Mixed With Additional Polycarboxylic Acid And A Polyamine; Amino Carboxylic Acid Or Derivative; Polyamine Salt Of A Polycarboxylic Acid; Lactam; Or Polymer Derived Therefrom Patents (Class 525/432)
  • Patent number: 5516855
    Abstract: Copolymers comprising amide units and ester units are prepared by melt phase interchange of diaryl esters of dicarboxylic acids and diamines with dihydric alcohols and diesters of aromatic dicarboxylic acids. The products are tough resins, useful per se as molding compounds, and to compatibilize and toughen other thermoplastic polymers.
    Type: Grant
    Filed: July 27, 1995
    Date of Patent: May 14, 1996
    Assignee: General Electric Company
    Inventors: Donald C. Clagett, Daniel W. Fox, Louis M. Maresca, Sheldon J. Shafer
  • Patent number: 5512368
    Abstract: Disclosed herein are organic polymeric fibers containing inorganic whiskers. The fibers are made from polymers which are anisotropic. Such polymers include, for example, certain aramids and polybenzobisthiazoles. The physical properties of the fibers are improved, and are useful, for example, in ropes and composites.
    Type: Grant
    Filed: March 16, 1995
    Date of Patent: April 30, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Mark A. Harmer, Brian R. Phillips
  • Patent number: 5506311
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: November 3, 1994
    Date of Patent: April 9, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5504157
    Abstract: A homogeneous polymer blend is disclosed containing components A and B. Accordingly A is about 1 to 30% by weight of a rigid, rod-shaped polymer having a persistence length of at least 10 nm and a ratio of molecular length to molecular diameter of at least 30, and B) is about 70 to 99% by weight of a flexible polymer which contains at least one member selected from the group consisting of non-ionic polar groups, ionic groups and groups convertible into ions. The flexible polymer is any one of polyolefins, polyacrylates, polyamides and polyurethanes. Component A) contains at least one chemically fixed member selected from the group consisting of non-ionic polar group, ionic group and a group convertible into ionic group, in an amount sufficient to render said A) and B) compatible one with the other.
    Type: Grant
    Filed: January 10, 1995
    Date of Patent: April 2, 1996
    Assignee: Bayer Aktiengesellschaft
    Inventors: Claus D. Eisenbach, Karl Fischer, Jorg Hoffmann
  • Patent number: 5494995
    Abstract: Copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition were obtained by reacting maleic acid, an additional polycarboxylic acid and ammonia in a stoichiometric excess, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., to provide copolymers of polysuccinimide. In a second embodiment, a polyamine was added to the reaction mix. These intermediate polysuccinimide copolymers could then be converted to the salts of copolymers of polyaspartic acid by hydrolysis with a hydroxide.Such copolymers are useful in preventing deposition of scale from water and find applications in treating water. Other applications include scale prevention additives for detergents. In addition, such copolymers inhibit dental tartar and plaque formation.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: February 27, 1996
    Assignee: Bayer AG
    Inventors: Louis L. Wood, Gary J. Calton
  • Patent number: 5492980
    Abstract: Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.
    Type: Grant
    Filed: October 7, 1993
    Date of Patent: February 20, 1996
    Assignee: Kishimoto Sangyo Co., Ltd.
