Abstract: A flame-retardant polyimide molding material and a molded article including the flame-retardant polyimide molding material, where the flame-retardant polyimide molding material includes a semi-aromatic polyimide resin (A) and carbon fiber (B), and the flame-retardant polyimide molding material includes 15 to 80 mass % of the carbon fiber (B).

Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.

Abstract: A polyamic acid that is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydrides, according to one or more embodiments of the present invention. The polyamic acid contains 2?-bistrifluoromethylbenzidine as a diamine component in addition to 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 9,9?-(3,4?-dicarboxyphenyl)fluorenic dianhydride as tetracarboxylic dianhydride components. The polyamic acid may include 9,9?-(3,4?-dicarboxyphenyl)fluorenic dianhydride in an amount ranging from 0.5 mol % or more to 10 mol % or less based on total amount of the tetracarboxylic anhydride.

Abstract: Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.

Abstract: A polycarbonate resin composition, a molded article, a polycarbonate resin, and an end-capping agent for polycarbonate resins are provided. The polycarbonate resin composition contains: a polycarbonate resin having a terminal structure represented by Formula (A) and having a viscosity average molecular weight from 1×104 to 5×104, and a stabilizer. In Formula (A), R1 is selected from the group consisting of a hydrogen atom, halogen atoms, linear alkyl groups having from 1 to 9 carbons, branched alkyl groups having from 3 to 9 carbons, linear alkenyl groups having from 2 to 9 carbons, branched alkenyl groups having from 3 to 9 carbons, and aryl groups having from 6 to 12 carbons; and R2 to R7 are each independently selected from the group consisting of a hydrogen atom, alkyl groups having from 1 to 9 carbons, and alkoxy groups having from 1 to 9 carbons.

Abstract: Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate.

Abstract: The invention relates to the synthesis method of polyglycolic acid (PGA) obtained by removing the excessive water and monomer formed subsequent to condensation by means of an organic solvent and using azeotropic distillation method in the presence of a catalyst. The invention is a synthesis method of polyglycolic acid with high molecular weight and high solubility, characterized by comprising the steps of placing the glycolic acid in reaction medium with a catalyst; using hydrophilic organic solvents for removing the excessive water and monomer formed during condensation; mixing and boiling the mixture; stabilizing the amount of solvent in reaction medium and distilling the water off by means of Dean stark apparatus and/or a similar apparatus; refluxing the solid polymer obtained at the end of the reaction with ethyl acetate and removing the same from monomer residue and catalyst.

Abstract: This invention relates to flame-retardant modified maleic anhydride resins. This resin copolymer consists of styrene, maleic anhydride and, along with a halogen-free epoxy resin, interacts with a hydroxyl group to become a flame-retardant maleic anhydride copolymer that can be applied to copper clad laminate and prepreg. This composition comprises: (A) one or more epoxy resin mixtures; (B) modified styrene-maleic anhydride curing agent copolymer; (C) additives; (D) inorganic fillers. When the aggregate amount of components (A), (B) and (C) equals 100%, component (A), epoxy resin mixture, is 60%-80% in total weight, component (B), modified styrene-maleic anhydride curing agent copolymer, equals 10%-40% in total weight. This invention uses the copolymer of Styrene and Maleic anhydride to generate a flame-retardant hydroxyl group, and with the phosphorus additive, the above components eventually interact to form a flame-retardant modified maleic anhydride copolymer curing agent.

Abstract: The invention relates to a process for producing aromatic polyimides, comprising the following steps: (a) preparation of one or more solid salt(s) by reacting one or more aromatic tetracarboxylic acid(s) and one or more diamine(s) according to a mole ratio ranging from 0.95 to 1.05; (b) drying of the solid salt(s), (c) addition, to the dry salt resulting from step (b), of one or more compound(s) (C) comprising one or more group(s) chosen from a carboxylic acid group, an anhydride group, an ester group and an acyl chloride group; (d) solid-state polymerization of said solid salt(s) in the presence of the compound(s) (C).

Abstract: This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.

Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.

