Solid Polymer Or Sicp Derived From At Least One Phenol Or Inorganic Phenolate Reactant Patents (Class 524/540)
  • Patent number: 7649073
    Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: January 19, 2010
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Gary C. Davis, Dibakar Dhara, Sarah Elizabeth Genovese, Katherine Glasgow, Gautam Madan, Patrick J. McCloskey, Yohana Perez de Diego, William D. Richards
  • Patent number: 7642315
    Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: January 5, 2010
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Gary C. Davis, Dibakar Dhara, Sarah Elizabeth Genovese, Katherine Glasgow, Jennifer Kübel, Gautam Madan, Patrick J. McCloskey, William D. Richards
  • Publication number: 20090314532
    Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
    Type: Application
    Filed: September 29, 2008
    Publication date: December 24, 2009
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Makoto Hayashi, Koshin Nakai, Katsuto Murata
  • Publication number: 20090301762
    Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.
    Type: Application
    Filed: May 29, 2007
    Publication date: December 10, 2009
    Applicant: Dow Global Technologies Inc.
    Inventors: Joseph Gan, Bernd Hoevel
  • Publication number: 20090192258
    Abstract: A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 ?m, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.
    Type: Application
    Filed: January 22, 2009
    Publication date: July 30, 2009
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoyoshi Tada, Shoichi Osada, Miyuki Wakao, Kazutoshi Tomiyoshi, Kenichi Totsuka, Tadaharu Ikeda
  • Publication number: 20090162650
    Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 25, 2009
    Inventors: Yong Woo Hong, Wan Jung Kim, Su Mi Im, Ah Ram Pyun, Chul Jeong, Sang Jin Kim, Chang Beom Chung
  • Publication number: 20090156715
    Abstract: The present disclosure relates to an epoxy composition. The epoxy composition contains an epoxy resin, a phenolic resin, a functional filler, an epoxy cure catalyst and at least one elastomer. The elastomer is used to increase the flexibility of the epoxy composition.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: THOMAS EUGENE DUEBER, Barbara Ann Wood, Charles John Talkowski
  • Publication number: 20090155569
    Abstract: The present invention provides a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.
    Type: Application
    Filed: December 16, 2008
    Publication date: June 18, 2009
    Applicant: RICOH COMPANY, LTD
    Inventors: Takehito Yamaguchi, Hitoshi Shimbo, Yutaka Kuga
  • Publication number: 20090149576
    Abstract: A solid elastomeric reinforcing material for use in the manufacture of compounded rubber goods that is made from an elastomeric material coagulated from a natural or synthetic latex, a natural or synthetic fibrous filler that has a linear density of at least 0.5 dtex, a tenacity of at least 1.0 gram per dtex, a fiber length between 0.1 and 6 mm and a specific surface area range between 0.1-25 square meters per gram and a modulus enhancing additive.
    Type: Application
    Filed: December 3, 2008
    Publication date: June 11, 2009
    Inventors: Arnold Frances, Daniel Li
  • Publication number: 20090133912
    Abstract: A substrate, a circuit board and a multilayer circuit board are provided which, although being made of an inorganic filler as a crushed product, are capable of providing a highly reliable hybrid integrated circuit because of having excellent adhesion to a metal plate or metal foil and exhibiting a high thermal conductivity. A resin composition comprising a curable resin comprising an epoxy resin and a curing agent for the epoxy resin; and an inorganic filler filled in the curable agent; wherein the curing agent comprises a phenol novolak resin, and wherein the inorganic filler comprises a coarse powder containing particles having an average particle size of 5 to 20 ?m, preferably particles is having a maximum particle size of 100 ?m or below and a particle size of 5 to 50 ?m in an amount of 50 vol % or above; and a fine powder containing particles having an average particle size of 0.2 to 1.5 ?m, preferably particles having a particle size of 2.0 ?m or below in an amount of 70 vol % or above.
