Solid Polymer Or Sicp Derived From At Least One Phenol Or Inorganic Phenolate Reactant Patents (Class 524/540)
  • Patent number: 10370522
    Abstract: The invention provides a polyphenylene sulfide resin composition which comprises polyphenylene sulfide resin and a deformed cross-section glass fiber, wherein the chlorine content of the polyphenylene sulfide resin composition is equal to or lower than 1,000 ppm. The obtained polyphenylene sulfide resin composition is excellent in flowability, toughness and rigidity. The invention further provides a molding prepared from the polyphenylene sulfide resin composition and a manufacturing process for the polyphenylene sulfide resin composition. The polyphenylene sulfide resin composition is particularly suitable for products for forming frames of a portable computer, a mobile phone and a portable electronic device.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 6, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kai Peng, Xianwen Tang, Qiang Liu, Fen Ouyang, Shunji Kono, Masashi Matsuda, Ping Hu, Ying Wai Julian Chan
  • Patent number: 10280260
    Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: May 7, 2019
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Chen-Yu Hsieh, Tse-An Lee, Hui-Ting Shih
  • Patent number: 9624371
    Abstract: The present invention relates to a composition based on poly(ether ether ketone) (PEEK) comprising poly(ether ketone ketone) (PEKK), characterized in that the poly(ether ketone ketone) (PEKK) comprises a mixture of terephthalic and isophthalic units, the percentage by weight of terephthalic units, with respect to the sum of the terephthalic and isophthalic units, being between 55 and 85%, limits included, and preferably between 55 and 70%, the said composition comprising between 1 and 40%, limits included, preferably between 5 and 40% and more preferably still between 10 and 30% by weight of PEKK, with respect to the total weight of the composition.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: April 18, 2017
    Assignee: ARKEMA FRANCE
    Inventors: Benoit Brule, Richard Audry, Jerome Pascal
  • Patent number: 9462689
    Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: October 4, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park, Sung Jin Yun, Jong Sik Lee, Sang A. Ju, Yeo Eun Yoon
  • Patent number: 9445500
    Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 13, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myeong Jeong Kim, Jae Man Park, Jeungook Park, Sungjin Yun, Jong Heum Yoon
  • Patent number: 9445498
    Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 13, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myeong Jeong Kim, Jong Heum Yoon
  • Publication number: 20150119483
    Abstract: A poly(siloxane) copolymer composition comprising: a first polymer comprising a first repeating unit, and a poly(siloxane) block unit, a second polymer different from the first polymer and comprising of bromine; and optionally, one or more third polymers different from the first polymer and second polymer; wherein siloxane units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and optional one or more third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 30, 2015
    Applicant: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Paul Dean Sybert, Laura Gayle Schultz Hume, James Franklin Hoover, Thomas L. Evans
  • Publication number: 20150080502
    Abstract: The present disclosure relates to a polymer composition comprising a polymer blend of Polyaryl Ether Ketone (PAEK) and Poly(2,5-benzimidazole) characterized with enhanced mechanical and wear resistance properties as compared to commercial polymer blends of Polyaryl Ether Ketone and Polybenzimidazole. The present disclosure also relates to shaped articles derived from the polymer composition of the present disclosure.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventor: Keki Hormusji GHARDA
  • Patent number: 8980974
    Abstract: A low copper-containing friction material composition used for brake pad is provided, which consists of 4-6 parts of aramid fiber, 2-2.5 parts of tire powder, 5-6 parts of magnesia, 5-6 parts of red vermiculite, 8-10 parts of ceramic fiber, 3.5-5 parts of magnetite, 7-8 parts of boron-containing phenolic resin, 15-17 parts of calcium sulfate crystal whisker, 16-18 parts of potassium titanate, 15-17 parts of barite, 5.5-7 parts of flake graphite, 6-8 parts of friction powder of cashew nut oil, 6-8 parts of calcined petroleum coke, 1.5-2 parts of boron nitride, 5-7 parts of flake aluminum powder, 0.4-0.5 parts of pure copper fiber, and 0.4-0.6 parts of black silicon carbide. The friction material composition has low content of heavy metal, wherein the content of copper is lower than 0.5%, has a satisfactory high temperature and thermal decay resistant performance, long service life, good abrasion resistance and stable friction coefficient.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: March 17, 2015
    Assignee: Ruiyang Automotive Materials (Xiantao) Co., Ltd.
    Inventor: Jim Zewei Zhang
  • Patent number: 8962711
    Abstract: A copper-flee friction material composition for brake pads consists of: 0.43 parts of aramid fiber, 1.9 parts of tire powder, 6 parts of heavy magnesia, 2.55 parts of calcined petroleum coke, 8 parts of ceramic fiber, 6.5 parts of phenolic resin, 14 parts of aluminum silicate fiber, 22 parts of potassium hexatitanate crystal whisker, 25 parts of barite powder, 5 parts of granular graphite, 2 parts of antimony sulfide, 2.8 parts of friction powder of cashew nut oil, 0.9 part of boron nitride, 5 parts of flake aluminum powder, and 0.6 parts of tantalum carbide. Trials show that it has satisfactory high temperature and thermal decay resistant performance, long service life, good abrasion resistance and stable friction coefficient. With the friction material of the present invention used, the brake pad of vehicles is sensitive and stable during braking, produces no screech, is comfortable and has no damage on coupling plate.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: February 24, 2015
    Assignee: Ruiyang Automotive Materials (Xiantao) Co., Ltd.
    Inventor: Jim Zewei Zhang
  • Patent number: 8951917
    Abstract: The invention provides a composition for forming a silicon-containing resist underlayer film comprising: (A) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (1) and one or more hydrolysable compound shown by the following general formula (2), and (B) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (3) and one or more hydrolysable silicon compound shown by the following general formula (4).
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: February 10, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsutomu Ogihara, Takafumi Ueda, Toshiharu Yano, Fujio Yagihashi
  • Publication number: 20150038638
    Abstract: This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's.
    Type: Application
    Filed: July 9, 2014
    Publication date: February 5, 2015
    Inventor: JAY ROBERT DORFMAN
  • Publication number: 20150005423
    Abstract: Polycarbonate blends with a combination of high thin wall flame retardance, low temperature ductility, and good tracking resistance are disclosed. The blends are a combination of a polycarbonate polymer, a polycarbonate-polysiloxane copolymer, non-brominated and non-chlorinated flame retardant, titanium dioxide, and carbon black.
    Type: Application
    Filed: June 24, 2014
    Publication date: January 1, 2015
    Inventors: Karin van de Wetering, Robert van de Grampel
  • Publication number: 20140357782
    Abstract: The present invention relates to mobile electronic devices comprising at least one structural part made of a polymer composition (C) comprising at least one polyaryletherketone (PAEK), at least one aromatic sulfone polymer (SP) such as poly phenylsulfone (PPSU), polyethersulfone (PESU), polysulfone (PSU) or mixture thereof, and at least one reinforcing filler.
    Type: Application
    Filed: December 17, 2012
    Publication date: December 4, 2014
    Applicant: SOLVAY SPECIALTY POLYMERS USA, LLC.
    Inventors: Keshav Gautam, Mohammad Jamal El-Hibri
  • Publication number: 20140349533
    Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.
    Type: Application
    Filed: August 6, 2014
    Publication date: November 27, 2014
    Applicant: Arkema Inc.
    Inventors: Christopher A. Bertelo, Gregory S. O'Brien
  • Publication number: 20140290854
    Abstract: The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO2) or alumina (Al2O3) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO2) or alumina (Al2O3) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition.
    Type: Application
    Filed: October 24, 2012
    Publication date: October 2, 2014
    Inventors: Jorge Parellada Llobet, Jordi Arbusá Amorós, Salvador Borrós Gómez
  • Publication number: 20140284850
    Abstract: The invention includes a cross-linking composition comprising a cross-linking compound and a cross-linking reaction additive selected from an organic acid and/or an acetate compound, wherein the cross-linking compound has the structure according to formula (IV): wherein the cross-linking reaction additive is capable of reacting with the cross-linking compound to form a reactive oligomer intermediate, which is capable of cross-linking an organic polymer. Also included is an organic polymer composition for use in forming a cross-linked organic polymer, comprising a cross-linking compound of Formula (IV), a cross-linking reaction additive and at least one organic polymer. In one embodiment, the at least one organic polymer has at least one halogen-containing reactive group and is dehalogenated by reacting with an alkali metal compound.
    Type: Application
    Filed: October 21, 2013
    Publication date: September 25, 2014
    Inventors: Kerry A. Drake, Andrew F. Nordquist, Sudipto Das, William F. Burgoyne, JR., Le Song, Shawn P. Williams, Rodger K. Boland
  • Patent number: 8829108
    Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: September 9, 2014
    Assignee: Arkema Inc.
    Inventors: Christopher A. Bertelo, Gregory S. O'Brien
  • Publication number: 20140202737
    Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Daisuke SHANAI, Takashi AOYAMA, Kazuhiko SASADA, Hiroaki KOMATSU
  • Publication number: 20140179858
    Abstract: A phosphorous copolymer, a method for preparing the same, and a flame retardant thermoplastic resin composition including the same is disclosed. The phosphorous copolymer includes a repeat unit represented by Formula 1: wherein each A is independently a single bond, C1 to C5 alkylene, C1 to C5 alkylidene, C5 to C6 cycloalkylidene, —S—, or —SO2—; R1 and R2 are each independently substituted or unsubstituted C1 to C6 alkyl or substituted or unsubstituted C6 to C20 aryl; R3 and R4 are each independently substituted or unsubstituted C1 to C6 alkyl, substituted or unsubstituted C3 to C6 cycloalkyl, substituted or unsubstituted C6 to C12 aryl, or halogen; a and b are each independently an integer from 0 to 4; and m and n are each independently an integer from 1 to 500.
    Type: Application
    Filed: July 23, 2013
    Publication date: June 26, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Seung Woo JANG, Chang Hong KO
  • Publication number: 20140158413
    Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 ?m or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 12, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Daisuke SHANAI, Takashi Aoyama, Kazuhiko Sasada, Hiroaki Komatsu
  • Publication number: 20140155540
    Abstract: Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly(phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.
    Type: Application
    Filed: June 20, 2012
    Publication date: June 5, 2014
    Applicant: Toray Industries, Inc.
    Inventors: Naokichi Imai, Atsuki Tsuchiya, Masato Honma, Kohei Yamashita, Shunsuke Horiuchi, Koji Yamauchi
  • Patent number: 8734921
    Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: May 27, 2014
    Assignee: Markem-Imaje
    Inventor: Pierre De Saint-Romain
  • Patent number: 8722761
    Abstract: The disclosure provides a melt processible theromoplastic composition, comprising a major proportion of a base polymer comprising a first melt processible thermoplastic polymer having a first Fedor's solubility parameter and a first viscosity; and a combination of a carrier polymer and a surface modifying additive, the carrier polymer comprising a second melt processible thermoplastic polymer which has a second Fedor's solubility parameter that is at least about 2.5 (J/cm3)1/2 lower than the first Fedor's solubility parameter, and a second viscosity, the carrier polymer being adhered to the surface modifying additive, and wherein the first viscosity is at least about 10 times the second viscosity.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: May 13, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Narayanan Sankara Subramanian, David D. Zhang
  • Patent number: 8703862
    Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: April 22, 2014
    Assignee: BASF SE
    Inventors: Martin Weber, Christian Maletzko, Mark Völkel
  • Patent number: 8673985
    Abstract: The present invention relates to novel polycarbonate-polyorganosiloxane and/or polyurethane-polyorganosiloxane compounds, methods for their production, their use, functional formulations containing them, precursors for their production, as well as reactive compositions containing the aforementioned precursors.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: March 18, 2014
    Assignee: Momentive Performance Materials GmbH
    Inventors: Horst Lange, Roland Wagner, Gunnar Hoffmüller, Karl-Heinz Sockel, Walter Simon
  • Publication number: 20140073732
    Abstract: A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 13, 2014
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke Inokawa
  • Publication number: 20140008585
    Abstract: An intermediate transfer member that includes a sulfonated poly(ether ether ketone) polymer, an optional conductive component, an optional polymer, and an optional release additive.
    Type: Application
    Filed: July 8, 2012
    Publication date: January 9, 2014
    Applicant: XEROX CORPORATION
    Inventor: Jin Wu
  • Publication number: 20130345352
    Abstract: A curable polymer composition containing: (A) a thermoset benzoxazine resin precursor component; (B) optionally, an arylsulphone-containing benzoxazine component, and (C) a polyarylsulphone thermoplastic toughening agent, wherein in the absence of component (B), component (C) contains one or more benzoxazine pendant-and/or end-groups.
    Type: Application
    Filed: January 10, 2012
    Publication date: December 26, 2013
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Steven Richard Ward, Paul Mark Cross, Robin Maskell
  • Patent number: 8613623
    Abstract: A radical-polymerizable acrylic insulating adhesive for NCF-bonding an electronic part to a circuit board includes a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The amount of the inorganic filler is 70 to 160 parts by mass with respect to a total of 100 parts by mass of the (meth)acrylate monomer and the film-forming resin. A radical polymerization cured product of the acrylic insulating adhesive exhibits a glass transition temperature of 150 to 185° C., a linear expansion coefficient (?1) of 30 to 35 ppm in a temperature range that is lower than the glass transition temperature, and a linear expansion coefficient (?2) of 105 to 125 ppm in a temperature range that is equal to or higher than the glass transition temperature. Further, ?2/?1 is greater than or equal to 3.4.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: December 24, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Daisuke Sato
  • Publication number: 20130323416
    Abstract: The invention relates to heat treatment of polymorphic semicrystalline or crystallizable polymers to increase the content of the highest melting crystalline form. Such heat treatment results in a polymer powder that has a consistent, uniform melting range, improved flow and improved durability of the powder particle size for applications that require powder flow at elevated temperatures. In addition to improved powder properties, the articles produced from the powders also exhibit better physical properties in both appearance and in mechanical properties. Thus the invention also includes polymer powders and articles produced by the described processes.
    Type: Application
    Filed: September 27, 2011
    Publication date: December 5, 2013
    Applicant: Arkema Inc.
    Inventors: Christopher A. Bertelo, Manuel A. Garcia-Leiner, Anthony Decarmine, Scott F. Defelice
  • Publication number: 20130289187
    Abstract: A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.
    Type: Application
    Filed: October 18, 2011
    Publication date: October 31, 2013
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Masahiro Wada, Ken Ukawa, Kenji Yoshida, Yusuke Tanaka
  • Patent number: 8552109
    Abstract: Disclosed is an aqueous polyurethane resin dispersion which comprises a polyurethane resin which is obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a) a polycarbonate polyol having an alicyclic structure in the main chain, (b) an acidic group-containing polyol compound and (d) a polyisocyanate, and (B) a chain-elongating agent, being dispersed in an aqueous medium, a carboxylic acid group content of the above-mentioned (A) polyurethane prepolymer based on a solid component of (A) the polyurethane prepolymer is 2.0 to 13.0% by weight, and a number of a hydroxyl equivalent of a mixture of the above-mentioned (a) polycarbonate polyol having an alicyclic structure in the main chain, the above-mentioned (b) acidic group-containing polyol compound, and, if necessary, (c) a polyol other than (a) and (b) is 70 to 270.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: October 8, 2013
    Assignee: Ube Industries, Ltd.
    Inventors: Taku Nakamura, Masahiro Naiki, Atsushi Morikami, Fumio Adachi, Manabu Takahashi
  • Patent number: 8536265
    Abstract: A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm?2, preferably in the range 0.085 to 0.095 kNsm?2.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: September 17, 2013
    Assignee: Victrex Manufacturing Limited
    Inventors: Craig Meakin, Dianne Flath, Brian Wilson
  • Patent number: 8512832
    Abstract: The invention relates to a method of making a coating composition for coating glass. The method includes the steps of combining an epoxy resin component, a methacrylate component, a silane coupling agent, an epoxy curing agent, and an initiator agent.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: August 20, 2013
    Assignee: Sabmiller International BV
    Inventors: Mei Wen, Gary Stephen Silverman
  • Patent number: 8507602
    Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: August 13, 2013
    Assignee: Whitford Worldwide Company
    Inventors: Thomas J. Bate, Arthur Wachowski, Jan Wilhelm Ernst Moos
  • Publication number: 20130202832
    Abstract: Polymer compositions comprising poly(aryl ether ketone)s and graphene materials. In particular, a polymer composition comprising: A) a poly(arylether ketone) and B) 0.1 to 70 wt. %, based on the combined weight of A) and B), of at least one non-tubular graphene material. Use of such polymer compositions for the manufacture of molded or extruded articles. Molded or extruded articles made from such polymer compositions.
    Type: Application
    Filed: October 10, 2011
    Publication date: August 8, 2013
    Applicant: SOLVAY SA
    Inventors: Kermit S. Kwan, Mohammad Jamal El-Hibri, Hans Edouard Miltner
  • Publication number: 20130172459
    Abstract: Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same.
    Type: Application
    Filed: August 5, 2011
    Publication date: July 4, 2013
    Inventors: Shinji Tsuchikawa, Hiroyuki Izumi, Kumiko Ishikura, Hikari Murai
  • Publication number: 20130164679
    Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 v, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
    Type: Application
    Filed: February 15, 2013
    Publication date: June 27, 2013
    Applicant: SAN-EI KAGAKU CO., LTD.
