Abstract: An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided.

Abstract: An synthetic quartz composition having improved tensile strength, compression strength and bending strength comprising up to 90% quartz stone, from 5 to 90% quartz powder, from 0.1 to 20% resin, from 1 to 25% fiber, from 0.1 to 5% coupling agent, from 0.1 to 5% curing agent, up to 70% glass chip, up to 70% mirror chip, up to 5% pigment, up to 5% shell chip, and up to 5% metal flake, by weight, may be produced in panels and molded shapes such as containers.

Abstract: A resin composition includes brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0-20 wt %, high thermal conductivity powder of 5-85 wt % and a processing aid of 0-10 wt %. The resin composition possesses high glass transition temperature, high thermal conductivity, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract: The present invention relates to epoxy resin compositions and more particularly to providing methods for toughening such epoxy resin systems. The methods include mixing a liquid epoxy resin with a glycidyl terminated modifying polymer and copolymerizing the epoxy resin and glycidyl terminated modifying polymer such that a liquid or gel phase comprising the modifying polymer separates from a solidified epoxy polymer to form the epoxy polymer composite system.

Abstract: A vanish, a heat-dissipation prepreg, and the manufacturing method thereof are disclosed. The vanish has a curing agent with structure as indicated in formula (1). The vanish based on this curing agent will improve thermal stability and peel strength. Glass fabric cloth is dipped into the vanish having the curing agent to form a heat-dissipation prepreg with better thermal stability and peel strength. Furthermore, the curing agent has polarity so that inorganic powders are uniformly distributed in the prepreg. Therefore, the dissipation efficiency of the heat-dissipation prepreg is improved.

Abstract: An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Abstract: Provided are a heat-dissipating black resin composition having excellent physical properties such as heat-dissipation, workability, corrosion resistance, solvent resistance, coating adherence and gloss, and being free from chromium and used for surface treatment of a zinc coated steel sheet, a method for treating a zinc coated steel sheet, and a zinc coated steel sheet treated thereby. The composition includes, based on 100 parts by weight: 10 to 60 parts by weight of a resin composition which at least one main resin and a melamine-based curing agent are mixed in a weight ratio of 10:2-7, the main resin being selected from the group consisting of polyester, epoxy, polyolefin, polyurethane, fluorine, phenol, acryl and polycarbonate resins; 1 to 10 parts by weight of at least one pigment selected from the group consisting of carbon black and carbon nano tube; 1 to 10 parts by weight of a matting agent; and the balance of a solvent.

Abstract: A thermosetting composition comprising (a) 97 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; and (b) 3 to 60 percent by weight of at least one bisphenol, wherein the percent by weight refer to the total amount of components (a) and (b), with the proviso that (a) and (b) add up to 100 percent by weight; and (c) optionally other components. Cured products made from these compositions have valuable chemical, physical and mechanical properties.

Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).

Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.

Abstract: A sealing material is provided, upon mounting semiconductor devices and/or electronic components which are relatively weak on a circuit board, which shows sealing characteristics that enables itself to seal the semiconductor devices and/or electronic components and connections therebetween with low stress and high reliability; and suitable repairability that enables merely semiconductor devices and/or electronic components which were determined to be off-specification after being sealed to be repaired with ease. The sealing material contains at least (a) a heat-curable resin component and (b) a hardener component therefor, and is characterized in that, once the sealing material is cured by being heated, the cured material has a glass transition temperature (Tg) in a temperature range of from ?80° C. to 50° C.

Abstract: Coating compositions for producing hydrophobic or super-hydrophobic surfaces and olephobic or super-olephobic surfaces, and to processes for producing such surfaces. In particular, the present invention relates to hydrophobic or olephobic powder coatings and their use for transforming surfaces of articles into hard-to-wet and self-cleaning surfaces.

Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).

Abstract: There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-V?W?nY??(1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.

Abstract: Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.

Abstract: A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60?(2a+b)/(2a+2b+2c)?0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).

Abstract: A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm?2, preferably in the range 0.085 to 0.095 kNsm?2.

Abstract: A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part.

Abstract: Objective lens 10 as an optical element of the present invention exhibits excellent optical stability maintained for a long duration. Disclosed is a resin composition constituting the optical element contains a thermoplastic resin, a curable resin, and inorganic particles having an average particle diameter of 1-50 nm.

Abstract: A powder coating composition for coating substrates providing enhanced smoothness of the coatings suitable for vapor metal deposition, the composition comprising an intimate mixture comprising A) 50 to 99 wt % of at least one resin binder selected from the group consisting of polyester resins, epoxy resins, urethane resins, (meth)acrylic resins, silicone resins, fluorocarbon resins, phenolic resins B) 0 to 95 wt % of at least one cross-linking agent, C) 0.1 to 10 wt % of at least one opacifying agent, and D) 0.01 to 20 wt % of at least one coating additive, pigment and/or extender (filler), the wt % are based on the total weight of the powder coating composition; wherein the powder coating composition on curing forms a surface having excellent smoothness suitable for vapor metal deposition and provides a DOI smoothness measurement by an easy and an exacting working procedure.

Abstract: Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Abstract: According to the present invention, an aromatic polycarbonate resin composition comprising: a resin component (A) mainly comprising an aromatic polycarbonate; a reinforcing agent and/or a filler (B); and an aromatic sulfonic acid and/or an ester thereof (C), wherein a mixture consisting of said component (B) and said component (C) has a pH of 4 to 8 when measured in accordance with JIS-K5101, and said composition comprises 1 to 200 parts by weight of said component (B) and 0.001 to 5 parts by weight of said component (C) based on 100 parts by weight of said component (A) is provided.

Abstract: An adhesive film for semiconductor is disclosed. The present invention provides an adhesive film for semiconductor used in semiconductor packaging, comprising an adhesive layer, wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 ° C. Accordingly, the adhesive film for semiconductor according to the present invention may prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition, and also obtain higher reliability in use of the adhesive film in the semi-conductor packaging by controlling tackiness and adhesive force in an optimum condition.

Abstract: Provided is a polycarbonate resin composition which is excellent in flame retardancy and heat resistance, while being improved in fluidity and reduced in molding shrinkage rate. Specifically, provided is an aromatic polycarbonate resin composition containing 100 parts by mass of an aromatic polycarbonate resin (A) and 0.1 to 50 parts by mass of a cenosphere (B).

Abstract: An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.

Abstract: The present invention relates to a method of preparation of a water based epoxy resin curing agent in dispersion form which is formed by combining an amine-functional dispersion (A) with an amine-functional curing agent (B). The invention also relates to the curing agent obtained from said method, its use for curing two component water based epoxy systems, compositions obtained from such curing and various uses of the compositions obtained.

Abstract: There is provided an aromatic polycarbonate resin composition exhibiting excellent mechanical strength, transfer property, light transmittance, thermal stability and moldability which is capable of being molded into thin-wall products and large-size products, as well as a light guide plate produced from the resin composition. The present invention relates to an aromatic polycarbonate resin composition for light guide plates, comprising an aromatic polycarbonate resin having a viscosity-average molecular weight of 13,000 to 15,000, and a ratio of a weight-average molecular weight to a number-average molecular weight (Mw/Mn) of 1.5 to 2.7 in terms of polystyrene as measured by gel permeation chromatography; and a stabilizer and a releasing agent blended in the aromatic polycarbonate resin, as well as a light guide plate produced from the resin composition.

Abstract: A binder resin for an electrostatic image developing toner, obtained by polycondensation reaction of a polycarboxylic acid and a polyol, wherein the polycarboxylic acid comprises at least one of a compound represented by formula (1) and a compound represented by formula (2) in an amount of from 50 to 100 mol %, the polyol comprises a compound represented by formula (3) in an amount of from 50 to 100 mol %, and a content of a catalyst-originated metal element in the resin is 100 ppm or less: R1OOCA1mB1nA1lCOOR1???(1) (wherein A1 is a methylene group, B1 is an aromatic hydrocarbon group, R1 and R1? each is a hydrogen atom or a monovalent hydrocarbon group, 1?m+1?12, and 1?n?3); R2OOCA2pB2qA2rCOOR2???(2) (wherein A2 is a methylene group, B2 is an alicyclic hydrocarbon group, R2 and R2? each is a hydrogen atom or a monovalent hydrocarbon group, 0?p?6, 0?r?6, and 1?q?3); HOXhYjXkOH??(3) (wherein X is an alkylene oxide group, Y is a bisphenol structure group, 1?h+k?10, and 1?j?3).

Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.

Abstract: A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin.

Abstract: A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.

Abstract: The present invention relates to a coating composition that can form a coating film with excellent oxygen barrier properties. An object of the invention is to provide a coated article having excellent corrosion resistance using the coating composition. The present invention provides a coating composition comprising: a modified epoxy resin (A) containing a benzene diether structure represented by a specific formula (1), which is obtained by reacting diglycidyl ether (a1) with at least one phenol (a2) selected from resorcinol, hydroquinone, and catechol; and a crosslinking agent (B).

Abstract: A polycarbonate such as aliphatic/aromatic polycarbonate comprises repeating structural carbonate units of the formula (H-1): in which Rh is a radical having the formula (H-2): wherein each of R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, and R28 is independently a hydrogen, a C1-C6 alkyl group, or a halogen substituted C1-C6 alkyl group. The polycarbonate, and a thermoplastic composition thereof, have improved thermal stability, cost-effectiveness, and exhibit improved manufacturability such as, for example, minimum cyclic carbonate formation and minimum amine acceptor requirement.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin.

Abstract: There is provided a resin composition that is excellent in thermal stability, light reflectivity and color, and preferably in flame retardancy. There is also provided a method for producing a resin composition which comprises mixing 60 to 99.9 parts by weight of polycarbonate resin (component A) with 0.1 to 40 parts by weight of titanium dioxide pigment (component B), the component B (i) satisfying 0.05?(b)?(a)?0.6, when weight reduction at 23 to 100° C. by thermogravimetric analysis (TGA) is (a) wt % and weight reduction at 23 to 300° C. by TGA is (b) wt %, and (ii) satisfying 0.001?(d)/(c)?0.01 and 0.001?(e)/(c)?0.02, when weight percentages derived from Ti, Al and Si elements in X-ray fluorescence analysis are (c) wt %, (d) wt % and (e) wt %, respectively.

Abstract: A binder resin for an electrostatic image developing toner is obtained by a polycondensation reaction of a polycarboxylic acid and a polyol, wherein the polycarboxylic acid includes a compound represented by at least one of formula (1) and formula (2) as defined in the specification in an amount of from about 50 to about 100 mol %; the polyol includes a compound represented by formula (3) as defined in the specification in an amount of from about 10 to about 100 mol %; and a content of a catalyst-originated metal element in the binder resin is about 100 ppm or less R1OOCA1mB1nA1lCOOR1???(1) R2OOCA2pB2qA2rCOOR2???(2) HOXh-Ph-Y-Ph-XkOH ??(3).

Abstract: Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.

Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

Abstract: The invention relates to a molding composition for producing casting molds for the foundry industry, comprising at least: a refractory mold material; a binder for curing the molding composition; a proportion of a borosilicate glass. The invention further relates to a process for producing a molding from the molding composition of the invention, the corresponding casting mold or the corresponding molding and also their use in metal casting.

Abstract: Crude oils, especially heavy crude oils that are subject to instability on storage or during transportation can be treated with additives in order to stabilizer the crude oil in regard to precipitating contaminants such as asphaltenes. Alkylphenol resins with at least a second component selected from the group consisting of a fatty acid amides, mannich resins and mixtures thereof are effective additives for stabilizing crude oils.

Abstract: The present invention provides a light diffusing polycarbonate resin composition including a polycarbonate resin containing a polycarbonate copolymer which comprises a repeating unit represented by the general formula (I) shown below and a repeating unit represented by the general formula (II) shown below, which has a content of the repeating units of the general formula (II) of 1 to 30% by mass and which has a viscosity value of 30 to 71, and (B) a light diffusing agent compounded therein in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the polycarbonate resin. The light diffusing polycarbonate resin composition and a light diffusing plate thereof show improved fluidity during molding and have excellent heat resistance, dimensional stability, luminance and color tone.

Abstract: The present invention is directed to a printable composition, comprising: 0.5 to 60 wt % of a polymer selected from the group consisting of epoxy, Novolac and poly(dimethylglutarimide); and 40-99.5 wt % of a solvent composition comprising (1) a high boiling point solvent having a flash point greater than about 10° C. and a boiling point greater than about 130° C. and (2) a low boiling point solvent having a flash point less than 30° C. and a boiling point less than or equal to 130° C., all weight percents based on the total weight of the composition. The present invention is also directed to methods of forming patterned substrates using the above compositions. The compositions of the invention are useful for printing electronic materials onto a substrate using a piezo-electric printer.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

Abstract: The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition.

Abstract: The invention relates to a moulding composed of a plastics matrix composed of a transparent plastic, comprising a soluble fluorescent dye and a scattering agent whose refractive-index difference from the plastics matrix is +/? from 0.003 to 0.2, characterized in that a white pigment whose refractive-index difference from the plastics matrix is from +0.4 to 1.5 is also present, at a concentration of from 0.001 to 0.1% by weight.

Abstract: A polycarbonate composition is disclosed comprising a polycarbonate resin, a 3-hydroxychromone dye, and an ultraviolet absorber selected from the group consisting of cyanoacrylates, malonates, and oxanilides. The combination of the 3-hydroxychromone dye and ultraviolet absorber results in a composition with good color retention and strong initial fluorescent emission intensity.

Abstract: [Problems] To provide a high solid type anticorrosive coating composition excellent in drying properties during coating, and capable of forming a coating film having excellent oil resistance, solvent resistance, chemical resistance and anticorrosive properties. [Solving Means] A high solid type paint composition comprising (A) a main component containing a semi-solid state bisphenol type epoxy resin (a1) wherein the epoxy equivalent weight of the epoxy resin is 250 to 300, and (B) a curing component containing an epoxy adduct of xylylenediamine (b1) and an epoxy adduct of polyamide (b2), wherein the epoxy adduct of polyamide (b2) is contained at 50 to 200 parts by weight per 100 parts by weight of the epoxy adduct of xylylenediamine (b1).

Abstract: An object of the invention is to provide an electropeeling composition which, when attached two adhered members, has an enough bond strength and can be easily detached the adherend members following use. An electropeeling composition includes an ionic liquid.

Abstract: An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A): a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B): an epoxy resin; (C): an epoxy resin curing agent; (D): a filler; and (E): a solvent.