Carboxylic Acid Contains Three Or More Acid Groups Or Derivative Thereof Patents (Class 524/600)
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Publication number: 20090317567Abstract: A cellulose ester film with Rth>0 nm comprising a cellulose ester having a total degree of substitution of at least 2.3 and a polymer X with a weight-average molecular weight of 500-100000 satisfying 30%?A?100%, wherein A indicates the polymerization ratio of a monomer whose homopolymer has a negative birefringence, is excellent in humidity stability and wet heat durability.Type: ApplicationFiled: June 19, 2009Publication date: December 24, 2009Applicant: FUJIFILM CORPORATIONInventors: Jun Takeda, Ryousuke Takada, Masaya Suzuki, Hiromichi Tachikawa
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Publication number: 20090318602Abstract: A method of making coatings, marking products and/or sealing products from a starting material including aggregate, includes the step of adding to a starting material a binder including at least one resin based on polymerized hydroxyacid derivatives as a non bituminous binder, as a non bituminous binder, the resin(s) being selected from: a) organic resins derived from an oil or a fat having a natural origin including monoglycerides and/or diglycerides, esterified with a poly(hydroxy acid), b) organic resins corresponding to lactic polyacid and polyol esters and/or mono- or polyhydroxylated polyacid esters, c) organic resins based on lactic polyacid or lactic polyacid derivatives such as corresponding esters thereof.Type: ApplicationFiled: June 19, 2009Publication date: December 24, 2009Applicant: COLASInventor: Christine Deneuvillers
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Publication number: 20090299003Abstract: Dendritic macroinitiator compositions are provided comprising a compound of the general formula, Fx-[G-n]-I, where F is the chain end functional group of the dendrimer, x is the number of chain end functional groups, G is the dendrimer, n is the generation number of the dendrimer, and I is the initiating group. Hybrid dendritic-linear copolymers made from these macroinitiator can act as highly efficient dispersing agents for a range of nanoparticles in matrix materials.Type: ApplicationFiled: May 29, 2008Publication date: December 3, 2009Inventors: Craig J. Hawker, Robert Vestberg, Nobuhiko Ueno
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Publication number: 20090269597Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.Type: ApplicationFiled: July 17, 2007Publication date: October 29, 2009Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Patent number: 7604754Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.Type: GrantFiled: November 19, 2007Date of Patent: October 20, 2009Assignee: E. I. du Pont de Nemours and CompanyInventor: John D. Summers
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Publication number: 20090246392Abstract: The present invention provides a polyamic acid composition in which carbon black with a pH value approximately 7 or less is dispersed in a solution comprising a polyamic acid represented by Formula (1) having amino groups at molecular terminal ends thereof, and a solvent. In Formula (1), R1 represents a tetravalent organic group, R2 represents a divalent organic group, and m represents an integer of 1 or more.Type: ApplicationFiled: October 31, 2008Publication date: October 1, 2009Applicant: FUJI XEROX CO., LTD.Inventor: Tsuyoshi MIYAMOTO
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Publication number: 20090162538Abstract: A composition for fixing wound items comprising A) 0 to 90 wt % of at least one ?, ?-unsaturated polyester and/or polyester imide resin based on at least one unsaturated mono-, di- or tricarboxylic acids and/or mono-, di- or tricarboxylic acid group containing molecules, at least one polyol and/or, in case of an unsaturated polyester imide, at least one imide having 5-membered cyclic imide moieties, B) 0.1 to 80 wt % of at least one inorganic and/or organic-inorganic hybrid component having functionalities to react with component A) and C), C) 2 to 80 wt % of at least one monomeric and/or oligomeric unsaturated component to react with component A) and B), and D) 0 to 15 wt % of customary additives, the wt % being based on the total weight of the composition. The composition provides excellent thermal transfer properties and a high level of electrical insulation properties with excellent adhesion and thermal stability.Type: ApplicationFiled: December 3, 2008Publication date: June 25, 2009Inventors: Frank-Rainer Boehm, Michael Herm, Murat Gueltekin, Barbara Trappmann
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Publication number: 20090143521Abstract: A polyimide material comprises a polyimide. The polyimide has repeating units of formula (I). The polyimide material further comprises a coupling agent-containing filler. A method for preparing a polyimide material comprises allowing a mixture comprising an aromatic tetracarboxylic dianhydride, an aromatic diamine, and a coupling agent-containing filler to react to produce a polyamic acid. The method further comprises contacting the polyamic acid with an aliphatic dicarboxylic acid of formula (II) to produce an intermediate, and imidizing the intermediate to produce the polyimide material. A polyimide comprises repeating units of formula (I).Type: ApplicationFiled: August 5, 2008Publication date: June 4, 2009Inventors: Qiang Li, Chengzhang Li, Lin Jiang
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Publication number: 20090137735Abstract: This invention relates to thermoplastic article having one or more decorative materials embedded therein which is obtained by applying heat and pressure to one or more laminates wherein at least one of said laminates comprises, in order, (1) an upper sheet material; (2) one or more decorative materials; and (3) a lower sheet material; wherein the upper and lower sheet materials are formed from a polyester/aromatic polycarbonate blend wherein the thermoplastic article comprises at least one polyester composition comprising at least one polyester which comprises terephthalic acid and 2,2,4,4-tetramethyl-1,3-cyclobutanediol.Type: ApplicationFiled: February 4, 2009Publication date: May 28, 2009Applicant: Eastman Chemical CompanyInventors: Emmett Dudley Crawford, David Scott Porter, Gary Wayne Connell
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Publication number: 20090130041Abstract: A composition comprising (a) a resin composition comprising a block copolymer of the formula hydrocarbon-polyether-polyamide-polyether-hydrocarbon; and (b) a polar liquid. The block copolymer may be prepared by a process comprising reacting together reactants comprising dimer acid, diamine, and a polyether having termination at one end selected from amine, hydroxyl and carboxyl, and termination at another end selected from hydrocarbons. The polar liquid may be one or more of an aromatic liquid, a polar aprotic liquid, a ketone-containing liquid, an ester-containing liquid, an ether-containing liquid, an amide-containing liquid and a sulfoxide-containing liquid. The composition may be a gel at room temperature.Type: ApplicationFiled: January 26, 2009Publication date: May 21, 2009Inventors: Richard C. MacQueen, Mark S. Pavlin
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Patent number: 7524891Abstract: The rate of degradation of polymers and polymer blends containing (poly) lactic acid can be increased and controlled by the inclusion of up to 10% (typically less than 1%) by weight of specific additives such as lauric acid or a derivative thereof such as the anhydride.Type: GrantFiled: July 3, 2002Date of Patent: April 28, 2009Assignee: Smith & Nephew PLCInventors: John Rose, Steven Hardwick
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Publication number: 20090104439Abstract: In the production process of a cellulose ester film, fine particles are added in the step of dissolving a cellulose ester resin in a main solvent at a temperature at or below the boiling point of the main solvent under the atmospheric pressure, and, after the addition, mixing is carried out at a temperature at or above the boiling point of the main solvent. Preferably, the mixing is carried out in a temperature range of the boiling temperature of the main solvent to a temperature of (boiling point of the main solvent+50° C.) for not less than 60 min and not more than 300 min.Type: ApplicationFiled: March 7, 2007Publication date: April 23, 2009Inventor: Hideo Sugimoto
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Publication number: 20090099301Abstract: The present invention relates to crosslinked polymeric nanospheres having a star-shaped structure of the core-branch type, in which the branches are of a hydrophilic nature and the core is of a polymeric, crosslinked, hydrophobic nature and forms the imprint of all or at least part of a target molecule and to a process for preparing them.Type: ApplicationFiled: March 22, 2007Publication date: April 16, 2009Applicant: POLYINTELLInventors: Kaynoush Naraghi, Sami Bayoudh, Michel Arotcarena
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Publication number: 20090092831Abstract: Carbon fibers and carbon fiber yarn consisting of carbon fibers, the fibers having been pretreated by electrochemical oxidation, characterized in that they have a finish consisting of epoxy resin(s), a vinyl component, and a plasticizer in an amount of 0.3 to 5 wt. % relative to the carbon fibers, which are to be provided with the finish.Type: ApplicationFiled: April 19, 2007Publication date: April 9, 2009Applicant: TOHO TENAX EUROPE GMBHInventors: Silke Stusgen, Bernd Wohlmann, Matthias Schubert
