Abstract: A curable composition of ionic silicones includes a silicone having the formula M1aM2bM3cD1dD2eD3fT1gT2hT3iQj having ionic groups and crosslinking functional groups. The composition can further include polyorganosiloxane having the average compositional formula R26nR27o(OH)pSiO(4-n-o-p)/2, organohydrogenoligosiloxane or organohydrogenpolysiloxane that has the average compositional formula HqR28rSiO(4-q-r)/2 a transition metal catalyst and other components such as UV stabilizer, cure accelerator, pigment, dye, antimicrobial agent, biocide, surfactant, functional or non-functional filler, conductive filler, finely divided surface treated/untreated metal oxides, clay, plasticizers, tackifiers, mold release agents, adhesion promoters, compatibilizers, pharmaceutical excipients, surfactants or antistatic agents.

Abstract: Polydiorganosiloxane polyoxamide, linear, block copolymers and methods of making the copolymers are provided. The method of making the copolymers involves reacting a diamine with a polydiorganosiloxane precursor having oxalylamino groups. The polydioroganosiloxane polyoxamide block copolymers are of the (AB)n type.

Abstract: The present invention provides for textiles treated with a composition comprising the reaction product of e) an oxirane or oxetane compound comprising at least two oxirane or oxetane groups; and f) an amino silane having the formula: N(H)(R1)R2Si(OR3)3-a-b-c(OR4)a(R5Si(OR6)d(R7)e)bR8c with R1 is chosen from the group consisting of H or a monovalent hydrocarbon radical containing one to 20 carbon atoms; R2 and R5 are independently selected from a group consisting of oxygen or a divalent linear or branched hydrocarbon radical consisting of 1-60 carbons; R4 is a hydrocarbon radical that contains 3 to 200 carbon atoms; R3, R6, R7, and R8 and are each independently selected from the group of monovalent linear or branched hydrocarbon radicals having from 1 to 200 carbon atoms; the subscript b is zero or a positive number and has a value ranging from 0 to 3; the subscripts a, and c are zero or positive and have a value ranging from 0 to 3 subject to the limitation that (a+b+c)?3; and the subscripts d and e ar

Abstract: A two-component silicone composition that includes a component A that includes i) at least one hydroxyl-group-terminated polydiorganosiloxane P; ii) at least one catalyst K for the cross-linking of polydiorganosiloxanes; and a component B that includes i?) at least one cross-linking agent for polydiorganosiloxanes. Compositions can be used as adhesives, sealants, coatings or as casting compounds and can be distinguished by a very long shelf life.

Abstract: Provided is a silicon-containing curable composition which includes a prepolymer (A) containing two or more Si—H groups in one molecule, which is obtained by subjecting one or more kinds of a cyclic siloxane compound (?) represented the following formula (1) and one or more kinds of a compound (?) represented by the following formula (2), to a hydrosilylation reaction; a cyclic siloxane compound (B) containing, in one molecule, two or more carbon-carbon double bonds that are reactive with Si—H groups; a polysiloxane compound (C) which is different from the prepolymer (A) and the cyclic siloxane compound (B); and a hydrosilylation catalyst (D). In formula (1), R1 to R3 each represent an alkyl group having 1 to 6 carbon atoms, or a phenyl group; a represents a number from 2 to 10; and b represents a number from 0 to 8. In formula (2), n represents the number 1 or 2.

Abstract: The present disclosure describes compounds of Formula (I) wherein m is 1 to 6, n is 6 to 10 and R1 is a straight or branch chain siloxane, their use in methods to modify the surface of hydrophobic substrates to render the substrates superhydrophilic and surface-modified substrates.

Abstract: A polysiloxane resin composition contains: a first polysiloxane having an average compositional formula of R4a(OR5)b(OH)cSiO(4-a-b-c)/2; a second polysiloxane different from the first polysiloxane and selected from cyclic polysiloxane, linear polysiloxane with a weight average molecular weight of less than 3000, and a combination thereof; a white pigment; an inorganic filler; and a catalyst.

Abstract: A condensation reaction curable composition comprises a silyl phosphate catalyst, and a polyorganosiloxane polyoxyalkylene block copolymer having one or more polyorganosiloxane blocks and one or more polyoxyalkylene blocks linked to each other via divalent radicals which comprises at least two silicon-bonded alkoxy groups, preferably of the form PS-(A-PO)m-(A-PS)n, wherein PO is a polyoxyalkylene block, PS represents a polyorganosiloxane block, A is a divalent radical, subscripts m and n have independently a value of at least 1, comprising at least one alkoxy-substituted siloxane unit of the formula (R?)q(OR)—SiO3-q/2, wherein R represents an alkyl group having 1 to 4 carbon atoms and each R? represents an alkyl group having 1 to 6 carbon atoms, a phenyl group, or an alkoxy group of the formula —OR and subscript q has a value of 0, 1 or 2, provided at least two silicon-bonded groups OR are present in the block copolymer.

Abstract: The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

Abstract: Disclosed is a millable type silicone rubber composition including as an essential components: (A) 100 parts by weight of an organopolysiloxane represented by the following average compositional formula (I) and having a polymerization degree of at least 100; R1aSiO(4-a)/2??(I) wherein R1 are, identical or different, unsubstituted or substituted monovalent hydrocarbon groups, and a is a positive number of 1.95 to 2.05; (B) 70 to 150 parts by weight of fumed silica having a specific surface area of more than 200 m2/g; (C) 0.1 to 30 parts by weight of an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule; and (D) 0.1 to 10 parts by weight of a hydrosilylation reaction catalyst.

Abstract: A composition is capable of curing via condensation reaction. The composition uses a phosphate condensation reaction catalyst. The phosphate condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, or rubber.

Abstract: A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIM1 and TIM2 applications.

Abstract: A first silicone resin composition is prepared by allowing an organopolysiloxane containing silanol groups at both ends containing silanol groups at both ends of a molecule and a silicon compound containing, in one molecule, at least two leaving groups leaving by a condensation reaction with the silanol groups to undergo the condensation reaction in the presence of a condensation catalyst. The silicon compound contains a trifunctional silicon compound containing, in one molecule, the three leaving groups and a bifunctional silicon compound containing, in one molecule, the two leaving groups.

Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.

Abstract: A silicone acrylate hybrid composition includes the reaction product of a silicon-containing pressure sensitive adhesive composition, an ethylenically unsaturated monomer, and an initiator. The silicon-containing pressure sensitive adhesive composition includes acrylate or methacrylate functionality. A method of making the hybrid composition includes polymerizing the ethylenically unsaturated monomer and the silicon-containing pressure sensitive adhesive composition in the presence of the initiator.

Abstract: A method for the manufacture of articles of thiol-ene polymers comprises the steps: a) reacting a compound comprising at least two thiol groups and a compound comprising at least two carbon-carbon double bonds, in off stochiometry ratios to obtain a first intermediate article, wherein said first intermediate article comprises at least one unreacted group selected from an unreacted thiol group and an unreacted carbon-carbon double bond, and b) contacting said first intermediate article with a second article, wherein the surface of said second article at least partially comprises reactive groups and reacting at least a part of said unreacted groups on said first intermediate article with chemical groups on said second article to obtain covalent bonds and forming a final article.

Abstract: Polymer electrolytes offer increased safety and stability as compared to liquid electrolytes, yet there are a number of new challenges that polymer electrolytes introduce. A polymer electrolyte, as disclosed herein, is a block copolymer that has a block that provides mechanical strength and a novel, ionically-conductive polymer block with a backbone that is both highly flexible and highly conductive with high conductivity pendant chains attached, thus increasing the concentration of lithium coordination sites and improving ionic conductivity. Previous strategies for comb-type conductive polymers have focused on attaching either conductive pendant chains to a flexible non-conductive backbone or conductive pendant groups to a marginally flexible conductive backbone.