    Type: Application
    Filed: September 4, 2006
    Publication date: May 28, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Kenji Miyata, Hidenori Ishikura
  • Patent number: 7537650
    Abstract: This invention relates to an ink jet ink set comprising a colored aqueous ink and a substantially colorless aqueous ink, wherein the colored ink comprises a cationic coloring agent and the colorless ink comprises an anionic polymer or oligomer.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: May 26, 2009
    Assignee: Eastman Kodak Company
    Inventors: Richard P. Szajewski, Xiaoru Wang
  • Publication number: 20090118417
    Abstract: The present invention is directed to a hyperbranched-polyester comprising at least one kind of a structural unit selected from an aromatic oxycarbonyl unit (P), aromatic and/or aliphatic dioxy units (Q), and an aromatic dicarboxy unit (R), and a trifunctional or higher polyfunctional organic residue (B), wherein the content of B is within a range from 7.5 to 50 mol % based on entire monomers constituting the hyperbranched-polyester. The present invention provides a hyperbranched-polyester which can remarkably improve thin-wall flowability, stiffness and gas barrier property by blending with a thermoplastic resin, and a thermoplastic resin composition blended with the same.
    Type: Application
    Filed: March 30, 2007
    Publication date: May 7, 2009
    Inventors: Koji Tachikawa, Makito Yokoe, Mitsushige Hamaguchi, Makiko Saito, Hideo Matsuoka, Toru Yamanaka
  • Publication number: 20090110909
    Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.
    Type: Application
    Filed: October 23, 2008
    Publication date: April 30, 2009
    Applicant: E. I. DuPont de Nemours and Company
    Inventors: Jeffrey Glenn Innocenzo, Pui-Yan Lin, Richard C. Oliver, Govindasamy Paramasivam Rajendran, George Elias Zahr
  • Publication number: 20090110843
    Abstract: The present invention discloses a latent thermosetting ink formulation for ink jet applications comprising a phenolic resin, an amino resin and a polyol. The formulation is characterized as having a viscosity of lower than 50 Cps at a shear rate of 10 to 100,000 sec-1 at a temperature lower than 100 C and a surface tension lower than 40 dynes/cm.
    Type: Application
    Filed: August 17, 2006
    Publication date: April 30, 2009
    Inventors: Izhar Halahmi, Shalom Luski, Michal Cohen
  • Publication number: 20090111926
    Abstract: The present invention provides a liquid-crystalline polyester blend, which is obtained by combining a liquid-crystalline polyester (A) and a liquid-crystalline polyester (B) such that the ratio by weight of (A)/(B) is 99/1 to 80/20: liquid-crystalline polyester (A) which consists of aromatic oxycarbonyl repeating units, aromatic dioxy repeating units and aromatic dicarbonyl repeating units, and contains 40-80 mol % of the repeating unit represented by formula (I) based on the total repeating units constituting the liquid-crystalline polyester (A); liquid-crystalline polyester (B) which comprises repeating units represented by formulae (I) and (II), wherein the molar proportion of the total amount of the repeating units represented by formulae (I) and (II) based on the total amount of the repeating units constituting the liquid-crystalline polyester (B) is greater than or equal to 90 mol % and the molar proportion of the repeating units represented by formulae (I) to (II) is from 10/90 to 50/50.
    Type: Application
    Filed: October 29, 2008
    Publication date: April 30, 2009
    Applicant: UENO FINE CHEMICALS INDUSTRY, LTD.
    Inventors: Satoru Yonezawa, Motoki Asahara, Hisanari Fujiwara, Hiroaki Terada, Hiroyuki Kato
  • Patent number: 7524894
    Abstract: A flexible resin composition comprises poly(arylene ether) resin, syndiotactic polystyrene, olefin elastomer, hydrogenated styrene-butadiene copolymer, and a non-halogen fire retardant.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: April 28, 2009
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Sho Sato, Hiroshi Kubo
  • Publication number: 20090090629
    Abstract: CED coating compositions which, apart from water, comprise (i) a resin solids content consisting of at least one film-forming, self- or externally cross-linking CED binder and the optional components: cross-linkers, paste resins, nonionic resins, and (ii) optionally, at least one component selected from the group consisting of pigments, fillers, coating additives and organic solvents, and contain relative to the resin solids content thereof, 1 to 20 wt. % of at least one resin A with functional groups selected from the group consisting of hydroxyl groups, free isocyanate groups and blocked isocyanate groups, wherein the at least one resin A is present as particles with melting temperatures from 40 to 200° C.
