Microcrystalline Wax Patents (Class 524/488)
  • Patent number: 11639434
    Abstract: A closure made of metal or plastic for a container for accommodating beverages or food has a mouth opening which is to be closed by the container closure. The container closure has a sealing insert which is arranged such that it closes the mouth opening with sealing action when the container closure is fitted on the container. The container closure, including the sealing insert, does not contain any halogen-containing material, and the sealing insert comprises at least two different polymers, of which at least one is a barrier polymer with a Shore D hardness of at most 40 and oxygen permeability of at most 1000 cm3·100 ?m/m2·d·bar and, without the Shore D hardness being limited, with oxygen permeability of at most 10 cm3·100 ?m/m2·d·bar.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: May 2, 2023
    Assignee: ACTEGA DS GMBH
    Inventors: Matthias Kern, Simon Heyder
  • Patent number: 10693114
    Abstract: A method for producing a polyolefin-based porous film includes an (A) step: a raw fabric forming step for forming a non-porous raw fabric from a polyolefin-based resin composition, a (B) step: an MD cold stretching step for cold stretching the non-porous raw fabric obtained in the (A) step at a temperature of ?20° C. to (Tm?30)° C. (Tm is a melting point (° C.) of the non-porous raw fabric) in an extruding direction (MD) of the raw fabric to make the raw fabric porous; a (D) step: a TD cold stretching step for cold stretching a film processed in the (B) step in a direction (TD) perpendicular to the MD, and an (H) step: a thermal fixing step, in the above order.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: June 23, 2020
    Assignee: Asahi Kasei E-materials Corporation
    Inventor: Miyuki Itou
  • Patent number: 10252254
    Abstract: The invention pertains to a stabilized catalyst mold comprising a catalyst body formed of a catalyst material, said catalyst material comprising a catalytically active material or a precursor material of the catalytically active material, characterized in that at least parts of the surface of the catalyst mold are provided with a protective coating comprising an organic binder. Further, the invention pertains to a method for obtaining a stabilized catalyst mold.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 9, 2019
    Assignee: CLARIANT INTERNATIONAL LTD.
    Inventor: Wolfgang Gabriel
  • Patent number: 9267239
    Abstract: Disclosed is a method of reducing adhesion to the surface of equipment used in paper manufacture or in paper converting processes, comprising applying to the surface the a composition. comprising (a) 50-98 parts of hydrocarbon oil, (b) 1-40 parts of emulsifier, and (c) 1-10 parts of a non-curing hydrocarbon polymer.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: February 23, 2016
    Assignee: Solenis Technologies, L.P.
    Inventor: Christopher P Dilkus
  • Patent number: 8796377
    Abstract: The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: August 5, 2014
    Assignee: Henkel AG & Co. KGAA
    Inventors: Holger Tönniessen, Annie Seiler, Rainer Rauberger, Ralf Grauel
  • Patent number: 8202929
    Abstract: Polymer mixtures containing a first long-chain polymer and a second short-chain polymer. The structural parameters of the two polymers are coordinated in such a way that a polymeric material is obtained which is easier to process while being provided with improved mechanical properties and in part also improved thermal properties compared with the first polymer at suitable conditions for producing the polymer mixture as a result of networks being formed and heterocrystallization taking place.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: June 19, 2012
    Assignee: InnoGEL AG
    Inventors: Rolf Müller, Federico Innerebner
  • Patent number: 8129464
    Abstract: A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 110° C. and having an aromatic content of at least about 1.5% by weight; about 0 to 55% of second midblock tackifying resin, about 5% to about 35% by weight of a plasticizer; and about 0% to about 20% by weight of an end block resin having a softening point lower than 125° C.; wherein the components total 100% by weight of the composition, the viscosity of the composition is equal to or less than about 20,000 mPa·s at 120° C., and is applied at a temperature lower that 150° C. and initial bond retention of the composition on elastic strands is at least about 60%.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: March 6, 2012
    Assignee: Bostik, Inc.
