Abstract: An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance.

Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.

Abstract: A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.

Abstract: The invention concerns a transparent polyamide alloy, produced by compounding it from 30-98% by weight of a transparent, amorphous, rigid and brittle polyamide A with at least 35 mole % cyclo-aliphatic diamine and a glass transition point of at least 150° C., and 2-70% by weight of a transparent, impact resistant polyamide B with at least 40-80 mole % of at least one long-chain polyamide-forming monomer, with more than 10 carbon atoms and at least 10 mole % terephthalic acid and a glass transition point of under 70° C.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.

Abstract: A high modulus, dimensionally stable film formed via an interpenetrating polyimide network of two polyimide structures, interlocked and bonded on a molecular level. The polyimide components are made from a dianhydride and a diamine. The dianhydrides used are tetravalent aromatic structures represented by where X is a divalent organic group selected from among —CO—, —O—, —S—, —SO2—, —CH2—, —C(CH3)2—, and —C(CF3)2— and diamines used are divalent aromatic structure represented by wherein Y is a divalent organic group selected from the group consisting of —CO—, —O—, —S—, —SO2—, —CH2—, —C(CH3)2—, and —C(CF3)2—. The end capping agent is a carboxylic anhydride or a silylating agent. The second polyimide is polymerized in the presence of the first polymer thus forming a single phase system.

Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.

Abstract: A pipe whose at least interior wall structural component is comprised of: I. from 40 to 80 parts by weight of a polyamide, and II. from 60 to 20 parts by weight of a flexible polymer whose main chains consist of carbon atoms, where the amounts of I and II in parts by weight total 100, the pipe being useful for the piping of aqueous, aqueous-alcoholic or purely alcoholic liquids.

Abstract: A method for preparing nylon 6 copolymer containing 5-sulfoisophthalate salts comonomer. The method includes the steps of reacting 5-sulfoisophthalate salts ester with aliphatic diamine in a molar ratio of 2˜20 at 160˜200° C., followed by completely removing the unreacted aliphatic diamine, to obtain the intermediate compound with terminal amine, 5-sulfobenzenediamide compound (formula III). Next, caprolactam and aliphatic diacid (formula IV) are reacted at 200˜260° C. to form an oligomer with a low molecular weight. 5-Sulfobenzenediamide (formula III) and catalyst are then added into the oligomer obtained in previous step to cause a polymerization reaction at 200˜280° C. to obtain nylon 6 copolymer containing 5-sulfoisophthalate salt comonomer. The molar ratio of E/C is 0.005˜0.150 and the molar ratio of D/E is 1.05-1.00. Compounds present in the water extract are greatly reduced.

Abstract: A hydraulic or pneumatic device is provided, which comprises a tube comprising a polyamide resin composition comprising (A) from 70 to 97% by weight, based on the weight of the polyamide resin composition, of a polyamide resin and (B) from 3 to 30% by weight, based on the weight of the polyamide resin composition, of a plasticizer comprising an ester of p- and/or o-hydroxybenzoic acid with a C12-C22 aliphatic alcohol having a branched chain and a component comprising a rubber compound comprising a polar rubber as a main component, and which exhibits a high reliability over an extended period of time.

Abstract: Golf balls having at least one layer formed from compositions including a polyamide a copolymer that lacks affinity for water formed from at least one dibasic acid and at least one diamine. The polyamide copolymer compositions may be mixed with ionomers or non-ionomers, including grafted or non-grafted metallocene catalyzed polymers.

Abstract: A combination of polymeric components provides desired characteristics in forming medical instruments such as catheters and balloons for dilatation catheters. For example, a balloon material is formed from a blend of polymeric components, including a first crystalline polymeric component and a second softening polymeric component. Where the first two components are generally incompatible, the balloon material can also include a third compatibilizing agent to facilitate blending the first two polymeric components together.

Abstract: Block copolymer comprising at least two kinds of polymer components each having a different structural unit in the polymer selected from polyamide, polyester, polycarbonate and polyarylate. The present block copolymer has a distinguished moldability and can be produced even from rework products or recycle products in a simple and economical manner.