    Type: Application
    Filed: March 6, 2007
    Publication date: April 9, 2009
    Inventors: Gabriele Buettner, Andreas Fieberg, Carmen Flosbach, Thomas Grawe, Tanja Renkes
  • Publication number: 20090088514
    Abstract: A thermoplastic composition comprises 55 to 97 weight percent of a polycarbonate; 1 to 25 weight percent of a polysiloxane-polycarbonate comprising siloxane units of the formula: wherein each occurrence of R is the same or different, and is a C1-30 monovalent organic group, wherein E is 1 to 1,000, and wherein the polysiloxane-polycarbonate comprises 0.1 weight percent to 50 weight percent siloxane units; 1 to 10 weight percent of an impact modifier; and 1 to 10 weight percent of a filler, wherein the filler has a particle size with D50 less than 2.7 micrometers. The thermoplastic composition has good flame retardance, flexural modulus, impact and surface appearance. A method of making and articles prepared from the thermoplastic composition are also disclosed.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Applicant: SABIC INNOVATIVE PLASTICS IP BV
    Inventor: Ma Shiping
  • Patent number: 7507474
    Abstract: The invention relates to thermoplastic compositions comprising a polymer matrix and an additive which modifies the rheological behavior of the matrix in the molten state. The purpose of the invention is to provide a preferably non-reactive additive which can be dispersed in the matrix and which can be used to obtain a good compromise in terms of rheological properties/mechanical properties. According to the invention, the additive is a hyperbranched polymer which is functionalized by R<2> radicals, R<2> being a radical of the following type: substituted or non-substituted hydrocarbon, of the silicon type, linear or branched alkyl, aromatic, arylalkyl, alkylaryl or cycloaliphatic, which can comprise one or more unsaturations and/or one or more heteroatoms.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: March 24, 2009
    Assignee: Rhodianyl
    Inventors: Joël Varlet, Florence Clement, Franck Touraud, Sandrine Rochat, Natalia Scherbakoff
  • Publication number: 20090069490
    Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.
    Type: Application
    Filed: March 16, 2006
    Publication date: March 12, 2009
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Ichirou Ogura, Kunihiro Morinaga, Kazuo Arita, Yutaka Sato
  • Publication number: 20090023855
    Abstract: A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent.
    Type: Application
    Filed: January 31, 2006
    Publication date: January 22, 2009
    Inventors: Shinya Nakamura, Tomoya Masuda, Mitsuo Katayose
  • Publication number: 20090015272
    Abstract: A self-healing composite material comprising a fibre-reinforced polymeric matrix, wherein the polymeric matrix comprises a thermosetting polymer and a thermoplastic polymer.
    Type: Application
    Filed: January 7, 2005
    Publication date: January 15, 2009
    Applicant: SHEFFIELD UNIVERISTY OF THE
    Inventors: Frank Jones, Simon A. Hayes
  • Publication number: 20090004488
    Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a polymer binder; and (c) cyanate ester or a prepolymer of the cyanate ester, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a flame retardant. Also, a composite substrate and a copper laminate using the same are disclosed.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: Doosan Corporation
    Inventors: Kwang Suk PARK, In Wook Kim, Duk Sang Han, Soo Im Jung, Dong Ki Nam
  • Publication number: 20080319124
    Abstract: A thermosetting resin material is provided with: (A) a thermosetting resin having a dihydrobenzoxazine ring; and (B) a condensed polycyclic aromatic hydrocarbon resin is described.
    Type: Application
    Filed: June 20, 2008
    Publication date: December 25, 2008
    Inventors: Shou Kurihara, Hiroshi Idei, Yoshihiro Aoyagi, Naeko Okumura
  • Publication number: 20080308225
    Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 18, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsuya Kanamaru, Tsuyoshi Honda
  • Publication number: 20080299395
    Abstract: Linerless prepreg, composite articles therefrom, and related methods are disclosed. In linerless prepreg according to the invention, matrix material is impregnated into a reinforcement material without the need for any release liners during manufacture or storage thereof. Beneficially, prepreg of the invention is capable of being easily wound into a roll or stacked for storage, without sticking to itself when it is later used in the manufacture of composite articles.
    Type: Application
    Filed: September 27, 2006
    Publication date: December 4, 2008
    Inventors: Andrew C. Strange, James E. McGuire, JR.
