Abstract: A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.

Abstract: An electrical device includes an electrical component that is at least partially covered by a covering material that includes a cement material. The covering material also includes particles having a first material and fibers having a second material. The first material and the second material each possess a higher coefficient of thermal conductivity than the cement of the cement material.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.

Abstract: Disclosed is a graft copolymer comprising an arylene-ether oligomer group having at least one polyolefin moiety bound thereto, wherein the arylene-ether oligomer has a number average molecular weight of less than 5,000 g/mole and the polyolefin has Mw of less than 10,000 g/mole. Also disclosed is a method to prepare a graft copolymer comprising reacting a neat or diluted arylene-ether oligomer with a vinyl or vinylidene-terminated polyolefin at a temperature of at least 80 or 100 or 120° C. to form heated reaction components; further reacting a Br?nsted acid or Lewis acid with the heated reaction components to form a polyolefin-arylene-ether oligomer.

Abstract: A poly(phenylene ether) composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene or a polyethylene, a low molecular weight polybutene, a flame retardant, a liquid ultraviolet absorbing agent, and a poly (alkylene oxide). The composition can be useful as an insulation or jacketing material for wires and cables, where the insulation and jacketing materials including the composition can have reduced surface blooming.

Abstract: The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.

Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Abstract: Provided is an ultraviolet-absorbing polycarbonate which exhibits excellent heat resistance as well as excellent weather resistance without showing a reduction in its performance or contaminating a processing facility during processing.

Abstract: Gel including a phase-change material and a gelling agent. In one embodiment, the phase-change material may be n-tetradecane, n-hexadecane or mixtures thereof. The gelling agent may be a high molecular weight styrene-ethylene-butylene-styrene (SEBS) triblock copolymer with a styrene:rubber ratio of about 30:70 to 33:67% by weight. To form the gel, the phase-change material and the gelling agent may be mixed at an elevated temperature relative to room temperature to partially, but not completely, dissolve the gelling agent. The mixture may then be cooled to room temperature. Alternatively, the phase-change material and the gelling agent may be mixed at room temperature, and the mixture may then be heated to form a viscoelastic liquid, which is then cooled to room temperature. The invention is also directed at a method of preparing the gel, a thermal exchange implement including the gel, and a method of preparing the thermal exchange implement.

Abstract: An encapsulation device includes: a fluid injection device that injects a first liquid forming a core; a liquid film holder that holds in film form a second liquid forming a shell containing the core; and a liquid contact device that makes the shell in contact with a third liquid, in which the first liquid is injected toward a liquid film of the second liquid retained by the liquid film holder to form a core, the core is wrapped with the second liquid on passing through the liquid film of the second liquid, thereby forming the shell, and the shell is made in contact with the third liquid to induce chemical reaction.

Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is ?R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.

Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.

Abstract: A thermoplastic composition comprises: a compatibilized blend of a poly(arylene ether), an aliphatic-aromatic polyamide and a polymeric compatibilizer; and an impact modifier; wherein the aliphatic-aromatic polyamide is composed of units derived from a dicarboxylic acid and units derived from a diamine and the units derived from a dicarboxylic acid comprise 60 to 100 mol % of units derived from terephthalic acid and the units derived from a diamine comprise 60 to 100 mol % of units derived from 1,9-nonanediamine, 2-methyl-1,8-octanediamine, or a combination of 1,9-nonanediamine and 2-methyl-1,8-octanediamine.

Abstract: A stabilizer composition comprising a phenyl acrylate compound or phosphite compound, and a sugar alcohol. A thermoplastic polymer composition comprising a phenyl acrylate compound or phosphite compound, and a sugar alcohol, wherein the total weight of the phenyl acrylate compound or phosphite compound, and the sugar alcohol is 0.001 to 3 parts by weight with respect to 100 parts by weight of the thermoplastic polymer.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: The masterbatch-type latent curing agent for epoxy resin comprised of (A) glycidyl ether type epoxy resin, (B) a fine particle of mixture containing (B-1) 50 to 99 mass % of adduct-modified amine obtained by reacting the glycidyl ether type epoxy resin with a polyamine compound and (B-2) 50 to 1 mass % of a phenol compound, (C) an active hydrogen compound and (D) an isocyanate compound; and a one-component curable epoxy resin composition containing the masterbatch-type latent curing agent and epoxy resin.

