With Solid Polymer Derived From At Least One Reactant Wherein At Least One Of The Reactants Forming The Solid Polymer Is A Phenol Or Inorganic Phenolate; Or With Spfi Or Sicp Derived From Phenol Or Inorganic Phenolate Wherein At Least One Of The Necessary Reactants Is Saturated Patents (Class 524/508)
  • Patent number: 5886097
    Abstract: Thermoplastic resin compositions consisting of 1 to 40 wt % a polyether ester amide (A) and 99 to 60 wt % of at least one thermoplastic resin (B) selected from styrene based resins, further containing (C) 0.1-10% of a modified vinyl polymer containing carboxyl groups, are permanently antistatic, excellent in mechanical properties represented by impact resistance, heat resistance moldability and also in the appearance and gloss of the moldings, and suitable for housings of optical or magnetic recording media.
    Type: Grant
    Filed: September 17, 1997
    Date of Patent: March 23, 1999
    Assignee: Toray Industries, Inc.
    Inventors: Tadao Fukumoto, Masatoshi Iwamoto, Akihiko Kishimoto
  • Patent number: 5886081
    Abstract: A compound and method for dielectrically heating plastic in a mold with an RF source. A novel molding compound includes, in one embodiment, plastic such as polystyrene having a first dielectric constant and a water based resin such as phenolic resin. A lossy additive, such as a chemically inert low dielectric material, having a second dielectric constant substantially lower than that of the plastic, is added to the molding compound. The lossy additive increases the RF energy absorbed by the plastic molding compound thereby reducing heating time in the mold.
    Type: Grant
    Filed: August 5, 1997
    Date of Patent: March 23, 1999
    Assignee: Rockwell Science Center, Inc.
    Inventor: Robert Henry Sternowski
  • Patent number: 5863988
    Abstract: An adhesive for electronic parts, which can be used for bonding and cured at a relatively low temperature and has sufficient heat resistance and reliability, and an adhesive tape for electronic parts, for which the above adhesive is adapted, the adhesive being a liquid adhesive obtained by dissolving an acrylonitrile-butadiene copolymer as Component (a), a phenolic resin as Component (b), a compound having at least 2 maleimide groups as Component (c) and a diamine compound of the general formula (1) specified in claim 1, and/or a polysiloxane compound terminating with an amino group at each terminal, having a weight average molecular weight of 200 to 7,000 and having the general formula specified in claim 1, as Component (d) in an organic solvent, and in which the total amount of Components (b), (c) and (d) per 100 parts by weight of Component (a) is 10 to 900 parts by weight, the amount of Component (b) based on the total amount of Components (b), (c) and (d) is 10 to 90% by weight, and the amount of amino g
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: January 26, 1999
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Takeshi Hashimoto, Katuji Nakaba, Jun Tochihira
  • Patent number: 5859111
    Abstract: A process is described for preparing aqueous polymeric dispersions of a dispersion of an interpenetrated polymer of a hydrophobic polyurethane and a polymer prepared from ethylenically unsaturated monomers, and optionally a dispersion of another monomer that will enhance the performance of the interpenetrated polymer.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: January 12, 1999
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Pravin K. Kukkala, Andrew J. Kielbania, Osamu Futakuchi
  • Patent number: 5847041
    Abstract: This invention provides the following resin composition, method for producing the composition, resin slide material, organic solvent resist material and glass fiber reinforced composition obtained therefrom. A polycarbonate/polyolefin based resin composition exhibiting an improved polycarbonate/polyolefin compatibility prepared by melt kneadin (A) a polycarbonate resin; (B) a polyolefin resin; (C) a polyolefin resin that has been modified with at least one functional group selected from the group consisting of epoxy, carboxyl, and an acid anhydride groups; (D) a compound represented by the formula: HOOC--R--NH.sub.2 wherein R represents at least one member selected from the group consisting of an alkene group, an alkylidene group, and an oligomethylene group containing 5 or more carbon atoms, and phenylene group and naphthylene group optionally substituted with an alkyl group; and optionally, (E) a styrene copolymer resin.