  • Publication number: 20080274360
    Abstract: A polymer composition comprising a mixture of a) a first resin component comprising a polyaryl ether ketone, a polyaryl ketone, a polyether ketone, a polyether ether ketone, or a combination of two or more of the foregoing, and b) a second resin component comprising a specific type of copolycarbonate, wherein the mixture has at least two glass transition temperatures, as measured by ASTM method D5418, wherein the first glass transition temperature is from 120 to 160° C. and the second glass transition temperature is from 170 to 280° C. is disclosed. The compositions have improved properties such as improved load bearing capability at high temperature, better impact strength, and a high crystallization temperature.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 6, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: Robert Russell Gallucci
  • Publication number: 20080269393
    Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.
    Type: Application
    Filed: October 22, 2007
    Publication date: October 30, 2008
    Inventors: Thomas J. Bate, Arthur Wachowski, Jan Wilhelm Ernst Moos
  • Publication number: 20080258337
    Abstract: The present description discloses a polymeric composition which is a melt-processed alloy comprised of (a) a polyarylene sulfide resin, (b) a polyaryl-ether-ketone resin, and a reactive compound which results in (c) a graft copolymer of the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin in addition to the starting resins. Exemplary melt-processed polymeric compositions can be made by reacting an alkoxy silane with the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin to produce a graft copolymer of a portion of one or both of the resins, sufficient to render the composition uniform and homogeneous. It is normally preferred for the exemplary organosilane compound, to be an amino silane. The subject invention further reveals an insulated wire comprising (1) an electrical conductor and (2) a layer of the melt-processed alloy composition; and fiber reinforced composites comprising fibers substantially fully impregnated with the alloy polymeric composition.
    Type: Application
    Filed: April 18, 2008
    Publication date: October 23, 2008
    Applicant: Ticona, LLC
    Inventors: Manoj Ajbani, Andrew Auerbach, Ke Feng
  • Publication number: 20080262135
    Abstract: A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y? represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y? may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.
    Type: Application
    Filed: November 19, 2007
    Publication date: October 23, 2008
    Inventors: Shinya Nakamura, Mitsuo Katayose, Kayoko Nakamura
  • Publication number: 20080246186
    Abstract: A method for making a polyarylene ether copolymer including mixing a polyarylene ether, a hydroxyaromatic terminated siloxane reagent and an oxidant, and melt compounding the mixture. A polyarylene ether copolymer including a polyarylene ether, a hydroxyaromatic terminated siloxane reagent, an oxidant and a filler is also presented.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 9, 2008
    Inventors: Scott Michael Fisher, Susanta Banerjee, Subramanya Kishore Avadhanula Venkata, Anatharaman Dhanabalan, Vijay R. Mhetar, Abhijit Namjoshi
  • Publication number: 20080132637
    Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.
    Type: Application
    Filed: January 22, 2008
    Publication date: June 5, 2008
    Applicant: Asahi Kasei Chemicals Corporation
    Inventor: Tetsuji Tokiwa
  • Publication number: 20080131702
    Abstract: An epoxy resin composition includes an epoxy resin, a curing agent, a coupling agent, and an inorganic filler. The coupling agent may include a hydrocarbon-substituted siloxane resin having at least one terminal hydroxy group.
    Type: Application
    Filed: November 26, 2007
    Publication date: June 5, 2008
    Inventors: Kyoung Chul Bae, Jin A. Kim, Yoon Kok Park
  • Patent number: 7368487
    Abstract: Ink jet printable compositions comprise an aqueous vehicle, particles of a self-crosslinking polymer, and optional colorant. In one embodiment, an ink jet printable ink may comprise an aqueous vehicle, a colorant, and a silyl-terminated sulfopoly(ester-urethane) polymer. In another embodiment, an ink jet printable ink comprises an aqueous vehicle, colorant, and at least 20 weight percent dispersed shear deformable polymer particles wherein the polymer is self-crosslinking. In another aspect, the invention concerns methods of printing a composition, and printed articles produced thereby.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: May 6, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Dong Wu, Larry R. Krepski, Kevin M. Lewandowski, Caroline M. Ylitalo, Peter T. Elliott
  • Patent number: 7329696
    Abstract: A aqueous dispersion comprising particles of at least one resin selected from the group consisting of a polyaddition type resin, a polycondensation type resin, an addition condensation type resin, a ring-opening-polymerization type resin and an addition polymerization type resin; wherein the particle has at least two peaks in a particle diameter distribution curve; at least one of the peaks comprises at least one resin selected from the group consisting of a polyaddition type resin, a polycondensation type resin, an addition condensation type resin and a ring-opening-polymerization type resin. The aqueous dispersion exhibits a low viscosity even at a high concentration exceeding 65%, and has better stability with day. In addition, a paint, an adhesive, a pressure-sensitive adhesive and a fiber and textile processing agent using the dispersion of the present invention is excellent in storage stability even at a high concentration.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: February 12, 2008
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Yoshiyuki Ueno, Toshihide Shima, Tadashi Tanaka, Munekazu Satake
  • Patent number: 7329699
    Abstract: The invention relates to a composition, preferably a care and/or treatment and/or make-up composition for keratin and keratinous materials in general (including the skin, hair, nails, scalp, and/lips of human beings, keratinous fibers, etc.), containing an oil, a structuring polymer and a coated silicone elastomer. Preferably, the compositions of the invention are anhydrous.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: February 12, 2008
    Assignee: L'Oreal
    Inventors: Terry Van Liew, Shaoxing Lu
  • Patent number: 7319131
    Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitrones, halonitroparaffins, oxazines, azaadamantanes, hexamethylenetetramine salts, nitroamines, imidazolidines, triazines, nitrooxazolidines, and imidazolidine-oxazolidine hybrids to serve as hardeners for curing phenolic resins. The hardeners and accelerators/catalysts described in the invention can be applied in any application where phenolic resins are used, including but not limited to fiber reinforced composite applications such as pultrusion, filament winding, bulk molding compound (BMC), sheet molding compounds (SMC), vacuum assisted resin transfer, prepregs, adhesives, foundry materials, abrasives, friction materials, insulation, laminates, coatings, electronics, fire resistant, and flame-retardant end uses.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: January 15, 2008
    Assignee: Angus Chemical Company
    Inventors: Raymond J. Swedo, George David Green
  • Patent number: 7319130
    Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitroamines, aminonitroalcohols, imines, hexahydropyimidines, nitrones, hydroxylamines, nitro-olefins and nitroacetals to serve as hardeners and/or as catalysts for curing phenolic resins. The hardeners and catalysts described in the invention can be applied in any application where phenolic resins are used, including but not limited to adhesives, molding, coatings, pultrusion, prepregs, electronics, composites, fire resistant, and flame-retardant end uses.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: January 15, 2008
    Assignee: Angus Chemical Company
    Inventor: Raymond J. Swedo
  • Patent number: 7317063
    Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitroamines, aminonitroalcohols, imines, hexahydropyrimidines, nitrones, hydroxylamines, nitro-olefins and nitroacetals to serve as hardeners and/or as catalysts for curing phenolic resins. The hardeners and catalysts described in the invention can be applied in any application where phenolic resins are used, including but not limited to adhesives, molding, coatings, pultrusion, prepregs, electronics, composites, fire resistant, and flame-retardant end uses.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: January 8, 2008
    Assignee: Angus Chemical Company
    Inventors: Raymond J. Swedo, George David Green
  • Patent number: 7317064
    Abstract: The invention includes formulations useful for creating reinforced composites based on 1) novolac resin compositions, and, 2) non-formaldehyde hardeners, as well as processes for manufacturing components using said reinforced composites.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: January 8, 2008
    Assignee: Angus Chemical Company
    Inventors: Raymond J. Swedo, George David Green
  • Patent number: 7297739
    Abstract: This invention relates to a polymer precursor dispersion for use in making a polymer that is a solid at room temperature and further relates to a method of making same where the dispersion comprises a polymer precursor comprising an addition monomer, a condensation monomer, a prepolymer, or a polymer modifier and 0.01 to 50 weight percent of a micropulp having a volume average length of from 0.01 to 100 micrometers.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: November 20, 2007
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: John Chu Chen, Arnold Frances, Sam Louis Samuels
  • Patent number: 7205354
    Abstract: The present invention provides: a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending from 5 to 150 parts by weight of an inorganic filler in a flake form to 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent, or a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending a combination of an inorganic filler in a flake form and a fibrous reinforcing filler in a total amount of 5 to 150 parts by weight with 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: April 17, 2007
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Hiroyuki Kobayashi, Yuuji Kusumi, Yukihiro Bann, Hiroto Matsuura
  • Patent number: 7094826
    Abstract: An aqueous coating composition comprising a crosslinkable water-dispersible hyperbranched macromolecule(s) wherein the composition when drying has an open time of at least 20 minutes, a wet edge time of at least 10 minutes, a tack free time ?15 hours, a dust free time ?5 hours and an equilibrium viscosity of ?5,000 Pa·s at any solids content when drying in the range of from 20 to 55% by weight using any shear rate in the range of from 9±0.5 to 90±5 s?1 and at 23±2° C.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: August 22, 2006
    Assignee: DSM IP Assets B.V.