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Publication number: 20090026425Abstract: The invention provides a composition comprising a polyester amide acid (A) obtained by reacting a tetracarboxylic dianhydride (a1), a diamine (a2) and a multivalent hydroxy compound (a3); a pigment (B); and an epoxy resin (C), which is most suitable for an ink-jet ink composition for a color filter.Type: ApplicationFiled: July 25, 2008Publication date: January 29, 2009Applicant: CHISSO CORPORATIONInventors: Hiroyuki SATOU, Yoshihiro DEYAMA, Akira YAMAUCHI
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Patent number: 7476339Abstract: A composite material including a thermoplastic polymer matrix and a non-carbonaceous resistivity modifier dispersed in the thermoplastic polymer matrix. The composite material has a surface resistivity of about 1.0×104 ohm/sq to about 1.0×1011 ohm/sq and at least a portion of a surface of the composite material has a surface roughness (Ra) not greater than about 500 nm.Type: GrantFiled: August 18, 2006Date of Patent: January 13, 2009Assignee: Saint-Gobain Ceramics & Plastics, Inc.Inventors: Pawel Czubarow, Gwo Swei, Oh-Hun Kwon
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Publication number: 20090005488Abstract: A heat resistant resin bonded grindstone is prepared by heating under pressure a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder, so that the diamond powder can be dispersed in and supported by a binder phase comprising the polyimide resin powder and the metal powder, in which the polyimide resin powder has been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3?,4,4?-biphenyltetracarboxylic acid or its dianhydride and 15 to 3 mol. % of 2,3,3?,4?-biphenyltetracarboxylic acid or its dianhydride.Type: ApplicationFiled: October 12, 2007Publication date: January 1, 2009Applicants: Shin-Nissan Diamond Tools Mfg. Co., Ltd., Ube Industries, Ltd.Inventors: Yoshiyuki Satow, Tatsuo Tsumiyama
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Publication number: 20090004832Abstract: A method of producing a printable composition comprises mixing a quantity of particulate semiconductor material with a quantity of a binder. The semiconductor material is typically nanoparticulate silicon with a particle size in the range from 5 nanometres to 10 microns. The binder is a self-polymerising material comprising a natural oil, or a derivative or synthetic analogue thereof. Preferably the binder comprises a natural polymer formed by auto-polymerisation of a precursor consisting of a natural oil, or its derivatives including pure unsaturated fatty acids, mono- and di-glycerides, or methyl and ethyl esters of the corresponding fatty acids. The method may include applying the printable composition to a substrate, in single or multiple layers, and allowing the printable composition to cure to define the component or conductor on the substrate.Type: ApplicationFiled: December 18, 2006Publication date: January 1, 2009Inventors: David Thomas Britton, Ekundare Ayodele Odo, Margit Harting
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Publication number: 20080305345Abstract: A coating composition suitable for protecting a substrate from abrasion. The coating composition comprises chlorosulfonated polyolefin, a monomer mixture and catalyst. The monomer mixture is made from (meth)acrylate monomers. The coating composition also acts as a sound deadener, an anti-slip coating, and an anti-wear coating. It can be applied to a variety of substrates especially on a truck bed as a bedliner.Type: ApplicationFiled: June 5, 2008Publication date: December 11, 2008Inventors: Peter William Uhlianuk, Daniel Lee Neumann
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Publication number: 20080299482Abstract: A method of manufacturing an aqueous dispersion of resin fine particles, including: a mixing step of mixing an aqueous medium, a resin having an acid group, a basic substance, and a surfactant to obtain a mixture; an emulsification step of applying a shearing force to the mixture while heating at temperature 10.0° C. or more higher than a softening temperature (Tm) of the resin having the acid group to obtain an emulsified product; and a cooling step of obtaining an aqueous dispersion of resin fine particles by cooling the emulsified product, in which, in the cooling step, cooling is carried out at a cooling rate of 0.5° C./min or more to 10.0° C./min or less to a glass transition temperature (Tg) of the resin having the acid group or lower while a shearing force is applied.Type: ApplicationFiled: July 24, 2008Publication date: December 4, 2008Applicant: CANON KABUSHIKI KAISHAInventors: Masayoshi Kato, Takayuki Toyoda, Takeshi Miyazaki
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Publication number: 20080275181Abstract: The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance.Type: ApplicationFiled: May 24, 2005Publication date: November 6, 2008Applicant: Sumitomo Electric Industries, LtdInventors: Maw Soe Win, Toshiyuki Goshima, Eika Kyo, Shintaro Nakajima, Noriki Hayashi, Tohru Kashiwagi, Kenji Miyazaki, Katsuya Yamada, Naoyuki Yamabayashi, Shoji Nakagama, Hiroshi Okuyama, Fumio Kasabo, Ippei Tanaka