    Type: Grant
    Filed: July 23, 1996
    Date of Patent: December 8, 1998
    Assignee: Kawasaki Steel Corporation
    Inventors: Kazuya Takemura, Masahiko Kajioka, Kazumichi Sashi, Shigeru Takano, Eiichi Sumita
  • Patent number: 5804633
    Abstract: Permanent aqueous marker inks are provided which include surfactant, a pigment, a film-forming polymer, and water. The surfactant may be a combination of a hydrocarbon, preferably an alkylphenol ethyoxylate and a fluorocarbon, or it may be a silicone.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: September 8, 1998
    Assignee: The Gillette Company
    Inventors: Rachel M. Loftin, Kimberly Borelli Sanborn
  • Patent number: 5777021
    Abstract: Disclosed is a styrene polymer composition comprising, in a specified proportion,(A) a styrene polymer having no functional group, and(B) either of polyphenylene ether having a polar group or a mixture of polyphenylene ether having a polar group and a styrene polymer having no functional group; or a styrene polymer composition comprising (C) polyamide, as well as above Components (A) and (B).These polymer compositions are excellent in impact resistance, water resistance, and mechanical properties, and are suitable for various purposes.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: July 7, 1998
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventor: Akikazu Nakano
  • Patent number: 5760125
    Abstract: A resin composition which has improved resistance to yellowing due to light without loss of the superior characteristics of polyphenylene ether polyamide resins comprises(A) a polyphenylene ether resin,(B) a polyamide resin,(C) a styrene thermoplastic resin,(D) a pigment;wherein the styrene thermoplastic resin and the pigment are dispersed in the polyphenylene ether resin and the polyphenylene ether resin is a particulate dispersion in the polyamide resin. The composition may further comprise a rubber polymer wherein the rubber polymer is dispersed in the polyphenylene ether resin.
    Type: Grant
    Filed: December 11, 1996
    Date of Patent: June 2, 1998
    Assignee: General Electric Company
    Inventors: Takashi Ohtomo, Hiromi Ishida, Hidekazu Kabaya, Hiroshi Kubo
  • Patent number: 5760105
    Abstract: There are disclosed a styrenic resin composition which comprises 1 to 95% by weight of a (a) styrenic polymer having syndiotactic configuration (SPS) or modified SPS; 1 to 95% by weight of a (b) thermoplastic resin having a polar group; 1 to 50% by weight of a (c) rubbery elastomer having an affinity for the component (a); and 0.1 to 10% by weight of a (d) compatibilizer having a polar group, a styrenic resin composition same as above except that the component (c) has a polar group capable of reacting with the component (b) as well as an affinity for the component (a) and a styrenic resin composition further comprising 1 to 350% parts by weight of an (e) inorganic filler based on 100 parts by weight of the above resin components. According to the present invention, there are obtained styrenic resin compositions that are well suited for various industrial materials and excellent in rigidity, heat resistance, impact resistance and water resistance.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: June 2, 1998
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akihiko Okada, Hiroki Fukui
  • Patent number: 5714030
    Abstract: A plastisol type adhesive composition used to bond a filer paper and end caps of an filter element of a fuel filter for filtering a mixture fuel of gasoline and methanol. The adhesive composition comprises a polymer (vinyl chloride polymer and/or copolymer) in an amount of 100 parts by weight, a filler in an amount ranging from 50 to 250 parts by weight, a plasticizer in an amount ranging from 50 to 250 parts by weight, and phenolic resin as an adhesiveness providing agent, in an amount ranging from 0.5 to 20 parts by weight.
    Type: Grant
    Filed: January 3, 1997
    Date of Patent: February 3, 1998
    Assignee: Tsuchiya Mfg. Co., Ltd.
    Inventors: Iwao Kitamura, Susumu Matsumoto, Norihisa Miyajima, Takayuki Ichihara, Seiichiro Hashimoto, Junko Yamakawa
  • Patent number: 5712333
    Abstract: A blend of polycarbonate and a homogeneously branched, linear ethylene polymer, which blend has a desirable balance of impact resistance and toughness properties.
    Type: Grant
    Filed: August 12, 1996
    Date of Patent: January 27, 1998
    Assignee: The Dow Chemical Company
    Inventors: Frank M. Hofmeister, Hani Farah, Morgan M. Hughes, Steve R. Ellebracht
  • Patent number: 5693739
    Abstract: A cationic final rinse metal treatment composition comprises a water soluble or water dispersible phenolic polymer which is the reaction product of: an amino phenol and either an anhydride-containing polymer or a di-epoxide, said polymer including a group imparting cationic functionality to the polymer.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: December 2, 1997
    Assignee: PPG Industries, Inc.
