Inorganic Si-o Bond Dnrm Patents (Class 523/466)
  • Patent number: 10494358
    Abstract: A compound represented by the following formula (1): wherein each X independently represents an oxygen atom or a sulfur atom, or non-crosslinking, R1 represents a single bond or a 2n-valent group having 1 to 30 carbon atoms, the group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aryl group having 6 to 30 carbon atoms, each R2 independently represents a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryloxy group having 6 to 30 carbon atoms, or a hydroxyl group, in which at least one R2 represents an alkoxy group having 1 to 30 carbon atoms or an aryloxy group having 6 to 30 carbon atoms, each m is independently an integer of 1 to 6, each p is independently 0 or 1, and n is an integer of 1 to 4.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Masatoshi Echigo, Takashi Sato, Takashi Makinoshima
  • Patent number: 10269695
    Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: April 23, 2019
    Assignee: Intel Corporation
    Inventors: Robert F. Cheney, Ashish Dhall, Suriyakala Ramalingam
  • Patent number: 10093768
    Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: October 9, 2018
    Assignee: Cytec Industrial Materials (Derby) Limited
    Inventor: Ian Aspin
  • Patent number: 9893380
    Abstract: A polymeric ionic liquid has a formula (I), where A1, A2, B, k, Q, and Z are as defined in the specification. An intermediate polymer for making the polymeric ionic liquid, a process for producing the polymeric ionic liquid, a process for producing a polymer membrane including the polymeric ionic liquid, a process for preparing a gel polymer electrolyte including the polymer membrane, and a binder including the polymeric ionic liquid are also disclosed.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: February 13, 2018
    Assignees: NATIONAL CHENG KUNG UNIVERSITY, RISING CHEMICAL CO., LTD.
    Inventors: Ping-Lin Kuo, Szu-Ting Chen, Huang-Ming Hsu, Chih-Hao Tsao, Chun-Han Hsu, Li-Hsuan Chien
  • Patent number: 9713266
    Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: July 18, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Richard Nichols, Don Jang, Harald Riebel, Frank Brüning
  • Patent number: 9694569
    Abstract: A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-?m/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: July 4, 2017
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Ching-Hung Huang, Kuang-Ting Hsueh, Tzu-Ching Hung, Hui-Chen Huang
  • Patent number: 9598392
    Abstract: A resist composition containing a compound represented by the general formula (1) or (2), a method for forming a resist pattern using the composition, a polyphenolic compound for use in the composition, and an alcoholic compound that can be derived therefrom are described.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: March 21, 2017
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masatoshi Echigo, Masako Yamakawa
  • Patent number: 9487688
    Abstract: The invention relates to a sealant composition, and a liquid crystal display panel using the same. The sealant composition comprises an expansive monomer which can compensate for the volume shrinkage occurring during polymerization of traditional sealant compositions. The sealant composition of the invention can improve the alignment accuracy, enhance the bonding strength, and reduce the vernier key level of the panel, so that the problems such as lower alignment accuracy and bonding strength caused by the volume shrinkage during polymerization of the traditional sealant compositions can be solved.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: November 8, 2016
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Hongpeng Li, Sunghun Song, Jian Li, Ang Xiao
  • Patent number: 9309381
    Abstract: An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: April 12, 2016
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Pritesh G. Patel, Edze Jan Tijsma
  • Patent number: 9193862
    Abstract: The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: November 24, 2015
    Assignee: BASF SE
    Inventors: Lionel Gehringer, Gregor Daun, Michael Henningsen, Rainer Klopsch, Olivier Fleischel
  • Publication number: 20150148453
    Abstract: Disclosed is a halogen-free epoxy resin composition for integrated circuit packaging, and the resin composition includes a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing a curing agent, an inorganic filler, a curing accelerator and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade.
