Wherein One Of Said Silicon Materials Contains Si-h Bond Patents (Class 525/478)
  • Patent number: 10729622
    Abstract: A process for taking a dental impression and/or conducting a dental retraction. The process includes the steps of: (a) providing a composition (A) having the consistency (a1), composition (A) including curable components, and a catalyst suitable to initiate or catalyze the curing of the curable components, composition (A) being contained in a device, (b) applying a portion (I) of composition (A) with a consistency (a2) into the sulcus of a tooth, (c) applying a portion (II) of composition (A) with a consistency (a1) in contact with composition (A) applied in step (b), (d) removing portion (I) together with portion (II) of composition (A) from the surface of the tooth, consistency (a2) being higher than consistency (a1).
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: August 4, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Andreas R. Maurer, Joachim W. Zech, Christoph Schulte, Peter U. Osswald, Rudolf Schmid, Hendrik Grupp, Marc Peuker, Helmut Pauser, Manfred Harre, Andreas J. Boehm
  • Patent number: 10414136
    Abstract: Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: September 17, 2019
    Assignee: Shengyi Technology Co., Ltd.
    Inventors: Xiaosheng Su, Suwen Ye, Guofang Tang
  • Patent number: 10113036
    Abstract: Provided are: a crosslinked organopolysiloxane which has properties intermediate between a dimethylpolysiloxane oil and a gel-like crosslinked siloxane; and a method for producing the crosslinked organopolysiloxane. An oil-like organopolysiloxane which is produced by: adding a compound having a siloxane unit represented by formula (3) to a gel-like silicone, wherein the gel-like silicone is produced by a hydrosilylation reaction of an organopolysiloxane having an alkenyl group with an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom in the presence of a platinum-group metal catalyst; and then equilibrating the resultant product with an acid or alkali catalyst. R12SiO2/2??(3) (R1 represents a group selected from a monovalent hydrocarbon group having no aliphatic unsaturated bond and an alkenyl group represented by the formula: —(CH2)a—CH?CH2 (wherein a represents a numerical value of 0 to 6), and the average polymerization degree of formula (3) is 3 to 2,000.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: October 30, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Toshiaki Ihara
  • Patent number: 10066137
    Abstract: The disclosed embodiments include an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured product thereof is greater than A30 and less than A65. The composition comprises: (A1) solid 3D organopolysiloxane having an R13SiO1/2 unit and an SiO4/2 unit; (A2) liquid straight-chain organopolysiloxane having an R13SiO1/2 unit and an R22SiO2/2 unit; the mixing viscosity of component (A1) and (A2) is between 6,000 and 20,000 mPa·s; (B) liquid straight-chain polyorganohydrosiloxane having an R33SiO1/2 unit and an R42SiO2/2 unit; (C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group; (D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition. The composition of the present invention and the cured semiconductor component thereof have good heat resistance, good adhesiveness with aluminum having a mirror finish and ceramic substrate, and good resistance to humidity.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: September 4, 2018
    Assignee: GUANGZHOU HUMAN CHEM CO., LTD.
    Inventors: Haiting Zheng, Hai He, Jingwei Zhu, Guangyan Huang
  • Patent number: 10022396
    Abstract: Compositions and methods useful in treating dermatological disorders are described. The methods include applying to the skin a composition comprising a reactive reinforcing component and a cross-linking component, wherein the cross-linking component facilitates a reaction to form a film in situ on the skin.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: July 17, 2018
    Assignee: Shiseido Americas Corporation
    Inventors: Betty Yu, Joseph Lomakin, Soo-Young Kang, Benjamin W. Adams
  • Patent number: 9963551
    Abstract: A curable organopolysiloxane composition and a semiconductor device are described. In a cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition includes: (A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: May 8, 2018
    Assignee: GUANGZHOU HUMAN CHEM CO., LTD.
    Inventors: Hai He, Wang Chen, Haiting Zheng, Jingwei Zhu, Guangyan Huang
  • Patent number: 9954152
    Abstract: A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms are substantially only silicon atoms to which three oxygen atoms are bonded. The heat curing satisfies 5<a?b<20, in which “a cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 1,000 to 1,050 cm?1 of the silicone resin before the heat curing and “b cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 950 to 1,050 cm?1 of the silicone resin composition after the heat curing.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 24, 2018
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Gaku Yoshikawa, Masayuki Takashima
  • Patent number: 9902856
    Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: February 27, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takayuki Kusunoki, Yuusuke Takamizawa, Yoshihira Hamamoto, Kinya Kodama
  • Patent number: 9859474
    Abstract: An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: January 2, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takayuki Kusunoki, Hiroyuki Iguchi
  • Patent number: 9758694
    Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: September 12, 2017
    Assignee: Central Glass Company, Limited
    Inventors: Masafumi Oda, Junya Nakatsuji, Yutaka Sugita, Tsuyoshi Ogawa
  • Patent number: 9475969
    Abstract: The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: October 25, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takafumi Sakamoto, Takahiro Yamaguchi, Tetsuro Yamada
  • Patent number: 9346954
    Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: May 24, 2016
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Emi Kim, Yoshihito Takei, Tsubasa Ito, Kazunori Ishikawa
  • Patent number: 9339591
    Abstract: Embolization, as well as related particles, compositions, and methods, are disclosed.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: May 17, 2016
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Paul DiCarlo, Thomas V. Casey, II, Stephan P. Mangin
  • Patent number: 9340649
    Abstract: A polyorganosiloxane resin represented by the following general formula (5): (R3SiO1/2)l?(R2SiO2/2)m?(RSiO3/2)n?(SiO4/2)o? (5) wherein R is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group having 1 to 18 carbon atoms, and optionally having an oxygen, halogen, nitrogen or sulfur atom; l?, m? and o? are, independently of each other, an integer of from 0 to 10,000; n? is an integer of from 1 to 10,000; a total of l?, m? and n? is from 2 to 30,000; and at least one R is a hydrogen atom and at least one R is an —OX group in the molecule, wherein X is an alkyl group having 1 to 10 carbon atoms or an alkoxyalkyl group having 2 to 10 carbon atoms; and at least one hydrogen atom and at least one —OX group bond to one and the same silicon atom.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: May 17, 2016
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takayuki Kusunoki, Tsutomu Kashiwagi
  • Patent number: 9321936
    Abstract: An addition curable silicone emulsion release composition suitable for forming a releasable film having a high releasability to a pressure sensitive adhesives simultaneously with good adhesion to a plastic film substrate is provided. A release film prepared by coating and curing such composition on a plastic film is also provided. The good adhesion and the high releasability to acryl pressure sensitive adhesives are realized despite the low content of the organopolysiloxane containing a large amount of trifunctional siloxane units and alkenyl groups which had been used for realizing the adhesion. The addition curable silicone emulsion release composition is prepared by blending predetermined proportion of mixtures of high molecular weight organopolysiloxanes each containing an alkenyl group and phenyl group at particular ratio.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: April 26, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Nakajima, Shinji Irifune, Kenji Yamamoto
  • Patent number: 9312196
    Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: April 12, 2016
    Assignee: DOW CORNING TORAY CO., LTD.
    Inventors: Tomohiro Iimura, Michitaka Suto, Kazuhiro Nishijima, Kasumi Takeuchi, Haruhiko Furukawa, Yoshitsugu Morita
  • Patent number: 9306133
    Abstract: An optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, the addition curing silicone resin composition having (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups per molecule and an aryl group, the organohydrogenpolysiloxane that contains 30 mol % or more of an HR2SiO0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: April 5, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihira Hamamoto, Manabu Ueno, Tsutomu Kashiwagi
  • Patent number: 9249302
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: February 2, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Kyung Mi Kim, Young Ju Park, Jae Ho Jung, Min A Yu, Min Kyoun Kim
  • Patent number: 9243143
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: January 26, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Kyung Mi Kim, Young Ju Park, Bum Gyu Choi, Dae Ho Kang, Byung Kyu Cho, You Na Yang
  • Patent number: 9226903
    Abstract: The invention relates to a transdermal therapeutic system which comprises a backing layer, an adhesive layer, a polymer layer and a removable protective layer. The adhesive layer is an organosiloxane layer and is anchored in the backing layer by siliconization.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: January 5, 2016
    Assignee: LTS Lohmann Therapie-Systeme AG
    Inventors: Walter Mueller, Johannes Leonhard
  • Patent number: 9068077
    Abstract: A light-conversion flexible polymer material consists of an organic silicone rubber (bi-component addition thermal vulcanizing liquid silicone rubber, 20.0-75.0%), a diluting agent (silicone oil, 10.0-20.0%), a luminescent material (one or more of aluminate, silicate, siliconitride and oxysulfide luminescent materials, 15.0-65.0%) and auxiliary. The polymer material can be bent randomly as required. The polymer material is made by mixing raw materials uniformly in a blending container, inpouring the obtained mixture into a mold and thermal-curing. The polymer material is used on the surface of a blue-light LED and the luminescent material in the light-conversion flexible polymer material can be excitated by light emitted from the blue light LED to give out light, which is combined with residual blue light into white light. The polymer material can be widely used in light-source devices such as lamp, nixie tube and backlight.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: June 30, 2015
    Assignee: Dalian Luminglight Co., Ltd.
    Inventors: Zhiguo Xiao, Ying Chang, Yulong Sui, Yuening Wu, Maolong Li
  • Publication number: 20150144987
    Abstract: One purpose is to provide a silicone resin composition which provides a cured product having a large Abbe's number and a high brightness. A silicone resin composition including (A-1) an organopolysiloxane having a three-dimensional crosslinked structure, at least two alkenyl groups, and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (A-2) a linear organopolysiloxane having alkenyl groups at at least both terminals of a molecular chain and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (B-1) a linear organohydrogen polysiloxane having at least one silphenylene skeleton in a molecular chain and hydrosilyl groups at least both terminals of the molecular chain, in an amount such that a ratio of the number of the hydrosilyl groups in component (B-1) to a total number of the alkenyl groups in components (A-1) and (A-2) is 0.5 to 2, and (C) a hydrosilylation catalyst in a catalytic amount.
    Type: Application
    Filed: November 18, 2014
    Publication date: May 28, 2015
    Inventors: Yoshihira HAMAMOTO, Tsutomu KASHIWAGI
  • Publication number: 20150137171
    Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.
    Type: Application
    Filed: January 27, 2015
    Publication date: May 21, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
  • Publication number: 20150124338
    Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.
    Type: Application
    Filed: November 4, 2014
    Publication date: May 7, 2015
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuka MAYUMI, Masayuki IKENO
  • Patent number: 9018777
    Abstract: An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: April 28, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Sang Ki Chun, In Seok Hwang, Dong-Wook Lee, Ji Young Hwang
  • Patent number: 9012586
    Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: April 21, 2015
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Makoto Yoshitake, Mieko Yamakawa
  • Patent number: 9006357
    Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) a catalyst composition comprising (1) at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof, and (2) at least one Lewis acid; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 14, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Yu Yang, George G. I. Moore, James T. Wolter, Kanta Kumar, Michael A. Semonick, John L. Battiste
  • Publication number: 20150087791
    Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.
    Type: Application
    Filed: December 8, 2014
    Publication date: March 26, 2015
    Inventors: Shengqian Kong, Liwei Zhang, Yong Zhang, Wentao Thomas Xing, Daniel J. Duffy
  • Patent number: 8980973
    Abstract: The invention relates to a composition for taking dental impressions, the composition comprising a siloxane component (A) comprising terminal vinyl groups, a siloxane component (B) comprising Si—H groups, a catalyst (C) being able to catalyze a curing reaction between components (A) and (B) and a silicone oil (D), wherein the silicone oil has a viscosity at 23 DEG C of at least about 600,000 mPa*s and is present in an amount from about 1 to about 20 wt.% with respect to the weight of the whole composition. The invention also relates to a method of producing such a composition and a method for adjusting the Shore hardness A of a composition.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: March 17, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Peter Uwe Osswald, Hyung-Min Shim, Johann Fetz, Joachim Wilhelm Zech, Bernd Kuppermann
  • Publication number: 20150072139
    Abstract: The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.
    Type: Application
    Filed: April 23, 2013
    Publication date: March 12, 2015
    Applicant: Dow Corning Toray Co., Ltd
    Inventors: Yoshitsugu Morita, Shin Yoshida, Syuji Endo
  • Patent number: 8975347
    Abstract: Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: March 10, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Saito, Tomomichi Takatsu
  • Publication number: 20150051356
    Abstract: Amphiphilic organosiloxane block copolymers and methods for making them are disclosed. The compositions incorporate an amphiphilic “linear” segment with a “resinous” segment. For example, a polyether (A) modified PDMS (B) with (AB)n architecture and polydiorganosiloxane with Si—H end-groups can be reacted with a phenyl silsesquioxane resin bearing vinyl functionality to form an amphiphilic resin-linear copolymer.
    Type: Application
    Filed: March 28, 2013
    Publication date: February 19, 2015
    Inventors: Andre Colas, John Bernard Horstman, Steven Swier
  • Patent number: 8957165
    Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: February 17, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Mitsuhiro Iwata, Toshiyuki Ozai, Yukito Kobayashi
  • Patent number: 8952108
    Abstract: A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is ? and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is ?, the ratio of ? and n×? (?:n×?) meets 1:3 to 1:100.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: February 10, 2015
    Assignee: JNC Corporation
    Inventors: Daisuke Inoki, Kiichi Kawabata, Akio Tajima, Takashi Matsuo
  • Patent number: 8946353
    Abstract: A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: February 3, 2015
    Assignee: Dow Corning Toray Co. Ltd.
    Inventors: Makoto Yoshitake, Takashi Sagawa, Masayoshi Terada
  • Patent number: 8946357
    Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: February 3, 2015
    Assignee: JNC Corporation
    Inventors: Kiichi Kawabata, Akio Tajima, Takashi Matsuo, Kiyoshi Sakai, Koichi Ayama
  • Patent number: 8946350
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: February 3, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
  • Patent number: 8937136
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: January 20, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8937131
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: January 20, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
  • Patent number: 8933177
    Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: January 13, 2015
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Seiji Hori, Takateru Yamada, Chung Mien Kuo
  • Patent number: 8921496
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 30, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8916653
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8916654
    Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Publication number: 20140350195
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.
    Type: Application
    Filed: August 13, 2014
    Publication date: November 27, 2014
    Inventors: Min Jin KO, Kyung Mi KIM, Young Ju PARK, Bum Gyu CHOI, Dae Ho KANG, Byung Kyu CHO, You Na YANG
  • Publication number: 20140350194
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.
    Type: Application
    Filed: August 11, 2014
    Publication date: November 27, 2014
    Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min A. YU, Min Kyoun KIM, Byung Kyu CHO
  • Publication number: 20140346550
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.
    Type: Application
    Filed: August 11, 2014
    Publication date: November 27, 2014
    Inventors: Min Jin KO, Kyung Mi KIM, Young Ju PARK, Jae Ho JUNG, Min A YU, Min Kyoun KIM
  • Publication number: 20140346556
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.
    Type: Application
    Filed: August 12, 2014
    Publication date: November 27, 2014
    Inventors: Min Jin Ko, Kyung Mi Kim, Young Ju Park
  • Patent number: 8895662
    Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: November 25, 2014
    Assignee: Eternal Chemical Co., Ltd.
    Inventors: Chih Chiang Yang, Hsin Hung Chen, Wan Hsi Yang, Kwei Wen Liang
  • Patent number: 8895678
    Abstract: A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: November 25, 2014
    Assignee: Dow Corning Toray Co., Ltd.
    Inventor: Makoto Yoshitake
  • Publication number: 20140332987
    Abstract: Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.
    Type: Application
    Filed: December 19, 2012
    Publication date: November 13, 2014
    Inventors: Shigeaki Kamuro, Yasunobu Nakagawa