Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Abstract: Low-VOC mixture of at least partially salified copolymers of at least one ethylenically unsaturated, phenyl-group-containing monomer and at least one ?,?-unsaturated monocarboxylic acid and/or at least one ?,?-unsaturated dicarboxylic acid, of at least one water-soluble polyether, esterification products of at least one water-soluble polyether and an aliphatic dicarboxylic acid, and of a star polymer obtainable by esterifying a carboxylic acid containing at least 3 carboxyl groups with at least one water-soluble polyether, and use thereof as a wetting and dispersing agent, preferably for producing low-VOC pigment pastes or low-VOC paint systems.

Abstract: The present invention relates to powder coating compositions and to components and ingredients for incorporation therein, suitable for fast curing schedule and with excellent resistance to outside aging. Non-isocyanurate polyepoxide cross-linking reagents can be used, provided the nature of the carboxylated polyester resin is formed of at least 30 mole % aromatic acid and the chain of the carboxyl terminated polyester also incorporates a moiety derived from 1,4 cyclohexanedicarboxylic acid. The powder coating composition can be cured for 90 seconds at a temperature of 250° C. or 55 seconds at 270° C. or 20 seconds in an induction oven at a temperature of 300° C. in the presence of a catalyst.

Abstract: A composition comprising a) about 30 to 80 wt. % of a polycarbonate, b) about 5 to about 50 wt. % of a polyester, c) about 2 to about 25 wt. % of an impact modifier and d) a gloss reducing effective amount of a multifunctional additive comprising at least one epoxy group.

Abstract: A styrenic thermoplastic resin composition of the present invention comprises about 100 parts by weight of base resin comprising (A) about 10 to about 99 parts by weight of styrenic resin containing an epoxy group and (B) about 1 to about 90 parts by weight of polyester resin; and (C) about 0.1 to about 97 parts by weight of amorphous modified polyester resin, based on the total weight of the base resin. A molded article produced from the styrenic thermoplastic resin composition of the present invention can have excellent impact resistance and paintability.

Abstract: Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: This invention relates to the preparation of polyamide block copolymers by sequential monomer addition. More particularly, it relates to catalysts capable of copolymerizing not only cyclic amides, but other monomers such as cyclic esters and epoxides as well, using sequential addition so as to produce useful and novel block copolymers.

Abstract: Polymer blends suitable for packaging are disclosed that include one or more impact modifiers; and one or more polyethylene terephthalate homopolymers or copolymers obtained by a melt phase polymerization using a catalyst system comprising aluminum atoms in an amount, for example, from about 3 ppm to about 60 ppm and one or more alkaline earth metal atoms, alkali metal atoms, or alkali compound residues in an amount, for example, from about 1 ppm to about 25 ppm, in each case based on the weight of the one or more polyethylene terephthalate homopolymers or copolymers The polymer blends disclosed exhibit improved low temperature toughness compared with blends made using polymers prepared with conventional catalyst systems.

Abstract: A process for the production of impact-modified composition that contains polyalkylene terephthalate and polycarbonate resins is disclosed. The process includes (i) in a first step combining in the melt at 90 to 175° C. glycidyl ester with at least one member selected from the first group consisting of polyalkylene terephthalate and polycarbonate to obtain a molten mixture, said member in powder form, and (ii) in a subsequent step combining the molten mixture with at least one component selected from the second group consisting of polyalkylene terephthalate and polycarbonate to obtain a composition. The composition is characterized in high gloss value.

Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.

Abstract: The invention is directed to coating compositions for direct coating of plastic substrates, comprising the following components: A) a hydroxy-functional binder component, comprising at least one branched hydroxy-functional polyester having a hydroxyl value of 50-300 mg KOH/g solid, a polydispersity of <2 and a number average molecular weight (Mn) of 300 to 4000, having at least three branches, and having at least one hydroxyl group on each of the at least three branches, B) a crosslinking component for the hydroxyfunctional binder component A), C) at least one adhesion promoting component and optionally, D) organic solvents, additives conventionally found in paints as well as pigments and/or fillers.

Abstract: A coating composition comprises a crosslinkable carbamate-functional resin and an aminoplast. The aminoplast comprises the reaction product of an aldehyde and a melamine. The aminoplast has a content of imino groups of less than or equal to about 10%, a content of alkylol groups of at least about 7%, and a remainder of groups being alkoxyalkyl groups, all based on a total number of reactive sites present in the melamine prior to reaction. A coating system includes a clear coat layer that comprises the reaction product of the crosslinkable carbamate-functional resin and the aminoplast. Threshold adhesion strength, in accordance with MVSS standards, can be achieved between glass and the coating system when the crosslinkable carbamate-functional resin and the specific aminoplast set forth above are reacted to form the clear coat layer, while minimizing problems associated with high viscosity of aminoplasts having a high content of imino groups of greater than 10%.

Abstract: An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

Abstract: The invention is a composition comprising a blend of two or more epoxide containing compositions selected from epoxidized vegetable oils, epoxidized alkyl esters or cycloaliphatic epoxides. In another embodiment, the invention is a blend of one or more epoxidized vegetable oils, epoxidized alkyl esters, or cycloaliphatic epoxides with one or more aromatic epoxides or epoxy functionalized polyoxyalkylene polyols.

Abstract: Polymers having polyolefin segments as the side chain, with a structural unit represented by the following Formula (1): wherein A is an olefin polymer having a weight average molecular weight of 400 to 500,000; R is H, an alkyl group, or an aralkyl group; W and Z are each O, HN, or S; and x and y are each 0 or 1, with the proviso that at least one of them is 1. The polymer can be applied as an antistatic agent, a cosmetic additive, a releasing agent for toner, a pigment dispersant, a lubricant for vinyl chloride resins, a coating material, an emulsion composition and the like.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A powder coating composition obtainable by homogeneous mixing of at least two separately produced powder coating compositions as powder coating bases to yield coating compositions having good storage stability and coatings with controlled low gloss levels as well as high exterior durability and stable flexibility.

Abstract: A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin.

Abstract: Novel impact modifiers obtained by the reaction of amphiphilic block copolymers. These impact modifiers are suitable for use in thermosetting epoxy resin adhesives. The impact modifiers include a carboxylic acid group prepared from the reaction of an intramolecular anhydride of a di- or tricarboxylic acid with at least one amphiphilic block copolymer including at least one hydroxyl group. A method for adhesively binding heat-stable substrates includes applying a single-component thermosetting epoxy resin composition to the surface of a first heat-stable substrate; contacting the epoxy resin composition with the surface of second heat-stable substrate; heating the epoxy resin composition to 20-100° C.; bringing the two substrates and the epoxy resin composition into contact with a wash liquid; and heating the epoxy resin composition to 140-220° C.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Safety cast compositions for the prevention of thermal injury are provided basically comprising a curable casting material, a flexible substrate coated or impregnated with the casting material and a thermochromic material. Methods for using the safety cast to prevent cast burns in patients in need of immobilizing a body member are also provided.

Abstract: Solid dispersions of stable, amorphous opioid antagonists, particularly [[2(S)-[[4(R)-(3-hydroxyphenyl)-3(R),4-dimethyl-piperidinyl]methyl]-1-oxo-3-phenylpropyl]amino]acetic acid, with improved water solubility and bioavailability are disclosed. Also disclosed are methods of preventing or treating a side effect associated with an opioid. In addition, methods of treating or preventing pain, ileus, and opioid bowel dysfunction are disclosed.

Abstract: Formulations comprising an isosorbide-modified unsaturated polyester comprising maleic acid, fumaric acid, itaconic acid or maleic anhydride and isosorbide and one or more low profile additives. The formulations exhibit better shrink control in molding compound formulations with standard low profile additives than their non-isosorbide-modified analogues. These isosorbide-modified unsaturated polyester resins may be applied in molding compounds like sheet molding compounds or bulk molding compounds and may be components of fiber reinforced composites or other composite materials.

Abstract: A polyester composition comprising (a) a polyester derived from a diol and a diacid, (b) a fluoropolymer and (c) a carboxy reactive compound, where the polyester composition has a highly useful combination of (i) mechanical properties and (ii) melt strength is disclosed. Also disclosed is a process to prepare these compositions and articles therefrom.

Abstract: Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile, further reacted with an epoxy resin, are disclosed.

Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.

Abstract: A powder primer composition comprising as essential components (A) a carboxyl group-containing thermosetting polyester resin, (B1) a bisphenol A-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (B2) a bisphenol-type epoxy resin with an epoxy equivalent of 400-2000 g/eq and (C1) a bisphenol F-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (C2) a modified epoxy resin containing phenolic hydroxyl groups, obtained by reacting (a) a bifunctional epoxy resin with (b) an excess of a bifunctional phenol. Coating films obtained using the powder primer composition have excellent finished appearance and corrosion resistance.