    Type: Application
    Filed: November 24, 2013
    Publication date: May 28, 2015
    Applicants: ITEQ CORPORATION, ITEQ (DONGGUAN) CORPORATION
    Inventors: Feng Tang, Quansheng Zhu, Tsung-Lieh Weng, Yongxin Jiang, Hailin Li, Faquan Tu
  • Publication number: 20150148452
    Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
    Type: Application
    Filed: February 15, 2013
    Publication date: May 28, 2015
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sook-Yeon Park, Yun-Ju Kim, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang
  • Publication number: 20150148454
    Abstract: The invention relates to compositions, especially thermoplastic moulding compositions, comprising polyethylene terephthalate (PET), poly(1,4-cyclohexanedimethanol terephthalate) (PCT), glass fibres and talc, to the use of these compositions in the form of moulding compositions for production of products resistant to heat distortion for short periods, and to a process for producing polyester-based products resistant to heat distortion for short periods, preferably polyester-based electric or electronic products, especially polyester-based optoelectronic products.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 28, 2015
    Inventors: Timo IMMEL, Jochen ENDTNER, Matthias BIENMUELLER
  • Patent number: 9040164
    Abstract: Self-assembled silica condensates are described as well as their use in coating compositions. The self-assembled silica condensates can be formed from the hydrolysis of medium to long chain trialkoxy silane compounds. Coating compositions containing the self-assembled silica condensates can provide coatings having improved scratch and mar resistance and can have excellent recoat adhesion.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: May 26, 2015
    Assignee: AXALTA COATING SYSTEMS IP CO., LLC
    Inventor: Jun Lin
  • Publication number: 20150140883
    Abstract: A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takabumi OOMORI, Keiichi HASEBE
  • Publication number: 20150136299
    Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition which in turn includes a volume of polymer intermixed with a number of color balloons, at least a portion of the number of color balloons each including a shell enclosing a colored agent.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Noah Barlow Mass, Jim Antime Marleau, Richard E. Newton, Jessica Smith
  • Publication number: 20150130318
    Abstract: A rotor-fixing resin composition of the present invention comprising: an epoxy resin-containing thermosetting resin; a curing agent; and an inorganic filler, wherein a tensile elongation at break-a is 0.1% or higher and 1.7% or lower, the tensile elongation at break-a is obtained by subjecting a test piece to a tensile test pursuant to JIS K7162 under conditions of a temperature of 120° C., a test force of 20 MPa and 100 hours, and the test piece is a cured product produced by subjecting the rotor-fixing resin composition to curing by heating at 175° C. for 4 hours, and molding to a dumbbell shape pursuant to JIS K7162.
    Type: Application
    Filed: February 28, 2013
    Publication date: May 14, 2015
    Inventors: Tetsuya Kitada, Kohji Muto
  • Patent number: 9018282
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Patent number: 8999433
    Abstract: Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: April 7, 2015
    Assignee: Huntsman International LLC
    Inventors: Christian Beisele, Josef Grindling, Daniel Baer
  • Publication number: 20150093499
    Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.
    Type: Application
    Filed: March 22, 2013
    Publication date: April 2, 2015
    Inventors: Peter Gröppel, Christian Meichsner
  • Publication number: 20150094403
    Abstract: Disclosed herein is a surface-modified inorganic filler including an alkyl group and an amine group sequentially introduced on a surface thereof, wherein the alkyl group and the amine group are introduced on the surface of the inorganic filler in a weight ratio between the alkyl group and the amine group of 0.5:9.5 to 4:6. An epoxy resin composition including the surface-treated inorganic filler according to the present invention may have low dielectric loss rate and low coefficient of thermal expansion properties.
    Type: Application
    Filed: April 10, 2014
    Publication date: April 2, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Seok KIM, Hwa Young LEE, Ji Hye SHIM
  • Patent number: 8987355
    Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Yukiharu Yuzuriha
  • Patent number: 8987354
    Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 24, 2015
    Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
  • Publication number: 20150069877
    Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Takuya OTOWA, Hiroshi MORITA, Atsushi OHTAKE, Kinya KOBAYASHI, Keiji SUZUKI
  • Publication number: 20150072478
    Abstract: Compositions containing a divinylarene dioxide and a hydroxy-substituted dioxide compound and having relatively low viscosity and reduced volatility are used as underfills in the manufacture of electronic assemblies.