    Inventors: Fabienne Abba, Christopher Morel-Fourrier, Nicolas Edgard Sajot
  • Patent number: 8067492
    Abstract: The invention relates to biodegradable hot-melt adhesive compositions, preferably without residual tackiness at room temperature and having a biodegradability, as measured by the released carbon-dioxide analysis method pursuant to Standard EN ISO 14855, that is higher than 55% , preferably higher than 60% , and preferably higher than 90% , and to the use thereof. This percentage is given by reference with the cellulose biodegradability measurement, which amounts to 100% in the same conditions.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: November 29, 2011
    Assignee: Bostik SA
    Inventor: Christophe Robert
  • Patent number: 8034456
    Abstract: The present invention provides a surface-treated metal material having a film formed on at least a portion of a surface of a metal material, the film containing at least polyurethane resin and silicon oxide, and a metal surface treatment agent used to obtain the surface-treated metal material. The polyurethane resin contains one or more of siloxane bond, dehydration-condensation bond of silanol group and different functional group, and silanol moiety, and urea bond. The sum of the siloxane bond, the dehydration-condensation bond of silanol group and different functional group, total amount of the silanol moiety, and the silicon oxide falls within a range of equal to or more than 1.6 wt % to equal to or less than 25 wt % for solids of the film. The ratio of the total amount of urea bond and urethane bond to the total amount of resin components falls within a range of equal to or more than 0.1 wt % to equal to or less than 10 wt %.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: October 11, 2011
    Assignees: Nippon Steel Corporation, Mitsui Chemicals, Inc.
    Inventors: Atsushi Morishita, Masahiro Fuda, Hiroshi Kanai, Hiroshi Kosuge, Tsutomu Tawa
  • Patent number: 7989522
    Abstract: A biodegradable wax composition containing a wax as a main component and also containing a biodegradable polymer and a filler and having a moisture permeability of 3 g·mm/m2·24 hr or less at 40° C. and 90% RH. The wax is preferably present in an amount of 65 to 95% by weight. The biodegradable polymer preferably has a weight average molecular weight of 200,000 or higher. The polymer is preferably polyisoprene or natural rubber and is preferably present in an amount of 5 to 35% by weight.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: August 2, 2011
    Assignee: Kao Corporation
    Inventors: Shingo Odajima, Nobuyuki Isshiki, Hitoshi Otsuka, Hidetoshi Oga, Minoru Goto
  • Patent number: 7939475
    Abstract: A resin composition for sliding members which comprises 1 to 10 wt. % hydrocarbon wax, 0.1 to 3 wt. % at least one member selected from the group consisting of phosphates, sulfates, and carbonates, 1 to 20 wt. % phenoxy resin, 0.1 to 5 wt. % compatibilizing agent, and a polybutylene terephthalate resin as the remainder; and a sliding member obtained by molding the resin composition. The resin composition for sliding members and the sliding member obtained by molding the resin composition have excellent frictional and wearing properties even when a soft metal, e.g., an aluminum alloy, is used as a mating material.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: May 10, 2011
    Assignee: Oiles Corporation
    Inventor: Kazuo Hirai
  • Patent number: 7790802
    Abstract: Disclosed herein is a liquid coating material curable with actinic radiation, substantially or entirely free from organic solvents, comprising (A) at least two compounds of general formula X—O—Y(—OH)—Z-Gr wherein X is a C6-C14 aromatic radical, C5-C20 heterocyclic aromatic radical or C6-C30 alkyl radical, Y is a trivalent organic radical, Z is a linking functional group, and Gr is an organic radical comprising one group which can be activated with actinic radiation; with the proviso that at least one of the two compounds (A) comprises aromatic or heterocyclic aromatic radical X and at least one comprises alkyl radical X; (B) oligo- and polyurethanes and/or oligo- and polyesters comprising two or three groups which can be activated with actinic radiation; (C) color and/or effect pigments; (D) waxes; (E) matting agents; and (F) polysiloxane additives comprising groups which can be activated with actinic radiation, a process for preparing it, and use thereof.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: September 7, 2010