    Inventors: Edward E. McEntire, Richard M. Nugent, Jr., Ralph C. Gray
  • Patent number: 5684122
    Abstract: A transparent N-alkyl-substituted maleimide/olefin copolymer composite material is provided which comprises 100 parts by weight of an N-alkyl-substituted maleimide/olefin copolymer, and 0.1 to 100 parts by weight of phyllosilicate, the phyllosilicate being dispersed uniformly and finely in a matrix of the N-alkyl-substituted maleimide/olefin copolymer. A process for producing the N-alkyl-substituted maleimide/olefin copolymer composite material is also provided. The N-alkyl-substituted maleimide/olefin copolymer composite material is excellent in transparency, heat resistance, rigidity, and dimensional stability.
    Type: Grant
    Filed: April 5, 1996
    Date of Patent: November 4, 1997
    Assignee: Tosoh Corporation
    Inventors: Hiroshi Inoue, Toru Doi
  • Patent number: 5618882
    Abstract: Gel compositions comprising styrene-(ethylene/propylene)styrene (SEPS) block copolymer having Mw of at least 180,000 and polystyrene content of 25-45 weight percent, and at least 300 parts by weight percent, and at least 300 parts by weight of extender liquid per 100 parts by weight of the block copolymer. The extender softens the ethylene/propylene mid-blocks of the copolymer and the resulting gels have unexpectedly higher tack, temperature resistance, and extender-retaining ability than corresponding gels made with styrene(ethylene/butylene)-styrene block copolymers.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: April 8, 1997
    Assignee: Raychem Limited
    Inventors: Philip J. Hammond, John M. Hudson, Hendrik Graulus
  • Patent number: 5594062
    Abstract: This invention provides the following resin composition, method for producing the composition, resin slide material, organic solvent resist material and glass fiber reinforced composition obtained therefrom. A polycarbonate/polyolefin based resin composition exhibiting an improved polycarbonate/polyolefin compatibility prepared by melt kneadin (A) a polycarbonate resin; (B) a polyolefin resin; (C) a polyolefin resin that has been modified with at least one functional group selected from the group consisting of epoxy, carboxyl, and an acid anhydride groups; (D) a compound represented by the formula: HOOC--R--NH.sub.2 wherein R represents at lease one member selected from the group consisting of an alkene group, an alkylidene group, and an oligmethylene group containing 5 or more carbon atoms, and phenylene group and naphthylene group optionally substituted with an alkyl group; and optionally, (E) a styrene copolymer resin.
    Type: Grant
    Filed: March 13, 1995
    Date of Patent: January 14, 1997
    Assignee: Kawasaki Steel Corporation
    Inventors: Kazuya Takemura, Masahiko Kajioka, Kazumichi Sashi, Shigeru Takano, Eiichi Sumita
  • Patent number: 5583174
    Abstract: Mixtures ofA) 75 to 99.5 wt. % of a high molecular weight, thermoplastic, aromatic polycarbonate with a molecular weight M.sub.w (weight average) of at least 10,000 which contains bifunctional carbonate structural units of the formula (I), ##STR1## in which R.sup.1 and R.sup.2, independently of each other, represent hydrogen, halogen, preferably chlorine or bromine, or a C.sub.1 -C.sub.8 -alkyl, C.sub.5 -C.sub.6 -cycloalkyl, C.sub.6 -C.sub.10 -aryl, preferably phenyl, or C.sub.7 -C.sub.12 -aralkyl, preferably phenyl-C.sub.1 -C.sub.4 -alkyl, in particular a benzyl group,m is an integer from 4 to 7, preferably 4 or 5,R.sup.3 and R.sup.4 can be selected separately for each X and, independently of each other, represent hydrogen or a C.sub.1 -C.sub.6 -alkyl group andX represents carbon,with the proviso that R.sup.3 and R.sup.4 simultaneously represent an alkyl group on at least one X atom.B) 0.5 to 15 wt.
