Abstract: The present invention is directed to a method for making a di(aminoaryl)fluorene compound that includes the steps of: (a) reacting a fluorenone compound according structure (I) with excess aminobenzene according to structure (II) wherein: each R1, R2, R3, R4, R12, and R13 is independently a group that is inert in the polymerization of epoxy compounds, and R11 is H or (C1-C6)alkyl, in the presence of an acid catalyst, in a liquid medium comprising an aromatic or substituted aromatic solvent having a boiling point of greater than or equal to 150° C. and in the presence of an acid catalyst, in a liquid medium comprising an aromatic or substituted aromatic solvent having a boiling point of greater than or equal to 150° C.

Abstract: A thermoplastic composition includes from about 40 wt % to about 60 wt % polycarbonate homopolymer or copolymer, from about 15 wt % to about 30 wt % styrene acrylonitrile copolymer, from about 13 wt % to about 15 wt % flat glass fiber, and from about 9 wt % to about 11 wt % round glass fiber. Methods for making a thermoplastic composition include forming a mixture from the recited components and extruding or molding the mixture to form the composition.

Abstract: A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: where R1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride ˜10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (˜100° C.).

Abstract: The present embodiment provides a material for forming an underlayer film for lithography, containing at least any of a compound represented by following formula (1) or a resin including a structural unit derived from a compound represented by the following formula (1), wherein R1 represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, each R2 independently represents a halogen atom, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a thiol group, a hydroxyl group, or a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, and may be the same or different in the same naphthalene ring or benzene ring, in which at least one R2 represents a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, n is an integer of 1 to 4, and structural formulae of n struct

Abstract: The present invention provides a material for forming an underlayer film for lithography, containing at least any of a compound represented by following formula (1) or a resin including a structural unit derived from a compound represented by the following formula (1), wherein R1 represents a 2n-valent group having a 1 to 60 carbon atoms, or a single bond, each R2 independently represents a halogen atom, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a thiol group, or a hydroxyl group, and may be the same or different in the same naphthalene ring or benzene ring, n is an integer of 1 to 4, structural formulae of n's structural units in square brackets [ ] may be the same or different when n is an integer of 2 or more, X represents an oxygen atom, a sulfur atom, or a non-bridging group, each m2 is independently an integer of 0 to 7, in which at least

Abstract: Encapsulated device including a photovoltaic cell and a composite film overlaying at least a portion of the photovoltaic cell, the composite film further including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer, and a protective (co)polymer layer derived from a silane precursor compound on the oxide layer.

Abstract: A compound represented by the following formula (1): wherein each X independently represents an oxygen atom or a sulfur atom, or non-crosslinking, R1 represents a single bond or a 2n-valent group having 1 to 30 carbon atoms, the group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aryl group having 6 to 30 carbon atoms, each R2 independently represents a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryloxy group having 6 to 30 carbon atoms, or a hydroxyl group, in which at least one R2 represents an alkoxy group having 1 to 30 carbon atoms or an aryloxy group having 6 to 30 carbon atoms, each m is independently an integer of 1 to 6, each p is independently 0 or 1, and n is an integer of 1 to 4.

Abstract: A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

Abstract: The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties—specifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability—specifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.

Abstract: A compound represented by the following formula (1): wherein each X independently represents an oxygen atom or a sulfur atom, or non-crosslinking, R1 represents a single bond or a 2n-valent group having 1 to 30 carbon atoms, the group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aryl group having 6 to 30 carbon atoms, each R2 independently represents a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryloxy group having 6 to 30 carbon atoms, or a hydroxyl group, in which at least one R2 represents an alkoxy group having 1 to 30 carbon atoms or an aryloxy group having 6 to 30 carbon atoms, each m is independently an integer of 1 to 6, each p is independently 0 or 1, and n is an integer of 1 to 4.

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.

Abstract: A polymeric ionic liquid has a formula (I), where A1, A2, B, k, Q, and Z are as defined in the specification. An intermediate polymer for making the polymeric ionic liquid, a process for producing the polymeric ionic liquid, a process for producing a polymer membrane including the polymeric ionic liquid, a process for preparing a gel polymer electrolyte including the polymer membrane, and a binder including the polymeric ionic liquid are also disclosed.

Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

Abstract: A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-?m/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.

Abstract: A resist composition containing a compound represented by the general formula (1) or (2), a method for forming a resist pattern using the composition, a polyphenolic compound for use in the composition, and an alcoholic compound that can be derived therefrom are described.

Abstract: The invention relates to a sealant composition, and a liquid crystal display panel using the same. The sealant composition comprises an expansive monomer which can compensate for the volume shrinkage occurring during polymerization of traditional sealant compositions. The sealant composition of the invention can improve the alignment accuracy, enhance the bonding strength, and reduce the vernier key level of the panel, so that the problems such as lower alignment accuracy and bonding strength caused by the volume shrinkage during polymerization of the traditional sealant compositions can be solved.

