Abstract: Provided is a conductive film for antennas, in which a conducting film and a substrate made of a polycarbonate resin material containing a polycarbonate resin are laminated, and the polycarbonate resin contains, as main constituent units, a unit (A) represented by the following formula (1) and/or a unit (B) represented by the following formula (2). The conductive film for antennas has low dielectric characteristics and bendability, can form an antenna with a low transmission loss, and has excellent adhesion to the conducting film. (In the formula (1), R1 and R2 each independently represent an alkyl group having 1 to 6 carbon atoms or a halogen atom, and R3 and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a halogen atom.

Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

Abstract: A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.

Abstract: The present invention relates to a liquid composition comprising a monomer, a (meth)acrylic polymer and at least one flame-retardant substance (FD1) chosen from a phosphorus-based additive. In particular the present invention it relates to a liquid composition comprising a monomer, a (meth)acrylic polymer and at least one flame-retardant substance (FD1) chosen from a phosphorus-based additive that can be used as a syrup and especially as a syrup for impregnation and for the preparation for improving the fire resistance of a thermoplastic polymer or matrix obtained after polymerization of the syrup. Also concerned is a thermoplastic material obtained after polymerization of the liquid composition or syrup. The invention also relates to a process for manufacturing such a liquid composition or syrup. The invention also relates to a process for impregnating a fibrous substrate of long fibers with said liquid composition or syrup.

Abstract: An electrical steel sheet adhesive coating composition according to an exemplary embodiment of the present invention includes, based on 100 wt % of the total solids: a resin at 20 to 40 wt % and having an average particle diameter of 10 to 300 nm; an inorganic nanoparticle at 10 to 35 wt % bonded with the resin; a metal phosphoric acid salt at 10 to 30 wt %; and phosphoric acid at 10 to 40 wt %. An electrical steel sheet product according to an exemplary embodiment of the present invention includes a plurality of electrical steel sheets; and an adhesive layer disposed between the plurality of electrical steel sheets, wherein the adhesive layer includes a metal of one or more kinds among Al, Mg, Ca, Co, Zn, Zr, and Fe at 0.5 to 30 wt %, N at 0.1 to 10 wt %, C at 0.1 to 5 wt %, P at 1 to 30 wt %, a metal of one or more kinds among Si and Ti at 10 to 30 wt %, and a balance of O.

Abstract: The present disclosure relates to a chromium-free coating composition including at least one binder and at least one iron(III)-tris(N,N-dithiocarbamate) complex, where the binder includes at least one synthetic resin and at least one crosslinker. The present disclosure also relates to the use of such a coating composition for the protection against corrosion of metallic substrates, a process for at least partially coating a metallic substrate with such a priming coat, a substrate at least partially coated therewith and an article or a component made of such a substrate.

Abstract: A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.

Abstract: A flame retardant sugar-derived molecule, a process for forming a flame retardant sugar-derived molecule, and an article of manufacture comprising a flame retardant sugar-derived molecule are disclosed. The flame retardant sugar-derived molecule can be synthesized from arabitol, xylitol, arabic acid, or xylonic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame retardant sugar-derived molecule can include reacting arabitol, xylitol, arabic acid, or xylonic acid and a flame retardant phosphorus-based molecule to form the flame retardant sugar-derived molecule.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Abstract: A novel thermoplastic material including polylactic acid (PLA) and calcium hydroxide is provided, the material having an elevated glass transition temperature (Tg). Methods of making this novel material, and articles of manufacture made from it are also provided.

Abstract: A process involving admixing a ligand and an alkanolamine. The process allows the use of ligand despite the presence of contaminating amounts of phosphorus acid, and improves the shelf life of premixed ligand solutions.

Abstract: A method of disposing a corrosion resistant system to a substrate may comprise applying a plating material to the substrate; forming a chemical conversion coating solution by combining a solvent, at least one corrosion inhibitive cation comprising at least one of zinc, calcium, strontium, magnesium, or aluminum, at least one corrosion inhibitive anion comprising at least one of phosphate, molybdate, or silicate, and a complexing agent; and applying the chemical conversion coating solution to the plating material on the substrate.

Abstract: A simple one pot sol-gel method for the synthesis of bi-metal nanostructures is based on non-noble metals (Fe, Co and Sn) and titanium. The method involves the synthesis of mixed metal nanoscale composites using low cost precursors which allow for the synthesis of desired nanocomposite materials with self-scarifying titanium or silica supports. The procedure does not require any surfactant or any need for pH controlled step. Applicants' method involves the in-situ generation of precursors and their simultaneous entrapment in a gel. This simple one pot synthesis allows for the synthesis of homogenous size, shape and distribution of targeted nanostructures. Further, this method can be applied for the preparation of various nanocomposite materials using different choices of metals and self-scarifying supports. Applicants also show that Pd, the noble metal based nanocomposite is feasible.