Abstract: According to one embodiment, a polymeric material includes at least one polydimethylsiloxane (PDMS) polymer, and at least one polyhedral oligomericsilsequioxane (POSS) molecule. According to another embodiment, a method includes providing at least one polydimethylsiloxane (PDMS) polymer, providing at least one polyhedral oligomericsilsequioxane (POSS) molecule, and coupling the at least one PDSM polymer to the at least one POSS molecule to form a hybrid polymeric material.

Abstract: A polyorganosiloxane polyoxyalkylene block copolymer having one or more polyorganosiloxane blocks and one or more polyoxyalkylene blocks linked to each other via divalent radicals which comprises at least two silicon-bonded alkoxy groups, preferably of the form PS (A PO)m (A PS)n, wherein PO is a polyoxyalkylene block, PS represents a polyorganosiloxane block, A is a divalent radical, m and n have independently a value of at least 1, comprising at least one alkoxy-substituted siloxane unit of the formula (R?)q(OR)—SiO3?q/2 ?, wherein R represents an alkyl group having 1 to 4 carbon atoms and each R? represents an alkyl group having 1 to 6 carbon atoms, a phenyl group, or an alkoxy group of the formula —OR and q has a value of 0, 1 or 2, provided at least two silicon-bonded groups OR are present in the block copolymer.

Abstract: A thermosetting composition containing an aluminosiloxane and an epoxy silicone. The thermosetting composition of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Abstract: Provided are poly(ferrocenyl)silane based network polymers, methods of preparing the same, and films including the poly(ferrocenyl)silane based network polymers. The network polymers have a steric network structure and are prepared by using a simplified process.

Abstract: Toughened polymeric materials and methods of forming toughened polymeric materials are provided herein. In some embodiments, a method of forming toughened polymeric materials may include preparing a branched polymeric additive; mixing the branched polymeric additive with a polymer to form a polymeric mixture, wherein the branched polymeric molecule either mixes and/or bonds with the polymer to reduce mobility in the polymer; and curing the polymeric mixture. In some embodiments, a toughened polymeric material comprises a polymer network; and a branched polymeric molecule bonded to the polymer network.

Abstract: Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized silicone materials may be used. Exemplary cured materials include silicone pressure sensitive adhesives, silicone foams, and non-tacky silicone films.

Abstract: This invention provides a single phase silicone acrylate formulation that resists phase separation and includes (A) at least one of a silicone, an acrylate, and combinations thereof. The single phase silicone acrylate formulation also includes (B) a silicone acrylate hybrid compatibilizing agent including silicone functionality and (meth)acrylate functionality and that is the reaction product of a silicon-containing pressure sensitive adhesive composition, a (meth)acrylate, and an initiator. A method of minimizing phase separation of the single phase silicone acrylate formulation includes the step of combining (A) and (B) to form the single phase silicone acrylate formulation.

Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.

Abstract: An organic polymer, having a number-average molecular weight of 800 to 15,000, and comprising 0.5 or more but less than 1.2 reactive silicon groups in each molecule of the polymer on average, in which the reactive silicon groups are introduced into one-side out of terminals thereof, and heightening, in particular, the proportion of molecules (of the polymer) into each of which the silicon group is introduced.

Abstract: A resin composition is provided that includes two or more types of compounds selected from the group consisting of (Component A) a compound comprising a silicon atom having a total of one or two alkoxy and hydroxy groups, (Component B) a compound comprising a silicon atom having a total of three alkoxy and hydroxy groups, and (Component C) a compound comprising a silicon atom having a total of four alkoxy and hydroxy groups. There are also provided a relief printing plate precursor that includes a relief-forming layer formed from the resin composition, a process for producing a relief printing plate precursor that includes a layer formation step of forming a relief-forming layer from the resin composition and a crosslinking step of thermally crosslinking the relief-forming layer so as to form a crosslinked relief-forming layer.

Abstract: The present invention relates to a composition for thermosetting silicone resin including: (1) a dual-end silanol type silicone resin represented by formula (I) in which R1 represents a monovalent hydrocarbon group, and n is an integer of 20 to 10,000, provided that all R1 groups may be the same or different; (2) a trialkoxysilane; and (3) a condensation catalyst.

