Abstract: A method of producing a heat-resistant chlorine-containing crosslinked resin formed body, formed from: Step (a) of melt-mixing, to a base resin containing a chlorinated polyethylene and a polyvinyl chloride and a plasticizer, an organic peroxide, an inorganic filler, and a silane coupling agent, at a specific ratio, at a temperature equal to or higher than a decomposition temperature of the organic peroxide; Step (b) of mixing a silane masterbatch obtained in Step (a) and a silanol condensation catalyst; and Step (c) of crosslinking by bringing a formed body obtained by Step (b) into contact with water; wherein, in Step (a), from 5 to 55 mass % of the plasticizer is contained in 100 mass % of the base resin to be used in the reaction with the silane coupling agent; the formed body produced therefrom; a silane masterbatch and a mixture thereof; and a heat resistant product.

Abstract: Provided herein are compositions made from a matrix and encapsulated phase change material particles dispersed therein, and electronic devices assembled therewith.

Abstract: A method for preparing a functionalized graphene layer is provided. The method utilizes superiority of transparent conductivity of the graphene and modifiability of the graphene surface to endow the graphene with an effect of liquid crystal molecule alignment. Thus, the functionalized graphene layer provides both transparent conductivity and liquid crystal alignment, and an alignment process that subsequently uses an alignment material is not necessary.

Abstract: A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500.

Abstract: A method for producing a thermodynamically more stable clathrate compound including at least one compound selected from the group consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 5-hydroxyisophthalic acid, and 5-nitroisophthalic acid as a host compound and an imidazole compound as a guest compound. The method for producing a clathrate compound includes: a mixing step of mixing a mixed solvent including a protic solvent, at least one compound selected from the group consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 5-hydroxyisophthalic acid and 5-nitroisophthalic acid, and an imidazole compound; and a heating step.

Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Abstract: This invention relates to thermosetting resin compositions useful for fluxing underfill applications, particularly in the form of a preapplied film.

Abstract: The present invention relates to a method for preparing a tank mix, which comprises the step of contacting a pesticide formulation, water, and a tank mix adjuvant which comprises a carbonate of the formula (I); to a pesticide formulation comprising the tank mix adjuvant; to a method of controlling phytopathogenic fungi and/or undesired vegetation and/or undesired insect or mite attack and/or for regulating the growth of plants, wherein the tank mix or the pesticide formulation is allowed to act on the respective pests, their environment or the plants to be protected from the respective pest, on the soil and/or on undesired plants and/or the crop plants and/or their environment; and to a use of the tank mix adjuvant for increasing the efficacyl of a pesticide.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: Composite compositions and machine and contact tools, for example, metal boring tools and face mills that are manufactured from them. The tools are provided with composite structure to lighten the tools and yet retain the strength and durability of the tool. The novelty resides in the use of additives to certain composites that make up a portion of the tool, especially tool bars.

Abstract: A coating comprising MgO, amino acid and a film-forming resin are disclosed as are methods of curing such a coating to coat at least a portion of a substrate and a substrate coated thereby.

Abstract: Described herein is an epoxy composition comprising: a first component comprising an amine-based curing agent and a first dye, having a first color; and a second component comprising a curable epoxy resin and a second dye, having a second color. Also described herein is a shelf-life-indicating composition comprising: an amine-based curing agent; and a dye selected from (i) a cationic triarylmethane dye, wherein the cationic triarylmethane dye reversibly reacts with a primary amine; (ii) a halochromic dye having a color transition range between 7-12 when measured in an aqueous solution; or (iii) combinations thereof.

Abstract: Curable composition obtained by combining and mixing an epoxy resin composition, comprising an epoxy resin and a carboxamide, and a polyisocyanate composition, comprising a polyisocyanate, a lithium halide and a urea compound, wherein the number of moles of lithium halide per isocyanate equivalent ranges of from 0.0001-0.04 and the number of urea+biuret equivalents per isocyanate equivalent of from 0.0001-0.4.