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Patent number: 7442727Abstract: Pyrogenically prepared, surface modified aluminum oxide, having the following physical chemical properties: Surface area [m2/g] ?50 to 150 Tamped density [g/L] ?25 to 130 Drying loss [%] less than 5 Loss on ignition [%] 0.1 to 15? C content [%] 0.1 to 15? pH value 3 to 9 is prepared by treating pyrogenically prepared aluminum oxide with a surface modifying agent.Type: GrantFiled: June 4, 2003Date of Patent: October 28, 2008Assignee: Degussa AGInventors: Juergen Meyer, Manfred Ettlinger
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Publication number: 20080138537Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.Type: ApplicationFiled: August 3, 2005Publication date: June 12, 2008Inventors: Christopher Dennis Simone, Brian C. Auman, Peter Francis Carcia, Richard A. Wessel
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Publication number: 20080122915Abstract: An ink composition suitable for ink jet printing comprises a polymeric colorant in a carrier, the colorant containing at least one hydrophilic portion and at least one hydrophobic portion, wherein the composite log Kow of the polymeric colorant is more positive than ?0.7.Type: ApplicationFiled: August 24, 2006Publication date: May 29, 2008Inventor: Mihaela L. Madaras
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Patent number: 7345105Abstract: A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.Type: GrantFiled: December 18, 2003Date of Patent: March 18, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masachika Yoshino, Motoo Fukushima, Toshio Shiobara
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Publication number: 20070276086Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.Type: ApplicationFiled: October 5, 2006Publication date: November 29, 2007Inventors: Shu-Chu Shih, Charng-Shing Lu, Jinn-Shing King
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Patent number: 7285585Abstract: This invention provides processes for isolating particles from an emulsion including the steps of: (a) forming an emulsion having a solid component having a population of particles, a liquid component, and a first ionic forming compound, wherein the presence of the first ionic forming compound in the emulsion does not result in the coagulation of the population of particles contained therein; (b) obtaining a composition having a second ionic forming compound which, by itself, is not sufficient to result in the coagulation of the population of particles contained in the emulsion; and (c) mixing the emulsion and the composition having the second ionic compound such that the first ionic forming compound reacts with the second ionic forming compound to form a coagulating agent which results in the coagulation of the population of particles. The invention also provides processes for preparing a polymer matrix system using the aforementioned process for isolating particles from an emulsion.Type: GrantFiled: August 8, 2003Date of Patent: October 23, 2007Assignee: Rohm and Haas CompanyInventors: Robert William Coyle, Morris Christopher Wills
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Patent number: 7265197Abstract: A polymeric dispersant of the structure: wherein R1 is selected from the group consisting of H, CH3, and a combination thereof, and n is an integer from 4 to 200, for use in printing inks.Type: GrantFiled: December 5, 2003Date of Patent: September 4, 2007Assignee: Sun Chemical CorporationInventors: Gregory T. Huber, Niranjan Deo, Paul A. Merchak, Terence R. Chamberlain, Russell J. Schwartz
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Patent number: 7183352Abstract: The present invention relates to novel polyesterpolyols with cyclic imide structure and to their use in coating compositions.Type: GrantFiled: August 11, 2003Date of Patent: February 27, 2007Assignee: Bayer MaterialScience AGInventors: Christian Wamprecht, Hans-Gerd Van Treek, Raul Pires, Ulrich Freudenberg, Robert Reyer
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Patent number: 7160528Abstract: Polymerizable compositions that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group at a reaction temperature of 25° C.Type: GrantFiled: November 16, 2005Date of Patent: January 9, 2007Assignee: 3M Innovative Properties CompanyInventor: Richard P. Rusin
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Patent number: 7148307Abstract: The present invention relates to novel polyesterpolyols with cyclic imide and isocyanurate structure and to their use in coating compositions.Type: GrantFiled: August 11, 2003Date of Patent: December 12, 2006Assignee: Bayer AktiengesellschaftInventors: Christian Wamprecht, Raul Pires, Ulrich Freudenberg, Robert Reyer