    Inventor: Takeshi Moriwaki
  • Patent number: 5492979
    Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
    Type: Grant
    Filed: April 4, 1994
    Date of Patent: February 20, 1996
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5491201
    Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: February 13, 1996
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5488088
    Abstract: Copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition were obtained by reacting maleic acid, an additional polycarboxylic acid and ammonia in a stoichiometric excess, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., to provide copolymers of polysuccinimide. In a second embodiment, a polyamine was added to the reaction mix. These intermediate polysuccinimide copolymers could then be converted to the salts of copolymers of polyaspartic acid by hydrolysis with a hydroxide.Such copolymers are useful in preventing deposition of scale from water and find applications in treating water. Other applications include scale prevention additives for detergents. In addition, such copolymers inhibit dental tartar and plaque formation.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: January 30, 1996
    Assignee: Bayer AG
    Inventors: Louis L. Wood, Gary J. Calton
  • Patent number: 5484860
    Abstract: Copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition were obtained by reacting maleic acid, an additional polycarboxylic acid and ammonia in a stoichiometric excess, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., to provide copolymers of polysuccinimide. In a second embodiment, a polyamine was added to the reaction mix. These intermediate polysuccinimide copolymers could then be converted to the salts of copolymers of polyaspartic acid by hydrolysis with a hydroxide.Such copolymers are useful in preventing deposition of scale from water and find applications in treating water. Other applications include scale prevention additives for detergents. In addition, such copolymers inhibit dental tartar and plaque formation.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: January 16, 1996
    Assignee: Bayer AG
    Inventors: Louis L. Wood, Gary J. Calton
  • Patent number: 5480944
    Abstract: This invention relates to polymeric interpenetrating blends comprising a polymer matrix having dispersed therein a branched fractal three dimensional polymer species which comprises rigid aromatic recurring units linked by electrophilic or nucleophilic reactive moieties or derivatives thereof.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: January 2, 1996
    Assignee: AlliedSignal Inc.
    Inventor: Shaul M. Aharoni
  • Patent number: 5480945
    Abstract: Novel orientable single and multilayer thermoplastic flexible films utilizing blends comprising an amorphous nylon copolymer such as nylon 6I/6T and a nylon copolyamide having a melting point of at least about 145.degree. C. having improved processability, shrinkage and optical properties.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: January 2, 1996
    Assignee: Viskase Corporation
    Inventor: Stephen J. Vicik
  • Patent number: 5478918
    Abstract: A polyimide precursor composition solution includes a tetracarboxylic acid component containing not less than 70 mol % of at least one selected from the group consisting of benzenetetracarboxylic acid and its reactive derivatives; a maleimide compound; and a diamine component containing not less than 70 mol % of 2,2'-substituted-4,4'-benzidine represented by the general formula (I) and siloxydiamine amounting to from 1 to 10 mol %. The tetracarboxylic acid component, the maleimide compound and the diamine component are dissolved in a solvent which is consisting essentially of .gamma.-butyrolactone. The amount of the tetracarboxylic acid component is substantially equivalent to that of the diamine component. The amount of the maleimide compound is from 5 to 30 wt % of the total weight of the tetracarboxylic acid and the diamine component.
    Type: Grant
    Filed: February 1, 1994
    Date of Patent: December 26, 1995
    Assignee: Central Glass Company, Limited
    Inventors: Masamichi Maruta, Hidehisa Nanai, Yoshihiro Moroi, Hiroshi Takahashi, Seiji Hasegawa
  • Patent number: 5478887
    Abstract: A polymer blend comprising an aliphatic polyamide matrix and a dispersed phase of a polycarbonate and a compatibilizing agent having pendant succinic anhydride groups or epoxide groups, made under such blending conditions that the polymer stock melt temperature is 290.degree.-350.degree. C., has a combination of excellent toughness and stiffness properties.
    Type: Grant
    Filed: July 26, 1993
    Date of Patent: December 26, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Gia Huynh-Ba
  • Patent number: 5473010
    Abstract: The present invention relates to a polyimide based resin composition comprises 1 to 50 parts by weight of polyetherimide for 100 parts by weight a resin composition comprising 50 to 99 parts by weight of polyarylether ketone and 50 to 1 parts by weight of polyimide having specific structural units.The polyimide based resin compositions have excellent fatigue characteristics and creep resistance and are expected widely to apply in field of machine and automobile parts which is required permanence for mechanical strength.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: December 5, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Atsushi Morita, Tomohito Koba, Toshiaki Takahashi, Katsunori Shimamura, Toshiyuki Kataoka, Hiroyuki Furukawa, Hiroaki Tomimoto
  • Patent number: 5470921
    Abstract: A synthetic polyamide of formula I and its salts ##STR1## in which each R.sub.1 independently is selected from hydrogen, carboxyl, amino or a group of formula .alpha.-A.sub.1 -R.sub.10 (.alpha.)where A, is a bridging group and R.sub.10 is a sterically hindered amine group;each R.sub.2 independently is hydrogen or a group of formula .alpha.A is a bridging group of the formula ##STR2## is 0 or 1; R.sub.3 is hydrogen, C.sub.1-12 alkyl or is a significance of R.sub.10 ;R.sub.5 is hydrogen or C.sub.1-12 alkylR.sub.4 is a significance of R.sub.10 or a group of formula .alpha.; andp is an integer from 5 to 200;with the proviso that the compound of formula I contains 1-400 sterically hindered amine groups.
    Type: Grant
    Filed: May 20, 1994
    Date of Patent: November 28, 1995
    Assignee: Sandoz Ltd.
    Inventors: Bansi L. Kaul, Angelos-Elie Vougioukas, Jurgen Goldmann
  • Patent number: 5470922
    Abstract: Polymeric blends of polyimide precursor resins and polyamides or polyesters, preferably in the form of liquid crystal polymers, provide polyimide products with excellent physical characteristics and injection molding capability.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: November 28, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Mureo Kaku, Robert R. Luise
  • Patent number: 5466761
    Abstract: Alloys of nylon 4.6 having good thermal stability above their melting points and a broad range of desired properties are prepared by melt mixing nylon 4.6 with at least one other nylon and a nylon copolymer. The inclusion of a copolymer in the alloy provides unexpectedly large increases in ductility and toughness.Alloys can be formulated with a unique combination of properties including, for example, elongations of at least 100%, Gardner impact strengths of at least 30 joules, tensile strengths of at least 80 MPa, and heat deflection temperatures of at least 85.degree. C.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: November 14, 1995
    Assignee: DSM N.V.
    Inventors: Howard A. Scheetz, Gerhardus J. A. deVrught
  • Patent number: 5464927
    Abstract: Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.
    Type: Grant
    Filed: May 10, 1993
    Date of Patent: November 7, 1995
    Assignee: International Business Machines Corporation
    Inventors: Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David A. Lewis, Sally A. Swanson, Nancy C. Labianca
  • Patent number: 5459230
    Abstract: The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: October 17, 1995
    Assignee: Elf Autochem Deutschland GmbH
    Inventors: Eduard de Jong, Karl-Heinz Hapelt
  • Patent number: 5459195
    Abstract: An improved process for preparing pigmented drawn polyamide fibers is disclosed, the improvement being the improved processability obtained from the use of an N,N'-dialkyl polycarbonamide as a carrier polymer for the pigment dispersion.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: October 17, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Raymond Longhi
  • Patent number: 5457144
    Abstract: This invention provides hydrolytically labile polyamide compositions and articles containing an ester derived moiety in the polymer backbone which will degrade after exposure to water over long periods of time.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: October 10, 1995
    Assignee: Rohm and Haas Company
    Inventors: Norman L. Holy, Newman M. Bortnick
  • Patent number: 5438105
    Abstract: A polyamic acid composite comprising i) a polyamic acid having three dimensional network molecular structure obtained by a ring-opening polyaddition reaction of a tetracarboxylic acid dianhydride with an aromatic diamine and a tri- or tetramino compound and ii) (a) a high polymer component having a different molecular structure from the polyamic acid, which is dispersed in the three dimensional network molecular structure of the polyamic acid and of which molecular chains are interpenetrated with molecular chains of the polyamic acid or (b) a curable resin composition which is dispersed in the three dimensional network molecular structure of the polyamic acid and which is capable of forming a cured resin of which molecular chains are interpenetrated with molecular chains of the polyamic acid, and a polyimide composite obtained from the polyamic acid composite, and process for production thereof.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: August 1, 1995
    Assignee: Toho Rayon Co., Ltd.
    Inventor: Yasuhisa Nagata
  • Patent number: 5434222
    Abstract: The new process for the preparation of polycondensates from polyamidoamines, epichlorohydrin and if appropriate polyamines, unreacted epichlorohydrin being removed by passing an inert gas through the reaction mixture, produces salt-free reaction products which have very low organic chlorine contents and at the same time very low values for dichloropropanol, chloropropanediol and epichlorohydrin, and are excellently suitable as auxiliaries for paper and textiles.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: July 18, 1995
    Assignee: Bayer Aktiengesellschaft
    Inventors: Jurgens Reiners, Karl Leiritz, Fritz Puchner
  • Patent number: 5434223
    Abstract: Block copolymers of nylon 4.6 are made by the solid phase polymerization of an alloy of nylons, including nylon 4.6, blended above the melting point of the nylons and then polymerized in particulate form under anhydrous conditions below the melting point of the nylons in the alloy. The block copolymers are characterized by their novel combination of properties which may include good melt strength, high melt viscosity, ductility (elongation), toughness (impact strength), good tensile strength and tensile modulus, high heat deflection temperatures, low crystallinity and high melting points.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: July 18, 1995
    Inventors: Howard A. Scheetz, Jacob Koenen
  • Patent number: 5422420
    Abstract: Polyamides and polyamide fibers having a major proportion of hexamethyleneadipamide units and minor proportions of at least two other amide units, one of those other amide units being those of 2-methylpentamethylenediamine are disclosed.
    Type: Grant
    Filed: May 19, 1993
    Date of Patent: June 6, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Ketan G. Shridharani
  • Patent number: 5416172
    Abstract: Transparent polyamide compositions having high resistance to chemical agents, as well as the process for their preparation and the articles obtained from said compositions. The present polyamide compositions contain from 1 to 99% by weight, preferably 40 to 90% by weight, of a first polyamide consisting of aliphatic units containing at least 7 carbon atoms, isophthalic and terephthalic diacids, the latter being predominant, and cycloaliphatic diamine units, and from 99 to 1% by weight, preferably 60 to 10%, of a semi-crystalline polyamide consisting of at least 35%, preferably 50%, by weight of an aliphatic unit containing at least 7 carbon atoms.
    Type: Grant
    Filed: December 18, 1992
    Date of Patent: May 16, 1995
    Assignee: Elf Atochem, S.A.
    Inventors: Philippe Blondel, Philippe Maj
  • Patent number: 5416171
    Abstract: The invention relates blending compositions comprising (a) a polyamide and (b) a block copolyetheramide with hard polyamide segments and soft polyether segments. The block copolyetheramide is defined by the formula:--[--CO--R.sup.1 --CO--(NHR.sup.2 CO).sub.m --O--(R.sup.3 --O--).sub.p --(CO--R.sup.2 --NH).sub.q --].sub.n --wherein R represents the alkylene group of an aliphatic diacid having between about 2 and about 18 carbon atoms; R.sup.2 represents an alkylene group having between about 3 and about 11 carbon atoms; R.sup.3 represents an alkylene group having between about 2 and about 4 carbon atoms; m and q independently range between about 2 and about 40; p ranges between about 10 and about 100; and n ranges between about 2 and about 50, said blending composition containing a polyether content ranging between about 1 and about 50%. The blocking copolyetheramides may be prepared by reacting a polyetherdiol, caprolactam and an aliphatic diacid in a two-stage method.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: May 16, 1995
    Assignee: Industrial Technology Research Institute
    Inventors: Lie-Zen Chung, De-Lun Kuo, Hong-Bing Tsai
  • Patent number: 5414051
    Abstract: Disclosed are compositions and process for the improving the rate or crystallization of polyamide containing compositions which comprise two polyamides having dissimilar melting temperatures, said process comprising the steps of heating the two polyamides to a temperature which is above the melting point of the polyamide having the lower melting temperature but below the melting temperature of the polyamide having the higher melting temperature, as well compositions made in accordance with the process. Preferred polyamides include polycaprolactam and polyhexamethylene adipamide, poly(tetramethylenediamine-co-adipic acid) and further, the inventive compositions may optionally include optional additional constituents. The process provided for improved nucleation without the necessity of inorganic nucleation promoters or agents, and articles made in accordance to the process exhibit good physical properties.
    Type: Grant
    Filed: March 14, 1994
    Date of Patent: May 9, 1995
    Assignee: AlliedSignal Inc.
    Inventors: Charles D. Mason, Nicolas Vanderkooi, Jr.
  • Patent number: 5412013
    Abstract: There is disclosed a polyamide resin composition comprising (A) 100 parts by weight of a polyamide (a) composed mainly of a xylylenediamine component and an .alpha.,.omega.-straight chain asphaltic dibasic acid component, or a combination of the polyamide (a) and polyamide 66, (B) 1 to 15 parts by weight of polyamide 12, (C) 0.01 to 5 parts by weight (in terms of copper) of a copper compound, (D) 1 to 15 parts by weight of carbon black, and (E) an alkali metal halide of such an amount that the number of halogen atoms of the alkali metal halide is 0.3 to 4 per one copper atom of the above copper compound. Said polyamide resin composition has an excellent weather resistance, moldability, and mechanical properties, and can be injection-molded.
    Type: Grant
    Filed: July 20, 1993
    Date of Patent: May 2, 1995
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Noriyoshi Watanabe, Kiyoshi Morishige, Hajime Inoue
  • Patent number: 5408028
    Abstract: Copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition were obtained by reacting maleic acid, an additional polycarboxylic acid and ammonia in a stoichiometric excess, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., to provide copolymers of polysuccinimide. In a second embodiment, a polyamine was added to the reaction mix. These intermediate polysuccinimide copolymers could then be converted to the salts of copolymers of polyaspartic acid by hydrolysis with a hydroxide.Such copolymers are useful in preventing deposition of scale from water and find applications in treating water. Other applications include scale prevention additives for detergents. In addition, such copolymers inhibit dental tartar and plaque formation.
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: April 18, 1995
    Inventors: Louis L. Wood, Gary J. Calton
  • Patent number: 5397847
    Abstract: This invention relates to heat-resistant polyimide blends and laminates thereof, which have excellent heat and moisture resistance, and excellent mechanical properties, including outstanding toughness. The blends contain a thermoplastic polyimide component and a thermosetting imide oligomer. The weight ratio of the thermoplastic component to thermosetting component is selected in the range of 99/1 to 5/95. The thermoplastic polyimide component has a number average molecular weight of 10,000 or more.
    Type: Grant
    Filed: July 15, 1993
    Date of Patent: March 14, 1995
    Assignee: The University of Akron
    Inventors: Frank W. Harris, Hiroyuki Furutani
  • Patent number: 5391640
    Abstract: Thermoplastic polymeric composition which feature good physical properties which are relatively insensitive to humidity and further exhibits good barrier properties of the composition comprise:(A) a first conventional polyamide, and(B) an amorphous copolyamide which is polymerized from(B.sub.1) a polyamide forming monomer selected from the group consisting of lactams, aminoalkanoic acids and mixture thereof wherein the monomer is present in a molar proportion of between about 0 and 50%,(B.sub.2) a diamine selected from the group consisting of aralkylene diamines, cycloalkylene diamines and mixtures thereof, the diamine being present in a molar proportion of between about 25 and 60%,(B.sub.
    Type: Grant
    Filed: December 17, 1993
    Date of Patent: February 21, 1995
    Assignee: AlliedSignal Inc.
    Inventors: Murali K. Akkapeddi, Jeffrey H. Glans, Jerome F. Parmer
  • Patent number: 5389327
    Abstract: An improved process for preparing pigmented drawn polyamide fibers is disclosed, the improvement being the improved processability obtained from the use of an N,N'-dialkyl polycarbonamide as a carrier polymer for the pigment dispersion.
    Type: Grant
    Filed: April 13, 1993
    Date of Patent: February 14, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Raymond Longhi
  • Patent number: 5380820
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: December 7, 1993
    Date of Patent: January 10, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Masao Yoshikawa
  • Patent number: 5380805
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: January 10, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi, Kouji Ohkoshi, Masao Yoshikawa
  • Patent number: 5378799
    Abstract: Heat-stable polyimides and polyamideimides with modified benzhydrol structural elements and a process of preparing thereof; wherein the polyimides and polyamideimides are obtained by reacting 3,3'4,4'-benzhydroltetracarboxylic acid dimethyl ester a) with only a diamine and then cyclized to give polyimides or b) with a diamine and with trimellitic, phthalic-or isophthalic acid (or the anhydrides, acid chlorides, anhydride chlorides or esters) and is then cyclized to give polyamideimides.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: January 3, 1995
    Assignee: Chemie Linz GmbH
    Inventors: Gerhard Greber, deceased, Heinrich Gruber, Marcel Sychra
  • Patent number: 5369171
    Abstract: A polymer mixture reinforced by an in situ, melt-polymerized microphase whereby the rigidity of the base material is increased, a process for manufacturing same, and use thereof for providing reinforced compositions and articles in which the polymer mixture is prepared by polymerizing a component B in a melt of a component A composed of at least one thermoplastic polymer. Component B is composed of at least one compound having the structure ##STR1## The reaction of component B in a melt of component A results in linear, branched or cross-linked, high or low molecular weight polymers constituting a microphase. Preferably, the microphases have the form of microfibers. In the structure of component B, X is NH.sub.2, NHR.sup.3, OH or an N-substituted, Y-activated lactam of the ##STR2## type which is activated with an electrophilic substituent Y, where Y is CO, SO.sub.2, or R.sup.5 P.dbd.O; R.sup.1, R.sup.2 and R.sup.
    Type: Grant
    Filed: June 10, 1992
    Date of Patent: November 29, 1994
    Assignee: Rehau AG + Co.
    Inventors: Rolf Mulhaupt, Joachim Rosch, Siegfried Hopperdietzel, Ekkehard Weinberg, Herbert Klein
  • Patent number: 5366663
    Abstract: Mixtures of liquid crystalline copolymers, polyether imides and compatibilizers and use thereof.Mixtures of at least one A) liquid crystalline copolymer, at least one B) polyether imide and at least one C) compatibilizer where the proportions of components A) and B) are each from 5 to 95 % by weight, based on the sum total of the two components, and the proportion of the compatibilizer C) is from 0.5 to 10 % by weight, based on the mixture of A) and B), have improved breaking strength and extension values.They are therefore highly suitable for producing molded articles or for use as matrix material for composites.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: November 22, 1994
    Assignee: Hoechst AG
    Inventors: Michael Romer, Andreas Schleicher
  • Patent number: 5366781
    Abstract: An oriented, shaped article comprising at least about 55% and less than about 80% by weight of a first polymer phase of at least one lyotropic polymer and at least about 20% and less than about 45% by weight of a second polymer phase of at least one thermally-consolidatable polymer and consolidated parts made therefrom.
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: November 22, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: John C. Coburn, Hung H. Yang
  • Patent number: 5359013
    Abstract: Disclosed are compositions and process for the improving the rate of crystallization of polyamide containing compositions which comprise two polyamides having dissimilar melting temperatures, said process comprising the steps of heating the two polyamides to a temperature which is above the melting point of the polyamide having the lower melting temperature but below the melting temperature of the polyamide having the higher melting temperature, as well compositions made in accordance with the process. Preferred polyamides include polycaprolactam and polyhexamethylene adipamide, and the said compositions may optionally include further constituents. The process provided for improved nucleation without the necessity of inorganic nucleation promoters or agents, and articles made in accordance to the process exhibit good physical properties.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: October 25, 1994
    Assignee: AlliedSignal Inc.
    Inventors: Charles D. Mason, Nicholas Vanderkooi, Jr.
  • Patent number: 5349018
    Abstract: Polyamide-hydrogenated polybutadiene-acrylonitrile block copolymers having high solubility in organic solvents, good compatibility with other polymers, and excellent thermal resistance and adhesive properties are characterized by comprising block units (A) represented by the following formula (I) and block units (B) represented by the following formula (III): ##STR1## wherein Bu is hydrogenated butadiene radical, R is divalent organic radical, R' is a divalent aromatic group having a hydroxyl group, Ar is an aromatic divalent group represented by the following formulae (1)-(6): ##STR2## each of k and z is an average polymerization degree where k is an integer of 2-400, and z is an integer of 5-100, m and n are molar fractions in the copolycondensation, where m.gtoreq.0.04, and m+n=1, and x and y are molar fractions in the copolymerization, where x:y=0.95:0.05 to 0.6:0.4, and x+y=1, and block units (A) and (B) are contained in the range of 2 to 20, respectively.
    Type: Grant
    Filed: January 15, 1992
    Date of Patent: September 20, 1994
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Toshio Tagami, Osamu Kiyohara
  • Patent number: 5346969
    Abstract: Polymeric blends of polyimide precursor resins and polyamides or polyesters, preferably in the form of liquid crystal polymers, provide polyimide products with excellent physical characteristics and injection molding capability.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: September 13, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Mureo Kaku
  • Patent number: 5344894
    Abstract: Polyimide oligomers include (1) linear, monofunctional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: September 6, 1994
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5344895
    Abstract: A polymer composition is disclosed which includes a polyamideimide polymer and a liquid crystalline polymer, wherein the amount of the liquid crystalline polymer is in an amount which significantly decreases the melt viscosity of the polyamideimide polymer while not significantly decreasing the mechanical properties of the polyamideimide polymer.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: September 6, 1994
    Assignee: University of Massachusetts Lowell
    Inventors: Xiaoyun Lai, Dafang Zhao, Francis Lai
  • Patent number: 5344679
    Abstract: Orientable single and multilayer thermoplastic flexible films utilizing blends comprising an amorphous nylon copolymer such as nylon 6I/6T and a nylon copolyamide having a melting point of at least about 145.degree. C. having improved processability, shrinkage and optical properties.
    Type: Grant
    Filed: April 16, 1991
    Date of Patent: September 6, 1994
    Assignee: Viskase Corporation
    Inventor: Stephen J. Vicik
  • Patent number: 5344708
    Abstract: Bulked random copolyamide yarns having enhanced dyeability as compared to comparable nylon 6 fibers are disclosed. The random copolyamides contain from 80 to 96% by weight of nylon 6 units and 4 to 20% by weight of nylon 6,6 units with from 90 to 94% nylon 6 and 6 to 10% nylon 6,6 being the preferred range. Further increases in dyeability are obtained by steam heat-setting the yarns.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: September 6, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: William T. Windley
  • Patent number: 5342918
    Abstract: Described are carboxyl-terminated polyetheramides of the formula: ##STR1## where R is a moiety from an alcohol or hydroxy compound having a valence of k; R' is independently hydrogen or lower alkyl from 1 to 4 carbon atoms; R" is independently a straight or branched alkylene or aromatic moiety averaging from about 2 to 36 carbon atoms; x averages from about 2 to 100; z averages from about 20 to about 250; k averages from about 1 to 3; m is 0 or 1; and p is independently 5 to 11. Because the carboxyl-terminated polyetheramides are all carboxyl-terminated, they do not gel. They are expected to have good impact strength as well as differing solubilities depending on the polyetheramine incorporated.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: August 30, 1994
    Assignee: Texaco Chemical Company
    Inventors: Richele T. Howelton, George P. Speranza
  • Patent number: 5338806
    Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-150B2) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: August 16, 1994
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5332777
    Abstract: Unreinforced polyamide molding materials containA) from 60 to 100% by weight of a mixture consisting ofA.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide andA.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atomsand, based on the total weight of the polyamide molding material,B) from 0 to 40% by weight of a toughened polymer andC) from 0 to 10% by weight of conventional additives in effective amounts.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: July 26, 1994
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz