Abstract: Provided are a heat-dissipating black resin composition having excellent physical properties such as heat-dissipation, workability, corrosion resistance, solvent resistance, coating adherence and gloss, and being free from chromium and used for surface treatment of a zinc coated steel sheet, a method for treating a zinc coated steel sheet, and a zinc coated steel sheet treated thereby. The composition includes, based on 100 parts by weight: 10 to 60 parts by weight of a resin composition which at least one main resin and a melamine-based curing agent are mixed in a weight ratio of 10:2-7, the main resin being selected from the group consisting of polyester, epoxy, polyolefin, polyurethane, fluorine, phenol, acryl and polycarbonate resins; 1 to 10 parts by weight of at least one pigment selected from the group consisting of carbon black and carbon nano tube; 1 to 10 parts by weight of a matting agent; and the balance of a solvent.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Abstract: An intumescent coating in the form of an initially liquid coating which cures to a solid and adheres to a substrate. The coating includes a flexible thermosetting epoxy, such as diglycidyl ether of bisphenol-A (DGEBA), with an aliphatic amine curing agent, expandable graphite flakes with reagent chemicals that react upon heating and decompose into gaseous products, and fumed silica. In the presence of heat or flame, an intumescent layer develops at the coating surface, insulating the substrate. The coating is found to add intumescent characteristics which provide heat resistant and fire retardant qualities.

Abstract: The present invention is directed to methods of integrating carbon nanotubes into epoxy polymer composites via chemical functionalization of carbon nanotubes, and to the carbon nanotube-epoxy polymer composites produced by such methods. Integration is enhanced through improved dispersion and/or covalent bonding with the epoxy matrix during the curing process. In general, such methods involve the attachment of chemical moieties (i.e., functional groups) to the sidewall and/or end-cap of carbon nanotubes such that the chemical moieties react with either the epoxy precursor(s) or the curing agent(s) (or both) during the curing process. Additionally, in some embodiments, these or additional chemical moieties can function to facilitate dispersion of the carbon nanotubes by decreasing the van der Waals attractive forces between the nanotubes.

Abstract: A coating composition comprising an effective corrosion-inhibiting amount of a carbon pigment is provided. In one embodiment, the corrosion-inhibiting carbon pigment is further comprising other components such as extenders, including neutral to slightly acidic generating extenders and acidic generating extenders, are earth compounds, amino acids and amino acid derivatives, gelatin and gelatin derivatives, organic-based exchange resins, and combinations thereof, to enhance the corrosion resistance of the resultant coating film. In one embodiment, the carbon pigment is a surface-modified carbon pigment. The coating compositions have good adhesion to substrates such as metals, including aluminum and aluminum alloys.

Abstract: Disclosed herein are a method for producing a fiber-reinforced thermally meltable epoxy resin having excellent heat resistance using a thermally meltable epoxy resin having a high melting initiation temperature and a fiber-reinforced plastic molded by the method. The method for producing a fiber-reinforced thermally meltable epoxy resin comprises the steps of: (I) impregnating reinforcing fibers with a compound (A) having two epoxy groups in one molecule and a compound (B) having two phenolic hydroxyl groups in one molecule; and (II) linearly polymerizing the compounds (A) and (B) impregnated into the reinforcing fibers by polyaddition reaction, wherein at least a part of the compound (A) and/or at least a part of the compound (B) are/is a compound having a fluorene skeleton, and the compound (A) and the compound (B) are mixed in such a ratio that the number of moles of epoxy groups in the compound (A) is 0.9 to 1.1 times the number of moles of phenolic hydroxyl groups in the compound (B).

Abstract: An article includes a reaction product of a filler having binding sites, a coupling agent composition including an aromatic amine and a first cycloolefin substituted with at least one epoxy group, a polymer precursor including a second cycloolefin, and a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. The coupling agent composition is capable of bonding to the filler and the coupling agent composition is compatible with a metathesis catalyst. An associated method is also provided.