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Patent number: 7129318Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.Type: GrantFiled: August 30, 2004Date of Patent: October 31, 2006Assignee: I.S.T. (MA) CorporationInventors: Gary L. Deets, Jianming Xiong
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Patent number: 7094826Abstract: An aqueous coating composition comprising a crosslinkable water-dispersible hyperbranched macromolecule(s) wherein the composition when drying has an open time of at least 20 minutes, a wet edge time of at least 10 minutes, a tack free time ?15 hours, a dust free time ?5 hours and an equilibrium viscosity of ?5,000 Pa·s at any solids content when drying in the range of from 20 to 55% by weight using any shear rate in the range of from 9±0.5 to 90±5 s?1 and at 23±2° C.Type: GrantFiled: October 11, 2001Date of Patent: August 22, 2006Assignee: DSM IP Assets B.V.Inventors: Emilio Martin, Gerardus Cornelis Overbeek, Pablo Steenwinkel, Ronald Tennebroek
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Patent number: 7053172Abstract: The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid which comprises a C4 to C20 ?,?-linear aliphatic dicarboxylic acid and at least one dicarboxylic acid selected from the group consisting of isophthalic acid and naphthalenedicarboxylic acid in a molar ratio of 30:70 to 95:5. The polyamide resin is excellent in not only fuel-barrier property and heat resistance, but also moldability and recyclability, and therefore suitably used as a barrier material of fuel containers.Type: GrantFiled: May 4, 2004Date of Patent: May 30, 2006Assignee: Mitsubishi Gas Chemical Co., Inc.Inventors: Kazunobu Sato, Kazunobu Maruo, Jun Mitadera, Masashi Kurokawa
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Patent number: 7026436Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.Type: GrantFiled: November 26, 2002Date of Patent: April 11, 2006Assignee: E.I. du Pont de Nemours and CompanyInventor: Kuppusamy Kanakarajan
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Patent number: 7008995Abstract: Carboxy resins of low equivalent weight per carboxyl group are synthesized by reacting a compound having two or more isocyanate groups with a compound having one hydroxyl group and two or more carboxyl groups. In a preferred embodiment, the compound having isocyanate groups is an isocyanurate derivative of a diisocyanate. The compound having isocyanate groups and the compound having one hydroxyl group and two or more carboxyl groups are reacted under conditions where reaction of carboxyl groups with isocyanate is substantially avoided. In another aspect of the invention, coating compositions are provided that contain in addition to the carboxy resin, a second component having a number of functional groups that are reactive with the carboxyl groups on the carboxy resin.Type: GrantFiled: September 27, 2001Date of Patent: March 7, 2006Assignee: BASF CorporationInventor: Sunitha Grandhee
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Patent number: 6984714Abstract: This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.Type: GrantFiled: April 23, 2003Date of Patent: January 10, 2006Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Kiwamu Tokuhisa, Hongyuan Wang
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Patent number: 6930165Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.Type: GrantFiled: June 15, 2001Date of Patent: August 16, 2005Assignee: Rhodia Engineering Plastics S.r.l.Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
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Patent number: 6919422Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.Type: GrantFiled: September 22, 2003Date of Patent: July 19, 2005Assignee: General Electric CompanyInventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
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Patent number: 6908983Abstract: The present invention contemplates a process for forming polyaminoamide polymers formed by the reaction of a dibasic acid/ester with excess amounts of an amine; the intermediate polymer resulting therefrom; a process for synthesizing effective, high solids resins resulting from the reaction of intermediate polymers with an epihalohydrin; and the resultant high, solids resin. These resins may be used as wet strength resins in the papermaking industry.Type: GrantFiled: April 1, 2003Date of Patent: June 21, 2005Assignee: Hercules CorporationInventor: William W. Maslanka
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Patent number: 6906165Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.Type: GrantFiled: August 7, 2001Date of Patent: June 14, 2005Assignee: Rhodia Engineering Palstics S.R.L.Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
