Ketone Or Aldehyde Dnrm Patents (Class 523/454)
  • Publication number: 20100044090
    Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.
    Type: Application
    Filed: April 7, 2008
    Publication date: February 25, 2010
    Applicant: Sumitomo Bakelite Co, Ltd.
    Inventor: Tadasuke Endo
  • Patent number: 7579392
    Abstract: The invention is a formulation that contains: (1) a low-viscosity epoxy resin; (2) a phenolic chain extender whose concentration is less that 0.6 equivalents phenolic hydroxyl group per equivalent of the low-viscosity epoxy resin; (3) a catalyst that promotes self-curing reactions between epoxy groups; (4) an inhibitor that inhibits the activity of the catalyst under “B-staging” conditions; (5) less than 25 weight percent of a volatile organic solvent; and (6) optionally, a multifunctional cross-linking agent. The formulation contains low levels of volatile organic solvent, and can be used to make electrical laminates. It builds molecular weight controllably in B-staging, so that dripping is avoided but the prepreg can be easily laminated.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: August 25, 2009
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, Alan R. Goodson
  • Patent number: 7338226
    Abstract: The invention relates to an aerosol can containing a two-component paint with an aerosol preparation, in particular for use in the automotive industry and for automotive repairs. Said aerosol can contains a binding agent component and a curing component. The binding agent component contains a curable epoxy parent component, solvents and a propellant and the curing component contains a cross-linking agent, which is suitable for curing the epoxy binding agent. The curing component is housed separately from the binding agent component in a cross-linking casing, which is located in the aerosol paint can and can be activated externally.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: March 4, 2008
    Inventor: Peter Kwasny
  • Patent number: 7049354
    Abstract: The present invention provides a novel oxazolidone ring-containing epoxy resin suitable for use as a resin for a coated film having a structure of the formula: wherein R3 represents a residue excluding epoxy groups of diepoxide, X represents a residue excluding isocyanate groups of polyurethane diisocyanate, and n represents an integer of 1 to 5; and wherein X has a structure of the formula: wherein R1 represents a residue excluding isocyanate groups of diisocyanate, R2 represents a residue excluding hydroxyl groups of diol, and m represents an integer of 2 to 10.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: May 23, 2006
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Shuhei Yamoto, Eiji Nakajima, Mitsuo Yamada
  • Patent number: 6924328
    Abstract: A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: August 2, 2005
    Assignee: Valspar Sourcing, Inc.
    Inventors: Jason M. Legleiter, Robert M. O'Brien
  • Patent number: 6887951
    Abstract: The present printing process provides a multilayer coating system comprising a low viscosity, latent, heat-curable thermoplastic adhesive layer, colored ink interlayer, and an abrasion-resistant top lacquer layer that can be utilized for production of heat transferable labels suitable for labeling bottles and other containers that are subjected for over ten cycles to immersion in heated aqueous sodium hydroxide solution for cleaning prior to re-use.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: May 3, 2005
    Assignee: Gotham Ink Corporation
    Inventors: Mukund R. Patel, Robert E. Lafler
  • Patent number: 6881783
    Abstract: Process for preparing a polyol comprising particulate material is dispersed from and in an amount 30-80% by weight.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: April 19, 2005
    Assignee: Huntsman International LLC
    Inventors: Gabriel A Verhelst, Alphonse E J Bruyninckx
  • Patent number: 6830815
    Abstract: The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts made from a low softening point materials with an anti-friction and anti-wear hard coating composition. The coating composition comprises a mixture of (i) solid lubricants comprising boron nitride, graphite and molybdenum disulfide, (ii) a thermoset resin system, (iii) catalyst for curing the resin system and (iv) a solvent system comprising highly volatile solvents. The coating composition is applied to the part and cured to form a coating on the part.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: December 14, 2004
    Assignee: Ford Motor Company
    Inventor: V. Durga Nageswar Rao
  • Patent number: 6649673
    Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: November 18, 2003
    Assignee: Battelle Memorial Institute
    Inventors: James Darryl Browning, Vincent Daniel McGinniss, Bhima Rao Vajayendran
  • Patent number: 6420460
    Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: July 16, 2002
    Assignee: UCB S.A.
    Inventors: Wenqin Zhang, John H. Malpert, Douglas C. Neckers, Dustin B. Martin
  • Patent number: 6387310
    Abstract: A thermosetting resin composition for prestressed concrete tendon, wherein the composition does not harden until the completion of the straining of the tendon, which is the inherent object in the post-tension technique, even if the heat storage temperature in the concrete structures elevates from 30° C. to 80° C. or higher due to heat of hydration reaction in setting a concrete, particularly 95° C. that is the maximum temperature in solidifying a concrete, and the composition including the site of 30° C. or lower where there is substantially no partial heat storage due to heat of hydration reaction in setting the concrete hardens within the prescribed period of time under spontaneous environmental temperature after the subsequent natural cooling, thereby achieving anti-rust and anti-corrosion of the tendon and also adhesion and integral bonding of the tendon and the concrete, a use method thereof and a prestressed concrete tendon.
    Type: Grant
    Filed: April 25, 2000
    Date of Patent: May 14, 2002
    Assignees: Mitsui Chemicals, Inc., Shinko Wire Company, Ltd.
    Inventors: Hiroshi Iizuka, Toshio Kobayashi, Mutsuhiko Ohnisi, Seiichiro Hirata
  • Patent number: 6372350
    Abstract: The present invention relates to epoxy compositions; in particular the present invention relates to stable low temperature curing epoxy-based compositions.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: April 16, 2002
    Assignee: Loctite Corporation
    Inventors: Edward Scott, Brendan Kneafsey
  • Patent number: 6359039
    Abstract: An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: March 19, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Chiang Chen, Jing-Pin Pan, Shur-Fen Liu
  • Patent number: 6359035
    Abstract: This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: March 19, 2002
    Assignees: Ibiden Co., Ltd., Sanyo Chemical Industries, Ltd.
    Inventors: Yoshitaka Ono, Taki Adachi
  • Patent number: 6337362
    Abstract: The compositions described include micronized zinc oxide UV blocking agents with at least one organic UV protective compound. Premix compositions are provided for imparting improved UV resistance to paints, coatings, finishes and plastic articles comprising both micronized inorganic zinc oxide and organic UV protective compounds suitable for easy later inclusion into paint, coating, finish and plastic articles formulations.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: January 8, 2002
    Assignee: Elementis Specialties, Inc.
    Inventors: William Reynolds, Robert Van Doren
  • Patent number: 6333369
    Abstract: The present invention relates to an epoxy-based coating resin composition which facilitates the transcription of the printed letters or photographs developed by sublimation dyes on printing paper to the surface of potteries, glasses, marbles, metals or woods only by thermal treatment and more particularly, to the epoxy-based coating resin composition with 1) long-tern storage stability due to the use of a mixture of diethanolamine and triethanolamine as a hardening accelerator, 2) uniform thickness after coated, 3) less air bubbles after dried, 4) good depth in printing, and 5) a releasing property which promotes easier separation of printing paper from its coated surface after transfer-printed.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: December 25, 2001
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: In-Hwan Park, Bong Keun Song, Jong Hak Kim, Bong Soo Chung
  • Patent number: 6225378
    Abstract: A triazine compound having formula I or formula II: Wherein n is integer from 1 to 5; R1 is hydrogen, halogen, C1-C4 alkyl, or C1-C4 alkoxyl; and R2 is aliphatic amine, aliphatic alcohol, alicyclic amine or alicyclic alcohol, and an epoxy resin composition containing the triazine compound. The epoxy resin composition is suitable for the preparation of the structural substrate of printed circuit boards having low dielectric constant.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: May 1, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Shin-Shin Wang, Hung-Chou Kang, Jie-Hwa Ma, Meng-Song Yin, Se-Tsun Hong, Kuo-Yuan Hsu, Kung-Lung Cheng
  • Patent number: 6136922
    Abstract: A curable composition comprisingA) a mixture ofA1) at least one polymer based on acrylate and/or methacrylate monomers and containing on average 0.1 to 4.0 equivalents of free carboxyl groups per kilogram of polymer, andA2) at least one carboxyl-terminated polyester which contains on average0.
    Type: Grant
    Filed: July 26, 1996
    Date of Patent: October 24, 2000
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Isabelle Frischinger, Jacques-Alain Cotting, Jacques Fran.cedilla.ois
  • Patent number: 5854361
    Abstract: The invention relates to a process for preparing soluble and/or meltable phosphorus-modified epoxy resins, which comprises reacting a polyepoxide compound having at least 2 epoxide groups per molecule with carboxyl-containing phosphinic or phosphonic acids.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: December 29, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Sebastian Horold, Hans-Peter Schmitz
  • Patent number: 5624979
    Abstract: The present invention relates to phosphorus-modified epoxy resins having an epoxide value of 0 to about 1 mol/100 g containing structural units which are derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphinic and/or phosphonic acid anhydrides, wherein at least one phenolic antioxidant is admixed to them. The phosphorus-modified epoxy resins stabilized in this way are distinguished by an increased storage stability, in particular at higher temperatures.The invention furthermore relates to the use of these stabilized, phosphorus-modified epoxy resins for the production of shaped articles, coatings or laminates.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: April 29, 1997
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Hans-Jerg Kleiner, Dieter Regnat
  • Patent number: 5604271
    Abstract: Compositions and methods of use are presented suitable for use in priming a first plastic surface, such as an automobile bumper facie, for adhesion of a second plastic material thereto, such as an epoxy resin. The compositions comprise an epoxy resin and a priming solvent, where the epoxy resin is derived from the reaction product of a first organic material having a plurality of epoxy-functional groups and a second organic material, the second organic material being the combination of a material having a plurality of amine-functional groups and a material having a plurality of mercaptan-functional groups. The first and second organic materials are initially dissolved or dispersed in their respective organic solvents, the two solvents making up the priming solvent. The priming solvent is adapted to wet and penetrate but not be substantially retained by the first plastic surface where applied thereto. Kits useful in repairing plastic surfaces using the compositions of the invention are also presented.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: February 18, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Richard H. Lundeen
  • Patent number: 5599856
    Abstract: Described herein are compositions useful for the preparation of high modulus matrix resins for composites comprising a cycloaliphatic epoxide and a particular modifier.
    Type: Grant
    Filed: March 1, 1984
    Date of Patent: February 4, 1997
    Assignee: Amoco Corporation
    Inventor: Hugh C. Gardner
  • Patent number: 5534565
    Abstract: Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: July 9, 1996
    Assignee: AlliedSignal Inc.
    Inventors: Joseph J. Zupancic, Jeffrey P. Conrad, Jiri D. Konicek, Aroon V. Tungare
  • Patent number: 5470896
    Abstract: Solutions of accelerator systems comprising a binary system comprisinga) 10 to 90% by weight of a salt of formula I[Me].sub.m.sup.x.sym. [R].sub.n.sup.y.crclbar. (I),wherein x and y are the respective number of charges and m and n are each a number 1, 2, 3 or 4, Me is a metal atom and R is the radical of an alcohol, phenol or thiophenol or of a carboxylic acid or thiocarboxylic acid, or10 to 90% by weight of a salt of formula II[Me.sub.1 ].sub.m.sup.x.sym. [A].sub.n.sup.y.crclbar. (II),with an organic complex former containing one or more hetero atoms having free electron pairs,wherein Me.sub.1 is a metal atom or a group of the formula N(R.sub.1).sub.4, S(R.sub.1).sub.3 or P(R.sub.1).sub.4 wherein each R.sub.1 independently of the others is hydrogen, an unsubstituted or substituted C.sub.1 -C.sub.6 alkyl or aryl radical, A is any anion and x, y, m and n are as defined above, andb) 90 to 10% by weight of an organic solvent containing at least one --OH, --OR.sub.1, --COOH, --COOR.sub.1, --COR.sub.1 or --CON(R.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: November 28, 1995
    Assignee: Ciba-Geigy Corporation
    Inventors: Alex Wegmann, Heinz Wolleb
  • Patent number: 5468461
    Abstract: An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based on the aromatic polyamine, of a promoter selected from the group consisting of phenol compounds and cresol compounds, (3) from 10 to 60 parts by weight of a polyisocyanate, (4) from 10 to 40 phr, based on the sum of components (1), (2), and (3), of silica particles of colloidal silica or fumed silica or a mixture of these, (5) from 0.5 to 5 phr of a lubricant, and (6) an organic solvent. The composition is particularly suitable for use to apply onto the chromate coating of a chromated, zinc-plated steel sheet.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: November 21, 1995
    Assignees: Nippon Paint Co., Ltd., Sumitomo Metal Industries, Ltd.
    Inventors: Yasushi Hosoda, Toshiaki Shiota, Nobukazu Suzuki, Satoshi Ikeda, Taketosi Odawa, Koichi Kimura, Hisataka Yamamoto
  • Patent number: 5428082
    Abstract: Compositions of coreactant resins, such as an epoxy resin, and polyanhydrides that contain non-cyclic anhydride moieties are cured to provide coatings that have good exterior durability. Preferred high molecular weight polyanhydrides contain a central polymer moiety that has no more than about 25 weight percent repeating units derived from unsaturated aliphatic hydrocarbon monomers. In other preferred polyanhydrides, the anhydride moleties are linked to a central moiety by an ester moiety.
    Type: Grant
    Filed: February 10, 1994
    Date of Patent: June 27, 1995
    Assignee: The Dow Chemical Company
    Inventors: Michael L. Gould, David A. Grilli, Marvin L. Dettloff, Richard A. Hickner, James A. Rabon
  • Patent number: 5326795
    Abstract: Storage stable thermosettable ethylenically unsaturated resins containing at least one 1,4-naphthoquinone substituted on the 2 or 3 or both the 2 and 3 positions. The reactivity of these storage stable resins with curing agents is not unacceptably reduced by the presence of the stabilizer. The compositions are useful in the preparation of laminates or composites and in filament winding pultrusion, braiding and resin transfer molding applications.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: July 5, 1994
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 5326794
    Abstract: A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: July 5, 1994
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Pin Pan, Chuen-Chyr Chen, Gwo-Yuh Shiau, Ker-Ming Chen
  • Patent number: 5218029
    Abstract: A free flowing powder of discrete particles of a polar group-containing modified propylene polymer (MPP) is disclosed. This MPP powder has an average particle size of less than about 5 microns and comprises about 25-45 wt. % of discrete particles of the MPP and about 55-75 wt. % of a liquid which is a solvent for a film forming resin material, all wt. percentages being based on the total weight of the powder. The preferred MPP is maleic anhydride polypropylene. The preferred film forming resin solvent is methyl ethyl ketone (MEK). The MPP powder is adapted to be suspended in a primer composition containing a film forming resin, preferably an epoxy resin.
    Type: Grant
    Filed: September 25, 1991
    Date of Patent: June 8, 1993
    Assignee: Morton Thiokol
    Inventor: Richard L. Brook
  • Patent number: 5124406
    Abstract: The present invention relates to an epoxy ester coating copolymer resin which is useful in the preparation of an air curable, high solids coating, which resin is the reaction product of components (I), (II) and (III); wherein (I) is a polymerizable base of (a) a fatty acid having free radical polymerizable double bonds and (b) a vinyl monomer selected from the group consisting of styrenes, vinyl toluene and mixtures thereof; (II) is an epoxy resin and (III) is a monobasic acid. The epoxy ester copolymer resin of the invention is prepared by the reaction of (I), (II) and (III) at an elevated temperature to an acid number below 10.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: June 23, 1992
    Assignee: Cargill, Incorporated
    Inventors: Thomas E. Rolando, Roger A. Schmidt, K. A. Pai Panandiker
  • Patent number: 5122552
    Abstract: A coating composition particularly useful in for forming exterior finishes on the exterior of vehicle parts, the binder of the composition which is in an organic liquid carrier is a polyesterurethane and a multifunctional epoxy compound; whereinthe polyesterurethane is formed by reacting a hydroxy functional polyester with a hydroxy containing carboxylic acid and an organic polyisocyanate andthe multifunctional epoxy resin is an aliphatic, cycloaliphatic or aromatic epoxy resin; coated parts, laminates and composite structures made with the coating composition are also part of the invention.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: June 16, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Jeffery W. Johnson
  • Patent number: 5095052
    Abstract: The high sublimation energy of industrial diamond pigment is combined with the clean ablation properties of an epoxy or urethane binder. The result is a low impulse decoy coating that has the desired compatibility with the decoy heat shield materials, good radar transmission, and a neutral effect on the electron densities in the wake. A high volume fraction of the diamond pigment is required to substantially reduce the blow-off impulse. The coating for a carbon-carbon substrate is a mixture of diamond pigment and a urethane or epoxy binder. Good quality, strong adherent coatings for a low-impulse decoy were fabricated in the range of 85 to 90 weight percent of diamond for both urethane and epoxy.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: March 10, 1992
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Chadwick B. Delano, Michael R. McHenry
  • Patent number: 5079094
    Abstract: Reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: January 7, 1992
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Michael E. Kimball
  • Patent number: 5034437
    Abstract: Thermosettable ethylenically unsaturated resins are rendered storage stable by the addition of a complex formed by mixing (a) at least one quinonoid compound and (b) at least one imidazole compound. The reactivity of these storage stable resins with curing agents is not significantly reduced by the presence of the stabilizer complex.