Abstract: An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.

Abstract: The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines.

Abstract: The invention relates to compositions, especially thermoplastic moulding compositions, comprising polyethylene terephthalate (PET), poly(1,4-cyclohexanedimethanol terephthalate) (PCT), glass fibres and talc, to the use of these compositions in the form of moulding compositions for production of products resistant to heat distortion for short periods, and to a process for producing polyester-based products resistant to heat distortion for short periods, preferably polyester-based electric or electronic products, especially polyester-based optoelectronic products.

Abstract: Disclosed is a halogen-free epoxy resin composition for integrated circuit packaging, and the resin composition includes a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing a curing agent, an inorganic filler, a curing accelerator and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade.

Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

Abstract: Self-assembled silica condensates are described as well as their use in coating compositions. The self-assembled silica condensates can be formed from the hydrolysis of medium to long chain trialkoxy silane compounds. Coating compositions containing the self-assembled silica condensates can provide coatings having improved scratch and mar resistance and can have excellent recoat adhesion.

Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition which in turn includes a volume of polymer intermixed with a number of color balloons, at least a portion of the number of color balloons each including a shell enclosing a colored agent.

Abstract: A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.

Abstract: A rotor-fixing resin composition of the present invention comprising: an epoxy resin-containing thermosetting resin; a curing agent; and an inorganic filler, wherein a tensile elongation at break-a is 0.1% or higher and 1.7% or lower, the tensile elongation at break-a is obtained by subjecting a test piece to a tensile test pursuant to JIS K7162 under conditions of a temperature of 120° C., a test force of 20 MPa and 100 hours, and the test piece is a cured product produced by subjecting the rotor-fixing resin composition to curing by heating at 175° C. for 4 hours, and molding to a dumbbell shape pursuant to JIS K7162.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.

Abstract: Disclosed herein is a surface-modified inorganic filler including an alkyl group and an amine group sequentially introduced on a surface thereof, wherein the alkyl group and the amine group are introduced on the surface of the inorganic filler in a weight ratio between the alkyl group and the amine group of 0.5:9.5 to 4:6. An epoxy resin composition including the surface-treated inorganic filler according to the present invention may have low dielectric loss rate and low coefficient of thermal expansion properties.

Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.

Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.

Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.

Abstract: Compositions containing a divinylarene dioxide and a hydroxy-substituted dioxide compound and having relatively low viscosity and reduced volatility are used as underfills in the manufacture of electronic assemblies.

Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.

Abstract: A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.

Abstract: An electrical insulation body for a high-voltage rotary machine is provided. The electrical insulation body has a synthetic resin which is produced by reacting an epoxy with a hardener, and to which a filler component comprising particles is added, wherein the mass fraction of chlorine in the epoxy is less than 100 ppm.

Abstract: An optical device includes a support structure configured to retain an optical element using a cured adhesive composition that is disposed between a surface of the support structure and a surface of the optical element, wherein a structured optical particulate material is dispersed throughout the cured adhesive. The structured optical particulate material redirects curing radiation via a scattering mechanism to facilitate curing of portions of the adhesive compositions that cannot be directly exposed to the radiation, thereby facilitating rapid and more thorough curing than could otherwise be achieved without the structured optical particulate material.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.

Abstract: Silicon dioxide particles can reinforce the mechanical properties of an epoxy matrix. Combining carbon nanotubes with the icon dioxide particles to co-reinforce the epoxy matrix achieves increases in compression strength, flexural strength, compression modulus, and flexural modulus. Such composites have increased mechanical properties over that of neat epoxy.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.

Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.

Abstract: The invention relates to a method for in-situ synthesis of silicon nanoparticles in a thermosetting polymeric matrix, the thermosetting and thermoset matrices obtained in this way and a material including same. The method includes the following steps: a) forming an aqueous-phase/organic-phase inverse emulsion, wherein the aqueous phase includes at least a basic catalyst and the organic phase includes at least a non-cross-linked (co)polymer precursor chosen from an aliphatic, cycloaliphatic or aromatic epoxy resin precursor, a polyester-imide precursor, an unsaturated/epoxy polyester (co)polymer precursor, a polyether/epoxy (co)polymer precursor and a polyurethane precursor; b) introducing, into the inverse emulsion formed in step a), at least one silicon precursor forming a complete network whereof the rate of hydrolysis is greater than the cross-linking speed of the (co)polymer and c) stirring the mixture obtained in step b) and heating to a temperature between 20° C. and 70° C.

Abstract: The present invention relates to an amine curable epoxy resin composition comprising: (A) epoxy resin component comprising: 8-31 wt % of diglycidyl ether of bisphenol A, 3-14 wt % of diglycidyl ether of bisphenol F, 1-5 wt % of monoglycidylether, 0.6-5 wt % of alkylsulphonic phenyl ester, 0.16-1 wt % of wetting and dispersing agent, 0.

Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.

Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.