    Inventor: SAN-EI KAGAKU CO., LTD.
  • Publication number: 20130157024
    Abstract: The invention concerns a non-stick coating for a substrate consisting of a metallic material, glass, ceramic, stone or enamel, which is characterised by at least one layer applied directly to the substrate and consisting of at least 33 wt. % polyetherketone and/or polyetheretherketone (PEEK), at least 33 wt. % of one or more fluoropolymers and no more than 16 wt. % additives.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 20, 2013
    Applicant: Rhenotherm Kunststoffbeschichtungs GmbH
    Inventor: Rhenotherm Kunststoffbeschichtungs GmbH
  • Publication number: 20130122319
    Abstract: An allergen reducing agent is provided that contains a terpenoid polymer or copolymer as an active component, and that functions to reduce allergens such as mites and pollen, and is capable of suppressing coloring.
    Type: Application
    Filed: July 22, 2011
    Publication date: May 16, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Kenji Sakamoto, Shigeharu Fukuzawa, Hiroyuki Omura, Shoichi Nakamoto, Kazumasa Rokushima
  • Patent number: 8440781
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: May 14, 2013
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato
  • Publication number: 20130101743
    Abstract: A mixture of a functionalized polyfluoropolyether and a benzoxaine resin in a weight ratio of from about 1/99 to about 99/1.
    Type: Application
    Filed: October 24, 2011
    Publication date: April 25, 2013
    Applicant: XEROX CORPORATION
    Inventors: Jin Wu, Lanhui Zhang, Lin Ma
  • Publication number: 20130075136
    Abstract: A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Inventors: Li-Chih YU, Tse-An LEE, Jen-Chun WANG, Yu-Te LIN, Yih-Rern PENG
  • Patent number: 8349935
    Abstract: To obtain injection molded objects having biodegradability and excellent flame retardance and mechanical strength, the injection molded object includes a lactic acid based resin; and a metal hydroxide in a ratio of 5 to 40 mass parts per 100 mass parts of the lactic acid based resin. The metal hydroxide is surface-treated, and Na2O (w-Na2O) present on a surface of grains of the metal hydroxide is 0.1 mass % or less based on the total mass of the metal hydroxide. Preferably, the injection molded object contains an aliphatic polyester other than the lactic acid based resin or an aromatic-aliphatic polyester in a ratio of 20 to 80 mass parts per 100 mass parts of the lactic acid based resin.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: January 8, 2013
    Assignees: Mitsubishi Plastics, Inc., Sony Corporation
    Inventors: Akihiro Ohashi, Kazuya Tanaka, Yukio Kato, Jun Takagi, Shinichiro Yamada, Hiroyuki Mori, Yuko Fujihira
  • Publication number: 20130005150
    Abstract: The invention provides a composition for forming a silicon-containing resist underlayer film comprising: (A) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (1) and one or more hydrolysable compound shown by the following general formula (2), and (B) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (3) and one or more hydrolysable silicon compound shown by the following general formula (4). There can be provided a composition for forming a resist underlayer film applicable not only to a resist pattern obtained in a negative development but also to a resist pattern obtained in a conventional positive development, and a patterning process using this composition.
    Type: Application
    Filed: June 15, 2012
    Publication date: January 3, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Takafumi UEDA, Toshiharu YANO, Fujio YAGIHASHI
  • Publication number: 20120329939
    Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Inventor: Edward Norman Peters
  • Publication number: 20120273738
    Abstract: A railway vehicle component, wherein the component is a partition or a light cover, and wherein the component is molded or formed from a thermoplastic polymer composition comprising: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.
    Type: Application
    Filed: March 30, 2012
    Publication date: November 1, 2012
    Inventors: Paul Dean Sybert, James Franklin Hoover, Thomas L. Evans
  • Publication number: 20120267480
    Abstract: An aircraft component wherein the component is a partition or a light cover, and wherein the aircraft component is molded or formed from a thermoplastic polymer composition including: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 25, 2012
    Inventors: Paul Dean Sybert, James Franklin Hoover, Laura G. Schultz Hume
  • Publication number: 20120269994
    Abstract: A marine vehicle component wherein the component is a partition or a light cover, and wherein the marine vehicle component is molded or formed from a thermoplastic polymer composition comprising a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 25, 2012
    Inventors: Paul Dean Sybert, James Franklin Hoover, Thomas L. Evans