Abstract: The present invention relates to flame retardant polymer compositions which comprise mixtures of phosphinic acid salts and dihydrophospho-phenantrene (DOPO). The mixtures are especially useful for the manufacture of flame retardant compositions based on polyfunctional epoxides and epoxy resin compositions that result in laminates with excellent surface characteristics and reduced delamination tendency.
    Type: Application
    Filed: April 10, 2014
    Publication date: August 7, 2014
    Applicant: BASF SE
    Inventors: Sabine FUCHS, Michael Roth, Rainer Xalter
  • Patent number: 8779034
    Abstract: A low color epoxy resin composition comprising (a) an epoxy resin and (b) at least one an inorganic phosphorous-containing compound stabilizing agent, for example an additive such as sodium pyrophosphate dibasic (SPD) compound; wherein the resulting epoxy resin composition is storage stable and the epoxy resin composition exhibits a low color. The low color epoxy resin composition is used to prepare an epoxy encapsulant which is useful in light emitting diodes (LEDs).
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: July 15, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Robert F. Eaton, James W. Carter, John M. Beckerdite
  • Patent number: 8779032
    Abstract: The present disclosure provides curable compositions such as curable compositions including: (i) at least one epoxy resin comprising at least one aromatic or aromatic-derived moiety but not containing an aromatic amine moiety; (ii) an epoxide hardener system comprising: (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines have a difference in melting points of at least 10° C.; and (iii) a filler capable of reducing the density of the curable composition. Also provided are compositions obtainable by curing the curable composition and methods of using the curable composition to fill voids in honeycomb structures.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: July 15, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Sohaib Elgimiabi
  • Publication number: 20140187676
    Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.
    Type: Application
    Filed: March 17, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Lee, Boum Seock Kim, Eun Tae Park, Se Hoon Jeong
  • Publication number: 20140178697
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 26, 2014
    Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
    Inventor: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
  • Publication number: 20140178685
    Abstract: The invention relates to an aqueous sizing composition for reinforcing charges, preferably glass fibers, comprising a silane coupling agent, an epoxy film forming polymer comprising 2-8 reactive epoxy groups per chain and compatible with thermoplastic polyester matrix resin selected from PET and PBT, and a hypophosphite in an amount of 5 to 30 w % of the composition, preferably 7 to 25 w %, more preferably 10 to 20 w % and most preferably 12 to 18 w % of the composition. A thermoplastic polyester resin reinforced with glass fibers coated with a sizing composition of the invention shows improved resistance to staining and improved tensile elongation at break. The sizing composition further improves processability of the sized fibres.
    Type: Application
    Filed: July 24, 2012
    Publication date: June 26, 2014
    Applicant: 3B-FIBREGLASS SPRL
    Inventors: Nadia Masson, Willy Piret
  • Publication number: 20140179831
    Abstract: Fire retardant or flame retardant additives are incorporated into thermoplastic, thermoset, and/or elastomeric polymer materials to form polymer compositions having improved fire retardant properties. More particularly, the polymer compositions of the present invention comprise additive compositions which have the effect of improving the FR effectiveness, the additive compositions comprising a mesoporous silicate additive. In addition, the polymer compositions of the present invention comprise additive compositions comprising a mesoporous silicate additive and a filler, wherein the filler is a flame retardant addition, an inert filler, or combinations thereof.
    Type: Application
    Filed: July 19, 2013
    Publication date: June 26, 2014
    Inventors: Thomas J. Pinnavaia, Joel I. Dulebohn, Bruce Nanasy
  • Publication number: 20140145339
    Abstract: A mold compound is provided for encapsulating a semiconductor device (101). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.
    Type: Application
    Filed: January 31, 2014
    Publication date: May 29, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Sheila F. CHOPIN, Varughese MATHEW, Leo M. HIGGINS, III, Chu-Chung LEE