Abstract: A method for preparing an insulating varnish. The method includes: providing equivalence of an epoxy resin solution having a concentration exceeding 99 wt. % and acetone solution having a concentration of 40 wt. %, adding silane coupling agent-modified hexagonal boron nitride (BN) having a particle size of between 200 and 250 nm to the acetone solution and stirring; mixing the epoxy resin solution and the acetone solution and stirring, and dispersing the resulting mixture; adding to the mixture, low molecular weight polyamide resins as a curing agent, and stirring to uniformly disperse the curing agent; adding n-butane as a lubricant to the mixture and stirring, cooling the mixture to room temperature, adding di-n-butyl phthalate as a diluent to the mixture and stirring; and allowing the mixture to stand in a vacuum drier to remove bubbles to yield the insulating varnish, which is free of bubbles.

Abstract: A coating material for an aluminum substrate for inkjet computer-to-plate and preparation method and use of same. The composition of the coating material is: high polymer 5-40 wt %; nano-sized and/or micro-sized oxide particles 5-30 wt %; organic solvent constituting the remainder. The high polymer is at least one selected from the group consisting of MMA-BMA-MA terpolymer resin, phenolic resin, epoxy resin, polyurethane, polyester, urea-formaldehyde resin, polyvinyl formal, polyvinyl butyral and gum arabic. The preparation method for obtaining the coating material is to mix the ingredients together and stir at room temperature. A spin coating method or a roll coating method is used to coat the coating material onto a clean aluminum substrate having not undergone electrolytic graining and anodic oxidation treatment, and then the substrate is baked, resulting in the required roughness.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.

Abstract: The invention relates to an epoxy/rubber composition comprising an epoxy resin which comprises an epoxy compound X, the epoxy compound X has epoxy equivalent weight (EEW) from 150 up to 200 and viscosity from 2,000 up to 10,000 cps (25 C), a curing agent, a liquid rubber that is liquid at room temperature and comprises at least 1.5 reactive terminated group, a fluorine contained organic matter, selected from a group, including where: n=1-20; X=—COOH, —CONH2, —CON(C6H5)2, —CH2OH. b) CF3(CF2)nCOOH, where: n=7-9. where: n=3-20.

Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.

Abstract: The present invention relates to epoxy resin formulations comprising a specific catalyst mixture for enhancing the reactivity thereof.

Abstract: There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): [in Formula (1), A is a monocyclic aliphatic hydrocarbon group optionally containing an epoxy group; R1, R2, R3 and R4 are independently a hydrogen atom or a C1-10 alkyl group; n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; and n5 and n6 are individually an integer of 1], and an acid generator.

Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.

Abstract: A non-aqueous dispersion comprising the dispersion polymerization reaction product of an ethylenically unsaturated monomer and a nonlinear, random acrylic polymer stabilizer wherein the polymerization reaction product comprises cyclic carbonate functionality is disclosed. Related coatings, methods, and substrates are also disclosed.

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 ?m and a filler B having an average particle size of not less than 0.1 ?m and less than 1 ?m, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.

Abstract: The invention relates to the use of a powder coating composition consisting of a bonding agent system, a wax comprising an acid group, one or more basic metal compounds or SiO2 for producing a textured/structured coating surface.

Abstract: The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Abstract: Disclosed is a process for the manufacture of a polyalkylene terephthalate such as polybutylene terephthalate. In particular, the process comprises employing a titanium-containing catalyst formed by the reaction product of tetraalkyl titanate and a complexing agent comprising a phosphorous, nitrogen or boron atom. The process is used to prepare polyalkylene terephthalates characterized by improved hydrostability, as well as compositions derived therefrom.

Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) 0.50 to about 5.0 weight percent of one or more amino acid selected from the group consisting of primary amino acids and secondary amino adds; said amino add having no hydroxyl groups and no more than one carboxylic add; optionally, c) one or more polyepoxy compound including at least two or more epoxy groups; d) reinforcing agent; e) polymeric toughener; and f) further additives; wherein the weight percents of components a), b), c) d) e) and f) are based on the total weight of the thermoplastic melt-mixed composition. Also disclosed are processes for making the compositions.