Abstract: Disclosed herein is a method for preparing a molding material for a fuel cell separator by dissolving an epoxy resin, a hardener and other additives in acetone and mixing a planar expanded graphite powder with the solution. Further disclosed are a molding material prepared by the method and a fuel cell separator produced from the molding material. The fuel cell separator shows very low gas permeability, superior electrical conductivity, sufficient strength, and maximized uniformity throughout the overall structure of the finished product.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystalline filler, a second talc, and a hydrocarbon resin are mixed forming an accelerator mixture. A methylamino accelerator is mixed into the accelerator mixture forming an epoxy accelerator. Substantially equal amounts of the epoxy base and the epoxy accelerator are mixed to form the lubricating fast-setting epoxy compound having a high lubricity and a curing time ranging from two minutes to twelve minutes. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The epoxy base can also include a flatting agent. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.

Abstract: The invention concerns a coating for a smoothing and/or polishing element, particularly a flexible grinding wheel, provided with a flexible abrasive insert, for smoothing and polishing stone material, consisting essentially of: a blend of epoxy resin and polysulfide; a thixotrope; primary amines; and synthetic diamond treated by a polyvinyl-formal primer.

Abstract: The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

Abstract: The present invention incorporates new processes for blending derivatized carbon nanotubes into polymer matrices to create new polymer/composite materials. When modified with suitable chemical groups using diazonium chemistry, the nanotubes can be made chemically compatible with a polymer matrix, allowing transfer of the properties of the nanotubes (such as mechanical strength) to the properties of the composite material as a whole. To achieve this, the derivatized (modified) carbon nanotubes are physically blended with the polymeric material, and/or, if desired, allowed to react at ambient or elevated temperature. These methods can be utilized to append functionalities to the nanotubes that will further covalently bond to the host polymer matrix, or directly between two tubes themselves.

Abstract: Provided is a coating composition containing (a) a resinous binder composition including an epoxy-functional polymer; and (b) a solid particulate composition dispersed in the resinous binder composition including (i) an electrically conductive material and (ii) a corrosion inhibitive material. The electrically conductive material (i) and the corrosion inhibitive material (ii) are present in a weight ratio of the conductive material (i) to the corrosion inhibitive material (ii) ranging from 1:8 to 12:1. The composition is characterized in that when applied to a conductive substrate to form a coating thereon, the coating is weldable. Coated substrates and related methods are further provided.

Abstract: The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Abstract: As a paint composition of cationic electrodeposition and a method preparing thereof, the paint composition of cationic electrodeposition comprises about 42 to about 47 percent by weight of a cationic electrodeposition resin composition, about 6 to about 13 percent by weight of a pigment paste composition, and about 40 to about 48 percent by weight of ion exchange water. An electronic part film coated by utilizing the paint composition of cationic electrodeposition on alloy such as an iron, an aluminum, etc. does not include a lead and a tin. In addition, when assembling electronic parts, an error rate is minimized by inhibiting frictional static electricity through anti-static capacity, and the probability of a fire is diminished by inhibiting static electricity.

Abstract: The invention relates to a timepiece which has a resin bearing section. Moreover, the invention relates to a wheel train apparatus which has a resin bearing section. The invention is constituted by the timepiece provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin. Alternatively the invention is constituted by the wheel train apparatus provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin.

Abstract: The invention relates to a timepiece which has a resin substrate, rotors, and wheel trains, and relates to a wheel train apparatus which has a resin substrate, bearing members, gear wheel, and the like. The invention is constituted by a timepiece comprising; a gear wheel, and a substrate which supports a shaft of a rotor and/or a shaft of the gear wheel, the substrate being formed from a filled resin. Alternatively the invention is constituted by a wheel train apparatus comprising: a gear wheel; a substrate which supports one shaft section of the gear wheel, and a bridge which rotatably supports an other shaft section of the gear wheel, the substrate and the bridge being formed from a filled resin.

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-toluene bis dimethyl urea, preferably in a concentration exceeding 70% by weight. The composition can be used in prepregs. The relative concentrations of the epoxy resin, curing agent, and catalyst are selected to achieve desired properties, including specific curing times and temperatures, and glass transition temperatures that enable a cured resin composition to be removed from a mold after being heated to its curing temperature, without being cooled. Exemplary formulations have reduced cure times, at both high and low curing temperatures, as compared to prior art formulations.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.

Abstract: A conductive adhesive sealant comprising vinyl ester resin or polyester resin, graphite powder, peroxide free-radical initiator, milled carbon fiber, and a quinone-based inhibitor such as para benzoquinone.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: A tire comprising a tread, where said tread includes a vulcanized rubber, where said vulcanized rubber includes from about 0.5 to about 40 weight percent epoxidized rubber; from about 1 to about 35 parts by weight of a functionalized polyolefin per 100 parts by weight of said vulcanized rubber; and from about 1 to about 100 parts by weight silica per 100 parts by weight of said vulcanized rubber.

Abstract: An abradable dry powder coating (22) composition for coating onto a surface (12) for subsequent curing to form into an abradable coating, including a powder (16) formed of uncured thermoset resin with at least 15 volume percent filler, wherein the filler does not substantially melt below the cure temperature of the resin. Method for making the coating composition includes melt-mixing the thermoset resin with at least 15 volume percent of filler, cooling the resulting mass composite, and then breaking the cooled mass composite into powder particles (16). Method of coating an article with an abradable coating includes applying the dry composite powder with the filler therein onto a substrate and curing the dry powder composition, preferably by electrostatic coating. An article is also disclosed which is coated with the abradable coating.

Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) wh

Abstract: Compositions comprising (a) an epoxy resin, (b) a hardener for the epoxy resin, (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, and (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite, are particularly suitable for producing bipolar plates.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: Described is a flexible, solid fire sealant produced by high shear mixing in a substantially volatile-free state and capable of being molded or extruded into a variety of shapes and used as firestops for windows, doors, dampers, shutters, and through-penetrations, the sealant containing water-insoluble intumescent mineral granules, a polymeric, halogen-free binder, and a flame retardant, wherein the sealant has a softness value from about 0.01 to about 3.75 mm and exhibits high expansion values and chars upon exposure to heat.

Abstract: The invention relates to a thermosetting resin composition including a radically curable resin mixture of: a) 50-100 parts by weight of a radically curable resin that also contains a free monomer capable of copolymerising with it; b) 0-50 parts by weight of a shrink-resistant compound that can also contain an amount of copolymerisable free monomer, the total of (a) and (b) adding up to 100, and 2D-randomly distributed, discontinuous carbon fibres obtained by chopping split, continuous carbon fibre bundles to form packages of carbon filaments, which carbon bundles are provided with a sizing that is at least partially chemically bonded thereto, and with a binder whose solubility at room temperature in the copolymerisable free monomer present in the radically curable resin mixture amounts to at least 10% by weight, the weight percentage of carbon fibres relative to the resin composition being between 5 and 65% by weight, and optionally a filler also being present.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: Epoxy resin polyglycoside-based cured polymers and process for the preparation are described. A particular epoxy resin precursor is the diglycidyl ether of bisphenol A. A particular glucose based polymer is a glucose malic acid ester-vinyl copolymer. The polymers have a degree of biodegradability because of the polyglycoside as well as elevated temperature stability and are useful in transportation vehicle settings. Natural source fillers, such as cellulose fibers, which are treated or untreated, exfoliated clays or exfoliated graphite can be used.

Abstract: Mixtures containing at least one functionalized low-molecular rubber A, at least one cross-linking agent B having groups which are reactive with respect to the functional groups of the rubber A, accelerators/catalysts C for the cross-linking reaction between A and B, possibly reactive diluents D, vulcanization chemicals E, and also fillers F and auxiliary substances G, with at least one of the average functionalities of the constituents A and B being at least 2, and their use as anti-corrosive coating agents.

Abstract: A flywheel system for storing and delivering on demand electrical energy includes a flywheel supported for high speed rotation on bearings in a vacuum enclosure, and a motor-generator for spinning the flywheel up to speed and then for converting the rotational inertia in the flywheel back to electrical power. The flywheel includes a solid steel hub and a rim having only two rings press-fit on the hub with an interference fit. The rings are filament wound construction made primarily from standard modulus carbon fiber/epoxy. The steel hub stores between 40% and 60% of the energy in the flywheel. The press-fitting of the rings on the hub creates radial interference pressure between the hub and each of the composite rings that is greater than 5 ksi when at rest. The outer carbon fiber/epoxy ring is radially thinner than the inner ring, and both the hub outer diameter and the inner diameter of the assembled composite rim are tapered with the same angle.

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.

Abstract: A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particulate material. The conductive resin composition forms a defect-free conductive coating on a substrate after mixing a one part epoxy resin composition under vacuum at a temperature insufficient to induce thermal cure. Adding a liquid epoxy resin to the one part epoxy resin composition to form a mixture combining 40 to 200 parts by weight of conductive particulate with the mixture and dispersing the combined conductive particulate and the mixture under vacuum until a homogeneous conductive resin paste results where the dispersing time for the combined conductive particulate and the mixture under vacuum is greater than or equal to the period of time of vacuum mixing the liquid one part epoxy composition.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: The present invention is a fire-resistant paint containing an epoxy resin, a hardener, and an inorganic filler wherein {circle around (1)} for the total of 100 weight parts of the epoxy resin and the hardener, {circle around (2)} 200-500 weight parts of the inorganic filler, chosen from a group consisting of neutralized thermally expandable graphite, metal carbonate, and a hydrated inorganic compound is contained; {circle around (3)} for the inorganic filler, at least 15-400 weight parts of neutralized thermally expandable graphite is contained; and {circle around (4)} the viscosity of the fire-resistant paint is 1-1,000 ps as measured by a B-type viscometer. The fire-resistant paint of the present invention has particularly remarkable fire resistance, and can be used in a wide range of applications.

Abstract: A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two epoxy groups per molecule), present in an amount of 20 to 50 parts by weight; a liquid anhydride, present in an amount of 80 to 150 parts by weight; a basic latent accelerator, present in an amount of 1 to 5 parts by weight; and a filler, present in an amount of 100 to 500 parts by weight.

Abstract: A current limiting PTC device (10) has two electrodes (14) with a thin film of electric conducting polymer material (20) disposed between the electrodes, the polymer material (20) having superior flexibility and short circuit performance, where the polymer material contains short chain aliphatic diepoxide, conductive filler particles, curing agent, and, preferably, a minor amount of bisphenol A epoxy resin.

Abstract: An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90)  (1), wherein k=0 when 60≦Tc<90 and k=0.35 when 90≦Tc≦200; Tc is the highest temperature (°C.

Abstract: A tray for carrying magnetoresistive heads of magnetic disks which is obtained by molding a resin composition comprising 100 parts by weight of a thermoplastic resin material and, incorporated therein, from 0.1 to 8 parts by weight of carbon fibrils having a fiber diameter of 100 nm or smaller and a fiber length/fiber diameter ratio of 5 or larger. The tray has a stable surface resistivity in the range of from 104 to 1012 &OHgr;/□, has an even surface state, and hardly generates particles upon scratching, wearing, or cleaning.

Abstract: A process for making an improved current limiting composition comprising mixing an epoxy thermosetting resin containing more than one 1,2 epoxy groups per molecule with an acid anhydride curing agent, an epoxy reactive diluent, first and second co-accelerators and conductive additive particles to form a liquid mixture. The liquid mixture is heated at a first temperature range below gelation temperature while drawing a vacuum to drive off volatiles and gases. Continued heating at a second temperature range promotes gelation and heating a third temperature range effects a final cure. A first co-accelerator becomes effective during the gelation temperature range and a second co-accelerator does not become effective until the final cure temperature range. Gelation takes about 2 to 4 hours at about 130° C. to 140° C. and final cure takes about 13 to 18 hours at about 140° C. to 160° C.

Abstract: In the present invention, provided are i) an encapsulant epoxy resin composition comprising an epoxy resin, a curing agent, a non-conductive carbon and an inorganic filler, and ii) an electronic device having an encapsulating member comprising a cured product of this composition.

Abstract: A curable composition useful for repairing worn surfaces on housings comprising an admixture of: (1) a mixture of (a) an one-component epoxy resin, (b) solvent and (c) reactive diluent, wherein said epoxy resin is present in a major amount in said mixture; (2) graphite powder; and (3) polytetrafluoroethylene powder.

Abstract: The present invention relates to a high-resistivity carbon black coated with a resin on the surface and having a volume resistivity of not less than 100 &OHgr;·cm.

Abstract: Improved thermal stability and good adhesion to polyurethane foam are provided by polyphenylene ether thermoplastic blends containing a polystyrene and an aromatic amine. Preferred compositions additionally containing tackifier resins are described. These compositions are particularly useful for molding automobile interior parts.

Abstract: A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing of an epoxy resin, a cross-linking agent and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper and an organic solvent.

Abstract: An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) an at least bifunctional ester-containing compound and/or an at least bifunctional ester-containing resin as a curing agent, 10 to 100% of whose hydroxy groups are esterified with aliphatic or aromatic acyl groups, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1): where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons.