Abstract: Thermoplastic polyurethanes having an alternating sequence of hard and soft segments in which a nanostructured polyhedral oligomeric silsesquioxane diol is used as a chain extender to form a crystalline hard segment constituting SMPs. The polyurethanes are formed by reacting a polyol, a chain extender dihydroxyl-terminated POSS and a diisocyanate. The polyurethanes have multiple applications including for example, implants for human health care, drug delivery matrices, superabsorbant hydrogels, coatings, adhesives, temperature and moisture sensors, etc.

Abstract: A nanocomposite optical plastic article has a plastic host material with a temperature sensitive optical vector (x) and a core shell nanoparticulate material dispersed into the plastic host material. The core shell nanoparticulate material is characterized by a core defined by a nanoparticulate material which has a temperature sensitive optical vector (x1) and a shell defined by a coating material layer coated onto the core. It is important to the invention that temperature sensitive vector (x1) is directionally opposed to the temperature sensitive optical vector (x) and nshell<nplastic host<ncore.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: In this application is disclosed a resin additive composition which can by produced by precipitating a calix(n+m+l)arene represented by the following general formula (2) and in a dissolved state together with or at the same time at least one functional ingredient selected from the group consisting of various water-soluble or hydrophilic resin flam-retardants, resin thermal stabilizers and resin curing agents, and in a dissolved or suspended state. This resin additive composition has a good affinity for organic polymers such as polyolefin and the like, which allows the functional ingredient(s) to be dispersed homogeneously in the resin. Therefore are provided high-performance resin compositions comprising various functional ingredient(s).

Abstract: The present invention provides a resol-type phenol resin composition which can be cured even in a low temperature range, using a curing accelerator which has no adverse effect on other materials or substances with which the resulting cured article is in contact, or a curing accelerator which requires a small amount of an additive. The composition comprises a resol-type phenol resin (A), an alkali earth metal oxide and/or an alkali earth metal hydroxide (B) (e.g. magnesium oxide, calcium hydroxide, barium hydroxide, etc.), and a salt (C) of a sulfur atom-containing oxo acid and a nitrogen atom-containing base (e.g. ammonium thiosulfate, etc.). This composition is cured at 10 to 110° C.

Abstract: The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract: A transparent and abrasion resistant coating which includes a transparent matrix, relatively large-sized abrasion resistant ceramic particles and nanosized ceramic particles for raising the index of refraction of the matrix to that of the abrasion resistant ceramic particles. The present coating provides a scratch resistant coatings for use on plastic substrates, which are needed in a variety of applications such as, high index ophthalmic and sportswear lenses, as well as automobile side windows and aircraft cockpit applications.

Abstract: A high temperature resistive coating composition includes a pigmenting component, a binder component, and a hardening agent. The pigmenting component includes a spinel of the formula AB2O4, in which A is selected from the group consisting of Mg, Fe, Zn, Mn, Cu and Ni, or a combination thereof, and B is selected from the group consisting of Al, Fe and Cr, or a combination thereof. The binder component of the high temperature resistive coating is preferably a polysiloxane material, such as a silicon resin. Moreover, the hardening agent of the high temperature resistive coating includes a finely powdered material selected from the group consisting of diamond powder, BN, WC, SiC, Al2O3, AlN and SiO2. The resistive coating may be advantageously used for coating the interior of a self-cleaning oven, an oven rack, burner grates, and the like, particularly due to its ability to withstand high temperatures.

Abstract: A method for reducing allergenicity of natural latex rubber. The natural latex rubber, prior to its vulcanization, is admixed with mineral oil and extracted to reduce protein levels therein. Ideally, the mineral oil is characterized as having a density of approximately 0.818 to 0.880 and a viscosity of approximately 33.5 cf at 40° C.

Abstract: An adhesive composition which can be formulated to have low or substantially no VOC emissions is provided. Adhesives in accordance with the invention can be formulated as high solids, one-part, reactive, cross-linked adhesives. This can be achieved by utilizing amide-ester-acrylate reactions or reactions with any other carboxylated polymers. Adhesive compositions in accordance with the invention can include oils, such as various drying oils and similarly acting polymers, co-polymers, and fatty acids. Adhesives in accordance with the invention can also include various hydrocarbon resins, particularly crosslinkable hydrocarbons having a melting point in the range 70° C. to 140° C. Cross-linking agents, such as materials with pendant oxazoline groups are also advantageously included. Various other mixing, flow and other handling ingredients can also be included.

Abstract: Sulfonated condensation products that are stable in storage and have increased thermal stability are based on aminoplastic formers having at least two amino groups or naphthalene and formaldehyde and, optionally include organic nitrogen bases which additionally contain, as nitrogenous formulation auxiliary agents, compounds of general formula (I) R1—NH—X—Y—R2, wherein R1 and R2 independently represent H, —CH3, —C2H5, —C3H7, —(CH2)n—CH2—; X?—CH2, CO, CS; Y?S, NH, —(CH2)m—; n=0 to 9; m=1 to 4; and/or compounds of general formula (II), wherein Z?—OCH3, —SO3—H, —SO3Na+, —NO2, —NH2, —NH—NH2, —CO2—Na+, —CHO. The mole ratio of aminoplastic formers: formaldehyde: sulfite: nitrogenous formulation auxiliary agents rangin from 1:1.9 to 6.0:1.0 to 2.0:0.01 to 1.5 and/or the mole ratio of naphthalene sulfonic acid: formaldehyde; nitrogenous formulation auxiliary agents equals 1:0.7 to 3.0:0.01 to 1.5. Method for preparing these condensation products of using them, e.g.

Abstract: The current process for producing powder coatings can be replaced with a process utilizing supercritical fluids including polymer polymerization, compatibilized blending of powder coating ingredients, and particle size control and classification of the powder coating. Traditionally, powder coating resins are polymerized in solvent based system. Next, the resin is blended with additives in a twin screw extruder at high temperatures. The material is then ground and separated by particle size to form the finished powder coating. This invention replaces the previous process by performing all operations in a supercritical fluid, preferably, carbon dioxide. Polymerization is conducted at any pressure above critical pressure and temperature above critical temperature up to 190°C. Solubility of the polymer in the supercritical fluid allows for control and narrow distribution of the molecular weight and a polydispersity of about 2 or less.

Abstract: A composite adhesive featuring a matrix phase that includes a cyanate ester and a filler or reinforcement phase that includes a plurality of bodies of at least one material comprising a high shear strength and/or high modulus material. Preferably, the filler also possesses at least one of high thermal conductivity and low coefficient of thermal expansion. Unlike certain commercially available cyanate esters, those of the instant invention substantially maintain or even increase in strength upon addition of the filler to the system. The instant composite adhesives may also display reduced coefficients of moisture expansion relative to the unfilled or “neat” resin. Such a composite adhesive is extremely useful for joining articles where high strength and minimal swelling in moist environments are required, such as in the precision equipment industry.

Abstract: The purpose of the invention is a coating precursor comprising a silicone resin, a mineral filler and an organic solvent capable of dissolving the said resin and putting the said mineral filler into suspension, the said silicone resin and the said mineral filler being capable of chemically reacting so as to produce a solid layer on a substrate after the organic solvent has evaporated and a cohesive refractory layer after a calcination operation. Another purpose of the invention is a method for coating a given surface of a substrate with at least one refractory layer containing silicon in which the substrate is coated with a coating precursor according to the invention so as to form a green layer and a heat treatment is carried out to calcine the said green layer and to form a cohesive refractory layer. The invention is a means of obtaining a protective coating capable of resisting oxidising environments, liquid metal and solid or molten salt.

Abstract: The purpose of the invention is a coating precursor comprising a silicone resin and a mineral filler capable of chemically reacting so as to produce a solid layer on a substrate and a cohesive refractory layer after a calcination operation. The precursor may also include an additive capable of reducing its viscosity. Another purpose of the invention is a method for coating a given surface of a substrate with at least one refractory layer containing silicon in which the substrate is coated with a coating precursor according to the invention so as to form a green layer and a heat treatment is carried out to calcine the said green layer and to form a cohesive refractory layer. The invention is a means of obtaining a protective coating capable of resisting oxidising environments, liquid metal and a solid or molten salt.

Abstract: A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical shaped alumina grains which have an average grain diameter in a range between 50 &mgr;m and 80 &mgr;m. The heat conductive filler includes micro grains having a grain diameter of 30 &mgr;m or less at a proportion of 5 volume % or less with respect to the total amount of the spherical shaped alumina grains.

Abstract: An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Abstract: A thermoconductive composition is described comprising: (a) 100 parts by weight of wax, (b) 10 to 1,000 parts by weight of the compound of formula (I) below: where, R1 and R2independently represent an alkyl group having 1 to 3 carbons, and n represents a value of 100 to 100,000, (c) 10 to 2,000 parts by weight of a thermoconductive filler and (d) 0 to 1,000 parts by weight of a softener. An article is also described comprising: (a) an exothermic component; (b) a heat radiator; and (c) the thermoconductive composition of claim 1 disposed between the exothermic component and the heat radiator.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A tire sealer and inflator provides utilization of R-134a propellant combined with a sealant composition. In a described example, a tire sealer and inflator includes R-134a propellant, and a sealant composition consisting essentially of, by weight, water approximately 77%, acrylic resin emulsion approximately 22%, sodium nitrite approximately 0.75%, oleic acid approximately 0.01%, and ammonium hydroxide approximately 0.01%.

Abstract: An adhesive composition which can be formulated to have low or substantially no VOC emissions is provided. Adhesives in accordance with the invention can be formulated as high solids, one-part, reactive, cross-linked adhesives. This can be achieved by utilizing amide-ester-acrylate reactions or reactions with any other carboxylated polymers. Adhesive compositions in accordance with the invention can include oils, such as various drying oils and similarly acting polymers, co-polymers, and fatty acids. Adhesives in accordance with the invention can also include various hydrocarbon resins, particularly crosslinkable hydrocarbons having a melting point in the range 70° C. to 140° C. Cross-linking agents, such as materials with pendant oxazoline groups are also advantageously included. Various other mixing, flow and other handling ingredients can also be included.

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract: Disclosed is a thermally conductive silicone gel is produced by reacting a stoichiometric excess of a multifunctional vinyl-substituted silicone with a multifunctional hydride-substituted silicone. The thermal conductive components comprise at least three conductive solid fillers, aluminum oxide, zinc oxide and boron nitride. The invention is adaptable to spin casting for encapsulating electronic circuitry, among other uses.

Abstract: Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: wherein R1 represents an optionally substituted aryl group, an optionally substituted aralkyl group, or an optionally substituted alkenyl group having an optionally substituted aryl group; R2 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 represents an optionally substituted, bivalent hydrocarbon group having 1 to 20 carbon atoms; and a, b, c, d, and e indicate the proportions in mol % of the respective structural units in the formula and satisfy 0<a≦85, 0≦b≦80, 0≦c≦50, 0≦d≦30, and 0<e≦50; a curable resin composition comprising a curable resin (A), a curing agent (B), and a modified polyvinyl acetal resin (C) consisting essentially of repeating units represented by (I′); and a laminated product comprising a laye

Abstract: An adhesive composition which can be formulated to have low or substantially no VOC emissions is provided. Adhesives in accordance with the invention can be formulated as high solids, one-part, reactive, cross-linked adhesives. This can be achieved by utilizing amide-ester-acrylate reactions or reactions with any other carboxylated polymers. Adhesive compositions in accordance with the invention can include oils, such as various drying oils and similarly acting polymers, co-polymers, and fatty acids. Adhesives in accordance with the invention can also include various hydrocarbon resins, particularly crosslinkable hydrocarbons having a melting point in the range 70° C. to 140° C. Cross-linking agents, such as materials with pendant oxazoline groups are also advantageously included. Various other mixing, flow and other handling ingredients can also be included.

Abstract: Erosion resistant coating compositions comprising a poly(Bisphenol A-co-epichlorohydrin) glycidyl end-capped component, an active hydrogen compound, a linear siloxane and a silsesquioxane. Protective coatings formed from such a composition impart particle-erosion resistance to parts having such a coating disposed on some portion of their surface.

Abstract: A composition for providing protection against electrical overstress (EOS) comprising an insulating binder, doped semiconductive particles, and semiconductive particles. The composite materials exhibit a high electrical resistance to normal operating voltage values, but in response to an EOS transient switch to a low electrical resistance and clamp the EOS transient voltage to a low level for the duration of the EOS transient.

Abstract: A mixture Ia comprises a mix IIa composed of a) from 1 to 95% by weight of a solid III, preferably a basic solid III, with a primary particle size of from 5 nm to 20 &mgr;m and b) from 5 to 99% by weight of a polymeric composition IV, obtainable by polymerizing b1) from 5 to 100% by weight, based on the composition IV, of a condensation product V of &agr;) at least one compound VI which is capable of reacting with a carboxylic acid or with a sulfonic acid or with a derivative or a iixture of two or more of these, and &bgr;) at least 1 mol per mole of the compound VI of a carboxylic acid or sulfonic acid VII which has at least one functional group capable of free-radical polymerization, or of a derivative thereof or of a mixture of two or more thereof and b2) from 0 to 95% by weight, based on the composition IV, of another compound VIII with an average molecular weight (number average) of at least 5000 having polyether segments in its main or side chain and at least one ester of the formula (E1) to (E5)

Abstract: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.

Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (&mgr;m) and maximum particle size D2 (&mgr;m) respectively satisfy Equations (2) and (3) below, 3<S<17  (1) D1≦5  (2) D2≦0.5(h1+h2)  (3) (wherein h1 represents the height of the protuberant electrode in the electronic component, and h2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: It is disclosed that an antibacterial acrylonitrile fiber having a photocatalytic activity in which an acrylonitrile fiber containing an antibacterially active metal compound is subjected to a heat treatment within a range of pH 1-6.

Abstract: The present invention relates to pearlescent pigments based on substrates coated with one or more layers of nitrides or oxynitrides to a method for the production of such pigments and their use in plastics, paints, coatings, powder coatings, inks, printing inks, glasses, ceramic products, agriculture foils, for lasermarking of papers and plastics, security applications and in cosmetic formulations.

Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

Abstract: A flame retarded polyamide or polyester resin composition is disclosed. The composition comprises (A) polyamide or polyester resin; (B) 3 to 50 parts by weight per 100 parts of said resin of brominated polystyrene or brominated polyphenylene ether; and (C) 10 to 10,000 ppm of said resin of a thermal coloration inhibitor selected from the group consisting of hydrazine, a hydrazino compound, a hydrazono compound and an acid addition salt thereof.

Abstract: Material compositions for use in orthopedic implants comprising blends of ultra high molecular weight polyethylene (UHMWPE) and hard ceramic powders prepared by blending powdered UHMWPE and the ceramic powder in a high shear mixer are described. Orthopedic implants are then fabricated by pressure/thermo-forming the ceramic/polymer blend into a net shape prosthesis or a rod suitable for subsequently machining the desired components using diamond tooling. Net shape forming is the preferred method for preparing the orthopedic implants.

Abstract: Corrosion inhibiting thermoplastic alloys and methods of preparing same for use in fabricating molded articles with long-term corrosion protection. Masterbatches of nylon, polycarbonate, and polyethylene terephthalate high temperature engineering plastic resins together with selected corrosion inhibitor formulations are extruded for use in injection molding operations Molded articles are prepared from the high temperature engineering plastic resins and a solid phase corrosion inhibitor blended in situ, and wherein the resin consists essentially of nylon, polycarbonates, and polyethylene terephthalate, and wherein the corrosion inhibitor contains a blend of corrosion inhibitors such as cyclohexylammonium benzoate, sodium nitrite, benzotriazole, and sodium sebacate.

Abstract: Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: wherein R1 represents an optionally substituted aryl group, an optionally substituted aralkyl group, or an optionally substituted alkenyl group having an optionally substituted aryl group; R2 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 represents an optionally substituted, bivalent hydrocarbon group having 1 to 20 carbon atoms; and a, b, c, d, and e indicate the proportions in mol % of the respective structural units in the formula and satisfy 0<a≦85, 0≦b≦80, 0≦c≦50, 0≦d≦30, and 0<e≦50; a curable resin composition comprising a curable resin (A), a curing agent (B), and a modified polyvinyl acetal resin (C) consisting essentially of repeating units represented by (I′); and a laminated product comprising a laye

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: Pulverulent rubber powder containing filler which remains free-flowing even after exposure to mechanical stresses, a process for the production thereof, in which the rubber powder is obtained in two precipitation steps, and the use of these powders for the production of vulcanizable rubber compounds.

Abstract: A paste composition having a high thermal conductivity and a relatively low viscosity is used to provide a thermal conductive connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The paste composition comprises a non-aqueous dielectric carrier, thermally conductive filler particles and a specially defined dispersant comprising the self-condensation reaction product of a hydroxy fatty acid, the reaction product having an acid number of about 30-100. A 12-hydroxy stearic acid self condensed reaction product is the preferred dispersant.

Abstract: The present invention concerns polymers obtained by anionic initiation and bearing functions that can be activated by cationic initiations that are not reactive in the presence of anionic polymerization initiators. The presence of such cationic initiation functions allow an efficient cross-linking of the polymer after moulding, particularly in the form of a thin film. It is thus possible to obtain polymers with well-defined properties in terms of molecular weight and cross-linking density. The polymers of the present invention are capable of dissolving ionic compounds inducing a conductivity for the preparation of solid electrolytes.

Abstract: A coating that inhibits stain formation in floor covering. The coating includes a copper amine complex, preferably a copper morpholine complex, and is advantageously applied to an underlayment upon which a floor covering is adhered. Coated panels and floor assemblies that include the coating are also described.

Abstract: An adhesive having polyamide and an electrically conductive filler dispersed or contained therein, for use in bonding components of electrostatographic, contact electrostatic, digital and other like printing machines.

Abstract: An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.

Abstract: The polyamide resin composition comprises a copolyamide resin, a nucleating agent for crystallization, and optionally an inorganic filler. The copolyamide resin is produced by polycondensing a carboxylic acid component mainly comprising adipic acid with a diamine component containing trans-1,4-bis(aminomethyl)cyclohexane, cis- 1,4-bis(aminomethyl)cyclohexane, and optionally another diamine. The nucleating agent for crystallization is selected from an organic nucleating agent and an inorganic nucleating agent. The polyamide resin composition exhibits a good molding cycle and provides a shaped article excellent in the retention of rigidity at a high temperature condition, the durability under a high temperature condition, and the retention of mechanical properties after water-absorption. Therefore, the polyamide resin composition is useful as a metal replacement in various applications such as automobile parts, mechanical parts and electric or electronic parts.

Abstract: A method of preparing a composition containing a fluorocarbon thermoplastic random copolymer comprising the steps of: (a) providing a mixture having: (i) a fluorocarbon thermoplastic random copolymer having subunits of: —(CH2CF2)x—, —(CF2CF(CF3)y—, and —(CF2CF2)z—,  wherein x is from 1 to 50 or 60 to 80 mole percent, y is from 10 to 90 mole percent. z is from 10 to 90 mole percent. x+y+z equals 100 mole percent; (ii) a filler comprising zinc oxide; (iii) a curable amino functional polydimethyl siloxaie copolymer comprising aminofunctional units selected from tile group consisting of (aminoethylaminopropyl) methyl, ( aminopropyl) methyl and (aminopropyl) dimethyl; and (iv) a bisphenol residue curing agent; and (b) curing the mixture for 3 to 10 hours at a temperature in the range of 220° C. to 280° C. and for an additional 2 to 10 hours at a temperature in the range of 250° C. to 270° C.

Abstract: This invention relates to a chlorine free, wax free aqueous composition for providing a repulpable water vapor barrier coating for flexible packaging applications. The composition includes a tackifier resin, a polymer and enough water to provide dispersions of the tackifier resin and the polymer. It may also include a filler with a plate like structure.

Abstract: A method for producing a colored adhesive caulking material by: (a) providing in a resealable container a caulk forming composition which can be thickened by contact with a pigmented composition; (b) adding a pigmented composition of a predetermined color to the container; and (c) shaking the container, thereby thickening the caulk forming composition to form a colored adhesive caulking material.

Abstract: A method of producing an aqueous solution of water-soluble polyacrylamide (PAM) with a concentration of at least about 5 grams per liter includes the steps of providing a monovalent or divalent cation salt solution, and preferably a calcium salt solution, and adding water-soluble PAM particles to the salt solution such that the PAM particles are essentially all dissolved within about 10 seconds. The PAM particles are characterized by a particle size that is about −100 mesh and consisting essentially of molecules having a molecular weigtht of at least about 15 million a.u. Preferably, the small PAM particles are produced by a mill that produces bulk quantities of small dry, flowable PAM particles from larger commercial grade particles. Small PAM particles produced in such a mill are essentially all soluble in plain water within about 10 seconds. After solution, the polymer concentrate can be diluted with water to make stock solutions of the polymer for some purposes.