Abstract: An adhesive composition comprising a silane-modified epoxy resin, a dicyclopentadiene novolac epoxy resin and a curing agent. The composition shows good oily steel bonding, even in the absence of CTBN rubber or rubber adducts as toughening agents, with good Tg values of the cured resin and good Tg retention after hot wet aging.

Abstract: In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N?,N?-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended.

Abstract: A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.

Abstract: The present invention relates to a method for producing a rubber composition containing a rubber component (A) of at least one selected from natural rubbers and synthetic dienic rubbers, a filler containing an inorganic filler (B), a silane coupling agent (C) and a vulcanization promoter (D), wherein the rubber composition is kneaded in multiple stages, and in the first stage of kneading, the rubber component (A), all or a part of the inorganic filler (B), and all or a part of the silane coupling agent (C) are kneaded, and then on the way of the first stage, the vulcanization promoter (D) is added and further kneaded. The production method enables production of a rubber composition having a low-heat-generation property while successfully preventing the coupling function activity of the silane coupling agent from lowering.

Abstract: The present invention relates to a polyarylene sulfide resin composition having excellent impact resistance in which a polyarylene sulfide resin having a specific end group, an epoxy-containing olefin-based elastomer, and/or an organic or inorganic filler are included, and a preparation method thereof.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: Polyamide-filled acrylate copolymer compositions comprising a continuous acrylate copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with diamine curatives the polyamide-filled acrylate copolymer compositions exhibit enhanced resistance to heat aging compared to carbon black-reinforced acrylate copolymer compositions.

Abstract: The present invention is aimed at enhancing dispersibility of filler, maintaining uniform low-thermal-expansion properties and mechanical strength, enhancing insulation characteristics, especially treeing resistivity, of a resin composition or a cured resin product, and enhancing the reliability of a high voltage apparatus, a power transmission and distribution apparatus or the like to which the resin composition or the cured resin product is applied. An insulating resin composition contains an insulating resin 1 as a matrix, a large particle diameter filler 2, and a small particle diameter filler 3 smaller in particle diameter than the large particle diameter filler 2, the large particle diameter filler 2 and the small particle diameter filler 3 being dispersed in the insulating resin 1, wherein the insulating resin 1 and the large particle diameter filler 2 has an affinity for each other, whereas the insulating resin 1 and the small particle diameter filler 3 have no affinity for each other.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: A rubber composition which can be used in particular in tires, based on at least one diene elastomer, one reinforcing filler, one crosslinking system, between 1 and 20 phr of an epoxide resin and between 1 and 15 phr of an amine-comprising curing agent. The pair formed of epoxide resin with an amine-comprising curing agent advantageously replaces the pair formed of phenollformaldehyde resin, which is a methylene acceptor, with the curing agent(s) HMT or H3M, which are conventional methylene donors. The use of this pair of reactants, epoxide resin and amine-comprising curing agent, makes it possible to obtain rubber compositions exhibiting a greater low-strain stiffness in comparison with conventional rubber compositions, without significantly damaging the hysteresis. Moreover, the combination of a phenolic resin, which is a methylene acceptor, with HMT or H3M, which is a methylene donor, produces formaldehyde during the vulcanization of the rubber composition.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: A nano-clay material that exhibits improved compatibility with polymers is described. The nano-clay material may be mixed with polymers to produce a nano-clay polymer nanocomposite material including reduced levels of clay loading. Methods for making the nano-clay nanocomposite material and articles of manufacture from the nanocomposite material are also described.

Abstract: The present invention provides a dual-cure composition containing multifunctional polyols, uretidiones, peroxide curable monomers containing unsaturation and crosslinking agents. The dual-cure composition may be used to form a high modulus material useful as the matrix in a prepreg material and in composites. The present invention also relates to methods for the production of the dual-cure composition, prepreg materials comprising the dual-cure composition and a fibrous support, and composites made from the prepreg material.

Abstract: A binder composition for a rechargeable battery, including a binder polymer having a glass transition temperature (Tg) of 20° C. or less, and having a storage modulus (60° C.) of 50-150 MPa. The binder composition according to an embodiment can improve life characteristics of the rechargeable battery by efficiently controlling expansion of a negative electrode plate.

Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.

Abstract: The invention relates to a rubber composition with a stiffness property promoted by combination of short fibers and resin product of a methylene donor and a methylene acceptor, where at least a portion of the methylene acceptor is comprised of expoxidized phenol formaldehyde, and to a tire with a component comprised of such rubber composition.

Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: A thermoplastic composition suitable for making articles having low gloss and good impact resistance at low temperatures is disclosed. The composition contains (A) 10 to 90 percent relative to the weight of the composition (pbw) of an aromatic (co)poly(ester)carbonate, (B) 10 to 90 pbw of first graft (co)polymer containing a graft base selected from the group consisting of polyurethane, ethylene vinyl acetate, silicone, ethylene-propylene diene rubbers, ethylene propylene rubbers, acrylate rubbers, diene rubbers, and polychloroprene, and a grafted phase, (C) 1 to 20 pbw of a linear glycidyl ester functional polymer comprising repeating units derived from one or more glycidyl ester monomers and (D) 1 to 20 pbw of a second graft (co)polymer containing a core and shell wherein the core contains an interpenetrated network of poly(meth)alkyl acrylate and polyorganosiloxane, and wherein the shell contains poly(meth)acrylate.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The present invention provides a film suitable for applications requiring high water vapor transmission rates. The film comprises a polyolefin polymer together with from 1 to 30 percent by weight of the film of a hydrophilic polymer and from 30 to 75 percent by weight of the film of a filler having a hydrophilic surface functionality.

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: An adduct of (a) at least one divinylarene dioxide, and (b) at least one end-functionalized polymer. For example, the adduct may be beneficially used as a toughening agent for toughening thermoset resins such as epoxy resins.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: A glass composition including SiO2 in an amount from 60.0 to 73.01% by weight, Al2O3 in an amount from about 13.0 to about 26.0% by weight, MgO in an amount from about 5.0 to about 12.75% by weight, CaO in an amount from about 3.25 to about 4.0% by weight, Li2O in an amount from about 3.25 to about 4.0% by weight, and Na2O in an amount from 0.0 to about 0.75% by weight is provided. Glass fibers formed from the inventive composition may be used in applications that require high strength, high stiffness, and low weight. Such applications include, but are not limited to, woven fabrics for use in forming wind blades, armor plating, and aerospace structures.

Abstract: A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.

Abstract: The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.

Abstract: Polyamide-filled acrylate copolymer compositions comprising a continuous acrylate copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with diamine curatives the polyamide-filled acrylate copolymer compositions exhibit enhanced resistance to heat aging compared to carbon black-reinforced acrylate copolymer compositions.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: A rubber composition which can be used in particular in tires, based on at least one diene elastomer, one reinforcing filler, one crosslinking system, between 1 and 20 phr of an epoxide resin and between 1 and 15 phr of an amine-comprising curing agent. The pair formed of epoxide resin with an amine-comprising curing agent advantageously replaces the pair formed of phenol/formaldehyde resin, which is a methylene acceptor, with the curing agent(s) HMT or H3M, which are conventional methylene donors. The use of this pair of reactants, epoxide resin and amine-comprising curing agent, makes it possible to obtain rubber compositions exhibiting a greater low-strain stiffness in comparison with conventional rubber compositions, without significantly damaging the hysteresis. Moreover, the combination of a phenolic resin, which is a methylene acceptor, with HMT or H3M, which is a methylene donor, produces formaldehyde during the vulcanization of the rubber composition.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: The present invention relates to a polymer composition containing (A) an elastomer that has a reactive functional group on a main chain, (B) an inorganic filler, and (C) a coupling agent that has one or less on average per molecule of a modification functional group having binding reactivity with the reactive functional group on the main chain of the elastomer as the component (A), and has a functional group having affinity with the component (B) or being capable of being bonded to the component (B), a rubber composition containing the polymer composition, and a tire containing the rubber composition, and provides a polymer composition that provides a rubber composition capable of enhancing fuel consumption efficiency of a tire and imparting sufficient wear resistance and rupture resistance to a tire, a rubber composition that has the aforementioned properties, containing the polymer composition, and a tire containing the rubber composition.

Abstract: A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Abstract: It relates to the use of curable resins containing a prepolymer based on glycidyl (meth)acrylate for making composite materials for use in space and, more particularly to composite materials entering the composition of structures intended to be deployed in space and to be stiffened after deployment.

Abstract: The present invention relates to a cured electrodeposition coating film which can be applied on a substrate such as an automobile body. The cured electrodeposition coating film has a dynamic glass transition temperature of 105 to 120° C. and a crosslink density of 1.2×10?3 to 2.0×10?3 mole/cc, and phenol structural part represented with the formula: —C6H4—O— within a range of 0.12 to 0.24 mole in molar number based on a resin solid content of 100 g in the cured electrodeposition coating film.

Abstract: A method for applying a plasticity plastic film to an in-mold decoration, including the steps of: (a) providing a substrate defining a top surface and a bottom surface, printing layer and a plastic material; wherein the plasticity plastic film comprises a photo-curing multiple functional group oligomer, a thermohardening resin and a cross-linking agent, and the photo-curing multiple functional group oligomer is cross-linked with the thermohardening resin through the cross-linking agent; (b) forming the plasticity plastic film on the top surface of the substrate; (c) hardening the plasticity plastic film; (d) solidifying the plasticity plastic film to form a plasticity resin layer; (e) covering the bottom surface of the substrate with the printing layer; (f) simultaneously pressing the plasticity resin layer and the substrate to form a predetermined shape; and then (g) forming the plastic material on a bottom surface of the printing layer.

Abstract: An insulating material and the method of applying the insulating material to products and systems. The material, method and system may be applied to tubulars used in deep water projects. The insulating material is composed of ceramic particles, epoxy and an acrylate monomer that is a precurser to an acrylic resin, and additives. Equal volumes of a epoxy component mixtures and a curing agent component mixture when heated and mixed together create a liquid insulating material that can be applied to the outer surface of pipe involving a repetitive series of steps controlled by an operator at a main control panel. Pipe unrolled from a pipe reel is straightened and heated. In a heated retort, liquid insulating material is applied to the surface of pipe and cured to the final insulation coating. The final coated pipe can be replaced on the reel for shipment to the job site.

Abstract: The present invention discloses a thermosetting resin composition comprising: a bifunctional or multifunctional epoxy resin, a styrene-maleic anhydride (SMA) copolymer with a styrene/maleic anhydride molar ratio of 5-12:1 as a curing agent, a BPA epoxy resin with a low or high bromine content or tetrabromobisphenol A as a flame retardant agent, an accelerator and a solvent. The cured resin composition of the invention has a very low dielectric property, improved thermal reliability and better toughness. A copper clad laminate made of the resin composition and a reinforced material such as glass fiber cloth has a very low dielectric constant and dissipation factor, high Td, better toughness and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs and also applied to the common use of epoxy resins, such as molding resins, and composite materials for construction, automobiles and aviation.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.