Abstract: A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.

Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) at least one photoactivatable composition comprising at least one organoborate salt selected from tetraarylborate, triarylorganoborate, diaryldiorganoborate, and aryltriorganoborate salts (and combinations thereof) of at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.

Abstract: A heavy release additive for a release sheet comprises a condensation reaction product of dehydrative condensation reaction between (A) a polydiorganosiloxane of average polymerization degree of 500 to 10,000 and has at least one hydroxy or hydrolysable group per molecule and (B) a polyorganosiloxane resin composed of a (SiO4/2) unit and a (R3SiO1/2) unit (wherein R's independently represent a C1-12 monovalent hydrocarbon group or a C2-6 alkenyl group each having no aliphatic unsaturated bond), has a ratio of the (R3SiO1/2) unit to the (SiO4/2) unit of 0.6 to 1.2 by mole, and contains the hydroxy group and the hydrolysable group in the total content of 2.1 mass % or more and less than 10.0 mass %. The heavy release additive can have the effect of achieving an extremely great peel force compared with cases in which no additive is added.

Abstract: Provided is an oil-in-water silicone emulsion composition that has a low silicone oligomer content, and that can form, even without the use of an organotin compound as a curing catalyst, a cured film that exhibits satisfactory strength and satisfactory adherence to a substrate, through the removal of water fraction. An oil-in-water silicone emulsion composition comprising (A) 100 mass parts of a polyorganosiloxane that contains in each molecule at least two groups selected from the group consisting of a silicon-bonded hydroxyl group, alkoxy group, and alkoxyalkoxy group, (B) 0.1 to 200 mass parts of a colloidal silica, (C) 0.1 to 100 mass parts of an aminoxy group-containing organosilicon compound that has in each molecule an average of two silicon-bonded aminoxy groups, (D) 1 to 100 mass parts of an ionic emulsifying agent, (E) 0.1 to 50 mass parts of a non-ionic emulsifying agent, and (F) 10 to 500 mass parts of water.

Abstract: The present invention has a main purpose of providing a resin composition capable of forming a resin film excellent in hardness and heat resistance. To achieve the purpose described above, the present invention provides a resin composition, comprising: a developable polysiloxane containing a developable group and substantially no radically polymerizable group; a polymerizable polysiloxane containing a radically polymerizable group and substantially no developable group; and a polyfunctional monomer.

Abstract: An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.

Abstract: A radical-curable hot-melt urethane resin composition includes 100 parts by mass of a hot-melt urethane (X) having a (meth)acryloyl group and 0.5 to 5.0 parts by mass of a radical polymerization initiator (Y), wherein the hot-melt urethane (X) is obtained by introducing, using a (meth)acrylate compound (D) having an active-hydrogen-containing group, a (meth)acryloyl group into a hot-melt urethane prepolymer (C) that has isocyanate groups at its terminals and is obtained by a reaction of a polyol (A) and an alicyclic polyisocyanate (B), the polyol (A) containing an aliphatic polycarbonate polyol (a1), an alicyclic polycarbonate polyol (a2), or an aliphatic polyether polyol (a3), in an amount of more than 50 mol % and 100 mol % or less of the total number of isocyanate groups of the urethane prepolymer (C).

Abstract: The present invention relates to a polymer which has an electronic dipole covalently bonded to the polymer structure. The polymer structure forming the basis of the polymer is in particular an elastomer which can be unbranched, or also branched or crosslinked. The present invention equally describes a method for bonding a dipole molecule to a corresponding polymer structure or elastomer structure. The polymer in accordance with the invention can be present as a pure substance or also as a mixture with any other polymers, preferably with further elastomers. Uses of the polymer or of the obtained polymer blend will equally be provided.

Abstract: Electron beam and gamma radiation crosslinked, silicone gel adhesives are described. Both nonfunctional and functional poly diorganosiloxanes are used. Methods of forming the adhesives, and medical articles incorporating such adhesives are also described.

Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) a catalyst composition comprising (1) at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof, and (2) at least one Lewis acid; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.

Abstract: A method of manufacturing a composite composition, having: bonding a dispersant to the surfaces of inorganic oxide particles to provide dispersibility in a hydrophobic solvent to the inorganic oxide particles, and then dispersing the inorganic oxide particles in a hydrophobic solvent; substituting the dispersant bonded to the surfaces of the inorganic oxide particles with a surface modifier, which is a polydimethylsiloxane-skeleton polymer having one functional group at one terminal end, in the hydrophobic solvent in which the organic oxide particles are dispersed to bond the functional group of the polydimethylsiloxane-skeleton polymer to the surfaces of the inorganic oxide particles; and conjugating a silicone resin and the inorganic oxide particles obtained in the previous step, wherein the surface thereof is modified by bonding the polydimethylsiloxane-skeleton polymer having one functional group at one terminal end thereof, to obtain a composite composition.

Abstract: Curable compositions of resin-linear organosiloxane block copolymers having improved shelf stability are disclosed. A stabilizer compound is added to the resin-linear organosiloxane block copolymer which increases the temperatures needed to effect final cure of the compositions. In other embodiments, the present disclosure provides curable compositions of resin linear organosiloxane block copolymers having improved physical properties, such as improved toughness.

Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) a catalyst composition comprising at least one carbene; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.

Abstract: A process for preparing resin-linear organosiloxane block copolymers is disclosed. The process involves an initial hydrosilylation reaction to link a linear organosiloxane block with a resin organosiloxane portion to form the resin-linear block copolymer. The resulting resin-linear organosiloxane block copolymer is further crosslinked to provide copolymer compositions that are useful as coatings for various electronics and lighting components.

Abstract: Provided herein are silicon-based compositions, which after curing is a coating composition having strong substrate adhesion and scratch resistance. The compositions are formed from a mixture of constituents comprising: from about 20% to about 90% (w/w) of a first siloxane selected from the group consisting of silsesquioxane, methylmethoxysiloxane, and combinations thereof; and from about 10% to about 80% (w/w) of one or more silicon compounds selected from the group consisting of a second siloxane, silane, and silazane. Optionally, the compositions may comprise from about 0.1% to about 5% (w/w) alkyltitanate.

Abstract: The invention relates to a process for the production of a piece made of silicone including: (a) the blending of 100 parts by weight of an HCR silicone base having a viscosity of greater than 106 mPa.s with from 0.3 to 7 parts by weight, such as from 0.5 to 5 parts by weight, of an amphiphilic copolymer including hydrophobic polydiorganosiloxane blocks and hydrophilic poly(ethylene oxide), poly(propylene oxide) or ethylene oxide and propylene oxide copolymer blocks, until a homogeneous blend of HCR base and amphiphilic copolymer is obtained, (b) the shaping of the homogeneous blend obtained, and (c) the curing of the shaped blend by heating or irradiation. It also relates to a piece, in particular a tube, manufactured according to this process and to a device comprising such a tube.

Abstract: Optical assemblies comprising an optical device and a composition comprising a resin-linear organosiloxane block copolymer are disclosed. In some embodiments, the organosiloxane block copolymers has a weight average molecular weight of at least 20,000 g/mole and includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R2—SiO3/2] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups. R1 is independently a C1 to C30 hydrocarbyl and R2 is independently a C1 to C20 hydrocarbyl. At least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains. Each linear block is linked to at least one non-linear block.

Abstract: A composition of matter comprising an interpenetrating polymer network of a combination of a silanol-containing polysiloxane phase and a silylated triglyceride oil phase. The two phases are mixed and covalently bound to each other via siloxane crosslinks. A method for producing interpenetrating polymer networks. The method comprises providing triglycerides from oils or fats and reacting the triglycerides with a reactive silane to form a silylated triglyceride oil. The silylated triglyceride oil and a silanol terminated polysiloxane are emulsified with water in a predetermined ratio. Thereafter, crosslinking agents are added and the water is removed from the emulsions providing siloxane crosslinks between the two intimately mixed immiscible phases.

Abstract: A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.

Abstract: A light guide has a transmission of greater than 90 percent, a refractive index greater than 1.4, and less than 10 haze percent. The light guide also includes an organosiloxane block copolymer having a weight average molecular weight of at least 20,000 g/mole. The organosiloxane block copolymer includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups [?SiOH]. R1 is independently a C1 to C30 hydrocarbyl and R2 is independently a C1 to C20 hydrocarbyl. Moreover, at least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: The invention relates to a composition for taking dental impressions, the composition comprising a siloxane component (A) comprising terminal vinyl groups, a siloxane component (B) comprising Si—H groups, a catalyst (C) being able to catalyze a curing reaction between components (A) and (B) and a silicone oil (D), wherein the silicone oil has a viscosity at 23 DEG C of at least about 600,000 mPa*s and is present in an amount from about 1 to about 20 wt.% with respect to the weight of the whole composition. The invention also relates to a method of producing such a composition and a method for adjusting the Shore hardness A of a composition.

Abstract: A curable silicone composition comprising: (A) (A1) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A1) and (A2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.

Abstract: Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

Abstract: A method for controlling morphology of a silicone organic block copolymer includes adding an MQ resin to the silicone organic block copolymer and annealing. The method is useful for forming thin films, which are useful in electronic device fabrication. The method is also useful for forming adhesives, release coatings, and reversible elastomers.

Abstract: The present invention is: a curable composition comprising a component (A) and a component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:40, the component (A) being a silane compound copolymer that is represented by a formula (a-1), and has a weight average molecular weight of 800 to 30,000, (CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZO2/2)o(R2SiZO2/2)p(CHR1X0-D-SiZ2O1/2)q(R2SiZ2O1/2)r??(a-1) wherein R1 is a hydrogen atom, etc., X0 is a halogen atom, etc., D is a single bond, etc., R2 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, etc., Z is a hydroxyl group, etc., m and n are independently a positive integer, and o, p, q, and r are independently 0 or a positive integer, and the component (B) being a silane coupling agent that includes a nitrogen atom in its molecule.

Abstract: A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.

Abstract: An airbag comprises a textile substrate and a coating on at least a portion of the surface of the substrate. An airbag module comprises an airbag, a gas generator connected to the airbag, and a cover at least partially enclosing the airbag and the gas generator. A process for producing an airbag comprises the steps of providing a textile substrate, providing a coating composition, applying the coating composition to the substrate, and heating the textile substrate. A system for producing a filled, cross-linked silicone polymer comprises a first part and a second part. Each part comprises a polysiloxane compound and a plurality of filler particles.

Abstract: A self-adhesive silicone rubber composition includes a silicone rubber forming base and at least one adhesive agent mixed in the silicone rubber forming base prior to curing of the silicone rubber forming base.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.

Abstract: A light guide has a transmission of greater than 90 percent, a refractive index greater than 1.4, and less than 10 haze percent. The light guide also includes an organosiloxane block copolymer having a weight average molecular weight of at least 20,000 g/mole. The organosiloxane block copolymer includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups [?SiOH]. R1 is independently a C1 to C30 hydrocarbyl and R2 is independently a C1 to C20 hydrocarbyl. Moreover, at least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains.

Abstract: Hot melt adhesive compositions are disclosed containing the reaction product of a resin linear organosiloxane block copolymer and an organosilane capping agent containing hydrolyzable groups.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: The present invention provides a curable resin composition including: a composite resin (A) in which a polysiloxane segment (a1), which has a structural unit represented by a general formula (1) and/or a general formula (2) as well as having a silanol group and/or a hydrolyzable silyl group, and a vinyl-based polymer segment (a2) having an alcoholic hydroxyl group are bound to each other through a bond represented by a general formula (3); and a polyisocyanate (B), wherein the content of said polysiloxane segment (a1) is from 10 to 60% by weight with respect to the total solid content of the curable resin composition, and the content of the polyisocyanate (B) is from 5 to 50% by weight with respect to the total solid content of the curable resin composition.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting a silanol terminated linear organosiloxane and an organosiloxane resin containing hydrolyzable groups to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked to sufficiently increase the average molecular weight of the resin-ituted organosiloxane block copolymer by at least 50%. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable.

Abstract: A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.

Abstract: A phosphosiloxane resin comprises a plurality of covalently bonded monomer units selected from phosphosiloxane units SiR23—O—P(?O)(R1)—(OR3)q(O1/2—)p and organosiloxane units R2m(OR3)nSiO(4-m-n)/2. R1 and each R2 are independently selected from the group consisting of hydrogen, C1 to C10 hydrocarbyl, and C1 to C10 hydrocarbylene; each R3 is independently selected from the group consisting of hydrogen and C1 to C10 hydrocarbyl; p is 0 or 1; q=1?p; m is 0, 1, 2, 3, or 4; n is 0, 1, or 2; and m+n is 0, 1, 2, 3, or 4. Curable silicone compositions comprise a phosphosiloxane resin having greater than one silicon-bonded alkenyl group, an organosilicon compound having at least two silicon-bonded hydrogen atoms, and a hydrosilylation catalyst. Fiber-reinforced free-standing films may comprise fibers dispersed in a cured product of the silicone composition. Laminated substrates comprise at least one fiber-reinforced free-standing film.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting in a first step an endcapped linear organosiloxane and an organosiloxane resin to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked in a second step to sufficiently increase the average molecular weight of the resin-linear organosiloxane block copolymer by at least 50%. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a tensile strength greater than 1.0 MPa and a % elongation at break greater than 40%. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiO2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, the trisiloxy units [R2SiO3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a refractive index greater than 1.5. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiC2/2] 9 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiC2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiC2/2] per linear block, the trisiloxy units [R12SiC3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: Curable compositions include at least one polydiorganosiloxane with at least two hydroxysilyl moieties, at least one hydroxyl-functional polyorganosiloxane resin, and at least one photoactivatable composition that, upon exposure to radiation, generates at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes. The curable compositions can be coated on substrates and cured to form coatings, including pressure sensitive adhesives.

Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) a catalyst composition comprising at least one carbene; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: An object of the present invention is to provide a curable composition that provides high hardness and can be used in adhesives and coating agents. This object can be achieved by a curable composition containing: 100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 1.3 to 5 reactive silyl groups per molecule; and 0 to 40 parts by weight of a plasticizer (C). This curable composition is suitable for flooring adhesives and tile adhesives, which require high hardness.

Abstract: Aqueous emulsions of organopolysiloxanes functionalized with a limited amount of aminoalkyl-functional end groups and silicone resins are storage stable, yet capable of adequate crosslinking upon application to substances to be hydrophobicized.