    Assignee: BASF Coatings Aktiengesellschaft
    Inventors: Maxime Allard, Dominique Kauffer
  • Publication number: 20100063173
    Abstract: An adhesive composition is described that is particularly useful for application to the plastic nonwoven materials found in personal hygienic articles. The composition includes first and second ethylene vinyl acetate copolymers. The first copolymer has a high molecular weight characterized by a melt viscosity at 150° C., of 100 Pascals per second or more. The second copolymer has a low molecular weight characterized by a melt viscosity at 150° C. of 50 Pascals per second or less. The second copolymer is present in an amount by weight percent less than or equal to the amount by weight percent of the first ethylene vinyl acetate copolymer. The composition also includes at least one tackifier resin, a hydrocarbon wax present in an amount from 0.5% to 10% by weight of the composition; and, a liquid plasticizer present in an amount up to 20% by weight of the composition.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 11, 2010
    Inventors: Italo Corzani, Pietro Lunetto
  • Patent number: 7671122
    Abstract: A process of producing a wax composition mainly comprising a wax, including the step of mixing the wax and a component to be mixed with the wax by applying an external force at a temperature lower than the melting completion temperature of the wax.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: March 2, 2010
    Assignee: Kao Corporation
    Inventors: Shingo Odajima, Nobuyuki Isshiki, Hidetoshi Oga, Hitoshi Otsuka, Minoru Goto, Akira Kawamata
  • Patent number: 7569627
    Abstract: The binder is produced based on natural bitumen, or bitumen from the oil industry, and comprises a first additive which is constituted by a hydrocarbon wax whose melting point is greater than 85° C. This binder further comprises a fatty acid ester wax which is of synthetic, vegetable or fossil vegetable origin and which has a melting point of less than 85° C. Use in the production of sealing coatings for buildings or civil engineering works, coatings for traffic routes or urban amenities.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: August 4, 2009
    Assignee: COLAS
    Inventor: Jean-Pierre Dean
  • Patent number: 7560505
    Abstract: A wax emulsion comprised of polyethylene wax and one or more surfactants in an aqueous medium, wherein the polyethylene wax has a degree of crystallinity of from about 50% to about 80% by weight of the polyethylene wax, is provided. The wax emulsion is made by emulsifying the polyethylene wax, one or more surfactants and an aqueous medium in a vessel at a temperature at or above the melting point of the polyethylene wax to form an emulsified product, and subsequently cooling the emulsified product to ambient temperature at a cooling rate of at least 10° C. per minute. The wax emulsion is preferably incorporated into toner particles prepared by emulsion/aggregation/coalescing.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: July 14, 2009
    Assignee: Xerox Corporation
    Inventors: Enno E. Agur, Joseph A. Bartel, Patricia A. Burns, Danielle C. Boils-Boissier, Sheau V. Kao
  • Patent number: 7541402
    Abstract: Disclosed herein is an adhesive composition comprising a blend functionalized with a functional group, wherein the blend comprises a C3 to C40 olefin polymer and an additive, the C3 to C40 olefin polymer comprising at least 50 mol % of one or more C3 to C40 olefins, and where the C3 to C40 olefin polymer has: a Dot T-Peel of 1 Newton or more on Kraft paper; an Mw of 10,000 to 100,000; and a branching index (g?) of 0.98 or less measured at the Mz of the polymer when the polymer has an Mw of 10,000 to 60,000, or a branching index (g?) of 0.95 or less measured at the Mz of the polymer when the polymer has an Mw of 10,000 to 100,000. A process of producing the adhesive composition, as well as methods of utilizing the adhesive composition are also disclosed.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: June 2, 2009
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Ramin Abhari, Charles Lewis Sims, Patrick Brant, Peijun Jiang
  • Patent number: 7498376
    Abstract: The present invention provides a high performance polymer-base material capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material so that a large amount of thermal absorbing particles may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material containing organic wax particles.