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: July 23, 1991
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 5021537
    Abstract: A coating composition is provided comprising an epoxy resin, a polyacetoacetate, a curing agent for the epoxy resin, and an optional organic solvent. The presence of the polyacetoacetate permits the preparation of a fast-drying high-solids coating formulation.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: June 4, 1991
    Assignee: Shell Oil Company
    Inventors: Charles J. Stark, Rita D. Pietruszka
  • Patent number: 4981886
    Abstract: A colored macromolecular polymer is produced by a method which comprises dissolving a soluble salt of a noble metal in a liquid monomer, polymerizing the monomer having the soluble salt of the noble metal dissolved therein, and subjecting the resultant solid polymer to a heat treatment at a temperature equal to or exceeding the colloid-forming temperature of the noble metal.
    Type: Grant
    Filed: October 26, 1988
    Date of Patent: January 1, 1991
    Assignees: Agency of Industrial Science Technology, Ministry of International Trade & Industry
    Inventors: Yukimichi Nako, Kyoji Kaeriyama, Aizo Yamauchi
  • Patent number: 4975221
    Abstract: This invention presents improved epoxy-based die attach adhesives which are of low viscosity, high ionic purity, and stable toward thermal cycling. This improvement is obtained by including in the formulation carboxy terminated polymers which are the reaction products of polyether diols with cyclic dianhydrides.
    Type: Grant
    Filed: May 12, 1989
    Date of Patent: December 4, 1990
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Shuhchung S. Chen, Jules E. Schoenberg, Song Park
  • Patent number: 4962138
    Abstract: Novel reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: October 9, 1990
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Michael E. Kimball
  • Patent number: 4960634
    Abstract: A composition of enhanced thermal conductivity which comprises a tetrabrominated diglycidyl ether polyepoxide; and epoxy polymer having an epoxy functionality of 3.5 to 6; zinc oxide and curing agents; and use thereof.
    Type: Grant
    Filed: March 14, 1990
    Date of Patent: October 2, 1990
    Assignee: International Business Machines Corporation
    Inventors: Christina M. Boyko, Craig N. Johnston, James R. Loomis, Carl E. Samuelson, Ricahrd A. Schumacher
  • Patent number: 4933380
    Abstract: An air-drying aqueous coating composition for eletrodeposition comprising[A] water-solubilized product or a water-dispersed product obtained by reacting (A-1) an epoxy resin and (A-2) a maleinized product of a (semi)drying oil fatty acid-modified vinyl polymer having an acid value of 10 to 200 in such proportions that the solids weight ratio of the component (A-1) to the component (A-2) is from 90/10 to 5/95, and[B] an amphoteric organic solvent having affinity for component [A].
    Type: Grant
    Filed: September 1, 1989
    Date of Patent: June 12, 1990
    Assignee: Kansai Paint Co.
    Inventors: Tetsuo Aihara, Yasuharu Nakayama, Shigeki Matsubara
  • Patent number: 4923934
    Abstract: A composition for use in forming an interpenetrating polymer network includes a blocked urethane prepolymer, a polyol, an epoxy resin and an epoxy catalyzing agent.
    Type: Grant
    Filed: January 5, 1989
    Date of Patent: May 8, 1990
    Inventor: Todd A. Werner
  • Patent number: 4876295
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an armotic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: April 18, 1988
    Date of Patent: October 24, 1989
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 4874669
    Abstract: Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a ketone solvent solution of a curable composition comprising (A) at least one aromatic based epoxy resin having an average number of epoxide groups per molecule of more than 2; (B) a mixture of (1) at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule; and (2) at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C), optionally, at least one catalyst for effecting the reaction between (A) and (B).