Abstract: Bioabsorbable macromer compositions are provided including a diisocyanate-functional bioabsorbable polymer. In some embodiments, the diisocyanate-functional bioabsorbable polymer can be combined with a functionalized polyol. The resulting bioabsorbable macromer composition can be employed as an adhesive or sealant for medical/surgical uses.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: The invention is a composition comprising a blend of two or more epoxide containing compositions selected from epoxidized vegetable oils, epoxidized alkyl esters or cycloaliphatic epoxides. In another embodiment, the invention is a blend of one or more epoxidized vegetable oils, epoxidized alkyl esters, or cycloaliphatic epoxides with one or more aromatic epoxides or epoxy functionalized polyoxyalkylene polyols.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: Star polymers prepared by reacting a highly branched polymer and either a lactone or lactam are disclosed. These star polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the described star polymers are also disclosed.

Abstract: The invention relates to biaxially oriented polyester films which contain 0.25-20% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and/or epoxidized fatty acid glycerides, and a chain extender. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: The present invention relates to a process for producing an acid anhydride-based epoxy resin curing agent, an acid anhydride-based epoxy resin curing agent, an epoxy resin composition, and a cured product and optical semiconductor device using the same. The process for producing an acid anhydride-based epoxy resin curing agent according to the present invention comprises heating a mixture containing a polyvalent carboxylic acid anhydride and a polyester resin in the presence of hydrogen gas and a hydrogenation catalyst.

Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: The present invention provides a method of producing a polyethylene terephthalate graft copolymerized resin, comprising subjecting the following mixture to a homogeneous reaction at a temperature of 250° C. or higher to impart a high melt viscosity to the mixture, the mixture containing (A) 100 parts by weight of a polyethylene terephthalate polyester as a main material, (B) 0.01 to 2 parts by weight of a polymeric polyfunctional epoxy compound containing 7 to 100 epoxy groups in a molecule and having a molecular weight of 1,000 to 300,000 as a coupling agent, (C) 0.01 to 1 part by weight of a metal salt of an organic acid as a coupling reaction catalyst, and (D) 0 to 100 parts by weight of an aromatic alicyclic polyester and/or an aromatic aliphatic polyester each having a carboxyl group in an aromatic nucleus as an auxiliary material.

Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.

Abstract: The present invention provides a process for conditioning double metal cyanide (DMC) catalysts, which are employed in the preparation of polyether polyols based on starter compounds having active hydrogen atoms, the preparation of polyether polyols using the conditioned catalysts and the use of the polyether polyols prepared in this way for the preparation of polyurethane materials.

Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.

Abstract: A coated article comprising (a) a substrate having two opposing surfaces; (b) a first curable film-forming composition applied to one surface of the substrate; and (c) a second curable film-forming composition applied to the opposing surface of the substrate, wherein the opposing surface is not coated with the first curable film-forming composition. Component (b) comprises a resinous binder; optionally, a curing agent and a metallic reflective pigment while component (c) comprises a polyepoxide; a thermoplastic polyester polymer; a curing agent a mineral filler; and microspheres.

Abstract: The emulsion herein is of an epoxy resin having a glass transition temperature of at least about 40° C., wherein the average diameter of the epoxy resin particles in the emulsion is 500 nm or less. The emulsion may include an epoxy resin, a sulfonated polyester resin and a nonionic surfactant. The emulsion may be used to produce a toner particle in an emulsion aggregation method.

Abstract: A flame retardant polyester fiber for artificial hair, which is obtained by melt spinning a composition as a mixture of 100 parts by weight of (A) a polyester made of one or more of polyalkylene terephthalate and a copolymer polyester comprising polyalkylene terephthalate as a main component with 5 to 30 parts by weight of (B) a brominated epoxy flame retardant. The present invention also relates to the polyester fiber for artificial hair which has at least one modified cross-section, is a mixture with a fiber having a modified cross-section, and has a mixing ratio of the fiber having a round cross-section to the fiber having a modified cross-section is 8:2 to 1:9, and to the flame retardant polyester fiber for artificial hair which further comprises a hydrophilic fiber treating agent attached thereto, and thus has excellent smooth feeling, combing properties, and flame retardance.

Abstract: A flame retardant polyester fiber for artificial hair, which is obtained by melt spinning a composition as a mixture of 100 parts by weight of (A) a polyester made of one or more of polyalkylene terephthalate and a copolymer polyester comprising polyalkylene terephthalate as a main component with 5 to 30 parts by weight of (B) a brominated epoxy flame retardant. The present invention also relates to the polyester fiber for artificial hair which has at least one modified cross-section, is a mixture with a fiber having a modified cross-section, and has a mixing ratio of the fiber having a round cross-section to the fiber having a modified cross-section is 8:2 to 1:9, and to the flame retardant polyester fiber for artificial hair which further comprises a hydrophilic fiber treating agent attached thereto, and thus has excellent smooth feeling, combing properties, and flame retardance.