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: March 3, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Bruce A. Myers, Arun K. Chaudhuri
  • Publication number: 20080085971
    Abstract: Molded part comprised of a polymer mixture, wherein a) the polymer mixture exhibits a synthetic first polymer P(i) and at least a second synthetic polymer P(j), that b) polymer P(i) exhibits a polymerization degree DP(P(i))>400 and at least one type of crystallizable sequences A with a polymerization degree DPs(P(i)) of these sequences of >15, that c) the polymer P(j) consists of the same monomer units as the sequences A of P(i), the polymerization degree DP(P(j)) of P(j) is <400, that d) the polymer mixture is mixed in a molecularly disperse manner, and a phase separation of the two polymers P(i) and P(j) is suppressed, and that e) the polymer mixture is shaped into a molded part by means of an injection molding process, wherein f) a network is formed during the solidification of the polymer mixture during heterocrystallization, characterized in that g) the percentage of p(j) at a polymerization degree of <12 in % w/w is <20.
    Type: Application
    Filed: October 19, 2005
    Publication date: April 10, 2008
    Inventors: Rolf Muller, Federico Innerebner
  • Patent number: 7163972
    Abstract: The present invention provide methods for producing a low moisture organophyllosilicate composition using monomers, oligomers, or polymers to displace water associated with the organophyllosilicates in an aqueous organophyllosilicate slurry or filter cake. The invention additionally provides methods for producing organophyllosilicate nanocomposites from the concentrated organophyllosilicate compositions by dispersing the compositions in a polymer matrix.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: January 16, 2007
    Assignee: UChicago Argonne, LLC
    Inventors: David J. Chaiko, Suhas G. Niyogi
  • Patent number: 7160942
    Abstract: Polymer-phyllosilicate nanocomposites that exhibit superior properties compared to the polymer alone, and methods-for producing these polymer-phyllosilicate nanocomposites, are provided. Polymeric surfactant compatabilizers are adsorbed onto the surface of hydrophilic or natural phyllosilicates to facilitate the dispersal and exfoliation of the phyllosilicate in a polymer matrix. Utilizing polymeric glycol based surfactants, polymeric dicarboxylic acids, polymeric diammonium surfactants, and polymeric diamine surfactants as compatabilizers facilitates natural phyllosilicate and hydrophilic organoclay dispersal in a polymer matrix to produce nanocomposites.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: January 9, 2007
    Assignee: UChicago Argonne, LLC
    Inventor: David J. Chaiko
  • Patent number: 7101929
    Abstract: The present invention relates to a process for reducing water carry-over during the production of polyolefin films or polyolefin tapes which are passed through a waterbath, where the polyolefin formulation comprises polyolefin waxes. The results are that less water is carried over and that the products have higher quality and better processing properties.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: September 5, 2006
    Assignee: Clariant GmbH
    Inventors: Matthias Zäh, FranzLeo Heinrichs, Reiner Hess
  • Patent number: 7056552
    Abstract: A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1<E2 where E1 is heat energy to fuse the solid plasticizer; and E2 is heat energy to fuse the heat-fusible substance.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: June 6, 2006
    Assignee: Ricoh Company, Ltd.
    Inventors: Tomoyuki Kugo, Toshiaki Ikeda
  • Patent number: 6984680
    Abstract: A hot melt label or other paper stock pick-up adhesive can be formulated using a hydrogenated tackifying resin combined with waxes, oils, stabilizers and other additive materials. Such a material has hot tack and other properties that produce excellent pick-up properties. The hot melt materials are hypoallergenic and are safe to use.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: January 10, 2006
    Assignee: Adherent Laboratories, Inc.