Abstract: A room temperature curable organopolysiloxane composition is provided. The composition comprises (I) an organopolysiloxane which is a condensation product of component (A) (an organopolysiloxane comprising R3SiO1/2 unit and SiO4/2 unit and containing 0.02 to 0.12 mol/100 g of hydroxy group bonded to the silicon atom) and component (B) (a diorganopolysiloxane raw rubber having hydroxy group on opposite ends thereof), (II) an organosilane compound having at least 2 hydrolyzable groups bonded to the silicon atom on average per molecule, and/or its partial hydrolytic condensate, (III) a solvent, and (IV) a silica nano particle having its surface modified by a branch structure. The composition is capable of providing a high strength film without incorporating reinforcement fillers, with no curing inhibition by the inorganic nano particles, and without inhibiting gas separation performance realized by the inorganic nano particles.

Abstract: The present invention relates to a polymer which has an electronic dipole covalently bonded to the polymer structure. The polymer structure forming the basis of the polymer is in particular an elastomer which can be unbranched, or also branched or crosslinked. The present invention equally describes a method for bonding a dipole molecule to a corresponding polymer structure or elastomer structure. The polymer in accordance with the invention can be present as a pure substance or also as a mixture with any other polymers, preferably with further elastomers. Uses of the polymer or of the obtained polymer blend will equally be provided.

Abstract: Electron beam and gamma radiation crosslinked, silicone gel adhesives are described. Both nonfunctional and functional poly diorganosiloxanes are used. Methods of forming the adhesives, and medical articles incorporating such adhesives are also described.

Abstract: Organosiloxane block copolymers, curable compositions, and solid compositions derived from these block copolymers are disclosed. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12—SiO2/2] 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiO2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, the trisiloxy units [R2SiO3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: The present invention relates to a composition comprising (i) a crosslinkable polyolefin with hydrolysable silane groups (A), (ii) a silanol condensation catalyst (B) of the formula Ar(SO3H)x as defined herein, and (iii) a silicon containing compound (C) selected from the group consisting of 3-ureidopropyltrimethoxysilane, N-trimethoxysilylmethyl-O-methylcarbamate, and mixtures thereof; to an article, in particular a wire or cable, comprising such a composition, and to the use of such a composition for producing the article. The present invention further relates to the use of silicon containing compound (C) as a processing aid in the compounding of polyolefin compositions and as a surface smoothening agent in polyolefin compositions.

Abstract: A method for controlling morphology of a silicone organic block copolymer includes adding an MQ resin to the silicone organic block copolymer and annealing. The method is useful for forming thin films, which are useful in electronic device fabrication. The method is also useful for forming adhesives, release coatings, and reversible elastomers.

Abstract: Gels having viscoelastic qualities, physical stability and adhesive properties, well suited for a wide variety of end applications, are prepared by crosslinking, by hydrosilylation, silicone compositions which contain: a polyorganosiloxanes POS (I) of SiH type; a polyorganosiloxanes POS (II) of SiVi type (Vi=vinyl); a polyorganosiloxanes POS (III) of monofunctional SiVi type; a platinum-based catalyst (D); and optionally, a polyorganosiloxanes POS (IV) of polydimethylsiloxane type.

Abstract: A polymer comprising a siloxane polymer having at least one Si—OH group and at least one Si—OR group, where R is condensation stabilizing group optionally having a reactive functional group, wherein the siloxane polymer, when placed into a solvent, has a weight average molecular weight increase of less than or equal to 50% after aging for one week at 40° C. as measured by GPC is provided.

Abstract: An encapsulated material composition is presented, which contains a compound of Chemical Formula I and a compound of Chemical Formula II, and has high refractive index due to the cycloalkane structure in the compound of Chemical Formula I and the compound of Chemical Formula II. Therefore, when the encapsulated material composition is applied in the light emitting diode (LCD) encapsulated structure, the light extraction efficiency of the LED encapsulated structure is effectively enhanced.

Abstract: A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent.

Abstract: A silicon composition with a silicon compound represented by Formula 1 and a silicon compound represented by Formula 2: wherein, R1, R2, R3, R4, R11, R12, R13, R14, R15, R16, R17, R18, and R19 are each independently a C1-C4 alkyl group, R5, R6, R7, R8, R9, and R10 are each independently hydrogen or deuterium, k, m, and n are positive integers, and the ratio of k to the sum of m and n is from about 1:0.001 to about 1:0.2; and an organic light emitting device including the same.

Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:

Abstract: A method of manufacturing a composite composition, having: bonding a dispersant to the surfaces of inorganic oxide particles to provide dispersibility in a hydrophobic solvent to the inorganic oxide particles, and then dispersing the inorganic oxide particles in a hydrophobic solvent; substituting the dispersant bonded to the surfaces of the inorganic oxide particles with a surface modifier, which is a polydimethylsiloxane-skeleton polymer having one functional group at one terminal end, in the hydrophobic solvent in which the organic oxide particles are dispersed to bond the functional group of the polydimethylsiloxane-skeleton polymer to the surfaces of the inorganic oxide particles; and conjugating a silicone resin and the inorganic oxide particles obtained in the previous step, wherein the surface thereof is modified by bonding the polydimethylsiloxane-skeleton polymer having one functional group at one terminal end thereof, to obtain a composite composition.

Abstract: Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 ?m, wherein the organopolysiloxane particle is a polymer of the general formula (R3SiO1/2)W(R2SiO2/2)X—(RSiO3/2)Y—(SiO4/2)Z, where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.

Abstract: A bodied siloxane resin comprises M, Q, and T-propyl units and is capped with additional M units. The bodied siloxane resin contains less silanol groups than the bodied siloxane resin before being capped with additional M units.

Abstract: Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.

Abstract: Polydiorganosiloxane polyoxamide, linear, block copolymers and methods of making the copolymers are provided. The method of making the copolymers involves reacting a diamine with a polydiorganosiloxane precursor having oxalylamino groups. The polydioroganosiloxane polyoxamide block copolymers are of the (AB)n type.

Abstract: A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important.

Abstract: A method for preparation of a molecular recognition element comprising the steps of binding a template to a surface of a carrier material, providing a recognition material to the surface of the carrier material, initiating polymerization of the recognition material on the surface of the carrier material, stopping the polymerization of the recognition material on the surface of the carrier material, and releasing the template from the surface of the carrier material and the polymerized recognition material. The method is characterized as an aim size of individual imprints is predefined, and the polymerization of the recognition material on the surface of the carrier material is stopped when a size of individual imprints of the polymerized recognition material essentially equals the predefined aim size. This method is readily applicable for preparation of a molecular recognition element useful as a drug, catalyst, competitive affinity ligand inhibitor, competitor, agonist, antagonist or diagnostic agent.

Abstract: Aqueous suspensions of silicate shell microcapsules are disclosed wherein a first portion of the silicate shell micro-capsules contain an organopolysiloxane having at least two alkenyl groups and a hydrosilylation catalyst as Part A of a curable siloxane composition, and a second portion of the silicate shell microcapsules contain an organohydrogensiloxane as Part B of the curable siloxane composition.

Abstract: A curable composition comprises (a) at least one inorganic or organic compound comprising reactive silane functionality comprising at least one hydrosilyl moiety; (b) at least one inorganic or organic compound comprising reactive silane functionality comprising at least one hydroxysilyl moiety, the hydroxysilyl moiety optionally being generated in situ by hydrolysis of at least one hydrosilyl moiety; and (c) at least one photoactivatable composition that, upon exposure to radiation, generates at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof; with the proviso that, when component (a) is an organic polymer, then component (b) is different from component (a) and is not generated in situ by hydrolysis of component (a).

Abstract: Copper complexes of aminoorgano group-containing organosilicon compounds exhibit high thermal stability and can be used to impart thermal stability to a wide variety of polymer compositions. The complexes are particularly useful as constituents of xerographic rollers and fuser oils, and are simply and economically prepared.