Ketone Or Aldehyde Dnrm Patents (Class 523/454)
  • Patent number: 10174233
    Abstract: A reactive hot-melt adhesive composition that is moisture curable contains: a urethane prepolymer having an isocyanate group, a (meth)acrylic resin, and an adhesion promoter containing at least an isocyanate group-containing (meth)acrylamide compound.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: January 8, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Misaki Matsumura
  • Patent number: 9109079
    Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: August 18, 2015
    Assignee: ELANTAS GMBH
    Inventors: Klaus-W. Lienert, Ding Wang, Lixin Ye, Changshun Zhou, Wenxue Guo
  • Publication number: 20150111993
    Abstract: Composite compositions and machine and contact tools, for example, metal boring tools and face mills that are manufactured from them. The tools are provided with composite structure to lighten the tools and yet retain the strength and durability of the tool. The novelty resides in the use of additives to certain composites that make up a portion of the tool, especially tool bars.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 23, 2015
    Inventor: Gregory James Kay
  • Patent number: 9012009
    Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hae Kwang Co., Ltd.
    Inventor: Myun Soo Kim
  • Patent number: 8980376
    Abstract: Epoxy resin compositions that include an epoxy resin component that includes at least one epoxy resin and a solvent blend that includes methyl ethyl ketone and glycol methyl ether acetate are provided. The compositions are well-suited for use in the fabrication of prepregs and composite electrical laminates made therefrom.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: March 17, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Robert L. Hearn, William E. Mercer, II
  • Publication number: 20150034940
    Abstract: Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventors: Seung Min LEE, Hyun Jee YOO, Suk Ky CHANG, Jung Sup SHIM, Yoon Gyung CHO, Kyung Yul BAE
  • Publication number: 20140362494
    Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 11, 2014
    Inventors: Tao Cheng, Qilin Chen, Zhou Jin
  • Publication number: 20140364542
    Abstract: A clear coat coating composition with a resin solids content comprising a hydroxyl-functional binder component and a crosslinker component, wherein the hydroxyl-functional binder component comprises at least one hydroxyl-functional urethane component comprising at least one aliphatic polyether polyol having —OCH2CnF2n+1 groups with n=1 or 2 as a building block, and wherein said —OCH2CnF2n+1 groups provide the clear coat coating composition with a fluorine content of 0.1 to 3 wt. %, calculated on the resin solids content of the clear coat coating composition.
    Type: Application
    Filed: November 13, 2012
    Publication date: December 11, 2014
    Inventors: Carmen Flosbach, Thomas Grawe, Kristina Hoehler
  • Publication number: 20140329934
    Abstract: A coating composition, in particular a clear coat coating composition, with a resin solids content comprising a cross-linkable binder component having functional groups with active hydrogen and a cross-linker component, wherein the cross-linker component comprises at least one isocyanate-functional urethane component comprising at least one aliphatic polyether polyol having —OCH2CnF2n+1 groups with n=1 or 2 as a building block, and wherein said —OCH2CnF2n+1 groups provide the clear coat coating composition with a fluorine content of 0.1 to 3 weight %, calculated on the resin solids content of the coating composition.
    Type: Application
    Filed: November 19, 2012
    Publication date: November 6, 2014
    Inventors: Carmen Flosbach, Thomas Grawe, Kristina Kohler
  • Patent number: 8865026
    Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: October 21, 2014
    Assignee: Dexerials Corporation
    Inventor: Yasuhiro Fujita
  • Publication number: 20140264827
    Abstract: Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Inventors: Anna M. Prakash, James C. Matayabas, Arjun Krishnan, Nisha Ananthakrishnan
  • Publication number: 20140227530
    Abstract: The present invention is directed to anti-corrosion coatings. It is particularly directed to coatings comprising a monomer, such as pyrrole, aniline, thiophene, or their analogs, and a resin. These coatings can be used with substrates such as cold-rolled steel and other metals to inhibit surface oxidation.
    Type: Application
    Filed: May 23, 2012
    Publication date: August 14, 2014
    Inventors: Simona Percec, Kayleigh J. Ferguson
  • Publication number: 20140182903
    Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.