    Type: Grant
    Filed: August 11, 1995
    Date of Patent: December 10, 1996
    Assignee: Bayer AG
    Inventors: Burkhard Kohler, Peter Bier
  • Patent number: 5569700
    Abstract: A resin composition comprising (a) a thermoplastic aromatic polycarbonate resin, (b) a graft co-polymer obtained by copolymerizing ethylene-.alpha.-olefin-diene copolymer and a monomer mixture comprising as main components an aromatic vinyl compound and vinyl cyanide compound as a main component, (c) a glass filler and (d) carbon fiber. The resin composition of the present invention has excellent rigidity, strength, heat resistance, high-impact properties, weathering resistance, appearance and drawdown property, and is swelling resistant.
    Type: Grant
    Filed: April 3, 1995
    Date of Patent: October 29, 1996
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tsuneaki Iwakiri, Gorou Shimaoka
  • Patent number: 5565515
    Abstract: Improved flow copolycarbonate compositions are provided containing resorcinol repeat units and containing styrene-acrylonitrile copolymers. The compositions may additionally comprise a rubbery polymer and an inorganic filler, such as glass fibers.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: October 15, 1996
    Assignee: General Electric Company
    Inventors: Kenichi Ishiwa, Hideyuki Itoi
  • Patent number: 5561193
    Abstract: Thermoplastic molding materials containA) from 5 to 95% by weight of a partly aromatic, semicrystalline copolyamide composed essentially ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acida.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acida.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together being 100%, andB) from 5 to 95% by weight of a polyphenylene etherC) from 0 to 30% by weight of an elastomeric polymer,D) from 0 to 45% by weight of a fibrous or particulate filler or of a mixture thereof,E) from 0 to 20% by weight of a flameproofing agent andF) from 0 to 30% by weight of conventional additives and processing assistants,the percentages A) to F) summing to 100%.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: October 1, 1996
    Assignee: BASF Aktiengesellschaft
    Inventors: Axel Gottschalk, Herbert Fisch, Gunter Pipper, Martin Weber
  • Patent number: 5548015
    Abstract: The invention is directed to a stable phenolic dispersion of hydrophilic phenolic resin polymer using polyvinyl alcohol as protective colloid. Incorporation of a small proportion of an etherified bisphenol-A resin into an aqueous solution of a phenolic resin and a protective colloid (e.g., polyvinyl alcohol) forms a stable dispersion with low volatile organics content.
    Type: Grant
    Filed: January 25, 1995
    Date of Patent: August 20, 1996
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Ken A. Bourlier, Peggy S. Mulrenin
  • Patent number: 5548011
    Abstract: The invention relates to blends of polycarbonates, branched, phenolic hydroxy functional dimeric fatty acid polyesters and at least one component selected from polyisobutylene, silicones and mineral oils.
    Type: Grant
    Filed: August 31, 1995
    Date of Patent: August 20, 1996
    Assignee: Bayer AG
    Inventors: Burkhard Kohler, Wolfgang Ebert, Klaus Horn, Richard Weider, Thomas Scholl
  • Patent number: 5502098
    Abstract: A polymer composition for electrical part material comprising, (I) a polymer blend which comprises (A) at least one polymer selected from specific types of polyether imides and polyesters, and (B) at least one polymer selected from specific types of polyphenylene ethers, polyolefins, and polycarbonates, and (II) a copolymer of maleic anhydride and vinyl type compound or (II') an epoxy-modified styrene-type copolymer. The composition has excellent compatibility, heat resistance, mechanical characteristics, platability, moldability, and electric characteristics. It is an ideal material for use as an electrical part material due to its low dielectric constant and low dielectric dissipation factor at high frequency.
    Type: Grant
    Filed: June 27, 1994
    Date of Patent: March 26, 1996
    Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.