    Inventors: Emilio Martin, Gerardus Cornelis Overbeek, Pablo Steenwinkel, Ronald Tennebroek
  • Patent number: 7056973
    Abstract: A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 ?m. Fiber reinforced and flame retarded compositions exhibit high HDT values.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: June 6, 2006
    Assignee: General Electric
    Inventor: Nirajkumar Patel
  • Patent number: 7019062
    Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: March 28, 2006
    Assignee: General Electric
    Inventors: Franciscus Johannes Maria van Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
  • Patent number: 7015274
    Abstract: This invention relates to a polymer precursor dispersion for use in making a polymer that is a solid at room temperature and further relates to a method of making same where the dispersion comprises a polymer precursor comprising an addition monomer, a condensation monomer, a prepolymer, or a polymer modifier and 0.01 to 50 weight percent of a micropulp having a volume average length of from 0.01 to 100 micrometers.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: March 21, 2006
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John Chu Chen, Arnold Frances, Sam Louis Samuels
  • Patent number: 6894102
    Abstract: A syndiotactic polystyrene blend comprises syndiotactic polystyrene and poly(arylene ether) wherein the poly(arylene ether) has an intrinsic viscosity less than about 0.25 deciliters per gram (dl/g) when measured in chloroform at 25° C.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: May 17, 2005
    Assignee: General Electric
    Inventor: Glen David Merfeld
  • Patent number: 6825257
    Abstract: A thermoplastic polymer mixture comprising at least on thermoplastic polycarbonate polymer, and at least one mold release agent including at least one polyol component, is described. At least one polyol component (I) of the mold release agent consists of a parent substance with at least 4 carbon atoms, at least 3 hydroxyl groups, at least one hydroxyl group esterified with an aliphatic carboxylic acid, and at least one free hydroxyl group.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: November 30, 2004
    Assignee: Bayer Aktiengesellschaft
    Inventors: Burkhard Reitze, Raimund Zimmermann, Wilfried Haese
  • Patent number: 6815483
    Abstract: Copolymers of polycarbonates or polyarylates with polyether polymers such as polyethersulfones, polyetherketones, and polyetherimides are prepared by reaction of the polyether polymer-forming reagents, e.g., bisphenol A disodium salt and bis(4-chlorophenyl) sulfone, in the presence of the polycarbonate or polyarylate. The reaction may take place in a dipolar aprotic solvent, or in a water-immiscible aromatic solvent in the presence of a phase transfer catalyst, preferably a hexaalkylguanidinium halide. Hydroxy-terminated polyether oligomers may be produced from the copolymers by saponification of carbonate or ester groups.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: November 9, 2004
    Assignee: General Electric Company
    Inventor: Tohru Takekoshi
  • Patent number: 6809147
    Abstract: The present invention provides a thermosetting composition which is excellent especially in storage stability and solid physical properties and can be used as automotive body sealers or undercoats. The thermosetting composition according to the present invention comprises an acrylic plastisol consisting of a plasticizer having acrylic resin particles having a gradient-type structure in which the monomer unit proportion changes from the core to the shell multistep-wise or continuously and a filler dispersed therein and therewith formulated, as a thermosetting material, a blocked urethane prepolymer or blocked polyisocyanate compound and a latent curing agent therefor.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: October 26, 2004
    Assignees: Sunstar Giken Kabushiki Kaisha, Sunstar Suisse SA
    Inventors: Hitoshi Ohno, Kenta Nakayama, Takashi Minamihori