    Inventor: Thomas H. Quinn
  • Patent number: 6887923
    Abstract: The present invention disclose a method for the orientation of a high density polyethylene (“HDPE”) film. The process of the invention comprises forming a HDPE-wax mixture by adding to a HDPE batch a normally solid hydrocarbon wax. The HDPE-wax mixture is subsequently stretched into a film at an orientation temperature below the film's melt temperature. The hydrocarbon wax is characterized by having a drop point equal to or lower than the melting point of the HDPE film. The present invention also provides a film made by the process of the invention and a master batch thereof.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: May 3, 2005
    Assignee: Equistar Chemicals, L.P.
    Inventors: Robert J. Bowling, D. Ryan Breese
  • Patent number: 6884836
    Abstract: To provide a polyolefin based resin film of high elastic modulus and a composition for producing a polyolefin based resin film of high elastic modulus. The polyolefin based resin film is characterized in that a polyolefin [A] having a weight average molecular chain length of 2850 nm or more and a polyolefin wax [B] having a weight average molecular weight of 700 to 6000 have been compounded in a ratio of [A]/[B]=90/10 to 50/50 (by weight) as the resin component, and 10 to 300 parts by weight of inorganic fillers have been added to 100 parts by weight of the resin component.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: April 26, 2005
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Atsuhiro Takata, Ryuma Kuroda, Satoshi Hanada, Takeshi Yamada
  • Patent number: 6846863
    Abstract: The invention concerns a polyethylene based composition comprising 0.05 to 0.5 wt. % of at least a saturated fatty acid amide containing 8 to 30 carbon atoms, 0 to 0.1 wt. % of an auxiliary lubricant selected among fatty acids, fatty acid esters, fatty acid salts, monounsaturated fatty acid amides, polyols containing at least 4 carbon atoms, monoalcohol or polyalcohol monoethers, glycerol esters, paraffins, polysiloxanes, fluorinated polymers and mixtures thereof, and 0 to 5 wt. % of one or more additives selected among the antioxidants, anti-acids, anti-UV stabilizers, coloring agents and antistatic agents.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: January 25, 2005
    Assignee: Solvay Polyolefins Europe-Belgium (S.A.)
    Inventors: Denis Plume, Pascal Vanden Berghe
  • Patent number: 6835768
    Abstract: A dispersion comprised of a wax and a hydrophilic polyester stabilizer.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: December 28, 2004
    Assignee: Xerox Corporation
    Inventors: Enno E. Agur, Guerino G. Sacripante, Fatima M. Mayer
  • Patent number: 6734233
    Abstract: A solid adhesive composition which has an excellent applying performance even after an applying part of the solid adhesive is left to stand in the atmosphere for a long time and which is excellent in a cap-off performance and which comprises at least an adhesive component, a gelling agent and a solvent, wherein contained in the above composition are at least one selected from the group consisting of waxes such as paraffin waxes and olefin waxes which are a solid at room temperature and have a solubility of 20% or less in the solvent at room temperature and/or a substance absorbing moisture contained at least in the atmosphere and/or the adhesive composition to form an evaporation-inhibiting film.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsubishi Pencil Kabushiki Kaisha
    Inventors: Suguru Yazawa, Takahiro Osada
  • Patent number: 6677397
    Abstract: Liners with improved oxygen barrier properties for use with closure caps are disclosed. The liners are made of a composition that includes a thermoplastic elastomer, polyisobutylene and polybutylene. The liner is adhered to the inner facing surface of a closure cap.
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: January 13, 2004
    Assignee: White Cap, Inc.
