Abstract: Methods for forming high molecular weight chain-extended condensation polymers are disclosed. The methods include adding a chain extender during the polymerization process of a condensation polymer to provide a chain-extended condensation polymer, wherein the chain extender comprises a polymerization product of at least one epoxy-functional (meth)acrylic monomer, and at least one styrenic and/or (meth)acrylic monomer.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: To provide a modified recycled polyester resin that has stable moldability, is capable of producing as a by-product only a small amount of gel-like material during the process of modification to allow stable cross-linking reaction, and can prevent the possibility of recleavage, and to provide a molded article using the same. The modified recycled polyester resin contains a recycled PET resin having a carboxyl group, and a modifying agent having an epoxy group and an oxazoline group, ends of the carboxyl group of the recycled PET resin being modified with the modifying agent, wherein a mole ratio between the oxazoline group and the epoxy group is within a range of 100:90 to 100:0.01, and an additive amount of the modifying agent is 0.001 to 15 parts by mass with respect to 100 parts by mass of the recycled PET resin.

Abstract: A hydrolyzed divinylarene dioxide resin composition including the reaction product of (a) a divinylarene dioxide, and (b) water; a process for making the hydrolyzed divinylarene dioxide resin composition; and a curable hydrolyzed divinylarene dioxide resin composition made therefrom. The cured product made from the above hydrolyzed divinylarene dioxide resin composition offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.

Abstract: Compositions comprising: (a) 30 to 65 weight percent of a polyester; (b) 7 to 25 weight percent of an ethylene copolymer toughener; (c) 5 to 25 weight percent of a copolyether ester elastomer having a shore D hardness of 20 to 50; optionally (d) 15 to 35 weight percent of a halogenated epoxy flame retardant; and (e) when (d) is present in the composition, optionally, 2 to 10 weight percent of a flame retardant synergist; wherein: the ratio of the combined weight of (b)+(c) relative to the weight of (a) ranges from 0.40 to 0.85; the ratio of the weight of (b) relative to that of (c) ranges from 0.3 to 2.5; and the Gardner impact of the composition, when molded, is at least 4.2 J, measured at ?40° C. according to ASTM D5420. Methods of making articles by molding these melt-mixed compositions.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: A polyester resin toner binder which gives a toner with good anti-blocking property at high temperature and high humidity and good low-temperature fixing ability. The present invention is directed to a toner binder for developing electrostatic charge images, which binder comprises a condensation-polymerization polyester resin, the polyester resin being a product formed in the presence of a catalyst (a) represented by the following general formula (I): Ti(—X)m(—OR)n??(I) wherein R, X, m and n are as defined herein.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The invention relates to biaxially oriented polyester films which contain 0.25-20% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and/or epoxidized fatty acid glycerides, and a chain extender. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: The present invention relates to a composite dyestuff, characterized in that it is in the form of microcapsules composed of a polymer matrix of crosslinked polyurethane, polyurea and/or polyurethane/polyurea type obtained by interfacial polycondensation, and of a pigment.

Abstract: A process for preparing a hybrid polyester-polyether polyol comprises contacting a carboxyl group-containing component and an epoxide, optionally in the presence of one or more of a double metal cyanide catalyst, a superacid catalyst, a metal salt of a superacid catalyst and/or a tertiary amine catalyst, under conditions such that a hybrid polyester-polyether polyol is formed. The hybrid polyester-polyether polyol offers the advantages of both ester and ether functionalities when used in a polyurethane formulation, thus enhancing physical properties. The process results in products having narrow polydispersity, a low acid number and unsaturation, and reduced byproduct formation, particularly when the double metal cyanide catalyst is employed.

Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).

Abstract: Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one ?,?-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: Novel biodegradable phosphoester polyamines are disclosed. The biodegradable phosphoester polyamines may be utilized as cross-linkers for sprayable compositions which may be used as tissue adhesives or sealants.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The present invention relates to a curing composition comprising a polyarylate having epoxy group and a cyanate ester resin, and a cured product prepared by using the same. The curing composition according to the present invention is used to provide a cured product which is excellent in terms of heat resistance and toughness.

Abstract: The present invention is directed to a polyester-based composition and adhesive containing a heterobicycle. The composition comprises a) a polycondensate of a1) a heterobicycle containing from 4 to 8 carbon atoms and from 1 to 3 oxygen atoms, wherein the heterobicycle is substituted by 2 to 4 hydroxyl groups, and a2) a dimer of a fatty acid, and b) a cross-linking agent having at least 2 functional groups per molecule; wherein the polycondensate and the cross-linking agent are capable of reacting with each other.

Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The invention described herein provides a mixture comprising polymer molecules or salts thereof, wherein a polymer molecule in the mixture comprises covalently bound subunits L, K, and M wherein the average molecular weight of the polymer molecules in the mixture is about 50 kDa to about 200 kDa, wherein the mole percentage of subunit M, K and L, relative to the total amount of subunits in the mixture, is about 90.5 to about 96 mol %, about 2.8 to about 7.3 mol %, and about 1.2 to about 2.2 mol %, respectively.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.

Abstract: Disclosed herein is a composition comprising a polyphenylene ether sulfone and a resorcinol based silicone aryl polyester carbonate copolymer wherein greater than or equal to 50 mol % of copolymer repeating units are ester units derived from resorcinol, based on the total molar amount of all repeating units in the polymer and wherein the blend has less than 1 weight percent polycarbonate, based on the total weight of the composition, has FAR 25.853 peak heat release of less than 60 KW/m2 and time to peak heat release of greater than or equal to 120 seconds.

Abstract: The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one ?,?-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.

Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: Disclosed is a low VOC coating additive employing a water-dispersible polymer, a water insoluble plasticizer, cyclohexanedimethanol, and optionally an amphiphilic component. The additive can be added to a coating to improve at least one performance characteristics of the coating, such as, wet-edge time, open time, scrub resistance, wet adhesion, and water resistance.

Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Abstract: Bioabsorbable macromer compositions are provided including a diisocyanate-functional bioabsorbable polymer. In some embodiments, the diisocyanate-functional bioabsorbable polymer can be combined with a functionalized polyol. The resulting bioabsorbable macromer composition can be employed as an adhesive or sealant for medical/surgical uses.

Abstract: A light absorbent for forming an organic anti-reflective layer, represented by the following formula 1 or formula 2, is provided: wherein A represents a substituted or unsubstituted, linear or branched, saturated tetravalent hydrocarbon group, a substituted or unsubstituted, linear or branched, saturated hydrocarbon group and containing one or more heteroatoms, a substituted or unsubstituted aromatic group, a substituted or unsubstituted heteroaromatic group, a substituted or unsubstituted alicyclic group, a substituted or unsubstituted heteroalicyclic group, a substituted or unsubstituted diaryl ether, a substituted or unsubstituted diaryl sulfide, a substituted or unsubstituted diaryl sulfoxide, a substituted or unsubstituted diaryl ketone, or a substituted or unsubstituted diaryl bisphenol A; R1, R2, and R3 each independently represent a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted acetal group,

Abstract: A polyester resin toner binder which gives a toner with good anti-blocking property at high temperature and high humidity and good low-temperature fixing ability. The present invention is directed to a toner binder for developing electrostatic charge images, which binder comprises a condensation-polymerization polyester resin, the polyester resin being a product formed in the presence of a catalyst (a) represented by the following general formula (I): Ti(—X)m(—OR)n??(I) wherein R, X, m and n are as defined herein.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: Disclosed is an improved coating composition for food containers that is resistant to high pH processing environments. The improved coating composition is based upon an epoxy-amino resin coating composition that has been modified with other components to improve its performance in high pH environments balanced with flexibility, formability and abrasion resistance. Typically, the coating composition includes an epoxy resin, an amino resin cross-linking agent, a blocked polyisocyanate and a saturated polyester.

Abstract: Two-component epoxy-based structural adhesives are disclosed which exhibit excellent impact resistance, even when cured at approximately room temperature. The adhesives include an epoxy resin component which includes an epoxy resin and a reactive tougher. The adhesives also include a hardener component, which includes from 15 to 50 weight percent of an amine-terminated polyether, from 4 to 40 weight percent of an amine terminated rubber having a glass transition temperature of ?40° C. or below, and from 10 to 30 weight percent of an amine-terminated polyamide having a melting temperature of no greater than 50° C.

Abstract: The invention relates to biaxially oriented polyester films which contain 0.1-5.0% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and 0.2-10% by weight (based on the weight of the film) of epoxidized fatty acid glycerides, the epoxidized fatty acid esters having a mean molecular weight of at least 425 g/mol. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: The present invention provides a method of producing a polyethylene terephthalate graft copolymerized resin, comprising subjecting the following mixture to a homogeneous reaction at a temperature of 250° C. or higher to impart a high melt viscosity to the mixture, the mixture containing (A) 100 parts by weight of a polyethylene terephthalate polyester as a main material, (B) 0.01 to 2 parts by weight of a polymeric polyfunctional epoxy compound containing 7 to 100 epoxy groups in a molecule and having a molecular weight of 1,000 to 300,000 as a coupling agent, (C) 0.01 to 1 part by weight of a metal salt of an organic acid as a coupling reaction catalyst, and (D) 0 to 100 parts by weight of an aromatic alicyclic polyester and/or an aromatic aliphatic polyester each having a carboxyl group in an aromatic nucleus as an auxiliary material.

Abstract: The invention relates to biaxially oriented polyester films that include a chain extender in addition to the polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor films, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: A method to prepare a carbon fiber bundle which can develop satisfactory interfacial adhesion to polyolefin-based resins, especially polypropylene resins, is provided. The carbon fiber bundle comprises a plurality of single fibers sized with a sizing agent comprising: a polymer having a main chain formed of carbon-carbon bonds, containing an acid group in at least part of side chains or at least a part of main chain ends, and having an acid value of 23 to 120 mg KOH/g as measured in accordance with ASTM D1386; or a polymer having a main chain formed of carbon-carbon bonds and containing at least either of an epoxy group and an ester group in at least a part of side chains or at least a part of main chain ends.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: The invention relates to a process for removing fouling on a surface, wherein the surface is contacted with an aqueous solution of a guanidine of formula R1R2N—C(?NH)—NR3R4??(I) wherein R1, R2, R3 and R4 may be the same or different and each of R1, R2, R3 and R4 is hydrogen or hydrocarbyl.

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: An agent and method for treating biodegradable synthetic yarns fabricated from a polymer comprising lactic acid as a main component, which enable improved lubricity, cohesion, etc. to be so imparted to the biodegradable synthetic yarns that the yarns can be prevented from fuzzing and breaking at every step from spinning to down-stream step, especially at a false twisting step and improved in terms of bulkiness, providing yarns having improved mechanical properties in a stable manner. The agent of the invention comprises 0.1 to 30 weight % of a specific functional agent, and a lubricant and a surfactant in the total amount of 70 weight % or greater, and has a friction coefficient in the range of 0.04 to 0.35.

Abstract: An object of the present invention is to provide a golf ball which has excellent durability and wear-resistance and provides an excellent shot feeling. The present invention is directed to a golf ball comprising: a core; and a cover covering the core, wherein the cover is formed from a cover composition containing a thermoplastic polyurethane (A), a polyisocyanate (B) having at least two isocyanate groups, and a polyhydroxyether (C) as a resin component, and wherein the core has a surface hardness of 85 or smaller in JIS-C hardness.

Abstract: The object of the present invention is to provide a golf ball which has excellent durability and wear-resistance and provides an excellent shot feeling. The present invention provides a golf ball comprising: a core consisting of a center and at least one intermediate layer covering the center; and a cover covering the core, wherein the cover is formed from a cover composition containing a thermoplastic polyurethane (A), a polyisocyanate compound (B) having at least two isocyanate groups, and a polyhydroxyether (C) as a resin component, wherein the cover composition has a slab hardness from 20 to 55 in shore D hardness, and the cover has a thickness from 0.1 mm to 1.5 mm.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.