Abstract: A polyimide precursor composition includes a solvent including water and a polyimide precursor including a group having a triple bond at a terminal thereof, which is dissolved in the solvent.

Abstract: A process is disclosed for synthesis of a poly(amic acid), including reacting a dianhydride and a diamine in the presence of a tertiary amine, tertiary ammonium salt, tertiary ammonium hydroxide, secondary amine, secondary ammonium salt, secondary ammonium hydroxide, quaternary ammonium salt, quaternary ammonium hydroxide, ammonium hydroxide, or a combination comprising at least one of the foregoing, in water, at a temperature of 60 C to 180 C, or 60 C to 100 C, or 100 C to 180 C, under an inert atmosphere, with agitation, to produce an aqueous poly(amic acid).

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

Abstract: A polyimide precursor comprising a repeating unit represented by the following chemical formula (1): in which A is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein the polyimide precursor comprises at least one type of repeating unit represented by the chemical formula (1) in which A is a group represented by chemical formula (2) or (3): in which m independently represents 0 to 3 and n independently represents 0 to 3; Y1, Y2 and Y3 each independently represent at least one selected from the group consisting of hydrogen atom, methyl group and trifluoromethyl group; and Q and R each independently represent direct bond, or at least one of —NHCO—, —CONH—, —COO— and —OCO—, in which Z and W each independently represent a divalent aromatic group having 6 to 18 carbon atoms; and Y4 rep

Abstract: Metallopolyimide precursor fibers for aging-resistant carbon molecular sieve hollow fiber membranes having enhanced selectivity include transition metal cations complexed with electronegative regions of a polyimide. CMS membranes are made by pyrolyzing the metallopolyimide precursor fibers. The cations are introduced by including, in the spin dope composition used to extrude the fibers, either a salt of the transition metal and an inorganic anion or a transition metal/organic ligand complex.

Abstract: A composition for preparing an article including a poly(imide-amide) copolymer, the composition including (i) a copolymer obtained by reacting a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a carboxylic acid dichloride to form a reaction product, followed by removing hydrochloric acid from the reaction product, (ii) an acid anhydride, and (iii) a solvent: Wherein group R1 in Chemical Formula 1 and group R2 in Chemical Formula 2 are the same as described in the specification.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: The present invention relates to preparation and use of water dispersible nanogels and solvent dispersible reactive nanogels as additives to enhance polymer properties or as precursors to polymeric networks.

Abstract: Compositions of azobenzene-containing, photomechanically active, copoly(amic acids) and linear copolyimides including an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride are provided; and methods of making the same.

Abstract: The present invention relates to a polyimide precursor comprising a repeating unit represented by the following chemical formula (1): wherein A is a tetravalent group having at least one aliphatic six membered ring and no aromatic ring in the chemical structure, and B is a divalent group having at least one amide bond and an aromatic ring in the chemical structure; or A is an aliphatic tetravalent group and B is a divalent group having at least one chemical structure represented by the following chemical formula (2) in the chemical structure: and X1 and X2 are each independently hydrogen, a C1-6 alkyl group or a C3-9 alkylsilyl group.

Abstract: A method for printing a three-dimensional part with an additive manufacturing system, which includes providing a part material that compositionally has one or more semi-crystalline polymers and one or more secondary materials that are configured to retard crystallization of the one or more semi-crystalline polymers, where the one or more secondary materials are substantially miscible with the one or more semi-crystalline polymers. The method also includes melting the part material in the additive manufacturing system, forming at least a portion of a layer of the three-dimensional part from the melted part material in a build environment, and maintaining the build environment at an annealing temperature that is between a glass transition temperature of the part material and a cold crystallization temperature of the part material.

Abstract: The present invention provides a novel resist underlayer film formation composition for lithography. A resist underlayer film formation composition for lithography comprising: a polymer having a structure of Formula (1) at a terminal of a polymer chain; a cross-linking agent; a compound promoting a cross-linking reaction; and an organic solvent; (where R1, R2, and R3 are each independently a hydrogen atom, a linear or branched C1-13 alkyl group, a halogeno group, or a hydroxy group; at least one of R1, R2, and R3 is the alkyl group; Ar is a benzene ring, a naphthalene ring, or an anthracene ring; two carbonyl groups are bonded to respective two adjacent carbon atoms of Ar; and X is a linear or branched C1-6 alkyl group optionally having a C1-3 alkoxy group as a substituent).