    Inventors: Fumie Watanabe, Takashi Mizoguchi, Masatoshi Iwafune
  • Patent number: 5496884
    Abstract: An adhesive composition containing a polyvinyl alcohol-stabilized butadiene polymer latex and a methylene donor compound. The butadiene polymer latex is prepared by an emulsion polymerization in the presence of polyvinyl alcohol. The adhesive composition may also contain other optional ingredients such as a supplemental polymeric film-forming component, a nitroso compound crosslinker, a maleimide compound crosslinker, a vulcanizing agent, and an acid-scavenging compound. The polyvinyl alcohol-stabilized butadiene polymer latex and methylene donor compound combine to provide a tightly crosslinked, robust film which provides for excellent adhesion and environmental resistance.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: March 5, 1996
    Assignee: Lord Corporation
    Inventors: Mark A. Weih, Helmut W. Kucera, Patrick A. Warren, Douglas H. Mowrey
  • Patent number: 5489640
    Abstract: Disclosed are compositions having the characteristic of improved heat distortion temperature for compositions comprising a poly(phenylene ether) resin, a polyester resin, a polycarbonate resin, a reinforcing filler, and a heat enhancing non-fibrous filler in combination with a poly(tetrafluoroethylene) resin. The compositions may further comprise at least one additive from the group consisting of impact modifiers, non-elastomeric polymers of an alkenyl aromatic compound and an additive package. The flow of such compositions can be further improved with the addition of an optional flow promoting terpene phenol material without significant loss of the physical properties.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: February 6, 1996
    Assignee: General Electric Company
    Inventor: Geoffrey H. Riding
  • Patent number: 5484838
    Abstract: The invention is a molded thermoplastic article having a modified electrical conductivity and hence being particularly adapted for electrostatic painting. The article is composed of a composition comprising a polymer blend of at least two polymers and electrically conductive carbon black. The polymer blend comprises a crystalline polymer and an amorphous or semi-crystalline polymer, the crystalline polymer comprising at least about 35 weight percent of the blend.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: January 16, 1996
    Assignee: Ford Motor Company
    Inventors: Jeffrey H. Helms, Edmund J. Blais, Mo-Fung Cheung
  • Patent number: 5470906
    Abstract: An aqueous ambient dry paint coating based on an emulsion copolymerized addition polymer containing an oligomer selected from a polyurethane or a polyester having a Tg below -20.degree. C. and a number average molecular weight between 300 and 5,000, where the coating is free of organic coalescing solvents. The matrix addition polymer is combined with an oligomer produced by forming an aqueous micro-preemulsion of oligomer in water by high shear mixing of oligomer and water containing 40% to 70% by weight oligomer and at temperatures between about 20.degree. C. and 100.degree. C. to provide an aqueous pre-emulsion having an organic phase droplet size less than 10 microns.
    Type: Grant
    Filed: December 27, 1993
    Date of Patent: November 28, 1995
    Assignee: The Glidden Company
    Inventors: Gary P. Craun, George S. Rosekelly, F. Louis Floyd
  • Patent number: 5466737
    Abstract: A polyimide resin composition for sliding members which has high heat resistance and sliding properties and excels in wear resistance under sliding conditions at high PV values and which can keep low the rate of shrinkage due to crystallization treatment. The composition is made up of 100 parts by weight of resin composition comprising 50-90% by weight of a thermoplastic polyimide resin and 50-10% by weight of graphite obtained by graphitizing a non-phenolic resin material and containing 97% or more of fixed carbon; 5-20 parts by weight of tetrafluoroethylene resin; and 5-30 parts by weight of a powdery hardened phenolic resin.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: November 14, 1995
    Assignee: NTN Corporation
    Inventors: Yoshio Oki, Takumi Shimokusuzono
  • Patent number: 5466738
    Abstract: Mixtures of liquid crystalline copolymers and fluorothermoplastics, and use thereof.Mixtures of A) liquid crystalline copolymers and B) fluorothermoplastics, having a proportion of A) of 45 to 97% by weight and a proportion of B) of 3 to 55% by weight, have an improved notched impact strength. They are therefore particularly suitable for producing molded articles or as a matrix material for composites.
    Type: Grant
    Filed: July 19, 1994
    Date of Patent: November 14, 1995
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Michael Romer, Andreas Schleicher, Peter Stamprech
  • Patent number: 5461092
    Abstract: A polycarbonate blend of good impact and flexural strength, good heat distortion and weldline properties, and good solvent resistance prepared by admixing with polycarbonate an aromatic polyester, an olefinic epoxide-containing modifier, and a rubber-modified styrene/acrylonitrile copolymer.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: October 24, 1995
    Assignee: The Dow Chemical Company
    Inventor: Michael K. Laughner
  • Patent number: 5457220
    Abstract: The present invention relates to a new silicone cure system. More particularly, the present invention discloses that a siloxane system containing sufficiently high levels of T or Q species in addition to M, D and a limited amount of silanol species can be cured by linear phosphonitrilic chloride disproportionation catalyst.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: October 10, 1995
    Assignee: General Electric Company
    Inventor: John S. Razzano
  • Patent number: 5447968
    Abstract: This invention relates to polyurethane-forming foundry binder systems which contain a nitrogen-containing aromatic compound selected from the group consisting of 2,2'-dipyridyl, 1,10-phenanthroline, and their substituted alkyl derivatives. The foundry binder systems are particularly useful for making foundry mixes used in the cold-box fabrication process for making foundry shapes. However, the binders systems can also be used to hold foundry shapes, such as molds and cores, together in an assembly.
    Type: Grant
    Filed: July 23, 1993
    Date of Patent: September 5, 1995
    Assignee: Ashland Inc.
    Inventors: Kenneth W. Barnett, William G. Carpenter, William R. Dunnavant, Robert B. Fechter
  • Patent number: 5432227
    Abstract: A phenolic resin molding material comprising a phenolic resin, an organic filler, an inorganic filler and a liquid substance having a boiling point of 80.degree.-150.degree. C., said phenolic resin comprising, as its main component, a novolac type phenolic resin wherein the ratio of the o-methylene bond to the p-methylene bond with respect to the phenol nucleus ranges from 1.0 to 2.5.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: July 11, 1995
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Norihisa Fujimura
  • Patent number: 5420181
    Abstract: Thermoplastic molding compositions containingA) ABS-type resin,B) aromatic polycarbonate resins,C) a compound bearing several carboxyl groups or mixtures thereof and optionallyD) further polymer resins,characterized in that an ABS resin with at least one basically acting additive is used as component A, component C is selected from compounds having a molecular weight of from 150 to 260 having at least two carboxyl groups (--COOH) in the molecule, and the weight ratio of basically acting additive in A: carboxyl groups in C is from 5:1 to 1:1.
    Type: Grant
    Filed: October 7, 1994
    Date of Patent: May 30, 1995
    Assignee: Bayer Aktiengesellschaft
    Inventors: Herbert Eichenauer, Karl-Heinz Ott, Alfred Pischtschan, Edgar Leitz, Karl-Erwin Piejko
  • Patent number: 5419946
    Abstract: An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: May 30, 1995
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shin Takanezawa, Teturou Irino, Yuuji Toshaka, Takashi Kagaya
  • Patent number: 5418275
    Abstract: There are disclosed a polystyrene composition which comprises 100 parts by weight of a syndiotactic polystyrene (SPS)(a) and 1 to 100 parts by weight of a high molecular compound comprising 5 to 95% by weight of polyphenylene ether (PPO) and/or modified PPO and 95 to 5% by weight of a rubbery elastomer (b) and optionally, 1 to 350 parts by weight of an inorganic filler (d) and also a polystyrene composition which comprises 100 parts by weight of the component (a), 0.1 to 30 parts by weight of the component (b) and 1 to 100 parts by weight of a rubbery elastomer (c) and optionally, 1 to 350 parts by weight of the component (d). The above compositions are greatly improved in impact resistance, elongation and retention of physical properties during recycling without detriment to heat resistance and modulus of elasticity.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: May 23, 1995
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akihiko Okada, Nobuyuki Sato
  • Patent number: 5397822
    Abstract: A thermoplastic resin composition having in admixture a polyphenylene ether resin and an elastomeric block copolymer wherein the block copolymer has in admixture a triblock copolymer A-B-A' and a diblock copolymer A-B with A and A' being polymerized vinyl aromatic hydrocarbon blocks such as styrene and B being an ethylene-alkylene block such as ethylene-butylene. The composition of this invention can also include other additives such as siloxane fluids, flame retardants, polyolefins, and phosphates, as well as fillers, etc. Also included in this invention is the process of preparing such compositions and articles of manufacture prepared therefrom, such as electrical conductor articles or formed articles. The compositions of this invention provide improved flexibility and elongation.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: March 14, 1995
    Assignee: General Electric Company
    Inventor: Gim F. Lee, Jr.
  • Patent number: 5395889
    Abstract: Glycidyl (meth)-acrylate polymer and an organic acid, phosphoric acid, phosphorous acid, hypophosphoric acid and/or a compound other than an organic acid containing one or more functional groups selected from among carboxyl, amino, hydroxyl, acid anhydride and thiol groups added to an aromatic polycarbonate resin composition, decrease the luster of the composition without compromising the properties of the composition.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: March 7, 1995
    Assignee: GE Plastics Japan
    Inventors: Tomohide Fujiguchi, Hideyuki Itoi, Akihiro Saito
  • Patent number: 5391611
    Abstract: There is disclosed a styrenic resin composition comprising (A) a styrenic polymer having high degree of syndiotactic configuration and (B) a rubbery polymer having a product of weight-average molecular weight and styrenic monomer unit content being at least 30,000.The above composition is excellent in release properties, impact resistance, heat resistance, mechanical strength and flame retardancy.
    Type: Grant
    Filed: November 4, 1993
    Date of Patent: February 21, 1995
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Michio Funayama, Shinichi Miura, Masami Mihara, Keiji Takamatsu
  • Patent number: 5384360
    Abstract: There are provided melt extruded blends of polyphenylene ether and diene based rubber containing an effective amount of a dialkylamine which has been found effective as a stabilizer for the diene based rubber. Additional diene based rubber stability can be achieved by using preextruded polyphenylene ether. The resulting melt extruded blends have been found to enjoy increased resistance to change in impact values when recycled in the molded state.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: January 24, 1995
    Assignee: General Electric Company
    Inventors: William D. Richards, James E. Pickett
  • Patent number: 5382627
    Abstract: A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    Type: Grant
    Filed: August 2, 1993
    Date of Patent: January 17, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Tomoyuki Nakata, Minoru Takiguchi
  • Patent number: 5376615
    Abstract: A color-developing composition comprises a multi-valent-metal-modified salicylic acid resin (Resin A) and a polycondensation resin (resin B) at a weight ratio of 90-30 to 10-70. Resin A is composed of 5-35 mole % of a structural unit (I) and 65-95 mole % of at least one structural unit (II) or 65-95 mole % of a coupled structural unit of at least one unit (II) and at least one unit (III) and has a weight-average molecular weight of 350-5,000. Resin B is composed of the unit (II) and/or the unit (III) and has a weight-average molecular weight of 350-5,000. ##STR1## wherein Z represents M/m, M being a metal ion of m valence and m being an integer; R.sub.1 and R.sub.2 represent H or a C.sub.1-12 alkyl, aralkyl, aryl or cycloalkyl group; R.sub.3 and R.sub.6 represent H or a C.sub.1-4 alkyl group; and R.sub.4 and R.sub.5 represent H or CH.sub.3.
    Type: Grant
    Filed: July 20, 1992
    Date of Patent: December 27, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Keizaburo Yamaguchi, Yoshimitsu Tanabe, Kiyoharu Hasegawa, Akihiro Yamaguchi
  • Patent number: 5369173
    Abstract: A resin composition is disclosed, which comprises(A) 100 parts by weight of(a) 1 to 50% by weight of polyphenylene ether or polyphenylene ether-containing resin composition,(b) 10 to 90% by weight of propylene polymer, except a propylene polymer modified with an oxygen-containing unsaturated compound,(c) 10 to 40% by weight of propylene polymer modified with an oxygen-containing unsaturated organic compound, and(d) 0 to 30% by weight of rubber-like substance which is elastic at room temperature, and(B) 3 to 60 parts by weight of(e) glass fiber. The resin composition has the remarkable effect that it not only has favorite mold processability but also is superior in balance among various physical properties of shaped articles resulting therefrom.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: November 29, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Motonobu Furuta
  • Patent number: 5358993
    Abstract: An inlaid tile composition and a method for making the composition in which filled colored polymeric chips are uniformly dispersed throughout a filled thermoplastic tile base is disclosed. In an alternative embodiment, colored, coated mineral chips of a mineral such as quartz are uniformly dispersed throughout a filled thermoplastic tile base. The chips are coated by a ceramic technique or with a pigmented polyester or epoxy resin. Alternatively, a mixture of coated mineral chips and partially cross linked resinous chips may be employed. In a further embodiment, additional chips may be spread on the top surface of the formed sheet and pressed in with a roller, prior to the final calendering step. The tile base may contain a lubricant to reduce processing temperatures and shear forces in the intensive mixer.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: October 25, 1994
    Assignee: Tarkett AB
    Inventors: Walter C. Timm, Michael H. McNally
  • Patent number: 5346931
    Abstract: Color former preparations comprisingA) a core of solid particles of a color former,B) a first envelope of a water-soluble nonionic polymer, andC) a second envelope of a crosslinked polymer,are useful for producing heat- and pressure-sensitive recording materials.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: September 13, 1994
    Assignee: BASF Aktiengesellschaft
    Inventor: Dietrich Hoffmann
  • Patent number: 5338796
    Abstract: A thermoplastic composition having a good balance of mechanical and thermal properties, an improved impact strength and a good processability includes a functionalized polyphenylene ether, a polyamide, and an olefinic elastomer containing a vinylaromatic monomer grafted thereon.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: August 16, 1994
    Assignee: Montedipe s.r.l.
    Inventors: Domenico Vianello, Armando Benetton, Alessandro Moro, Roberto Pippa, Aldo Longo
  • Patent number: 5326813
    Abstract: There are disclosed a thermoplastic resin composition comprising (A) a styrenic polymer having a high degree of syndiotactic configuration, (B) an inorganic filler and (C) a polyphenylene ether that is modified with a compound having an ethylenic double bond and a polar group in the same molecule, especially maleic anhydride, the ether having a modification rate of 1.3% or more by weight; a thermoplastic resin composition further comprising (D) a rubbery elastomer in addition to the above components (A), (B) and (C); a process for producing modified polyphenylene ether (PPO) comprising reacting 100 parts by weight of PPO with 1 to 20 parts by weight of the above compound or a derivative thereof in an aromatic hydrocarbon solvent in the presence of 15 or less parts by weight of a radical generator; and a process for producing the modified PPO comprising reacting 100 parts by weight of PPO with 1 to 5 parts by weight of the above compound or a derivative thereof at 300.degree. to 350.degree. C.
    Type: Grant
    Filed: December 10, 1992
    Date of Patent: July 5, 1994
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akihiko Okada, Akitoshi Masuyama
  • Patent number: 5324769
    Abstract: There are provided melt extruded blends of diene based rubber and preextruded polyphenylene ether, or blends thereof with an effective amount of a stabilizer such as a hindered phenol or metal deactivator/hindered phenol. The resulting polyphenylene ether composition can be further extruded with a polymeric organic matrix material, such as a polyamide or polyetherimide. When molded, the polyphenylene ether compositions have been found to resist loss of impact strength upon thermal aging and recycling.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: June 28, 1994
    Assignee: General Electric Company
    Inventors: William D. Richards, James F. Kelley
  • Patent number: 5304593
    Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: April 19, 1994
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Taichi Nishio, Takashi Sanada, Satoru Hosoda, Kenji Nagaoka, Takayuki Okada
  • Patent number: 5302645
    Abstract: Disclosed is a polyethylene terephthalate composition comprising:(A) 100 parts by weight of polyethylene terephthalate,(B) 1 to 25 parts by weight of a bisphenol type epoxy resin having an epoxy equivalent of 1000 or less,(C) 5 to 50 parts by weight of a thermoplastic resin,(D) 0 to 10 parts by weight of a modified thermoplastic resin containing at least one epoxy group, carboxyl group or carboxylic anhydride in a molecular chain of one molecule,(E) 0.1 to 2 parts by weight of a phosphorus type stabilizer and(F) 5 to 150 parts by weight of a glass fiber,wherein the composition has thermal stability, and is small in change of physical properties such as fluidity even when the composition dwells in a molding machine for a long time.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: April 12, 1994
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Seiko Nakano, Kiyoharu Yada
  • Patent number: 5302631
    Abstract: An ink for jet printer is disclosed, which contains an oil soluble dye, a synthetic resin, and an organic solvent, wherein the synthetic resin contains a terpene-phenol copolymer resin and a styrene-acrylic copolymer resin.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: April 12, 1994
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Yutaka Yamada, Isao Tabayashi, Sadahiro Inoue, Shinji Amaya