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Patent number: 6887909Abstract: The present invention provides production processes of aqueous alkyd resin dispersions, said processes comprising a step of synthesizing alkyd resin by dissolving polyester resin whose chief component is terephthalic acid and which has been recovered from waste materials and regenerated, in a mixture of an alcoholic component, fatty acid and/or oil and fat, and polybasic acid component, said alcoholic component containing tri- or lower polyhydric alcohol and tetra- or higher hydric alcohol at a weight ratio of the former/latter within a range of 0-20, to effect depolymerizaiton and concurrently, esterification reaction; if necessary a step of introducing acid radicals into the resin; and a step of neutralizing and/or dispersing with use of surfactant, the so obtained alkyd resin in water. According to the processes of the present invention, aqueous alkyd resin dispersions can be prepared within a short time, using polyester resin which has been recovered from waste materials and regenerated.Type: GrantFiled: March 28, 2002Date of Patent: May 3, 2005Assignee: Kansai Paint Co., Ltd.Inventors: Chicara Kawamura, Kei Ito
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Patent number: 6884865Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.Type: GrantFiled: August 7, 2001Date of Patent: April 26, 2005Assignee: Rhodia Engineering Plastics S.R.L.Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
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Patent number: 6878800Abstract: Process for providing a binder for mineral fibers, comprising the steps of: mixing together under reactive conditions an amine and an anhydride whereby water is added thereto, once substantially all the anhydride is dissolved and/or reacted in the amine.Type: GrantFiled: July 3, 2001Date of Patent: April 12, 2005Assignee: Rockwool International A/SInventors: Thor Husemoen, Erling Lennart Hansen, Povl Nissen
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Patent number: 6864349Abstract: Polymerized fatty acid-based polyamides may be combined with low polarity and high polarity co-solvents to produce homogeneous water-in-oil emulsions. These emulsions have the appearance of white or translucent creams, with stiffnessranging from soft and greasy, to hard and able to support weight. These emulsions are stable in the presence or absence of surfactant, and are formed easily by mixing components with heat and then cooling. These emulsions are useful in applications favoring an oil base, such as skin creams and cosmetics with emulsions of low stiffness, and car polish with emulsions of greater stiffness.Type: GrantFiled: December 13, 2002Date of Patent: March 8, 2005Assignee: Arizona Chemical CompanyInventors: Mark S. Pavlin, Richard A. O'Brien
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Patent number: 6864354Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.Type: GrantFiled: June 15, 2001Date of Patent: March 8, 2005Assignee: Rhodia Engineering Plastics S.r.l.Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
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Patent number: 6852828Abstract: A poly amic acid precursor containing a combination of tetrahydrofuran and N-methylpyrrolidinone as cosolvents is described. Utilizing the combination of tetrahydrofuran and N-methylpyrrolidinone allows for the removal of significant portions of the solvent during the formation of the polyimide. The removal of tetrahydrofuran and N-methylpyrrolidinone can be done without the use of preheating zones so as to allow for the large scale production of polyimide articles.Type: GrantFiled: February 15, 2002Date of Patent: February 8, 2005Assignee: Medtronic, Inc.Inventor: Lisa Scott
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Patent number: 6849706Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.Type: GrantFiled: August 25, 2003Date of Patent: February 1, 2005Assignee: General Electric CompanyInventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
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Patent number: 6846856Abstract: A composite structure comprises an inorganic discrete phase, an organic matrix phase and an interfacial layer comprising both the inorganic and organic phases. In one process, the inorganic discrete phase is partially dissolved and the precipitated by a chemical reaction forming an interfacial layer having a finite thickness and transitioning from 100% inorganic to 100% organic.Type: GrantFiled: May 20, 2003Date of Patent: January 25, 2005Assignee: Innovative Construction and Building MaterialsInventors: David S. Soane, Christopher D. Tagge
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Patent number: 6841651Abstract: The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 ?, ?-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): 14000?a?40000??(A) b?1.000??(B) 0.9930?b?1.1a2×10?11+3.2a×10?7?0.9980??(C) wherein a and b are as defined in the disclosure.Type: GrantFiled: April 8, 2003Date of Patent: January 11, 2005Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kazunobu Maruo, Tomomichi Kanda, Koji Yamamoto