Abstract: Example 3D printing methods involve rapid liquid filling of one or more cavities within a hollow and/or porous 3D printed object. In some examples, a conventional applicator computer-controllably dispenses significantly viscous solidifiable fluid in layers to build up a side wall of the object, and that same applicator or another applicator discharges a second solidifiable fluid at relatively low viscosity to rapidly fill the cavity(s), voids and/or porosity defined by the accurately printed side wall. In some examples, the liquid fill solidifies to permanently embed an internal object (e.g., wire or fiberglass mesh, Kevlar fabric, acrylic, bullet resistant armor, structural reinforcing material, etc.). In some examples, the liquid fill material permanently bonds to the accurately printed side wall. In some examples, the liquid fill material shrinks upon solidifying to create beneficial residual compressive stress within the 3D printed side wall and/or within the solidified material itself.

Abstract: A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3?-bis(halophthalimide) of the formula from more than 17 wt. % to less than 85 wt. % of a 4,3?-bis(halophthalimide) of the formula ?and from more than 0 to less than 27 wt.

Abstract: A polyimide film includes a polyimide polymer forming a main molecular structure of the polyimide film, and polyimide particles present in the polyimide film at a weight ratio between about 15 wt % and 30 wt % of a total weight of the polyimide film, the polyimide particles having an average diameter between about 3 ?m and 8 ?m. The polyimide film can have a 60° gloss value equal to or smaller than 10, a haze equal to or higher than 90%, and a Young's modulus equal to or higher than 280 kgf/mm2. In some embodiments, methods of fabricating the polyimide film are also described.

Abstract: The present invention provides compositions, methods and kits for the removal of proteins from complex reaction mixtures useful in majority workflows of molecular biology research experiments. More specifically, such compositions, methods and kits are useful in such processes as purification of nucleic acids from biological samples or after their treatment with specific enzymes, when residual enzyme activity in reaction mixture is not compatible with downstream applications.

Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI): in which A is tetravalent aromatic group or aliphatic group, B is divalent aromatic group, and each R2 independently represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, in which B in general formula (AI) includes a triazine moiety represented by following formula (AB1): in which R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms or an aromatic group, and R3 represents hydrogen, methyl or ethyl.

Abstract: The invention provides a liquid crystal alignment film, a method for preparing the same and a liquid crystal display device comprising the same. The alignment film comprises a polyimide obtained by reacting a compound as shown in Formula 2 or Formula 3 with an aromatic diamine as shown in Formula 1, wherein the R1, R2, R3, R4, R5, R6, R7, R1?, R2?, R3?, R4?, R5?, R6?, R7?, or R8? is H, an alkyl, an aralkyl or a haloalkyl, and the Ar is an aryl. The liquid crystal alignment film has a tactic spatial configuration, decreases the ?-? attractive interaction between the polyimide backbones, allows the directional and homogenous alignment of the liquid crystal molecules on the surface of the polyimide, and thereby increases the contrast of the liquid crystal display.

Abstract: There is described a low VOC, unsaturated alkyd resin obtained by reacting (A) to (E): (A) optionally from 0 to 30% w/w naturally occurring Rosin, comprising from 40 to 80 w/w parts per hundred of Rosin of an unsaturated mono carboxylic acid with at least one C15-25cyclohydrocarbo moiety capable of a Diels Alder or Ene reaction (pref monoacids being abietic acid, palustric acid, levopimaric acid, sandaracopimaric acid, and/or anhydrides thereof); (B) from 25 to 80% w/w of a linear C12-60hydrocarbo carboxylic acid with at least one (preferably at least two conjugated) C?C bonds (=unsaturated fatty acid); (C) optionally from 1 to 30% w/w of an ethylenically unsaturated C5-6hydrocarbo dicarboxylic acid and/or anhydride thereof, being reactive as a dienophile and/or enophile with A and/or B (pref C are itaconic acid, citraconic acid and/or anhydrides thereof); (D) from 1 to 40% w/w of at least one polyol; (E) optionally at least one monomer other than A to D—the total of A to E being 100%.

Abstract: There is provided a high temperature hybridized molecular functional group adhesion barrier coating for a composite structure. The coating has one or more hybridized molecular functional groups attached to a composite surface of the composite structure, wherein the one or more hybridized molecular functional groups are hybridized through a chemical derivatization process. The coating further has one or more chemical derivatization compounds attached to the one or more hybridized molecular functional groups via a condensation reaction. The coating is resistant to high heat temperatures in a range of from about 350 degrees Fahrenheit to about 2000 degrees Fahrenheit, and the coating is a thermally protective, toughened adhesion coating that mitigates effects of a hostile operating environment.

Abstract: Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.

Abstract: A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3?-bis(halophthalimide) of the formula from more than 17 wt. % to less than 85 wt. % of a 4,3?-bis(halophthalimide) of the formula and from more than 0 to less than 27 wt.

Abstract: A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3?-bis(halophthalimide) of the formula from more than 17 wt. % to less than 85 wt. % of a 4,3?-bis(halophthalimide) of the formula and from more than 0 wt. % to less than 27 wt. % of a 4,4?-bis(halophthalimide) of the formula wherein R is para-phenylene.

Abstract: The present invention relates to a liquid crystal alignment agent, a liquid crystal alignment film made by the liquid crystal alignment agent and a liquid crystal display element having the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer composition (A) and a solvent (B). The polymer composition (A) is synthesized by reacting a mixture that includes a tetracarboxylic dianhydride component (a) and a diamine component (b). The aforementioned liquid crystal alignment agent has a better process stability, and the liquid crystal alignment film made by the liquid crystal alignment agent could improve the reliability of the liquid crystal display element.

Abstract: A polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, from more than 45 to less than 75 weight percent of a 3,3?-bis(halophthalimide), less than 10 weight percent of a 3,4?-bis(halophthalimide), and from more than 45 to less than 75 weight percent of a (4,4?-bis(halophthalimide.

Abstract: A liquid crystal display device includes a first substrate, a first alignment layer on the first substrate, a second substrate facing the first substrate, a second alignment layer on the second substrate, and a liquid crystal layer between the first substrate and the second substrate and including liquid crystal molecules. The first alignment layer and the second alignment layer include a polymer including at least of polyamic acid, polyimide, and a combination including at least one of the foregoing polymers, and a compound including an epoxy cross-linker represented by Chemical Formula 1.

Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.

Abstract: A liquid crystal display device includes: a pair of substrates at least one of which is transparent; a liquid crystal layer disposed between the pair of substrates; an electrode group formed on at least one substrate of the pair of substrates, for applying an electric field to the liquid crystal layer; a plurality of active elements connected to the electrode group; and a liquid crystal alignment film disposed on at least one substrate of the pair of substrates, in which the liquid crystal alignment film, which is formed by a photo-alignment process, contains polyimide formed using tetracarboxylic acid dianhydride and/or diamine each having a specific chemical structure.

Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), ? represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: The present invention relates to semiaromatic semicrystalline thermoplastic copolyimides obtained by polymerization of at least: (a) an aromatic compound comprising two anhydride functions and/or carboxylic acid and/or ester derivatives thereof; (b) a diamine of formula (I) NH2-R—NH2 in which R is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number X of carbon atoms, X being between 4 and 12; and (c) a diamine of formula (II) NH2-R?—NH2 in which R? is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number Y of carbon atoms, Y being between 10 and 20; it being understood that diamine (b) is different from diamine (c).

Abstract: The present invention relates to a liquid crystal alignment agent, a liquid crystal alignment film made by the liquid crystal alignment agent and a liquid crystal display element having the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer (A) and a solvent (B). The polymer (A) is synthesized by reacting a mixture that includes a tetracarboxylic dianhydride compound (a) and a diamine compound (b). According to the specific diamine compound (b) and an amount of the same, the aforementioned liquid crystal alignment agent has better pretilt angle stability.

