Abstract: A modified polyphenylene ether resin is provided which is a product of the reaction of 100 parts by weight of (A) a polyphenylene ether having a main chain structure of the following formula (1): (wherein R1 and R4 each independently represents hydrogen, a primary or secondary lower alkyl, a phenyl, an aminoalkyl or a hydrocarbonoxy, and R2 and R3 each independently represents hydrogen, a primary or secondary lower alkyl or a phenyl), with 0.01 to 10.0 parts by weight of (B) a modifier selected from conjugated non-aromatic diene compounds, dienophilic compounds having one dienophile group and precursors of the diene or dienophilic compounds, wherein the number of rearrangement structures each represented by the following formula (2): (wherein R1, R2, R3, and R4 have the same meanings as defined above in the formula (1)) is less than 0.01 per 100 phenylene ether units of the formula (1).

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention relates to an optical film in which a photoelasticity coefficient is easily controlled according to the content of an aromatic based resin having a chain having the hydroxy group containing portion and aromatic moiety, a method for manufacturing the same, and an information electronic device comprising the optical film.

Abstract: A varnish composition for producing an electrically insulative thermoset coating is disclosed. The varnish composition includes a functionalized poly(phenylene ether) having at least one aliphatic unsaturated group and exhibiting an intrinsic viscosity in the range of about 0.06 to about 0.25 deciliter per gram, measured in chloroform at 25° C. The varnish composition further includes an unsaturated polyester resin or vinyl ester resin, a reactive liquid monomer, and a compatibilizing agent. When cured, the polymers and reactive liquid monomer form an electrically insulative thermoset.

Abstract: Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80).

Abstract: Capped poly(arylene ether)s are prepared by a method that includes reacting a poly(arylene ether) with a capping agent to form a capping reaction mixture, washing the capping reaction mixture with a concentrated basic aqueous solution, and isolating the capped poly(arylene ether) by a total isolation method. The washing method is effective for removal of capping-related impurities, and surprisingly does not result in decomposition of the capped poly(arylene ether).

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a polymer or monomer, or reactive with a nucleophilic group on a polymer or monomer at a slower rate than any leaving group. The invention also comprises polymers or monomers with nucleophilic groups capped with a triazine moiety. Still other embodiments of the invention comprise processes for capping nucleophilic groups in a polymer or monomer which comprises combining and reacting the polymer or monomer with a triazine-comprising capping agent.

Abstract: A core-shell particle including a core with poly(arylene ether) and a shell with an ethylenically unsaturated copolymer is described. Also described are a method of forming the particle, a composition including the particle, and an article including such a composition.

Abstract: In order to improve the mechanical strength after ageing, particularly in a wet medium, of an insulation product, especially a thermal and/or acoustic insulation product, based on mineral wool provided with a size, a latex is incorporated in the sizing composition which contains especially a phenolic resin. The presence of the latex allows the loss of mechanical performance after ageing to be very considerably reduced. The sizing composition advantageously comprises a latex based on an aqueous dispersion or emulsion of a polymer phase carrying hydrophilic functional groups. Application to the manufacture of insulation products intended to be exposed to atmospheric condensation and/or based on mineral wool of lower hydrolytic resistance.

Abstract: A vulcanizable rubber composition including an unsaturated rubber, core-shell particles, and a vulcanizing agent is described. The core-shell particles include a core with poly(arylene ether) and a shell with an ethylenically unsaturated copolymer. Also described are a vulcanized rubber composition and an article that includes it.

Abstract: Disclosed is a resin composition comprising 10 to 90 parts by weight of a mixture of two or more aromatic polyamides having different intrinsic viscosities [?] and 90 to 10 parts by weight of a polyphenylene ether, both relative to 100 parts by weight of the sum total of the aromatic polyamides and the polyphenylene ether. The resin composition is extremely useful for an automotive exterior panel (e.g., a car fender), an SMT-compatible part, a lamp-related part, and the like.

Abstract: Provided is a copolycarbonate which can meet a wide range of molding conditions as a raw material and which results in providing good optical molded articles. It is a copolycarbonate comprising repetitive units represented by the following Formulas (I) and (II), wherein a content of the repetitive unit represented by Formula (II) described below is 1 to 30 mass %, and a viscosity number is 30 to 71. In the formulas, R1 and R2 represent an alkyl group having 1 to 6 carbon atoms; X represents a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, a cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO2—, —O—, —CO— or the like; R3 and R4 represent an alkyl group having 1 to 3 carbon atoms; Y represents a linear or branched alkylene group having 2 to 15 carbon atoms; a to d each are an integer of 0 to 4; and n is an integer of 2 to 450.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The invention relates to aqueous, radiation-curable resins, to a process for preparing them, and to their use.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.

Abstract: A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplastic particles.

Abstract: The present invention can provide a resin composition comprising epoxy-modified polyphenylene ethers which show good solubility in MEK or acetone which has been conventionally used in a manufacturing process for printed boards of epoxy resins, and has high heat resistance originating from polyphenylene ethers. Specifically, the resin composition of the present invention contains (C) an epoxy-modified polyphenylene ether obtained by reacting (A) a polyphenylene ether having a content of volatile components of 0.1-5.0% by weight and a number of average molecular weight of 500 or more and less than 1.0×104 and (B) a cresol-novolac type epoxy resin at a modification ratio of component (A) of 5-95%, wherein (B?) a cresol-novolac type epoxy resin is contained in an amount of 10-900 parts by weight based on 100 parts by weight of the total of the reaction products (C), and (A?) a polyphenylene ether.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Abstract: A core-shell particle including a core with poly(arylene ether) and a shell with an ethylenically unsaturated copolymer is described. Also described are a method of forming the particle, a composition including the particle, and an article including such a composition.

Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Abstract: The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.

Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, and a nanofiller. Suitable nanofillers include, for example, carbon nanofibers and nanotubes, main group metal oxides, transition metal oxides, metal carbides, cermet materials, ceramics, glass, perovskites, layered inorganic materials, fibrillar inorganic materials, and combinations thereof. The nanofiller may, optionally, be rendered more organophilic by intercalation with neutral or ionic molecules. Methods of preparing and curing the composition, as well as uses for the cured composition, are described.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a polymer or monomer, or reactive with a nucleophilic group on a polymer or monomer at a slower rate than any leaving group. The invention also comprises polymers or monomers with nucleophilic groups capped with a triazine moiety. Still other embodiments of the invention comprise processes for capping nucleophilic groups in a polymer or monomer which comprises combining and reacting the polymer or monomer with a triazine-comprising capping agent.

Abstract: A curable composition includes a poly(arylene ether) and a fused alicyclic (meth)acrylate monomer. Also described are a method of preparing the composition, a cured composition derived from the curable composition, and an article comprising the cured composition. The composition is useful, for example, as a bulk molding compound.

Abstract: A thermoplastic composition includes a functionalized poly(arylene ether) and a copolymer of (a) ethylene or an ?-olefin, and (b) an alkyl(meth)acrylate. Optional components in the composition include an impact modifier and a flame retardant. The composition is useful for fabricating wire and cable insulation.

Abstract: A curable composition includes a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a polymeric additive selected from polystyrene, poly(styrene-maleic anhydride), poly(styrene-methyl methacrylate), polybutene, poly(ethylene-butylene), poly(vinyl ether), poly(vinyl acetate), and combinations thereof. Curable compositions comprising polybutene having a number average molecular weight of greater than or equal to 300 atomic mass units form sol-gels having sol-gel transition temperatures of greater than about 60° C. These sol-gel compositions also exhibit lower tack at ambient temperature.

Abstract: A composition comprises an impact modifier and a compatibilized blend of a poly(arylene ether) and an aliphatic-aromatic polyamide. The polyamide is composed of dicarboxylic acid units comprising 60 to 100 mol % of terephthalic acid units and diamine units comprising 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units. The polyamide has an amine end group content greater than 45 micromoles per gram of polyamide.

Abstract: A composition comprises greater than or equal to 20 weight percent glass fiber, based on the total weight of the composition, and a compatibilized blend of a poly(arylene ether) and an aliphatic-aromatic polyamide. The polyamide is composed of dicarboxylic acid units comprising 60 to 100 mol % of terephthalic acid units and diamine units comprising 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units. The polyamide has an amine end group content greater than 45 micromoles per gram of polyamide. The composition has a heat distortion temperature (HDT) greater than or equal to 230° C. when measured according to ASTM D 648 at 1.8 megapascals (MPa).

Abstract: A composition comprises two or more impact modifiers and a compatibilized blend of a poly(arylene ether) and an aliphatic-aromatic polyamide. The polyamide is composed of dicarboxylic acid units comprising 60 to 100 mol % of terephthalic acid units and diamine units comprising 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units. The polyamide has an amine end group content greater than 45 micromoles per gram of polyamide.

Abstract: A composition comprises an impact modifier and a compatibilized blend of a poly(arylene ether) and an aliphatic-aromatic polyamide. The polyamide is composed of dicarboxylic acid units comprising 60 to 100 mol % of terephthalic acid units and diamine units comprising 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units. The aliphatic-aromatic polyamide has a melt viscosity greater than or equal to 2000 Pa-s at a shear of 1000 second?1 and a temperature of 330° C. and the composition has a melt viscosity greater than or equal to 160 Pascal seconds (Pa-s) at a shear of 1500 second?1 (s?1) and a temperature of 330° C.

Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

Abstract: The present invention is concerned with cross-linked sulfonated polymers, eventually perfluorinated, and their preparation process. When molded in the form of membranes, the polymers are useful in electrochemical cells, in a chlorine-sodium electrolysis process, as separator in an electrochemical preparation or organic and inorganic compounds, as separators between an aqueous phase and an organic phase, or as catalyst for Diels-Alder additions, Friedel-Craft reactions, aldol concentrations, cationic polymerisation, esterification, and acetal formation.

Abstract: A conductive thermoplastic composition includes specific amounts of a polyphenylene ether copolymer, a polyamide, and an electrically conductive filler. The composition exhibits excellent high-temperature dimensional stability and impact strength, and it is particularly useful for molding automotive body panels that are subsequently electrostatically painted.

Abstract: The invention relates to a sulfonated polyetherketonketone (sPEKK), which is amorphous and/or which can be obtained by sulfonating amorphous PEKK. This sPEKK can be preferably produced by using a diphenyl ether and a benzenedicarboxylic acid derivate. Particularly preferred is the use of benzenedicarboxylic acid dichloride. The benzenedicarboxylic acid derivative is advantageously provided in the form of a mixture consisting of at least two different benzenedicarboxylic acid derivatives, in particular, an isophthalic acid derivative and a terephthalic acid derivative.

Abstract: A functionalized poly(arylene ether) having a pendant carbon—carbon double bond is prepared by reacting the hydroxy end group of a poly(arylene ether) with a polyisocyanate compound to produce a urethane-capped poly(arylene ether) having pendant isocyanate functionality, which is then reacted with a polyfunctional compound having a carbon—carbon double bond and a hydroxy, thiol, or amino group. The functionalized poly(arylene ether) is useful as a component of a curable composition in which its carbon—carbon double bond copolymerizes with one or more olefinically unsaturated comonomers.

Abstract: Use of a copolymer (A) preparable by free-radical polymerization of a) at least one olefinically unsaturated monomer and b) at least one olefinically unsaturated monomer different than the olefinically unsaturated monomer (a) and of the general formula I R1R2C?CR3R4??(I), in which the radicals R1, R2, R3 and R4, in each case independently of one another, are hydrogen atoms or substituted or unsubstituted alkyl, cycloalkyl, alkylcycloalkyl, cycloalkylalkyl, aryl, alkylaryl, cycloalkylaryl, arylalkyl or arylcycloalkyl radicals, with the proviso that at least two of the variables R1, R2, R3 and R4 are substituted or unsubstituted aryl, arylalkyl or arylcycloalkyl radicals, especially substituted or unsubstituted aryl radicals; in an aqueous medium for producing molding compounds and moldings.

Abstract: A screw for a multiple screw extruder comprises at least two conveying sections for transporting a composition comprising a polymeric resin from the feed end to the discharge end of the extruder; and at least two mixing sections comprising screw elements having two flights, wherein the ratio of the length to diameter ratio of the sum of the mixing sections to the length to diameter ratio of the screw is about 0.17 to about 0.5 and wherein the conveying sections are separated by at least one mixing section.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), and alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

Abstract: The invention relates to a method of forming a polyphenylene ether resin containing residual aliphatic unsaturation. A polyphenylene ether is reacted with a capping agent in a solvent to form the polyphenylene ether resin containing residual aliphatic unsaturation, which is precipitated from solution by combining the solution with an antisolvent. The precipitated polyphenylene ether resin containing residual aliphatic unsaturation has lower levels of residual impurities than the same compound isolated by devolatilization.

Abstract: A curable resin composition including a poly(arylene ether), an allylic monomer, and an acryloyl monomer may be formulated as a powder. The resin composition exhibits improved toughness, and it is useful in thermoset processing applications where use of powdered resins is preferred.

Abstract: A curable composition includes a functionalized poly(arylene ether); an alkenyl aromatic monomer; an acryloyl monomer; and a polymeric additive having a glass transition temperature less than or equal to 100° C. and a Young's modulus less than or equal to 1000 megapascals at 25° C. The polymeric additive is soluble in the combined functionalized poly(arylene ether), alkenyl aromatic monomer, and acryloyl monomer at a temperature less than or equal to 50° C. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.

Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Abstract: A process for manufacturing block polymer or copolymer from isotactic polypropylene. Polyolefins are introduced into an extruder. Free radical generator is mixed with the polyolefins to form a mixture at room temperature for free radical formation. The mixture is brought up to a temperature of between 175° C. to 220° C. Chain degradation of the polyolefins is induced by the free radical formation to form degraded polymer. Alkenically unsaturated monomers or polymer segments are mixed with the degraded polymer to form a second mixture. The temperature of the second mixture may be lowered to a temperature of between 90° C. to 150° C. The temperature of the second mixture is then adjusted to a temperature between 100° C. to 250° C. to form a novel block polymer or copolymer.

Abstract: A resin composite covered piping material is provided having high heat resistance and excellent flame retardation property, anti-corrosion property, chemical resistance, insulation property and sufficiently high adhesion property with steel material and moreover, is highly economical. The piping material having a covering layer of a resin composite wherein said resin composite comprises: (A) 10 to 80 weight percent of polyphenylene ether resin, (B) 10 to 80 weight percent of polystyrene polymer possessing syndiotactic structure, and (C) 10 to 80 weight percent of polystyrene resin other than component (B) wherein the total of (A), (B) and (C) is 100 weight percent. The resin composite described above may further contain an impact resistance improving agent (D) in a quantity of 1 to 50 parts by weight, with respect to the total of 100 parts by weight of components (A), (B) and (C).