Abstract: An antipenetrating agent is to be added to a solvent ink for preventing penetration of the solvent ink into a medium to be printed. The antipenetrating agent includes inorganic fine particles and a resin soluble in an organic solvent.

Abstract: The present invention relates to a process for preparing 2-alkylpolyisobutenylphenols and their Mannich adducts, to compositions obtainable by this process and to their use.

Abstract: A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below.

Abstract: Problems: To provide an epoxy resin composition for prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, which does not generate toxic substance on combustion and excellent in ignition resistance, solder heat resistance after moisture absorption and high temperature rigidity, prepregs and multilayered printed wiring boards. Means for solving problems: A phosphorous compound comprising 1.8 or more but less than 3 phenolic hydroxyl groups on an average and 0.8 or more phosphorous atom on an average within a molecule is reacted in advance with a particular bifunctional epoxy resin (selected from biphenyl, naphthalene, dicylcopentadiene or other types) in a ratio of epoxy equivalent to phenolic hydroxyl equivalent to be 1.2 or more but less than 3 to 1 to yield a preliminarily reacted epoxy resin, of which 20% by mass to 55% by mass against the whole epoxy resin composition is formulated together with a multifunctional epoxy resin having 2.

Abstract: A water soluble polymer comprising a copolyhydroxyaminoether having side-chains of polyalkylene oxides, an aqueous solution of said polymer and process for preparing the copolyhydroxyaminoether.

Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH ??(1a) H-(E-X-E)l-OH ??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m— ??(2a) —(OCHRCH2)n— ??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).

Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH ??(1a) H-(E-X-E)l-OH ??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m— ??(2a) —(OCHRCH2)n— ??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).

Abstract: Disclosed herein are pigments comprising mostly rutile TiO2, wherein the mostly rutile TiO2 consists essentially of low abrasion TiO2 particles produced by introducing a metal halide into the chloride process. Further disclosed are ink, can coatings, fibers, papers, and plastics comprising the pigment. Also disclosed herein are pigments comprising the low abrasion TiO2 pigments comprising TiO2 particles which have been further heat treated at a temperature of at least about 800° C. in an oxidizing atmosphere for a time period of at least about 1 hour.

Abstract: Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a poly-ethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal of the excess polyethylene polyamine, and B) 99%-1% by weight of an adduct obtainable by reacting b1) a diamine or polyamine with b2) acrylonitrile and/or C) 99%-1% by weight of a polyaminoamide, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing mouldings and sheetlike structures, and also for applications in the adhesives and sealants sector and for epoxy-resin mortars.

Abstract: High-use temperature, lightweight polymer/inorganic nanocomposite materials are described having enhanced thermal stability and performance characteristics. These materials are made possible by new methods for synthesizing composite materials that enhance the thermal stability of the nanocomposite systems from 100-150° C. to over 450° C. These materials and techniques for their formation are enabled at least in part by the use of polar organic phthalonitrile monomers and oligomers that can exfoliate layered phyllosilicates, such as smectite clays, in percentages greater than 10% inorganic by weight. This approach offers a solvent-free direct melt intercalation technique that greatly reduces the cost of processing nanocomposites. Additionally, the use of unmodified phyllosilicates overcomes temperature limitations of prior art, which uses organically-modified layered silicates.

Abstract: An acrylic or other polymer composition, optionally containing aluminum trihydrate, and having undoped and/or doped titanium dioxide dispersed evenly throughout is disclosed. Said composition provides a sterile surface which can be renewed. Said composition provides a highly sterile surface upon photoactivation of the surface by at least either low-level ultraviolet irradiation or ambient/natural light (as when using doped titanium dioxide). A method of using such a surface material is also disclosed. Said acrylic or other polymer composition may be adhered onto a polycarbonate or other polymeric backing, optionally by an intervening layer of a third polymer. The resulting acrylic or other polymer/polycarbonate or other polymer combination is adapted to provide ambient lighting when exposed to a light source.

Abstract: A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y? represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y? may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

Abstract: The invention relates to aqueous, radiation-curable resins, to a process for preparing them, and to their use.

Abstract: A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability.

Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Abstract: The present invention relates to a matter composition, and a method for obtaining the same, comprising at least one fluid hardenable resin component and at least one toning component suitable for changing its colour or colour shade depending upon the kind of energy applied to the composition. The matter composition can be advantageously used as a building material or for covering building materials.

Abstract: A method of fabricating a thin film pattern improve the life of a blanket and reduce the cost and improve reliability in forming the thin film pattern. The method includes injecting an etch resist solution into a blanket on a printing roller, wherein the etch resist solution includes a printing solvent that satisfies the condition 6>?solvent or ?solvent>11, where ?solvent is the solubility parameter of the solvent, or satisfies the condition 6<?solvent<11 and ?<2(D), where ? is the dipole moment of the solvent; rotating the printing roller to uniformly coat the etch resist solution on the blanket; rolling the printing roller coated with the etch resist solution onto a printing plate to pattern the etch resist solution to thereby form an etch resist pattern; transferring the etch resist pattern from the printing roller to a substrate; hardening the etch resist pattern; and forming a desired thin film pattern on the substrate using the etch resist pattern.

Abstract: A novel composition-of-matter, method of manufacturing thereof, and applications thereof as an adhesive, in a wide variety of different fields, and in particular, in the health care fields of medicine, dentistry, and veterinary science, for use by health care providers, such as medical, dental, and veterinary, surgeons, in procedures for reattaching or repairing body parts or components thereof, such as tissue, of (human or animal) subjects, especially under wet conditions, for example, involving adhesion of wet surfaces. The composition is comprised of a cross-linked form of a water miscible polymer, and at least one phloroglucinol type compound selected from the group consisting of: phloroglucinol, a derivative of phloroglucinol, and a polymer synthetically prepared from phloroglucinol or a derivative of phloroglucinol. An exemplary water miscible polymer is a naturally existing, or synthetically prepared, salt form of the carbohydrate alginic acid, such as sodium alginate, or alginic acid itself.

Abstract: An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy resin of the present invention is represented by the following formula (1): (wherein n is 0.1 to 20 (the number is an average). The epoxy resin of the present invention can be produced by extending the chain of an epoxide of 4,4?-bisphenol F with 4,4?-biphenol.

Abstract: The present invention relates to a process for preparing a resin binder for toner, comprising the steps of (A) carrying out an addition polymerization reaction of addition polymerization resin monomers including styrene in the presence or absence of an organic solvent; and (B) mixing the resulting reaction mixture from the step (A) with water at a rate of 0.002 to 0.5 parts by weight based on 100 parts by weight of the addition polymerization resin monomers per minute at a temperature of 100° to 300° C. during and/or after the step (A), wherein the amount of water to be mixed in the step (B) is 0.1 to 50 parts by weight based on 100 parts by weight of the addition polymerization resin monomers. The resin binder for a toner obtained according to the present invention can be used, for instance, for developing electrostatic latent images formed in electrophotography, electrostatic recording method, electrostatic printing method, and the like, and a toner containing the resin binder.

Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.

Abstract: The present invention provides compositions such as a polymer grout, a molded plastic part, a void-filling plastic material, a concrete-anchoring material and a polymeric casting made from a thermosetting polymer chosen from vulcanized rubbers, polyoxybenzylmethylen-glycolanhydride (“Bakelite”), novolac resins, resole phenolic resins, duroplast, bismaleimide resins, polyimide resins, melamine, acrylic resins, polyester resins, cyanate ester resins, phenolic triazine resins, paracyclophane resins and epoxy resins and at least one phase change material (“PCM”). The compositions of the present invention have a lowered exotherm compared to compositions made from the same thermosetting polymer without the addition of a phase change material. Also provided are improved processes for producing the inventive compositions.

Abstract: A varnish composition for producing an electrically insulative thermoset coating is provided. The varnish composition includes poly(phenylene ether) having at least one end group having aliphatic unsaturation and a reactive solvent. When cured, the poly(phenylene ether) and reactive solvent form an electrically insulative thermoset.

Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components: (A) an epoxy resin; (C) an inorganic filler; (D) a curing accelerator of the general formula (1): (E) a radical initiator; (F) a compound having at least two maleimide group per molecule; and (G) a phenol compound having at least one alkenyl group per molecule.

Abstract: A composition containing a solvent and a soluble poly(arylene ether) copolymer is described. The poly(arylene ether) copolymer is the product of oxidative polymerization of monomers including a first monohydric phenol having identical substituents in the 2- and 6-positions, and a second monohydric phenol comprising ethylenic unsaturation and having different substituents in the 2- and 6-positions. The solvent may be a ketone, a dialkylamide, a dialkyl ether, an aromatic hydrocarbon, a chlorinated hydrocarbon, an alkyl alkanoate, an alkyl cyanide, a dialkyl sulfoxides, or a mixture thereof. The poly(arylene ether) has a solubility in the composition of at least 10 grams per kilogram of composition at 25° C.

Abstract: A composition containing a solvent and a soluble poly(arylene ether) copolymer is described. The poly(arylene ether) copolymer is the product of oxidative polymerization of monomers including a first monohydric phenol having identical substituents in the 2- and 6-positions, and a second monohydric phenol having different substituents in the 2- and 6-positions. The monomers are free of ethylenic unsaturation. The solvent may be a ketone, a dialkylamide, a dialkyl ether, an aromatic hydrocarbon, a chlorinated hydrocarbon, an alkyl alkanoate, an alkyl cyanide, a dialkyl sulfoxide, or a mixture thereof. The poly(arylene ether) has a solubility in the composition of at least 10 grams per kilogram of composition at 25° C.

Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Abstract: A method of preparing an antioxidant polymer includes forming or obtaining a first polymer having reactive pendant groups, where the first polymer does not include cyclic anhydride repeat units, and derivatizing the first polymer with an antioxidant. Another method of preparing an antioxidant polymer includes forming or obtaining a first polymer having reactive pendant groups and derivatizing the first polymer with an antioxidant, where the antioxidant is attached to the first polymer by an acetal, amide, amine, carbamate, carbonate, ester, ether or thioether linkage or by a carbon-carbon bond. The invention is also directed to polymers that are generally prepared by these methods, compositions that include such polymers and methods of using such polymers.

Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.

Abstract: Compositions including a base resin, a reinforcement and a modifier including a block copolymer for producing vesicles, spherical and/or cylindrical micelles and composites made therefrom.

Abstract: A poly(arylene ether) may be fractionated into higher and lower molecular weight fractions by forming a mixture that includes a poly(arylene ether) starting material, a first solvent that is dichloromethane, bromochloromethane, dibromomethane, or a mixture thereof, and a second solvent different from the first solvent having a Hildebrand solubility parameter of about 16 to about 22 megapascal1/2. The mixture separates into fractions containing higher and lower molecular weight poly(arylene ether)s.

Abstract: The invention relates to an improved system for inkjet printing which results in images with increased permanence as measured by transfer of color from the image when the image is subjected to mechanical and/or chemical abrasion. The invention provides a fusible material that may be combined with any or all of the color inks used to create the image, or it may be used as a colorless fluid applied pre- or post-printing. The permanence of images produced by the system are comparable to those produced by electrophotography. The invention also relates to a printing apparatus that contains a means for fusing the image using heat applied after the printed substrate is ejected from the printer.

Abstract: In the present invention, a novolac-type phenolic resin which does not require cold storage is used as a base resin for a resin pulley. To improve dimensional stability, strength, thermal shock resistance and abrasion resistance of the resin pulley, the pulley is formed with a resin composition containing the novolac-type phenolic resin, silica which is difficult to be abraded itself to be an abrasive powder and serves to grind and abrade dust with contact, and 5 to 20% by weight of alumina, harder than silica, having an average particle diameter of 5 ?m or larger.