    Inventors: Thomas R. Baranowski, Richard W. Cormack, James Taber
  • Patent number: 6664319
    Abstract: A golf ball is provided that includes a molded resilient inner core made of a rubber compound and a polymeric cover surrounding the inner core. The rubber compound is a halo-butyl rubber polymer and a carbon black filler in an amount of 80% to 100% by weight of the total rubber component.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: December 16, 2003
    Assignee: Waggle Pty LTD
    Inventors: Virendra Kumar Bahl, Steven Joseph Fisher
  • Patent number: 6608131
    Abstract: In one aspect, the present invention provides a formulation for sealing the edge of a wood-based panel. The formulation includes a butylacrylate latex, a solution of a wax in oil, a surfactant, and water. In another aspect of the invention, a wood-based panel that is edge-sealed with a sealant formulation is provided.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: August 19, 2003
    Assignee: Weyerhaeuser Company
    Inventors: Jack G. Winterowd, Charles E. Lewis, Jerry D. Izan, Roger M. Shantz
  • Patent number: 6515057
    Abstract: A method and product which provides a solid, non-powdered homogeneous form to liquid and low melting point solid compounds which facilitates stability, storage, dispersability and handling and which may be added directly to formulations requiring the liquid compound or low melting point solid compound. The liquid or low melting point solid ingredient is combined with a binder which is comprised of at least a wax and thermoplastic polymer. During the method of forming the product, both the binder and the liquid compound (or low melting point solid compound) pass through a liquid phase during which they are mixed. The product is then formed and cooled.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: February 4, 2003
    Assignee: Rhein Chemie Corporation
    Inventors: Richard D. Cortelezzi, Clifford C. Martin
  • Patent number: 6433063
    Abstract: Directly paintable polymer compositions contain (1) a thermoplastic olefin, (2) a propylene homopolymer or propylene copolymer with ethylene or a C4-8 &agr;-olefin, grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid, (3) an oxidized polyethylene wax having a melting point of less than 116° C. and an acid number of less than 40, (4) a functionalized polymer that reacts with the anhydride groups of the grafted polymers, (5) an epichlorohydrin rubber and, optionally, (6) a polyolefin rubber grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid, (7) an ethylene polymer grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid, (8) a thermoplastic resin, and (9) an organic sulfonic acid salt of a group I or II metal, or mixtures thereof, the compositions are particularly suitable for electrostatic painting.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: August 13, 2002
    Assignee: Basell Technology Company BV
    Inventor: Dominic A. Berta
  • Patent number: 6410627
    Abstract: A hot melt adhesive composition comprising (a) greater than 40% by weight of a polymeric component; and (b) 5 to 40% by weight of a high hydroxyl number compound, with hydroxyl number greater than 100 mg KOH/g.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: June 25, 2002
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Charles W. Paul, Mitchell J. Blumenthal
  • Patent number: 6407160
    Abstract: The present invention relates to a polymer particle having a wax phase and a second phase. The wax phase includes a wax having a melting point of greater than 30° C. and comprising greater than 80% by weight of the wax phase. The second phase, free of ionic charge groups, includes a mono-alpha, beta-ethylenically unsaturated monomer free of ionic charge groups capable of addition polymerization to form a water soluble homopolymer including from 1 to 40% by weight of the second phase and a mono-alpha, beta-ethylenically unsaturated monomer capable of addition polymerization to form a water insoluble homopolymer.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: June 18, 2002
    Assignee: Eastman Kodak Company
    Inventors: Yongcai Wang, James L. Bello, Janglin Chen, Dwight W. Schwark
  • Publication number: 20020016402
    Abstract: A moistureproof hot melt composition comprising polyethylene and/or polypropylene (A) and a tackifier resin (B), component (A), component (B) and wax (C), an ethylene-vinyl acetate copolymer (D) and component (B), or component (D), component (B) and component (C); and moistureproof paper excellent in moistureproof properties and recyclability, low in cost and excellent in productivity, which paper is coated with the above composition.
    Type: Application
    Filed: May 24, 2001
    Publication date: February 7, 2002
    Applicant: YASUHARA CHEMICAL CO. LTD
    Inventors: Tatsuhiro Kuno, Takaichiro Shimokado, Yoshitada Nishikiori
  • Patent number: 6319979
    Abstract: Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: November 20, 2001
    Assignees: The Dow Chemical Company, H. B. Fuller Licensing & Financing, Inc.