Abstract: A pressure sensitive adhesive (PSA) comprising: (A) 50 to 99 weight percent (wt %) of a partially aromatic polyester comprising at least two hydroxyl groups per polymer chain and having a: (1) Storage modulus of >0.33 Megapascals (MPa) at 23° C., (2) Mn of 20,000 to 200,000 grams per mole (g/mol), and (3) Glass transition (Tg) temperature of ?60° C. to 20° C.; (B) 1 to 40 wt % of at least one of a plasticizer or tackifier; and (C) 0.1 to 10 wt % of a crosslinker with a functionality of >2.5; with the provisos that the PSA has a: (i) Tg of ?60° C. to 10° C.; (ii) Storage modulus of <0.33 MPa at 23° C.; (iii) Rubbery plateau in excess of its Tg; and (iv) Melt flow in excess of 70° C.

Abstract: Black polyimides polymer and a method of synthesizing the same have been developed. The black polyimide polymer includes at least one acid monomer, at least one diamino monomer and a solvent-soluble black dye. The acid and diamino monomers having been reacting in a solvent under suitable conditions to form a polyimide precursor polymer.

Abstract: A polyimide film includes a polyimide polymer forming a main molecular structure of the polyimide film, and polyimide particles present in the polyimide film at a weight ratio between about 15 wt % and 30 wt % of a total weight of the polyimide film, the polyimide particles having an average diameter between about 3 ?m and 8 ?m. The polyimide film can have a 60° gloss value equal to or smaller than 10, a haze equal to or higher than 90%, and a Young's modulus equal to or higher than 280 kgf/mm2. In some embodiments, methods of fabricating the polyimide film are also described.

Abstract: This invention relates to high hydrocarbon resistant chemically cross-linked aromatic polyimide polymers, membranes and methods for making and using these polymers and membranes. The high hydrocarbon resistant chemically cross-linked aromatic polyimide membrane described in the present invention comprises a plurality of repeating units of a first aromatic polyimide comprising hydroxyl groups cross-linked with a second aromatic polyimide comprising carboxylic acid groups via covalent ester bonds. These membranes exhibit high permeability and selectivity in separation of mixtures of gases and liquids.

Abstract: The present invention relates to a liquid crystal alignment agent, a liquid crystal alignment film made by the liquid crystal alignment agent and a liquid crystal display element having the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer composition (A) and a solvent (B). The polymer composition (A) is synthesized by reacting a mixture that includes a tetracarboxylic dianhydride component (a) and a diamine component (b). The aforementioned liquid crystal alignment agent has a better long-term printability.

Abstract: This disclosure relates to a process of purifying a polymer. The process includes (a) providing an organic solution containing a polyimide or polyamic ester in at least one polar, aprotic polymerization solvent; (b) adding at least one purification solvent to the organic solution to form a diluted organic solution, the at least one purification solvent is less polar than the at least one polymerization solvent and has a lower water solubility than the at least one polymerization solvent at 25° C.; (c) washing the diluted organic solution with water or an aqueous solution to obtain a washed organic solution; and (d) removing at least a portion of the at least one purification solvent in the washed organic solution to obtain a solution containing a purified polyimide or polyamic ester. This disclosure also relates to a process of preparing a film on a semiconductor substrate, as well as related purified polymer solutions, films, and articles.

Abstract: One-part thermosetting binder compositions are described that may include soy protein, a first crosslinking compound, and a second crosslinking compound different from the first crosslinking compound. Upon curing, the first and second crosslinking compounds covalently bond to each other and to the soy protein to form a thermoset binder. Also describe are fiber-containing products that include a plurality of fibers and a formaldehyde-free binder. The formaldehyde-free binder is formed from a one-part, thermosetting binder composition that includes soy protein, a first crosslinking compound, and a second crosslinking compound different from the first crosslinking compound. Upon curing, the first and second crosslinking compounds covalently bond to each other and to the soy protein to form a thermoset binder.