Abstract: A solvent system for an ink including a nitro solvent; an ink further including a film-forming resin, a pigment or dye, and, optionally, a substrate wetting agent; and a marking instrument containing the ink, are disclosed.

Abstract: The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.

Abstract: A resin composition comprising a polyphenylene ether produced by polymerizing a monomer component consisting of 100 parts by weight of 2,6-dimethylphenol and 0.5 to 7.5 parts by weight of o-cresol in the presence of both a catalyst and an oxygen-containing gas and a flame retardant. When the polyphenylene ether has a molecular weight distribution of 2.8 to 8.0, the resulting resin composition is more excellent in flame retardance, particularly anti-dripping properties in burning. The resin composition is applicable to not only electric and electronic applications necessitating high flame retardance but also other fields of application of polyphenylene ether resins.

Abstract: An object of the present invention is to provide a low dielectric loss resin composition with a narrow molecular weight distribution, the resin composition suffering as low a dielectric loss as that of commercially available polyphenylenether, being soluble in a general-purpose solvent with a low boiling point, and being easily processed into a wiring board. The present invention provides a thermosetting low dielectric loss resin which is a random copolymer of polyphenylenether having an unsaturated bond in a side chain and which has a molecular weight distribution of less than 10, more preferably at most 5, particularly preferably at most 3, as well as the hardened resin, a resin composition and an electronic part containing the resin, and a synthesizing method for obtaining the resin.

Abstract: The object of the present invention is to provide a polycarbonate resin composition which has excellent transparency and durability against molding heat, which gives a molded article having an excellent mold release property, reduced strains, improved cracking resistance and, preferably, weatherability, and which is particularly suitable for a transparent member for a vehicle, pellets thereof and a molded article thereof, and the present invention provides a polycarbonate resin composition obtained by blending 100 parts by weight of a polycarbonate resin (Component A) and 0.005 to 2 parts by weight of a full ester (Component B) from an aliphatic polyhydric alcohol having 4 to 8 hydroxyl groups and 5 to 30 carbon atoms and an aliphatic carboxylic acid having 10 to 22 carbon atoms, said Component B having a 5% weight loss temperature, measured by TGA (thermogravimetric analysis), of 250 to 360° C. and having an acid value of 4 to 20, pellets thereof and a molded article thereof.

Abstract: A resin composition for improving adhesion with polyurethane foam is disclosed which comprises: (a) about 10 to about 80 percent by weight of at least one polyphenylene ether resin; (b) about 20 to about 70 percent by weight of at least one polyolefin polymer; (c) about 1 to about 20 percent by weight of at least one amine compound; and (d) 0 to about 4 percent by weight of at least one adhesion promoter, wherein all percentages are based on the weight of the entire composition. In preferred embodiments, the resin composition further comprises at least one member of the group consisting of polyphenylene ether-polyolefin copolymers, polystyrene-polyolefin copolymers, and polystyrene resins. Also disclosed herein is a method for improving adhesion between a resin composition and polyurethane foam.

Abstract: The present invention provides: a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending from 5 to 150 parts by weight of an inorganic filler in a flake form to 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent, or a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending a combination of an inorganic filler in a flake form and a fibrous reinforcing filler in a total amount of 5 to 150 parts by weight with 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent.

