Abstract: A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.

Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: An aqueous dispersion based on an amorphous unsaturated polyester resin obtained by polycondensing a mixture of Dicidol isomers and one or more saturated and/or unsaturated dicarboxylic acids.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.

Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage. In a representative composition, 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 &mgr;m to approximately 180 &mgr;m and a number average diameter of approximately 0.1 &mgr;m to 15.00 &mgr;m and the average aspect ratio of which is greater than 3:1 is compounded with 100 parts by weight of semi-aromatic polyamide in which the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol % and the melting point of which is greater than 280° C.

Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

Abstract: A separating agent that serves as an optical resolution agent is composed of a novel, useful optically active polymer. The separating agent is obtained through anionic polymerization of a novel maleimide and serves to separate optically active compounds.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.

Abstract: Pastes containing flatting agents and/or texture additives, containing A) 5 to 30 wt. % of one or more thixotropic (meth)acrylic copolymers and/or one or more thixotropic polyesters B) 15 to 45 wt. % of one or more flatting and/or texturing agents, C) 30 to 65 wt. % of one or more organic solvents and optionally wetting and dispersing agents, rheology modifiers, catalysts and optionally further additives and auxiliaries, wherein the proportions of components A), B) and C) add up to 100 wt. % and the weight ratio of thixotropic (meth)acrylic copolymer and/or thixotropic polyester: flatting and/or texturing agents is 1:6 to 1:0.8.

Abstract: A molding composition of at least 50% by weight of a polyamine-polyamide copolymer obtained from 0.05 to 2.5% by weight of a polyamine having at least 4 nitrogen atoms and having a viscosity of at least 5 000 Pa•s at 250° C. and at a shear rate of 0.1 l/s, and having a viscosity ratio of at least 7 at 250° C., when the melt viscosities at shear rates of 0.1 l/s and 100 l/s are compared with one another, has high melt stiffness and is easy to cut, and performs well in blow molding.

Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.

Abstract: A latex emulsion that includes crosslinked polymeric microparticles dispersed in an aqueous continuous phase. The microparticles are prepared from a monomer mix of a crosslinking monomer, a monomer having hydrophilic functional groups, and one or more other monomers. Also disclosed is a thermosetting composition that includes a first reactant that has reactive functional groups; a curing agent that has at least two functional groups reactive with the functional groups of the first reactant; and the latex emulsion of crosslinked polymeric microparticles dispersed in an aqueous continuous phase. The thermosetting composition may be used to coat a substrate. The coating may be a multi-layer composite coating that includes a base coat layer deposited from a pigmented film-forming base coat composition containing the thermosetting composition; and a substantially pigment free top coat layer deposited over a portion of the base coat layer from a substantially pigment free top coat composition.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: A process for the production of polyamides is disclosed. In a first reaction step, suitable monomers such as caprolactam or an aliphatic aminocarboxylic acid are reacted with polyfunctional amines, which contain at least one secondary amino group, and/or with salts containing such amines and dicarboxylic acids. The reaction product is in a further process step undergoes solid phase post-condensation.

Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp(−3.48 &eegr;r)≦MFR≦3.25×104 exp(−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.

Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

Abstract: The invention concerns a polyamide comprising macromolecular chains having a star-shaped configuration, a method for making said polyamide and compositions comprising same. More particularly, the invention concerns a method for making a polyamide comprising linear macromolecular chains and star-shaped macromolecular chains with control of the star-shaped chain concentration in the polymer. Said control is obtained by using besides the polyfunctional polymers and amino acids or lactams a polyfunctional comonomer comprising either acid functions or amine functions. The resulting polyamide has optimal mechanical and rheological properties for improving the speed and quality of mould filling and producing mouldable compositions comprising high filler factors.

Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage.

Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units.

Abstract: An asymmetric support membrane can be prepared by using a phase separation method. The method includes immersing a polymer solvent solution into water. The polymer solution is made by dissolving 15 to 35% by weight of the polymer into a solvent that lets the polymer solution become a gel at a temperature of 0 to 50° C. The solution is then allowed to gel and brought into a final membrane form in water for phase separation and formation of the asymmetric support membrane. The polymer may be poly(vinyl chloride), polyethersulfone, polyetherimide and polyamic(methylester). The solvent is &ggr;-butyrolactone alone as a major solvent or is a mixed solvent with N-methyl-2-pyrrolidone as a cosolvent. The asymmetric support membrane is a porous support membrane of a sponge form having open pores that are connected to one another with a narrow pore size distribution. Thus, the asymmetric support membrane has an improved permeance and mechanical strength.

Abstract: An aqueous-based composition comprising an aqueous solution of the product formed of the combination of a polyamide-amic acid and a triamine, preferably wherein the polyamide-amic acid is prepared from trimellitic acid halide or its equivalent and an aromatic diamine comprising 4,4′-methylenedianiline.

Abstract: The present invention is directed to an aqueous dispersion of a polyester salt and polymeric vehicles which include the aqueous dispersions of a polyester salt. The polymeric vehicle is particularly effective for providing coating binders in cured primer coatings. The primer coating compositions are useful for multilayer paint coating films which have at least two layers of paint film including the cured primer coating composition film. The use of the primer polymeric vehicles of the present invention in conjunction with one or more additional overlaying top coating film layers provide a multiple layer coatings having improved adhesion and chip resistance.

Abstract: The present invention relates to aqueous polyurethane dispersions wherein the polyurethanes contain terminal hydrazide groups and correspond to the formula wherein the terminal, modified hydrazide groups are present in an amount of 1 to 25% by weight [calculated as C(O)—NH—NH—C(O), MW 84], based on the weight of the polyurethanes, and wherein X represents OR′ or NHR′, R represents the residue obtained by removing the isocyanate groups from an NCO prepolymer, R′ represents a group which is inert to Isocyanate groups under the conditions used to form the polyurethane of in formula I, R″ represents a divalent, linear or branched aliphatic group containing 2 to 10 carbon atoms, provided that there are at least two carbons between the oxygen atoms, wherein the aliphatic group may optionally be substituted by heteroatoms to form ether or ester groups, m is 0 or 1 and n is 2 to 4.

Abstract: The invention concerns a transparent polyamide alloy, produced by compounding it from 30-98% by weight of a transparent, amorphous, rigid and brittle polyamide A with at least 35 mole % cyclo-aliphatic diamine and a glass transition point of at least 150° C., and 2-70% by weight of a transparent, impact resistant polyamide B with at least 40-80 mole % of at least one long-chain polyamide-forming monomer, with more than 10 carbon atoms and at least 10 mole % terephthalic acid and a glass transition point of under 70° C.

Abstract: The present invention relates to aqueous polyurethane dispersions wherein the polyurethanes contain terminal hydrazide groups and correspond to the formula 1

Abstract: A process for preparing inherently light- and heat-stabilized polyamides comprises polymerizing in the presence of at least one triacetonediamine compound of the formula where R is hydrogen or hydrocarbyl having from 1 to 20 carbon atoms, preferably alkyl having from 1 to 18 carbon atoms, or benzyl.

Abstract: Polymer coating composition for a plastics substrate including a polymeric binder and an inert filler. The composition also includes polyamide epichlorohydrin and an ionic insolubilizing agent that is capable of reacting with the binder to render the binder insoluble in water.

Abstract: The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications.

Abstract: Polymer derivatives based upon polyalkyleneimine backbones having a color stabilizing-effective amount of their reactive amino functionalities substituted by either a carboxylic acid or an amino-protecting group such as urea, are disclosed. Methods for preparing said derivatives are also disclosed. Fiber lubricant compositions comprising said polymer derivatives, and the resistance to yellowing associated with such lubricants are disclosed. Also disclosed are methods for treating fibers using the polymer derivatives.

Abstract: The present invention relates to compounds containing modified hydrazide groups and corresponding to formula I wherein R represents the residue obtained by removing the isocyanate groups from a monomeric polyisocyanate, a polyisocyanate adduct or an NCO prepolymer, X represents OR′ or NHR′ and R′ represents a group which is inert to isocyanate groups under the conditions used to form the compound of formula I, R″ represents a divalent, linear or branched aliphatic group containing 2 to 10 carbon atoms, provided that there are at least two carbons between the oxygen atoms wherein the aliphatic group may optionally be substituted by heteroatoms to form ether or ester groups, and n is 2 to 6.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for the fabrication of composite parts via RTM and/or RI processes, were prepared, characterized and fabricated into moldings and carbon fiber reinforced composites and their mechanical properties were determined. These materials are particularly useful for the fabrication of structural composite components for aerospace applications. The method for making high performance resins for RTM and RI processes is a multi-faceted approach. It involves the preparation of a mixture of products from a combination of aromatic diamines and aromatic dianhydrides at relatively low calculated molecular weights (i.e. high stoichiometric offsets) and endcapping with latent reactive groups.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: Aqueous solutions or dispersions of binders for preparing aqueous coating materials are produced, including as an aqueous component water of reaction which is obtained during the condensation of alcohols with carboxylic acids.

Abstract: Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.

Abstract: A process for the preparation of an oligomeric polyimide comprises: mixing a tetracarboxylic acid, a dianhydride, a partially hydrolysed dianhydride or a mixture thereof with a diamine in a reaction medium comprising greater than 80% by weight water, and heating mixture in said reaction medium at a temperature above 100° C. for a time sufficient to form said oligomeric polyimide.

Abstract: A polyimide for optical communications, which is expressed by the formula (1) where R1 and R2 are independently selected from the group consisting of CF3, CCl3, unsubstituted aromatic ring group and halogenerated aromatic ring group; R3 and R4 are independently selected from the group consisting of Cl, F, I, Br, CF3, CCl3, unsubstituted aromatic ring group and halogenated aromatic ring group; and n is an integer from 1 to 39. The polyimides have a superior heat resistance, and can avoid the increase in optical absorption loss due to a refractive index increase and deterioration of adhesive and coating properties due to weak surface tension of a polyimide film. In addition, use of the polyimides as a material for a core layer of optical waveguides can expand the selection range of material for the cladding layer of the optical waveguide.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: The present invention provides a novel polyimide composition which includes a cinnamoyl group or a derived cinnamoyl group and has photo-reactivity and heat-reactivity inherent to the cinnamoyl group. Further, a novel diamine and an acid dianhydride according to the present invention are materials mainly used for preparing a novel polyimide composition having the cinnamoyl group or the derived cinnamoyl group in a main chain or a side chain.

Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp (−3.48 &eegr;r)≦MFR≦3.25×104 exp (−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.

Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4′-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.

Abstract: Dispersants that adsorb to hydrophobic particle surfaces in aqueous media are described. The dispersants comprise dendritic polymers having at least one ionizable moiety and at least one peripheral hydrophobic long chain hydrocarbon moiety. Dispersions and inks wherein the dispersant operates as a solitary or co-dispersant are also described.