Abstract: The present disclosure relates to a polycarbonate resin and a method of preparing the same, has an effect of providing a polycarbonate resin having superior chemical resistance and wear resistance due to application of a predetermined comonomer thereto, and a method of preparing the same.

Abstract: A corrosion inhibition composition is disclosed comprising a cerium, a tungstate, a molybdate and silicate compounds. A corrosion inhibition composition is provided comprising a zinc oxide, a zinc hydroxide benzoate, a sodium benzoate, a molybdate and a silicate compound. A corrosion inhibition composition is provided comprising a zinc oxide, a zinc phosphate, a calcium silicate, an aluminum phosphate, a zinc calcium strontium aluminum orthophosphate silicate hydrate, a molybdate, and silicate compounds.

Abstract: A cast-molded article in a composite material comprising a cured polymeric binder incorporating embedded particles of filler, characterized in that the binder incorporates randomly distributed fibers of polyamide, wherein the fibers have a length of 5-20 mm and a diameter of 0.05-0.2 mm and the fibers comprise 0.02-0.5 wt % based on the overall mass of the cast-molded article.

Abstract: This invention relates to a process for producing compounds derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). In particular, the invention relates to producing DOPO-derived compounds by reacting DOPO with diol compounds in the presence of a catalyst. This invention also relates to DOPO derived composition containing a high melting point diastereomer. The DOPO derived compounds may be useful as flame-retardants.

Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.

Abstract: A method for synthesizing poly(butylene succinate-co-butylene adipate) (PBSA), including: a) adding raw materials including succinic acid, adipic acid, and 1,4-butanediol into a reaction still; increasing the temperature in the reaction still to 130° C., and stirring the raw materials, then keeping the temperature in the reaction still at 170-200° C., and dehydrating for 1-3 hours at atmospheric pressure, to yield an oligomer of PBSA; and b) decreasing the temperature of the reaction still to 100° C., and adding a composite catalyst system, the total addition of the composite catalyst system accounting for one ten-thousandth to one ten-millionth of a total weight percentage of the raw materials; uniformly stiffing and mixing the composite catalyst system and reactants, slowly vacuum pumping the reaction still, heating the reaction still to a temperature of 200-240° C. and allowing the composite catalyst system and the reactants to react for 10-20 hrs.

Abstract: The present invention provides a phosphorus-containing flame retardant epoxy resin that can constitute parts of electric or electronic equipment having low water absorptiveness and high heat resistance. The phosphorus-containing flame retardant epoxy resin is obtained by reacting an epoxy resin having at least three epoxy groups per molecule with an organophosphorus compound represented by Formula (I).

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which R1 represents a hydroxyl group or an alkoxy group, R2 represents a hydrogen atom or a monovalent hydrocarbon group, and n is an integer of from 1 to 7; and (E) a release agent including at least one of the following (?) and (?): (?) a linear saturated carboxylic acid having a number average molecular weight of from 550 to 800, and (?) an oxidized polyethylene wax: R1CH2—CH2—OnR2??(1).

Abstract: A corrosion inhibition composition is disclosed comprising a zinc oxide, a zinc hydroxide benzoate, a sodium benzoate, a molybdate compound and a silicate compound. Moreover, a corrosion inhibition composition is disclosed comprising a zinc oxide, a zinc phosphate, a calcium silicate, an aluminum phosphate, a zinc calcium strontium aluminum orthophosphate silicate hydrate, a molybdate, and a silicate compound.

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.

Abstract: Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness.

Abstract: The present invention provides a floor coating composition comprising (A) and aqueous solvent; and (B) a chelating polymer which comprises units derived from one or more aminocarboxylate compounds or their salts, one or more other polymerizable monomers, one or more ethylenically unsaturated monomers and, optionally, one or more crosslinking monomers. For example, the aminocarboxylate compounds or their salts may be one or more of iminodiacetic acid (IDA), iminodisuccinic acid (IDS), ethylenediamine triacetic acid (ED3A) and ethylenediamine disuccinic acid (EDDS), or their salts. Suitable polymerizable monomers may be one or more of glycidyl methacrylate (GMA), allyl glycidyl ether (AGE), vinylbenzyl chloride (VBC), allyl bromide, and their derivatives.

Abstract: Disclosed is an insulating film composition of a non-oriented electrical steel sheet. The insulating film composition of a non-oriented electrical steel sheet according to the present invention comprises a mixed metal phosphate consisting of aluminum phosphate (Al(H3PO4)x=1-3) and cobalt phosphate (Co(H3PO4)3), and an organic/inorganic composite consisting of epoxy resin and silica (SiO2) nanoparticle substituted on the functional group of the epoxy resin.

Abstract: The invention relates to a process for the impregnation of air core reactors or parts of air core reactors and impregnated air core reactors or parts thereof obtainable by said process.

Abstract: A paint composition, which comprises a stanchion-encapsulated pigment such as titanium dioxide, can provide enhanced paint quality with reduced cost.