    Type: Application
    Filed: September 11, 2013
    Publication date: March 12, 2015
    Inventor: Paul J. MORGANELLI
  • Publication number: 20150065613
    Abstract: A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 5, 2015
    Applicants: Dow MF Produktions GmbH & Co. OHG, The Dow Chemical Company
    Inventors: Bharati Balijepalli, Theofanis Theofanous, Bernd Hoevel, Nikhil E. Verghese, Ha Q. Pham
  • Publication number: 20150065612
    Abstract: An electrical insulation body for a high-voltage rotary machine is provided. The electrical insulation body has a synthetic resin which is produced by reacting an epoxy with a hardener, and to which a filler component comprising particles is added, wherein the mass fraction of chlorine in the epoxy is less than 100 ppm.
    Type: Application
    Filed: February 1, 2013
    Publication date: March 5, 2015
    Applicant: Siemens Aktiengesellschaft
    Inventors: Peter Groppel, Christian Meichsner, Friedhelm Pohlmann
  • Publication number: 20150064447
    Abstract: An optical device includes a support structure configured to retain an optical element using a cured adhesive composition that is disposed between a surface of the support structure and a surface of the optical element, wherein a structured optical particulate material is dispersed throughout the cured adhesive. The structured optical particulate material redirects curing radiation via a scattering mechanism to facilitate curing of portions of the adhesive compositions that cannot be directly exposed to the radiation, thereby facilitating rapid and more thorough curing than could otherwise be achieved without the structured optical particulate material.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 5, 2015
    Applicant: Corning Incorporated
    Inventors: Paul Gerard Dewa, Justin Paul Gales, Robert Dennis Grejda, Todd Robert McMichael, Paul John Shustack
  • Patent number: 8969503
    Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: March 3, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Fabio Aguirre Vargas, Raymond J. Thibault, John Beckerdite
  • Publication number: 20150051318
    Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.
    Type: Application
    Filed: March 22, 2013
    Publication date: February 19, 2015
    Inventors: Franz Grohmann, Martin Breineder, Thomas Breineder
  • Publication number: 20150045478
    Abstract: Silicon dioxide particles can reinforce the mechanical properties of an epoxy matrix. Combining carbon nanotubes with the icon dioxide particles to co-reinforce the epoxy matrix achieves increases in compression strength, flexural strength, compression modulus, and flexural modulus. Such composites have increased mechanical properties over that of neat epoxy.
    Type: Application
    Filed: March 7, 2013
    Publication date: February 12, 2015
    Applicant: APPLIED NANOTECH HOLDINGS, INC.
    Inventors: Dongsheng Mao, Zvi Yaniv
  • Patent number: 8952097
    Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 10, 2015
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Matthias Gössi
  • Publication number: 20150034369
    Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.
    Type: Application
    Filed: July 3, 2012
    Publication date: February 5, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki Kashima, Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi, Yoshihiro Kato
  • Publication number: 20150037589
    Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Inventors: Hiroharu INOUE, Shingo YOSHIOKA
  • Publication number: 20150031794
    Abstract: The invention relates to a method for in-situ synthesis of silicon nanoparticles in a thermosetting polymeric matrix, the thermosetting and thermoset matrices obtained in this way and a material including same. The method includes the following steps: a) forming an aqueous-phase/organic-phase inverse emulsion, wherein the aqueous phase includes at least a basic catalyst and the organic phase includes at least a non-cross-linked (co)polymer precursor chosen from an aliphatic, cycloaliphatic or aromatic epoxy resin precursor, a polyester-imide precursor, an unsaturated/epoxy polyester (co)polymer precursor, a polyether/epoxy (co)polymer precursor and a polyurethane precursor; b) introducing, into the inverse emulsion formed in step a), at least one silicon precursor forming a complete network whereof the rate of hydrolysis is greater than the cross-linking speed of the (co)polymer and c) stirring the mixture obtained in step b) and heating to a temperature between 20° C. and 70° C.
    Type: Application
    Filed: February 20, 2013
    Publication date: January 29, 2015
    Inventors: Chloé Schubert, Olivier Poncelet
  • Publication number: 20150031798
    Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.