    Inventors: Robert A. Dubois, Cynthia L. Rickey, Steven W. Albrecht, Thomas F. Kauffman, Beth M. Eichler, Maynard Lawrence, Thomas H. Quinn
  • Patent number: 6319599
    Abstract: An apparatus and method for metabolic cooling and insulation of a user in a cold environment. In its preferred embodiment the apparatus is a highly flexible composite material having a flexible matrix containing a phase change thermal storage material. The apparatus can be made to heat or cool the body or to act as a thermal buffer to protect the wearer from changing environmental conditions. The apparatus may also include an external thermal insulation layer and/or an internal thermal control layer to regulate the rate of heat exchange between the composite and the skin of the wearer.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 20, 2001
    Inventor: Theresa M. Buckley
  • Patent number: 6300404
    Abstract: A curable polymer composition comprising (a) an oxyalkylene polymer having a silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through a silanol condensation reaction, and (b) a paraffinic hydrocarbon, which composition provides a cured material having improved tack which remains on the surface of the cured material.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: October 9, 2001
    Assignee: Kanegafuchi Chemical Industry Co. Ltd.
    Inventors: Keiko Nishimura, Masaaki Azuma, Kazumasa Hashimoto, Fumio Kawakubo
  • Patent number: 6258882
    Abstract: Polish formulations are provided which comprise: a) an aliphatic hydrocarbon solvent comprising 0-10% aromatic hydrocarbons; b) an acrylic resin; and c) a wax product that is thermoplastic, transparent, a solid at room temperature and has a melting/softening point of about 60° to about 90° C.; wherein wt:wt ratio of said acrylic resin and wax is about 1:3 to about 1:8 and the wt:wt ratio of said resin and wax to said solvent is about 1:1 to about 1:9. The formulations function as surface polishes that can be used on any hard surface including wood, metal, stone, and other non-porous surfaces.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: July 10, 2001
    Assignee: The Smithsonian Institution
    Inventor: Melvin Joseph Wachowiak, Jr.
  • Publication number: 20010003763
    Abstract: A curable polymer composition comprising (a) an oxyalkylene polymer having a silicon-containing group which has a hydroxyl or hydrolyzable group bonded to the silicon atom and can be crosslinked through a silanol condensation reaction, and (b) a paraffinic hydrocarbon, which composition provides a cured material having improved tack which remains on the surface of the cured material.
    Type: Application
    Filed: December 28, 1998
    Publication date: June 14, 2001
    Inventors: KEIKO NISHIMURA, MASAAKI AZUMA, KAZUMASA HASHIMOTO, FUMIO KAWAKUBO
  • Patent number: 6214913
    Abstract: A method and product which provides a solid, non-powdered homogeneous form to liquid and low melting point solid compounds which facilitates stability, storage, dispersability and handling and which may be added directly to formulations requiring the liquid compound or low melting point solid compound. The liquid or low melting point solid ingredient is combined with a binder which is comprised of at least a wax and thermoplastic polymer. During the method of forming the product, both the binder and the liquid compound (or low melting point solid compound) pass through a liquid phase during which they are mixed. The product is then formed and cooled.