Abstract: A method for producing a bridged polymer membrane includes the steps of: obtaining a liquid medium comprising a basic polymer having an amino group in a repeating unit, a bridging agent, and a solvent; shaping the liquid medium into a membrane configuration to obtain the shaped membrane; and bridging the basic polymer by the bridging agent in the shaped membrane. A fuel cell has the bridged polymer membrane. The mechanical strength of the polymer electrolyte membrane is improved.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: A joint to be adhered to nylon resin moldings includes a copolymerized nylon or a composition comprising a copolymerized nylon or a copolymerized nylon blend and at least one of a nucleating agent and a lubricant. A method for adhering nylon resin moldings includes, adhering nylon resin moldings to the joint using a solvent adhesive. The joint and the solvent adhesive enable formation of an effective adhesive layer.

Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.

Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.

Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

Abstract: Polyamide resin composition for fuse element consisting of 95-5% by mass of polyamide copolymer(A) and 5-95% by mass of polyamide homopolymer(B). Above-mentioned polyamide resin composition for fuse element, wherein a silicate layer(C) of swellable lamellar silicate is dispersed on molecular order level and the content of the silicate layer(C) is 0.1-20% by mass. A fuse element which has a housing and a pair of terminals projecting from the prescribed flat surface of the housing and standing in a parallel and accommodates a fuse-element connecting between the base ends of said two terminals in said housing, wherein the housing is made of said polyamide resin composition.

Abstract: The invention relates to a process for preparing a high-molecular polyamide or polyester by melt-mixing polyamide or polyester having a lower molecular weight with a carbonyl bislactam having formula 1, in which n=an integer of between 3 and 15. With the process according to the invention a permanent increase in the molecular weight of a polyamide is obtained within 2 minutes, whereas this takes at least 10 minutes under comparable conditions using a bislactam according to the state of the art.

Abstract: The invention provides a thermoplastic resin composition having excellent blister resistance, which does not cause blister on the surfaces of resinous parts by passing through a reflowing oven when the resin composition is used as a resin material forming the resinous parts subjected to the surface-mount technology system, particularly, a thermoplastic resin composition high in mechanical strength such as flexural strength, weld strength and tensile elongation and excellent in moldability and friction property.

Abstract: An electrically conductive thermoplastic composition with a superior ability to be heated rapidly in an electromagnetic field comprises a polyetherimide resin, a polyester resin, and electrically conductive filler. Such compositions display good dimensional stability at elevated temperatures especially when heated rapidly using electromagnetic radiation, which renders them useful in articles and operations where rapid assembly is important.

Abstract: Polyamine compositions for welding are provided, having excellent weldability, heat resistance, and hydrolysis resistance. Compositions of (A) an aromatic polyamide in which the molar fraction of aromatic monomers among the monomer components making up the polyamide is at least 0.2, and (B) an aliphatic polyamide, wherein the weight ratio of (A) and (B) is from 99:1 to 5:95 are described.

Abstract: A diaminobenzene derivative represented by the formula (1): 1

Abstract: Disclosed are a fatty acid esters composition of a polyglycerine containing more than 70% of a fatty acid monoester which is defined by a specified analysis method, a process for the preparation thereof, a process for the preparation of a highly-purified fatty acid esters composition of a polyglycerine, and a highly-purified fatty acid esters composition of a polyglycerine having an oxirane oxygen concentration of below 100 ppm which is defined by a specified analysis method. The fatty acid esters compositions of a polyglycerine are useful as additives for a variety of food-stuffs, additives for a variety of thermoplastic resins, and as additives for a variety of cosmetics or detergents.

Abstract: The invention concerns modified polyamides, and more particularly polyamides comprising units of the type obtained by reacting a diacid on a diamine, modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, as well as a very good surface appearance. The inventive modified polyamide is obtained by mixing in melted state polyamides of different types, in the presence of a multifunctional compound.

Abstract: A crystalline polyester having a number-average molecular weight of from 5000 to 10000, a weight-average molecular weight of from 150000 to 8000000, a maximum peak temperature of heat of fusion of from 60° to 150° C., and a ratio of a softening point to a maximum peak temperature of heat of fusion (softening point/peak temperature) of from 0.6 to 1.3. The crystalline polyester can be used as a resin binder for a toner used for developing electrostatic latent images formed in electrophotography, electrostatic recording method, electrostatic printing method, and the like.

Abstract: A polymer having a satisfactory balance between in vivo degradability and satisfactory mechanical properties, which is an A1BA2 type polymer comprising a segment A1 and a segment A2 each having a modified amino acid and a segment B consisting of polyethylene glycol with a number-average molecular weight of 8000 or higher bonded at one end to the segment A1 and at the other end to the segment A2, and has a number-average molecular weight of 10000 to 600000; an in vivo degradable material which comprises the polymer; and a film for preventing tissue adhesion, an artificial dura mater, a suture, an implant preparation, or a sustained-release drug base each comprising the degradable material.

Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.

Abstract: The present invention relates to a golf ball comprising a core layer, at least one intermediate layer, and a cover layer, wherein the core layer or the at least one intermediate layer are formed from compositions comprising a polyamide, in the form of a homopolymer, a copolymer, or mixtures thereof. The compositions comprise about 1 to about 99 weight percent of at least one nonionomer polymer and about 99 to about 1 weight percent of at least one polyamide polymer. The polyamides of the present invention comprise polyamides and polyamide copolymers, such as nylons, nylon copolymers, and nylon block copolymers. The nonionomer polymer comprises a nonionomer thermoplastic elastomer or a nonionomer thermoplastic.

Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.

Abstract: Core-shell tecto(dendrimers) useful in biomedicine, pharmaceuticals, personal care products, and in other ways analogous to the known uses for dendrimers, hypercomb branched polymers, and other dendritic polymers are the reaction product of a core dendritic polymer molecule having a plurality of terminal functional groups of a first type which are not reactive with each other, and a plurality of shell dendritic polymer molecules having a plurality of terminal functional groups of a second type which are not reactive with each other, but which are reactive with the terminal functional groups of the first type. Each of the shell dendritic polymer molecules is chemically bonded to the core dendritic polymer molecule by a reaction of at least one of the terminal functional groups of the second type with at least one of the terminal functional groups of the first type.

Abstract: Described is a film having at least a single layer and at least one copolyamide layer (I) containing dispersed nanoscale nucleating particles. Crystalline structures extending from the dispersed particle surfaces are formed after the layer (I) is cooled from a molten state at a cooling rate of from 10° C. to 20° C. per minute. The dispersed nanoscale nucleating particles are present in layer (I) in an amount of from 10 ppm to 2000 ppm, based on the total weight of layer (I). Also described is a method of using the film of the present invention in packaging foodstuffs.

Abstract: Thiol-linked polymeric prodrugs, methods of making and using the same are disclosed. The use of a sulfhydryl bond in combination with a benzyl elimination system results in the formation of prodrugs which can take advantage of plasma enzymes in vivo for regeneration of the parent molecule.

Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.

Abstract: The invention relates to a process for the production of a polyamide molded part from a polyamide composition comprising 0.01-5 wt. % polyamide-4.6 and 99.99-95 wt. % of a polyamide with a melting point that is lower than that of polyamide-4.6. The polyamide composition is obtained by mixing in the melt of a blend of granules of the polyamide with the low melting point (A) and a composition (B) of the polyamide-4.6 in the polyamide with the low melting point, the polyamide-4.6 content of (B) amounting to 2-50 wt. % and B having been obtained at a temperature above the melting point of polyamide-4.6. The polyamide with a low melting point is preferably polyamide-6. The process results in a permanent 15° C. increase in the crystallisation onset temperature of nylon-6. A 30% gain in cycle time relative to polyamide-6 nucleated with the aid of microtalc was realised for injection-molding of relatively large articles.

Abstract: Heat-sealable and formable polyamide laminating films with high temperature thermal stability. These properties permit the films to be used in monolayer structures, such as embossed laminates for high temperature insulating or cushioning applications. A multi-phase thermoplastic resin composition which may be used in the manufacture of heat formed embossed laminates which comprises at least one polyamide resin having a melting point greater than 200° C.; at least one polyamide resin having a melting point of less than 200° C., and the remainder comprises mainly ethylene polymers.

Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.

Abstract: An acid-dyeable polymer composition comprising (a) polymer and (b) polymeric additive comprising repeating units having the formula: 1

Abstract: The invention relates to a polyamide composition with improved flow behavior that comprises at least 80-99.5 wt. % of a high-molecular polyamide and 0.5-20 wt. % of a polyamide oligomer that has a melting point that is higher than the melting point of the high-molecular polyamide, the amounts being relative to the total weight of the polyamide present in the composition. The high-molecular polyamide is preferably PA-6 or PA-4,6/6 copolymer and the polyamide oligomer is preferably chosen from the group comprising PA-6,6, PA-4,6, PA-4,6/6 copolyamide or copolyamides or mixtures thereof.

Abstract: The present invention relates to a composition comprising, per 100 parts by weight:

Abstract: The invention relates to a condensation polymer, as well as to a process for preparation said polymers, having at least one dialkylamide endgroup connected through the polymer backbone to a unit derived from an alkylamide, the connection comprising at least one ester linkage. The polymer according to the invention can be linear or branched. The condensation polymers can be very widely used in technically different fields, both in thermosetting and in thermoplastic applications. The invention also relates to a composition comprising the condensation polymer according to the invention, an active substance and a polymer, as well as to a process for incorporating an active substance in an object comprising at least of a polymer composition, by bringing the object into contact with the active substance. More in particular, the invention relates to the dying of polymer fibres.

Abstract: A polyamide resin composition is provided, which has an excellent flowability upon molding and shows a high strength when subjected to various welding methods. The resin composition for use in molding comprises (A) 96 to 99.9% by weight of a crystalline polyamide resin and (B) 0.1 to 4% by weight of a non-crystalline, partially aromatic copolymerized polyamide resin containing at least two kinds of aromatic monomer components, with the total content of (A) and (B) being 100% by weight, or comprises (A), (B) and (C) 5 to 200 parts by weight of an inorganic filler per 100 parts by weight of sum of (A) and (B). The polyamide resin compositions show an excellent weld strength.

Abstract: A thermoplastic elastomer composition dynamically vulcanized to a gelation rate of 50 to 95% which is superior in heat resistance and durability while maintaining flexibility and superior in air permeation preventive property which can be efficiently used as, for example, a pneumatic tire as an air permeation preventive layer.

Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.

Abstract: Oxygen barrier polyamide compositions exhibiting high oxygen scavenging capability suitable for extended shelf-life, packaging applications. Thus a polyamide composition comprises a polyamide homopolymer, copolymer, or blends thereof, and at least one polyamide reactive, oxidizable polydiene or oxidizable polyether. The polyamide products are particularly suited to making barrier packaging articles such as monolayer or multi-layer films, sheets, thermoformed containers and coinjection/coextrusion blow molded bottles comprising PET, polyolefin or polycarbonate as structural layers. Such articles are useful in a variety of oxygen-sensitive food, beverage, pharmaceutical and health care product packaging applications.

Abstract: The present invention relates to copolymers containing polyamide blocks and polyether blocks based on ethoxylated primary amines, these copolymers having a melting point of between 80° C. and 135° C. and an MFI (melt flow index) of between 5 and 80 g/10 min (2.16 kg-150° C.). The invention also relates to adhesives of the HMA (or hot melt adhesive) type consisting of the above copolymers containing polyamide blocks and polyether blocks.

Abstract: A polyamide composition comprising 50 to 90 parts by weight of (A) semiaromatic polyamides having dicarboxylic acid units containing 60 to 100 mole % of terephthalic acid units and diamine units containing 60 to 100 mole %, in total, of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 50 to 10 parts by weight of (B) aliphatic polyamides in which the average of total carbon atoms of dicarboxylic acid units and diamine units per one amide group is 7 to 12; having excellent moldability, toughness, light-weightness, hot water and steam resistance, heat resistance, mechanical characteristics, low water absorption, chemical resistance and melt stability; and are applicable for molding at low temperature with a conventional steam-heating or a conventional hot-water-heating type mold to give molded articles having sufficient heat resistance, rigidity at high temperature and dimensional stability.

Abstract: Fiber reinforced thermoplastic blends of a at least one high melting crystalline polyamide containing at least one of polyetherimide or polysulfone resin having a high glass transition temperature provide molded parts with a high degree of flatness and dimensional stability. The fiber-reinforced resin composition has good load bearing capability at high heat and high mechanical strength compared to related fiber-reinforced polyamide compositions not containing the polyetherimide and polysulfone resin.