Abstract: A thermoplastic composition is prepared by melt blending a poly(arylene ether) and an other resin, where the poly(arylene ether) has a particular molecular weight distribution. The thermoplastic composition exhibits significantly increased melt flow compared to compositions containing poly(arylene ether)s with similar intrinsic viscosities but different molecular weight distributions. The increased melt flow facilitates preparation of the thermoplastic composition and subsequent article fabrication procedures.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Disclosed are random copoly(phosphonate carbonate)s with the high molecular weight and narrow molecular weight distribution exhibiting a superior combination of properties compared to prior art.

Abstract: The present invention relates to carbonate blend compositions demonstrating improved environmental stress crack resistance in combination with an excellent blend of impact, thermal, and physical properties. Said carbonate blend composition comprises a polycarbonate, a polyester, and a silicon-containing graft (co)polymer having a core-shell morphology, comprising a shell that contains (co)polymerized alkyl(meth)acrylate and glycidyl methacrylate grafted to a composite rubber core that contains polyorganosiloxane and poly(meth)alkyl acrylate components and methods to make said compositions.

Abstract: The present invention provides a crosslinking agent which is excellent in processing characteristics and crosslinking performance, and is capable of preventing staining of a molded product upon molding in a metal mold which tends to be induced when using the crosslinking agent together with a triallyl isocyanurate. The crosslinking agent of the present invention comprises an isocyanurate derivative represented by the following general formula (I): wherein R1 and R2 are each independently a hydrogen atom, a methyl group or an ethyl group; R4 to R13 are each independently a hydrogen atom or a methyl group; R3 is a hydrocarbon group having 1 to 3 carbon atoms which may have a substituent group; and n is an integer of 1 or 2.

Abstract: An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.

Abstract: An end-modified soluble polyfunctional vinyl aromatic copolymer, which is improved in heat resistance, thermal stability, solvent solubility, and compatibility with acrylate compounds, and a curable resin composition using the same are disclosed. The end-modified soluble polyfunctional vinyl aromatic copolymer is obtained by allowing a divinyl aromatic compound (a), a monovinyl aromatic compound (b), and an aromatic ether compound (c) to react with each other, and has, at an end, an end group derived from the aromatic ether compound and having an acrylate bond. The copolymer has a number average molecular weight Mn of 500 to 100,000, an introduction amount (c1) of the end group derived from the aromatic ether compound satisfies (c1)?1.0 (group/molecule), a molar fraction a? of a structural unit derived from the divinyl aromatic compound and a molar fraction b? of a structural unit derived from the monovinyl aromatic compound in the copolymer satisfy 0.05?a?/(a?+b?)?0.95.

Abstract: Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (—OH) are converted to HR1C?CR1—CH2—O— and/or H2R1C—CR1?HC—O—, where R1 is as described herein. Embodiments also include thermosettable compositions including the poly(allyl ether)s of polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions.

Abstract: There are provided a thermoplastic resin composition excellent in a balance between fluidity and low outgassing, and a molded product and a sheet including the thermoplastic resin composition. The thermoplastic resin composition may include from 70 to 99% by mass of (A) a polyphenylene ether, from 1 to 30% by mass of (B) a copolymer including an aromatic vinyl compound and an unsaturated dicarboximide derivative as constituent monomers, and from 0 to 20% by mass of (C) a copolymer including an aromatic vinyl compound and a cyanided vinyl compound as constituent monomers, based on 100% by mass of the total of the (A) component, the (B) component and the (C) component, wherein the (B) component has a weight-average molecular weight of from 70,000 to 250,000.

Abstract: Fiber reinforced epoxy resin composites are produced using a specific epoxy resin system. The epoxy resin system contains at least one polyglycidyl ether of a polyphenol. The system also contains a hardener that contains a mixture of aminocyclohexanealkylamine and polyalkylene polyamine hardeners. The ratio of epoxy resin groups to amine hydrogen groups is from 1.05 to 1.50. The epoxy resin system contains a tertiary amine catalyst such as a tertiaryaminophenol, a benzyl tertiary amine or an imidazole compound.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: The present invention relates to a polyamide curative composition comprising a reaction product (P) of (1) at least three compounds of formula H2NCH2CH2(NHCH2CH2)xNH2 with x=1 or higher with (2) a dimer fatty acid and (3) a carboxylic monoacid, with the proviso that the composition is free of tetrahydro-pyrimidine-containing compounds and free of piperazine-containing compounds and the proviso that the dimer fatty acid (2) building block of (P) contains less than 50% of non-cyclic dimer fatty acid isomers.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: A method of preparing a capped poly(arylene ether) resin includes reacting a capping agent with a blend of two or more poly(arylene ether) resins having different intrinsic viscosities. Cured compositions prepared from these capped poly(arylene ether) resins exhibit improved balances of stiffness, toughness, and dielectric properties compared to compositions with two or more separately capped and isolated poly(arylene ether) resins.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Abstract: The present invention provides a compound having a formula: where R1 is selected from the group consisting of alkyl, CH2(OC2H4)OCH3, and —(OC2H4)OCH3; n is 0-4; Olig is an oligomer having a formula: -L-O-PAGR.R2]q where L is a optional linker moiety selected from the group consisting of —CH2O—, —CH2OX—, —OX—, —C(O)—, —C(O)X, —NH—, —NHC(O)—, —XNHC(O)—, —NHC(O)X—, —C(O)NH—, —C(O)NHX—, and where X is alkyl1-6 or is not present, Y is N or O or is not present, and R3 is alkyl1-6; PAG is a linear or branched polyalkylene glycol moiety; R2 is an alkyl1-22 capping moiety if X is present or alkyl2-22 if X is not present; and q is a number from 1 to the maximum number of branches on PAG; and m is 1-5.

Abstract: A poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst has a monomodal molecular weight distribution with a reduced content of very high molecular weight species. It also exhibits increased morpholine incorporation in the high molecular weight fraction. Compared to commercially available poly(2,6-dimethyl-1,4-phenylene ether) prepared using a di-n-butylamine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits reduced odor. Compared to other poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits improved molecular weight build during compounding and improved compatibilization with polyamides.

Abstract: The present invention relates to a method for producing a cured product of a thermosetting resin composition, the method including: heating a thermosetting resin composition including the following ingredients (A) to (C) at a temperature of 100 to 200° C. for 1 to 60 minutes; and then further heating the thermosetting resin composition at a temperature of 220 to 350° C. for 10 to 6,000 minutes, thereby curing the thermosetting resin composition: (A) an allyletherified phenol resin; (B) an epoxy resin; and (C) a curing accelerator.

Abstract: Disclosed herein is a polymer composition comprising: a poly(arylene ether); a polyester; electrically conductive filler, and an impact modifier. The composition has a continuous phase comprising polyester and a disperse phase comprising poly(arylene ether). The amount of the disperse phase is less than 35 weight percent, based on the total weight of the composition.

Abstract: The present invention provides a coating system for an article including a first component having a surface in frictional engagement with a surface of a second component, wherein at least a portion of at least one surface of the component(s) is coated with a coating prepared from a composition including a first, curable organopolysiloxane comprising at least two alkenyl groups; and a second, curable organopolysiloxane comprising at least two polar groups, the second organopolysiloxane being different from the first organopolysiloxane, which can provide low breakloose force when used in syringe assemblies.

Abstract: Disclosed is a composition including a melt mixed blend including (a) 52 to 96.9 weight percent one or more copolyester thermoplastic elastomers; (b) 3 to 40 weight percent polyphenylene ether; and (c) 0.1 to 8 weight percent of polymeric toughener selected from the group consisting ethylene copolymers of the formula E/X/Y wherein: E is the radical formed from ethylene; X is selected from the group consisting of radicals formed from CH2?CH(R1)—C(O)—OR2 wherein R1 is H, CH3 or C2H5, and R2 is an alkyl group having 1-8 carbon atoms; vinyl acetate; and mixtures thereof; wherein X comprises 0 to 50 weight % of E/X/Y copolymer; and Y is a radical formed from glycidyl (meth)acrylate; and wherein the composition has one or more low temperature glass transition(s) between minus 100 and plus 150° C. Also disclosed are molded articles including the compositions, including CVJ boots and air ducts for automotive applications.

Abstract: A process for preparing a redistributed poly(phenylene ether), comprising reacting a poly(phenylene ether) in a reactive diluent monomer with a polyhydric phenol in the presence of a redistribution catalyst to form a composition comprising a redistributed poly(phenylene ether) in the reactive monomer diluent. The redistributed poly(phenylene ether) exhibits an intrinsic viscosity in the range of about 0.06 deciliters per gram to about 0.25 deciliters per gram, measured in chloroform at 25° C. The redistributed poly(phenylene ether) can be functionalized and admixed with unsaturated resin such as an unsaturated polyester resin or vinyl ester resin to obtain a varnish composition that, when cured, can form an electrically insulative thermoset.

Abstract: Compositions comprise phase separated polyetherimide/polyphenylene ether sulfone blends. The dispersed phase has an average cross sectional size of 0.1 to 10 micrometers. The composition retains has good hydrolytic stability and is capable of withstanding steam autoclaving at temperatures of 130 to 138° C.

Abstract: A poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst has a monomodal molecular weight distribution with a reduced content of very high molecular weight species. It also exhibits increased morpholine incorporation in the high molecular weight fraction. Compared to commercially available poly(2,6-dimethyl-1,4-phenylene ether) prepared using a di-n-butylamine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits reduced odor. Compared to other poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits improved molecular weight build during compounding and improved compatibilization with polyamides.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: A composition is disclosed comprising a styrenic first polymer, nanoclay, and an emulsifier compound, which can be blended with an additional polymer. A nanocomposite exhibits improved heat resistant properties and stiffness. In one embodiment, the additional polymer is poly(phenylene ether). An article and a method for the preparation a nanocomposite are also disclosed.

Abstract: An article comprising a paint film disposed on at least a portion of a thermoplastic section. The thermoplastic section is made of a thermoplastic composition. The thermoplastic composition has a compatibilized blend of a poly(arylene ether) and a polyamide, an electrically conductive carbon black, and an impact modifier. The electrically conductive carbon black has agglomerates and the agglomerates have an average agglomerate size greater than or equal to 30 square micrometers. The weight ratio of electrically conductive carbon black to polyamide is greater than or equal to 0.043.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Abstract: A process for preparing a redistributed poly(phenylene ether), comprising reacting a poly(phenylene ether) in a reactive diluent monomer with a polyhydric phenol in the presence of a redistribution catalyst to form a composition comprising a redistributed poly(phenylene ether) in the reactive monomer diluent. The redistributed poly(phenylene ether) exhibits an intrinsic viscosity in the range of about 0.06 deciliters per gram to about 0.25 deciliters per gram, measured in chloroform at 25° C. The redistributed poly(phenylene ether) can be functionalized and admixed with unsaturated resin such as an unsaturated polyester resin or vinyl ester resin to obtain a varnish composition that, when cured, can form an electrically insulative thermoset.

Abstract: A copolycarbonate; a copolycarbonate composition that contains the copolycarbonate and a polycarbonate resin; a polycarbonate base resin composition that contains the copolycarbonate and an acryl base resin; an optical molded article containing the copolycarbonate; a light guide plate containing the copolycarbonate; a lens containing the copolycarbonate; an optical molded article containing the copolycarbonate composition; a light guide plate containing the copolycarbonate composition; a lens containing the copolycarbonate composition; an optical molded article containing the polycarbonate base resin composition; a light guide plate containing the polycarbonate base resin composition; and an optical molded article containing the polycarbonate base resin composition.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.