    Type: Grant
    Filed: February 24, 1997
    Date of Patent: April 10, 2001
    Assignee: Rhein Chemie Corporation
    Inventors: Richard D. Cortelezzi, Clifford C. Martin
  • Patent number: 6180708
    Abstract: The incorporation of waxes into thermoplastic adsorbent compositions enables the formation of high adsorbent loading compositions which have suitable flowability properties. The wax-containing thermoplastic adsorbent compositions are especially useful as thermoplastic adsorbent adhesives for use in desiccating interior compartments of insulating glass units.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: January 30, 2001
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Jia-Ni Chu
  • Patent number: 6162859
    Abstract: The present invention is directed to hot melt pressure sensitive adhesive compositions, that exhibit excellent adhesion properties and improved thermal stability, said compositions comprising:a) 1 to 30 parts of styrene-butadiene-styrene triblock copolymer;b) 1 to 30 parts of styrene-isoprene-styrene triblock copolymer;c) 5 to 50 parts of a tackifier compatible with the butadiene and isoprene midblocks, but not compatible with the styrene end blocks;d) 5 to 70 parts of a tackifier compatible with the butadiene and isoprene midblocks, and the styrene end blocks;e) 5 to 30 parts of a tackifier compatible with the styrene end blocks, but not compatible with the butadiene and isoprene midblocks;f) 5 to 30 parts oil; andg) 0 to 5 parts wax.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: December 19, 2000
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Xinya Lu, Ingrid Cole
  • Patent number: 6136217
    Abstract: Compositions made up of one or more molecular alloys which are suitable for storing or restorng thermal energy at a temperature level T and over a time interval .delta. matching those required for a pareicular applicaion as a phase-change material, said alloys belonging to a phase diagram having a transition region wih a temperaure range which includes the required temperatre and has a near-horizontal geometric locus (EGC). Said compositions are useful as a phase-change materials, particularly in the agrifoodstuffs and paramedical industries.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: October 24, 2000
    Assignee: Centre National de la Recherche Scientifique
    Inventors: Yvette Haget, Denise Mondieig, Miguel-Angel Cuevas-Diarte
  • Patent number: 6121366
    Abstract: A thin-walled rubber article with a relatively low modulus, prepared by dip forming, formed from a composition comprising styrene-isoprene-styrene (S-I-S) triblock copolymer, and styrene-butadiene-styrene (S-B-S) triblock copolymer with a S-I-S content in excess of at least 76% by weight. The composition additionally contains antiblocking agent to prevent the articles from sticking together, especially polyethylene wax. The articles are preferably gloves.
    Type: Grant
    Filed: February 26, 1998
    Date of Patent: September 19, 2000
    Assignee: ECI Medical Technologies Inc.
    Inventor: Pam Sharma
  • Patent number: 6107430
    Abstract: Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: August 22, 2000
    Assignees: The Dow Chemical Company, H.B. Fuller Licensing & Financing Inc.
    Inventors: Robert A. Dubois, Cynthia L. Rickey, Steven W. Albrecht, Beth M. Eichler, Thomas F. Kauffman, Maynard Lawrence, Thomas H. Quinn
  • Patent number: 6084012
    Abstract: Thermoplastic molding compositions compriseA) from 5 to 99% by weight of a thermoplastic polymer selected from the group consisting of polyamides, polyesters, polyphenylene ethers and mixtures of these,B) from 1 to 60% by weight of red phosphorus which has been pretreated with from 0.01 to 2% by weight, based on 100% by weight of B), of a phlegmatizer and from 2 to 15% by weight of a mineral filler,C) from 0 to 70% by weight of other additives and processing aids,where the sum of the percentages by weight of components A) to C) is 100%.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: July 4, 2000
    Assignee: BASF Aktiengesellschaft
    Inventors: Brigitte Gareiss, Martin Klatt, Heiner Gorrissen
  • Patent number: 6077894
    Abstract: There are instruments used for handling a substrate in a clean room at room temperature and atmospheric pressure, which contain a resin base and at least one additive selected from the group consisting of a lubricant, a plasticizer, an anti-oxidizing agent and an antistatic agent, and the additives do not generate gaseous organic material compound under conditions of room temperature and atmospheric pressure.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: June 20, 2000
    Assignees: Tokyo Electron Limited, Taisei Corporation
    Inventors: Misako Saito, Takenobu Matsuo, Tsuyoshi Wakabayashi, Sadao Kobayashi, Yoshihide Wakayama, Masayuki Imafuku