Abstract: The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat.

Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

Abstract: A battery electrode or separator surface protective agent composition having fluidity and being capable of being solidified by hot melt, and comprising at least two types of organic particles comprising organic materials, wherein the organic particles of types different from each other are substantially incompatible with each other, wherein when the composition is solidified by hot melt, the organic particles of the same type thermally fuse with one another to form a continuous phase.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. 1 wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C.

Abstract: A high heat-resistant composite material which comprises a polymerizable composition comprising a bi-functional epoxy compound, a tri- or more-functional epoxy compound and a polymerization initiator, wherein the polymerization initiator comprises a sodium salt or potassium salt of mono- or poly-functional carboxylic acid, and a reinforcing fiber such as a carbon fiber or a glass fiber; and a vehicle member or a construction member comprising the above heat-resistant composite material. Said composite material comprises an epoxy polymer having high heat-resistant physical properties over those of a conventional epoxy polymer as a matrix, and exhibits an extremely high retention factor of storage modulus at high temperature.

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): (B) a phenolic curing agent, (C) an accelerator in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of component (A), and (D) an inorganic filler in an amount of 20 to 900 parts by weight based on 100 parts by weight of component (A).

Abstract: A composition comprising polycarbonate, polyethylene terephthalate, organopolysiloxane-polycarbonate block copolymer, and epoxy-functional block copolymer for providing an improved balance of properties, including heat aging performance in combination with impact resistance. Articles molded from the composition are advantageously useful for automotive applications.

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: wherein n is about 1 to about 10.

Abstract: Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: In the case of an adhesive for fixing an electronic component on a circuit board and/or for embedding an electronic component into a circuit board, the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond on a ply or layer of a circuit board, and fixing optionally being followed by jacketing by plies, and/or by covering by at least one further ply, an epoxy resin-based adhesive is selected, which has at least one added additive to adjust the surface tension and/or viscosity, especially a defoamer and/or an additive for adjusting the levelling properties, which can achieve reliable fixing of a component, especially with avoidance of cavities or air inclusions below the surface of the component to be fixed. Also provided are a method and a use.

Abstract: An end-face sealing agent for display devices, which consists of a resin composition containing (1) a liquid epoxy resin, (2) an epoxy resin curing agent that is liquid at 23° C. and that is selected from the group consisting of acid anhydrides and thiol compounds having two or more mercapto groups in the molecule, (3) a secondary or tertiary amine that is solid at 233° C., or microcapsules that contain a secondary or tertiary amine therein, and (4) a filler, and in which the content of the component (4) is 50 to 150 parts by weight relative to 100 parts by weight of the sum total of the components (1), (2) and (3), and the viscosity as determined using an E-type viscometer at 253° C. and 2.5 rpm is 0.5 to 50 Pas.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a carboxyl group-containing wax having an acid value of 10 to 100 mg KOH/g.

Abstract: Described herein is an epoxy composition comprising: a first component comprising an amine-based curing agent and a first dye, having a first color; and a second component comprising a curable epoxy resin and a second dye, having a second color. Also described herein is a shelf-life-indicating composition comprising: an amine-based curing agent; and a dye selected from (i) a cationic triarylmethane dye, wherein the cationic triarylmethane dye reversibly reacts with a primary amine; (ii) a halochromic dye having a color transition range between 7-12 when measured in an aqueous solution; or (iii) combinations thereof.

Abstract: Epoxy resin compositions comprising a) epoxy resins and b) at least one 2-oxo-[1,3]dioxolane derivative of the formula I in which one or two of the radicals R1 to R4 are an electron-withdrawing organic group having 1 to 20 C atoms or an electron-withdrawing heteroatom, and the remaining radicals R1 to R4 are independently of one another an H atom or a hydrocarbon group having 1 to 20 C atoms.

Abstract: A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.