Abstract: A particulate coating composition, preferably a powder coating composition comprising at least one epoxy containing compound, at least one polycarboxyl polymer, at least one organic Lewis acid and at least one organic Lewis base.

Abstract: A plastic article formed from a thermoplastic composition including a polycarbonate having repeating structural carbonate units according to the formula: in which at least 60 percent of the total number of R1 groups contain aromatic moieties and the balance thereof are aliphatic, alicyclic, or aromatic. The composition also includes an epoxy additive having at least two epoxy groups per molecule and a phenolic diphosphite derived from pentaerythritol. The thermoplastic composition exhibits a dE (2000hrs.) value of less than 1.5 after 2000 hours of heat aging at 130° C., measured according ISO 11664-4:2008(E)/CIE S 014-4/E:2007 using CIE illuminant D65 and a 2.5 mm thick molded plaque of the thermoplastic composition.

Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: The invention relates to mixtures of at least one diphosphinic acid of the formula (I) in which R1, R2 are each H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl R4 is C1-C18-alkylene, C2-C18-alkenylene, C6-C18-arylene, C7-C18-alkylarylene with at least one alkylphosphinic acid of the formula (II) in which R3 is C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl. The invention also relates to a process for preparing these mixtures and to the use thereof.

Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphinates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

Abstract: Mixtures of diphosphinic acids and alkylphosphonic acids, a process for preparation thereof and use thereof. The invention relates to mixtures of at least one diphosphinic acid of the formula (I) in which R1, R2 are each H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl R4 is C1-C18-alkylene, C2-C18-alkenylene, C6-C18-arylene, C7-C18-alkylarylene with at least one alkylphosphonic acid of the formula (II) in which R3 is H, C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl and/or C7-C18-alkylaryl; a process for preparation thereof and use thereof.

Abstract: The invention relates to mixtures of at least one dialkylphosphinic acid of the formula (I) in which R1, R2 are the same or different and are each independently C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl, C7-C18-alkylaryl, with at least one alkylphosphonic acid of the formula (II) in which R3 is C1-C18-alkyl, C2-C18-alkenyl, C6-C18-aryl or C7-C18-alkylaryl; to a process for preparation thereof and to the use thereof.

Abstract: The present invention provides a biodegradable master batch and a preparation method thereof. The biodegradable master batch is prepared by in-situ polymerization of the components in the following formula in weight parts: 10-80 parts of biodegradable monomer or prepolymer, 0.01-5 parts of catalyst, 0.05-5 parts of reaction activator, 0.1-5 parts of thermal stabilizer, 0-80 parts of flame retardant, 0-80 parts of filler, 0-80 parts of antistatic agent, 0-80 parts of pigment, 0-80 parts of foaming agent, and 0-5 parts of surface coupling agent. Provided in the present invention are the biodegradable polymer master batch having good dispersion effect and excellent interface bonding property, and the preparation method thereof.

Abstract: Polyester compositions comprising: a) at least one semi-aromatic polyester resin; b) at least one reinforcing agent; c) hydroxyapatite; d) at least one epoxy component having two or more epoxy functional groups per molecule of the epoxy component; and optionally, at least one toughener, wherein the compositions exhibit the combined property of a desirable melt viscosity stability and a desirable hydrolysis resistance to articles molded from the compositions. Articles molded or extruded from these compositions especially, electric and electronic components. Methods of maintaining melt viscosity stability of a melt-mixed composition while simultaneously retaining tensile strength in the article prepared from the melt-mixed composition.

Abstract: A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein RA and RB are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and RC is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R1-R4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: The present invention relates to composites comprising inorganic micro pigments and/or fillers in the form of surface-phosphated microparticles, whose surface is at least partially coated with finely divided with alkaline earth carbonate nanoparticles by means of binders based on copolymers comprising as the monomers one or more dicarboxylic acids and one or more monomers from the group of diamines, triamines, dialkanolamines or trialkanolamines and epichlorohydrin, a method for producing such composites, aqueous slurries thereof and the use thereof in papermaking or in the field of production of paints and plastics as well as the use of the binders for the coating of microparticles with nano alkaline earth carbonate.

Abstract: The present invention relates to flame retardant polymer compositions which comprise mixtures of phosphinic acid salts and dihydrophospho-phenantrene (DOPO). The mixtures are especially useful for the manufacture of flame retardant compositions based on polyfunctional epoxides and epoxy resin compositions that result in laminates with excellent surface characteristics and reduced delamination tendency.

Abstract: The present disclosure provides curable compositions such as curable compositions including: (i) at least one epoxy resin comprising at least one aromatic or aromatic-derived moiety but not containing an aromatic amine moiety; (ii) an epoxide hardener system comprising: (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines have a difference in melting points of at least 10° C.; and (iii) a filler capable of reducing the density of the curable composition. Also provided are compositions obtainable by curing the curable composition and methods of using the curable composition to fill voids in honeycomb structures.