    Type: Application
    Filed: August 18, 2014
    Publication date: January 29, 2015
    Inventors: Jens ROCKS, Walter Odermatt
  • Publication number: 20150025178
    Abstract: The present invention relates to an amine curable epoxy resin composition comprising: (A) epoxy resin component comprising: 8-31 wt % of diglycidyl ether of bisphenol A, 3-14 wt % of diglycidyl ether of bisphenol F, 1-5 wt % of monoglycidylether, 0.6-5 wt % of alkylsulphonic phenyl ester, 0.16-1 wt % of wetting and dispersing agent, 0.
    Type: Application
    Filed: February 26, 2013
    Publication date: January 22, 2015
    Inventors: Derek Jingui Jiang, Peter Congxiao Wang, Timothy Marc Handyside, Iris Chunbin Zhao
  • Publication number: 20150014032
    Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.
    Type: Application
    Filed: January 24, 2013
    Publication date: January 15, 2015
    Inventors: Keiichi Hasebe, Seiji Shika, Naoki Kashima, Yoshinori Mabuchi
  • Publication number: 20150017450
    Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 15, 2015
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 8928158
    Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Seung Han, Ju Mi Kim, Sung Su Park, Eun Jung Lee
  • Publication number: 20140378581
    Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.
    Type: Application
    Filed: November 19, 2012
    Publication date: December 25, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Takuya Aoyagi, Takashi Naito, Tadashi Fujieda, Yuichi Sawai, Hajime Murakami, Hiroshi Yoshida, Akihiro Miyauchi, Masahiko Ogino
  • Publication number: 20140377565
    Abstract: A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.
    Type: Application
    Filed: October 30, 2012
    Publication date: December 25, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hiroaki Kobayashi, Masanobu Sogame, Yoshihiro Kato
  • Publication number: 20140367147
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.
    Type: Application
    Filed: February 4, 2014
    Publication date: December 18, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Seong Hyun Yoo, Jin Young Klm, Geum Hee Yun
  • Publication number: 20140370771
    Abstract: Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).
    Type: Application
    Filed: August 24, 2012
    Publication date: December 18, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki Oka, Syouichi Itoh, Masataka Kudo, Michio Yaginuma
  • Patent number: 8900697
    Abstract: This invention relates to a surface modified silica by an alkyl sulfonated tetrazole compound, a preparation method thereof, and a resin composition containing the same. The silica according to this invention can exhibit superior adhesion to a metal.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: December 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Kwan Seo, Jin Won Lee, Sung Nam Cho, Jun Young Kim, Hyun Jung Lee
  • Publication number: 20140342161
    Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 20, 2014
    Applicant: Shengyi Technology Co. Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140329066
    Abstract: To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.
    Type: Application
    Filed: November 30, 2012
    Publication date: November 6, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Chisato Saito, Masanobu Sogame, Yoshinori Mabuchi, Yoshihiro Kato
  • Publication number: 20140316027
    Abstract: There are provided curable resin sols having a curable polycyanate ester resin and at least 30 weight percent of an essentially volatile-free, colloidal dispersion of substantially spherical surface-modified silica nanoparticles; wherein the curable resin sol comprises no greater than 200 parts per million by weight alkali metal and alkaline earth metal ions based on the total weight of the silica nanoparticles and curable polycyanate ester resin. There are also provided compositions comprising such curable resin sol and reinforcing fibers, a process for preparing such compositions, and various articles made using such curable resin sols and compositions.
    Type: Application
    Filed: October 24, 2012
    Publication date: October 23, 2014
    Inventors: Wendy L. Thompson, James M. Nelson, William J. Schultz
  • Publication number: 20140315026
    Abstract: A method is provided for making an annealed door skin or composite door assembly. At least the door skin is formed of a composition comprising a thermoset binder and fiberglass. The door skin, alone or in combination with other parts of a door assembly, is subjected to annealing to make the annealed door skin. The process of annealing comprises the step of heating the door skin, alone or in combination with other parts of the door assembly, above the glass transition temperature yet below the thermal degradation temperature of the thermoset binder for a sufficient amount of time to cause release internal stresses in the door skin, then the step of cooling the door skin.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Inventors: James PFAU, James BRYANT, Liqun XU, Elizalde EXCONDE