    Type: Application
    Filed: July 13, 2012
    Publication date: July 3, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Takashi Sagara, Hidetaka Kakiuchi, Keiko Kashihara, Yuki Kitai, Hirosuke Saito, Daisuke Yokoyama, Hiroaki Fujiwara
  • Publication number: 20140142220
    Abstract: The present invention relates to a fluorine-containing polymer comprising a structure represented by the following general formula (I), as well as the preparation process and use thereof. According to the technical solution of the invention, a novel fluorine-containing polymer with a larger molecular weight and an aromatic side group is obtained through a simple reaction, and it can be used as a non-ionic fluorine carbon surfactant, and especially, is applicable to the preparation of a pigment dispersion. Additionally, the invention further relates to a pigment dispersion and the preparation process thereof.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Inventors: Xuelan Wang, Zhuo Zhang, Jisheng Zhao, Chen Liu
  • Publication number: 20140097388
    Abstract: A method for producing a rubber composition which gives a cross-linked rubber which has a low volume resistivity value, which is low in hardness, and which is kept down in contamination of the photoconductor when used as a conductive member is provided, that is, a production method of a rubber composition comprising a step of mixing a polyether rubber which is dissolved in a solvent at 0.1 to 30 wt % of concentration and a liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber in a solution is provided.
    Type: Application
    Filed: October 3, 2013
    Publication date: April 10, 2014
    Applicants: ZEON Chemicals L.P., ZEON CORPORATION
    Inventors: Kazu NIWA, Clark CABLE
  • Patent number: 8669305
    Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: March 11, 2014
    Assignee: Valeo Japan Co., Ltd.
    Inventors: Katsumi Fujimoto, Takao Hasegawa
  • Publication number: 20140066545
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.
    Type: Application
    Filed: November 28, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Jeong Kyu Lee, Seong Hyun Yoo, Keun Yong Lee
  • Publication number: 20140058017
    Abstract: A pigment dispersion and a method for preparing the same are provided. The pigment dispersion comprises the following components in the following mass percentage: 10%˜20% pigment, 1.5%˜12% dispersant, 0.75%˜7.5% binder resin, 58.5%˜87.3% solvent and 0.45%˜2% nonionic surfactant, based on the total mass of the pigment dispersion. The pigment dispersion is improved in stability, and is applicable to a colored filter.
    Type: Application
    Filed: December 21, 2012
    Publication date: February 27, 2014
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuelan Wang, Chen Liu, Jisheng Zhao, Wenwen Sun
  • Patent number: 8637612
    Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: January 28, 2014
    Assignee: CCP Composites US LLC
    Inventors: Ming Yang Zhao, Chih-Pin Hsu
  • Publication number: 20130331483
    Abstract: The present invention relates to an organic-inorganic hybrid paint composition comprising (a) an organic resin comprising an acrylic resin, a melamine resin and an epoxy resin; (b) a ceramic resin; and (c) a solvent. The paint composition of the present invention may be easily cured without a curing accelerator unlike conventional paint compositions, and it may form a paint film having generally improved properties of surface hardness and scratch resistance, as well as gloss, adhesion, boil resistance, chemical resistance, and the like.
    Type: Application
    Filed: December 16, 2011
    Publication date: December 12, 2013
    Applicant: AKZO NOBEL COATINGS INTERNATIONAL B.V.
    Inventors: Youn Bong Kang, Peng Sam Park
  • Publication number: 20130280455
    Abstract: This invention provides a polymer that is useful in a variety of applications, including as a binder polymer of a coating composition, and especially a packaging coating composition. Packaging articles (e.g., containers) comprising the polymer and methods of making such packaging articles are also provided.
    Type: Application
    Filed: October 15, 2012
    Publication date: October 24, 2013
    Inventors: Richard H. Evans, Jeffrey Niederst, Robert M. O'Brien, Benoit Prouvost, Kevin Romagnoli, Grant Schutte, Paul Stenson, Tom Van Kuren
  • Publication number: 20130237645
    Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.
    Type: Application
    Filed: April 29, 2013
    Publication date: September 12, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Hirohisa Hino, Taro Fukui, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi
  • Patent number: 8512594
    Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: August 20, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Robert Marjo Theodoor Rasing, Gamini Ananda Vedage, Michael Ian Cook, Peter Andrew Lucas
  • Patent number: 8501876
    Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: August 6, 2013
    Assignee: Marabuwerke GmbH & Co. KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8501877
    Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: August 6, 2013
    Assignee: CCP Composites US LLC
    Inventors: Ming Yang Zhao, Chih-Pin Hsu
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Publication number: 20130126789
    Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.
    Type: Application
    Filed: January 2, 2013
    Publication date: May 23, 2013
    Applicant: Sony Chemical & Information Device Corporation
    Inventor: Sony Chemical & Information Device Corporation
  • Publication number: 20130004967
    Abstract: The disclosure provides microstructured articles and methods useful for detecting an analyte in a sample. The articles include microwell arrays.
    Type: Application
    Filed: November 22, 2010
    Publication date: January 3, 2013
    Inventors: Kurt J. Halverson, Raymond J. Kenney, Olester Benson, JR., Raymond P. Johnston, Guoping Mao, Patrick R. Fleming, George Van Dyke Tiers, Naiyong Jing
  • Publication number: 20120329913
    Abstract: The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 27, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventor: GEORGE ELIAS ZAHR
  • Publication number: 20120299216
    Abstract: An adhesive adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques.
    Type: Application
    Filed: July 1, 2011
    Publication date: November 29, 2012
    Applicant: WESTECH AEROSOL CORPORATION
    Inventors: David W. Carnahan, Robert R. Yuodelis, James C. Manlove
  • Publication number: 20120251707
    Abstract: The invention provides an adhesive comprising structurally modified, pyrogenically prepared silicas containing on their surface organosilane groups of the formula (I) SiCnH(2n+1), where n is 2 to 18. The invention further provides for the use of these structurally modified, pyrogenically prepared silicas in adhesives.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 4, 2012
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Mario SCHOLZ, Juergen Meyer, Horst Zeizinger, Pia Buckel
  • Publication number: 20120251955
    Abstract: There is provided a composition for forming a resist underlayer film for electron beam or EUV lithography that is used in a device manufacture process using EUV lithography, reduces the adverse effects caused by an electron beam or EUV, and is effective for the formation of a good resist pattern and a resist pattern formation method using the composition for forming a resist underlayer film for lithography. A composition for forming a resist underlayer film for electron beam or EUV lithography, comprising: a polymer having a repeating unit structure of Formula (1): [where Q is a group of Formula (2) or Formula (3): {where Q1 is a C1-10 alkylene group, a phenylene group, a naphthylene group, or an anthrylene group, X1 is a group of Formula (4), Formula (5), or Formula (6): and a solvent.
    Type: Application
    Filed: December 10, 2010
    Publication date: October 4, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Rikimaru Sakamoto, Takafumi Endo, BangChing Ho
  • Publication number: 20120244297
    Abstract: A vinyl chloride-based resin latex which froths little when unreacted monomer remaining in the latex are recovered under heat and reduced-pressure conditions, and a thermal transfer image-receiving sheet which has satisfactory water resistance, does not yellow during storage, and gives images having excellent durability and light resistance. The invention provides a vinyl chloride-based resin latex contains a copolymer containing a vinyl chloride and an epoxy-group-containing vinyl or contains vinyl chloride, an epoxy-group-containing vinyl, and a carboxylic acid vinyl ester, wherein a content of the epoxy-group-containing vinyl is 0.1% by weight or more but less than 3% by weight, and wherein the latex contains no surfactant, and has a solid concentration of 25% by weight or more; a process for producing the latex; and a thermal transfer image-receiving sheet obtained using the latex.
    Type: Application
    Filed: December 7, 2010
    Publication date: September 27, 2012
    Applicant: Tosoh Corporation
    Inventors: Haruyasu Kitaguchi, Shinichi Yoshida
  • Publication number: 20120214907
    Abstract: The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing mieroballoons.
    Type: Application
    Filed: April 19, 2012
    Publication date: August 23, 2012
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Mahesh Kotnis, Elizabeth Louise Otloski, Paul Terrence Wombwell, William Walter Charles Badcock, Richard Martin Broad
  • Patent number: 8198395
    Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: June 12, 2012
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Gamini Ananda Vedage, Williams Rene Edouard Raymond, Ellen Margaret O'Connell, Maw Lin Foo, Peter Andrew Lucas
  • Patent number: 8198381
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 12, 2012
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Publication number: 20120142822
    Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.
    Type: Application
    Filed: August 6, 2010
    Publication date: June 7, 2012
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takashi Sato, Shuichi Ueno
  • Patent number: 8178598
    Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: May 15, 2012
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Keisuke Hakuya, Michael Ian Cook, Kouichi Sakasegawa, Yoshimi Hasegawa
  • Publication number: 20120100379
    Abstract: Bonding compositions are provided herein for bonding a curable fluoroelastomer composition, and preferably a perfluoroelastomer composition, to a substrate during a heat curing process. The compositions include (a) a compound selected from the group consisting of aluminum acrylates, silicon acrylates, ammonia acrylates, and combinations thereof, (b) an adhesive compound; and (c) a solvent. Methods of bonding fluoro- and perfluoroelastomers to a substrate surface are also including herein which utilize the bonding compositions.
    Type: Application
    Filed: October 18, 2011
    Publication date: April 26, 2012
    Applicant: Greene, Tweed of Delaware, Inc.
    Inventors: Jiazhong Luo, Brian Ux, Eugene Gurevich
  • Patent number: 8153709
    Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: April 10, 2012
    Assignee: Iteq Corporation
    Inventors: Bin Jian, Li-Chun Chen
  • Publication number: 20120065296
    Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 15, 2012
    Inventors: Katsumi FUJIMOTO, Takao HASEGAWA
  • Publication number: 20120025400
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.
    Type: Application
    Filed: July 27, 2011
    Publication date: February 2, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke KOMOTO, Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
  • Publication number: 20120004349
    Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.
    Type: Application
    Filed: March 9, 2010
    Publication date: January 5, 2012
    Inventors: Masami Kaneko, Kazuo Ono, Natsuki Amanokura, Naoyuki Kamegaya
  • Publication number: 20110257299
    Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.
    Type: Application
    Filed: January 6, 2009
    Publication date: October 20, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Tomoyuki Aoyama, Frank Y. Gong, Bernd Hoevel, Michael J. Mullins, Perrin Shao Ping Ren, Joey W. Storer, Hung-Jue Sue, Ludovic Valette, Anteneh Z. Worku, Raymond J. Thibault
  • Publication number: 20110224329
    Abstract: A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed.
    Type: Application
    Filed: January 6, 2009
    Publication date: September 15, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Frank Y. Gong, Michael J. Mullins, Raymond J. Thibault, Wayne Yi
  • Publication number: 20110218273
    Abstract: A process comprising: contacting a) an epoxy resin; b) a compound selected from the group consisting of a phenol-containing compound, an isocyanate-containing compound, and mixtures thereof and c) a stabilizer comprising a metal-containing compound, said metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof; in the presence of a catalyst in an advancement reaction zone under advancement reaction conditions to produce an advancement reaction product is disclosed.
    Type: Application
    Filed: December 15, 2009
    Publication date: September 8, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Raymond J. Thibault, Michael J. Mullins
  • Publication number: 20110076488
    Abstract: A resin composition for a pre-coated steel sheet having good processibility, heat resistance, and corrosion resistance, and a pre-coated steel sheet fabricated by using the resin composition are disclosed. The resin composition includes a 10 to 40 parts by weight of a hardener comprising end-capped blocked polyisocyanate and a melamine resin by 2:1 to 3:1 by parts by weight and 0. 1 to 10 parts by weight of organized layered nano-clay, based on a 100 parts by weight of a base resin. The pre-coated steel sheet obtained by the method exhibits good processibility, heat resistance, and corrosion resistance.
    Type: Application
    Filed: May 14, 2009
    Publication date: March 31, 2011
    Applicant: POSCO
    Inventors: Jae-Soon Lee, Jae-Dong Cho, Jae-Ryung Lee, Yong-Kyun Cho
  • Publication number: 20110003914
    Abstract: A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B).
    Type: Application
    Filed: January 30, 2009
    Publication date: January 6, 2011
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Reona Yokota, Koichi Shibayama, Kazuyoshi Shiomi, Hiroshi Kouyanagi
  • Patent number: 7816430
    Abstract: The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: October 19, 2010
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasuyuki Mizuno, Daisuke Fujimoto, Hiroshi Shimizu, Kazuhito Kobayashi, Takayuki Sueyoshi
  • Publication number: 20100044090
    Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.
    Type: Application
    Filed: April 7, 2008
    Publication date: February 25, 2010
    Applicant: Sumitomo Bakelite Co, Ltd.
    Inventor: Tadasuke Endo