Abstract: In one embodiment, a colored polymeric resin composition, comprises: a polymeric resin; and a 1,8-diaminoanthraquinone derivative having a purity of greater than or equal to about 90 wt % and having a Formula (VIII): wherein R2–R7 are, individually, selected from the group consisting of a hydrogen atom, a hydroxyl group, an alkoxy group, an aryloxy group, an aliphatic group, an aromatic group, a heterocyclic group, a halogen atom, a cyano group, a nitro group, —COR9, —COOR9, —NR9R10, —NR10COR11, —NR10SO2R11, —CONR9R10, —CONHSO2R11, and —SO2NHCOR11; in which R9 and R10 are, individually, selected from the group consisting of a hydrogen atom, an aliphatic group, an aromatic group, and a heterocyclic group; wherein R11 is selected from the group consisting of an aliphatic group, an aromatic group, and a heterocyclic group; and wherein R is selected from the group consisting of hydrogen, an alkyl group containing 1 to 20 carbon atoms, a cycloalkyl group containing 3 to 20 carbon atoms, an allyl group containi

Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.

Abstract: There is provided a film comprising a layered silicate cation-exchanged with an organic cation and a polyester or polycarbonate. The organic cation is represented by the following formula (I): (R)n-L+??(I) wherein R is a group represented by the following formula (I-1): wherein R1 is a divalent hydrocarbon group having 5 to 20 carbon atoms, and R2 is a divalent hydrocarbon group having 1 to 20 carbon atoms, an alkyl group, an aryl group or an aralkyl group, L+ is an ammonium ion, a phosphonium ion or a hetero aromatic ion, and n is an integer of 1 to 4, with the proviso that when L+ is an ammonium ion or a phosphonium ion, n is 4 and four Rs may be the same or different. This film has the layered silicate highly dispersed therein and is excellent in various properties such as mechanical properties and dimensional stability.

Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Abstract: The present invention is directed to an ink composition resistant to solvent evaporation which may be employed for use in retractable permanent marker pens. Generally, the ink composition of the present invention comprises n-propanol, a pyrrolidone, a tryglyceride, a terpene phenolic resin, and at least one colorant to yield a detectable color when the ink composition is applied to a writable substrate. Additionally, the ink composition may further comprise at least one of polyether modified dimethylpolysiloxane copolymer and silicone glycol surfactant. Optionally, the ink composition may further comprise water.

Abstract: The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or average thickness (d) of not greater than 100 nm and an average aspect ratio (L/D) of not smaller than 5 as defined by the ratio of the average length (L) to said average diameter or average thickness (d).

Abstract: The invention relates to a polycarbonate resin composition, including (1) a colored composition that comprises two types of specifically-terminated aromatic polycarbonates along with an inorganic filler added thereto, (2) a composition that comprises a polycarbonate resin terminated with a specific phenoxy group, a functional group-having silicone compound and a core/shell-type grafted rubber-like elastomer, and (3) a composition that comprises a specifically-terminated aromatic polycarbonate-polyorganosiloxane copolymer, a specifically-terminated aromatic polycarbonate and a fibril-forming polytetrafluoroethylene.

Abstract: A polysulfone-based resin solution composition which is stable, contains no undissolved resin left in the liquid, shows neither thickening nor gelation, gives a smooth coating layer when spread on a base film and does not generate any harmful component, and a laminate which is produced by spreading and drying the same polysulfone-based resin solution composition on a base film surface. More specifically, a polysulfone-based resin solution composition prepared by dissolving at least one type of polysulfone-based resin in a mixed solvent composed of a lactone (A) or ketone (B) having an aromatic ring, and cycloketone (C) and aliphatic ketone (D) having a boiling point of 150° C. or lower, and a laminate which is produced by spreading and drying the same polysulfone-based resin solution composition on a base film surface.

Abstract: Method of compounding a multimodal polyethylene composition in a compounding device, wherein a) the total residence time of the polyethylene composition in the compounding device is at least 1.5 minutes, b) the total drive specific energy (SEC) applied on the polyethylene composition is from 0.270 to 0.460 kWh/kg, c) optionally, a specific cooling energy (SCC) of at most 0.200 kWh/kg is applied on the polyethylene composition, d) the total specific energy, which is the difference between the total drive specific energy SEC and any specific cooling energy SCC, applied on the polyethylene composition is from 0.220 to 0.330 kWh/kg.