    Type: Grant
    Filed: August 15, 1988
    Date of Patent: October 17, 1989
    Assignee: The Dow Chemical Company
    Inventors: Paul A. Larson, Dale J. Aldrich, Jody R. Berman
  • Patent number: 4870141
    Abstract: Novel solvent-based thermosetting composition comprising (a) hydroxy functional epoxy ester resin of number average molecular weight (Mn) between about 1,000 and about 5,000, comprising the reaction product of diepoxide with aliphatic diol and, subsequently, with acid component comprising (i) hydroxy functional acid and, optionally, (ii) fatty acid; and (b) polyfunctional, hydroxy-reactive crosslinking agent, for example, aminoplast crosslinking agent or blocked polyisocyanate crosslinking agent comprising isocyanate groups blocked by reaction with an active hydrogen bearing blocking agent. Coating composition may be formulated as primer sprayable with conventional spraying equipment.
    Type: Grant
    Filed: November 4, 1987
    Date of Patent: September 26, 1989
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Panagiotis I. Kordomenos
  • Patent number: 4842936
    Abstract: Composite basic resin particles each of which comprises a granular body portion of crosslinked polymer having a mean diameter of 0.01 to 10.mu. and a number of linear polymer chains, a part of the respective linear polymer chain penetrating into the inside of the granular body portion and the remaining part extending outwardly therefrom, and at least part of said linear polymer chains bearing basic functional groups selected from amino groups and ammonium group. A dispersion of said composite basic resin particles in an organic solvent is useful as a resinous vehicle for coating compositions.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: June 27, 1989
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Akio Kashihara, Keizou Ishii, Shinichi Ishikura
  • Patent number: 4837248
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: April 18, 1988
    Date of Patent: June 6, 1989
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 4832748
    Abstract: A coating composition comprising (a) an imine obtained by reaction of an organic silicon compound having an aminoalkyl group and at least one alkoxy group with an organic carbonyl compound, (b) a compound having at least one oxirane ring, and optionally (c) a compound having at least one acryloyl or methacryloyl group.
    Type: Grant
    Filed: October 19, 1987
    Date of Patent: May 23, 1989
    Assignee: Toagosei Chemical Industry Co., Ltd.
    Inventors: Kunio Tawara, Toshiro Hirose
  • Patent number: 4812535
    Abstract: A solvent-based thermosetting coating composition comprising a hydroxy functional epoxy-polyester graft copolymer and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer suitable for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy functional epoxy-polyester graft copolymer is the product of polymerization of lactone monomers in the presence of hydroxy functional epoxy ester resin precursor. The precursor resin is the reaction product of diepoxide chain extended with diphenol and chain terminated with acid component comprising primary hydroxy functional acid. The polymerization of the lactone monomers is carried out at a temperature between about 50.degree. C. and about 300.degree. C.
    Type: Grant
    Filed: September 3, 1987
    Date of Patent: March 14, 1989
    Assignee: E. I. DuPont de Nemours and Company
    Inventors: Andrew H. Dervan, Panagiotis I. Kordomenos
  • Patent number: 4808652
    Abstract: Crosslinker compositions comprising an etherified amino resin, a styrene allyl alcohol copolymer and an epoxy resin. The crosslinker compositions are used to cure hydroxy functional coating vehicles to provide cured coatings resistant to staining.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: February 28, 1989
    Assignee: Monsanto Company
    Inventor: Kenneth J. Gardner
  • Patent number: 4794149
    Abstract: Solvent-based thermosetting coating composition comprising a hydroxy functional epoxy ester resin, linear polycaprolactone diol and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy functional epoxy ester resin is the reaction product of diepoxide chain extended with aliphatic diol and chain terminated with acid component comprising primary hydroxy functional acid.
    Type: Grant
    Filed: September 3, 1987
    Date of Patent: December 27, 1988
    Assignee: E. I. Du Pont De Nemours and Company
    Inventors: Andrew H. Dervan, Dennis J. Grebur, Panagiotis I. Kordomenos