Abstract: A curable silicone composition is disclosed. The composition comprises: (A) a hydrosilylation-reactive resin-linear block copolymer type organopolysiloxane; (B) an organopolysiloxane resin containing a curing-reactive group having a carbon-carbon double bond in the molecule; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. An absolute value (?RI) of a difference between refractive indices of component (A) and component (B) measured at room temperature is less than 0.05. The curable silicone composition generally has excellent handleability, moldability, and mechanical strength (hardness, in particular) and flexibility of a cured product while achieving high transparency. Also disclosed is a resin sheet for an optical member including the composition or cured product thereof, and a light-emitting device or the like including the composition or cured product thereof.

Abstract: Organopolysiloxane mixtures curable by hydrosilylation include MT organopolysiloxanes having 10 to 20 siloxy units and containing a fraction of 0.15 to 0.24 M units based on total siloxy units in the organopolysiloxane, and a polydispersity of 1.05 to 1.40, a hydrosilylation catalyst, and an Si—H-functional organopolysiloxane are curable to vulcanizates with elastic moduli which may be greater than 0.5 GPa.

Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.

Abstract: A sponge-forming silicone rubber composition is disclosed. The sponge-forming silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) water; (D) a thickener; (E) a surfactant; (F) a silane compound having silicon atom-bonded alkoxy groups, or a partially hydrolyzed condensate thereof; and (G) a hydrosilylation reaction catalyst. The sponge-forming silicone rubber composition forms a silicone rubber sponge. In general, the silicone rubber sponge has excellent water absorption and water retentivity.

Abstract: There is provided an adhesion mediator composition for use in the adhesion of silicone elastomers made from hydrosilylation curable silicone rubber compositions to thermoplastic substrates, especially polyolefin substrates. There is also provided a process for adhering silicone elastomers to thermoplastic substrates using the adhesion mediator composition. The adhesion mediator composition comprises: (i) a trialkoxysilane; (ii) a platinum group metal based hydrosilylation reaction catalyst; (iii) an alkoxy titanium compound; (iv) a tetraalkoxysilane; and (v): either (a?) a polyorganosiloxane containing at least two unsaturated groups; or (b?) a mixture of two or more polyorganosiloxanes containing at least two unsaturated groups.

Abstract: A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule; (B) a branched organopolysiloxane represented by the average unit formula; (C) an organosiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having good mechanical properties and good retention of transparency under conditions of high temperature.

Abstract: A liquid preparation for application to an inner side of a hollow body to produce a sliding layer on a packaging for pharmaceuticals or cosmetic products comprises the following constituents: a reactive silicone system for forming a silicone network of the sliding layer, a catalyst for catalyzing the cross-linking reaction of the reactive silicone system, at least one unreactive silicone oil, and at least one diluent. The diluent comprises a silicon-containing compound and a content of the at least one diluent in the preparation amounts to more than 45 percent by weight and less than 95 percent by weight in the preparation.

Abstract: Embodiments of the present disclosure relate to a backlight unit and a display device, and more particularly, may provide a backlight unit and a display device including the backlight unit having a thin thickness while having excellent optical performance and reliability by including a first protective layer including a first silicone polymer.

Abstract: The present invention relates to an addition-curable silicone rubber composition having self-bonding capability. The addition-curable silicone rubber composition exhibits self-bonding capability in particular to substrates that contain residual hydroxyl groups or other residual hydrosilyl-reacting groups on their surface, including polycarbonate, polyester, polyamide, polysulfone, polyurethane, phenolic resin, epoxy resin, cellulose, glass and the mixture thereof.

Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

Abstract: A silicone pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. The composition cures to form a pressure sensitive adhesive with selective adhesion to different substrates, including urethane foam. The pressure sensitive adhesive composition, pressure sensitive adhesive, and urethane foam article including the pressure sensitive adhesive are useful in electronics applications for the protection of display devices.

Abstract: A solventless silicone pressure sensitive adhesive composition includes: (A) a polydiorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (B) a branched polyorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (C) a polyorganosilicate resin, (D) an olefinic reactive diluent, (E) a polyorganohydrogensiloxane, (F) a hydrosilylation reaction catalyst, and (G) an anchorage additive. This solventless silicone pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Abstract: Approaches are described for coating various flexible media, such as sheets of paper, synthetic polymer (polyolefin, polyester, etc.) sheets or fabric sheets, with a silicone on high-speed rolls. For example, an efficient method is described for minimizing and/or reducing mist formation when coating flexible supports with a liquid silicone composition precursor of crosslinked coatings. The coating process can be performed using a coating device that includes a roll operating at a high speed.

Abstract: A silicone adhesive composition includes 100 parts by weight of a peroxide-curable silicone, 1.2 to 3.2 parts by weight of an organic peroxide curing agent, and 2 to 9 parts by weight of an addition reaction-curable silicone rubber. An adhesive tape includes a base and an adhesive layer placed on the base, the adhesive layer being formed from the above silicone adhesive composition. The adhesive composition exhibits high load bearing capacity even in higher-temperature environments than ever before. The adhesive tape exhibits high load bearing capacity and good shelf life even in such high-temperature environments.

Abstract: The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I) -An-R—SiXYZ??(I), wherein A is a divalent or trivalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C1 to C8 alkyl, C1 to C8 alkoxy, C1 to C8 acyloxy groups and —CH2—N—R? wherein N is oxygen, nitrogen or sulfur, preferably oxygen, and R? is selected from C1 to C8 alkyl groups, preferably a methyl group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C1 to C8 alkoxy or C1 to C8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II)

Abstract: A liquid curable silicone elastomer composition is disclosed. The composition comprises: an organopolysiloxane (A) comprising: an organopolysiloxane (A1) containing at least 2 alkenyl groups bonded to silicon atom per molecule and having a total alkenyl content of from 0.01 to 1.5 mmol/g, and an organopolysiloxane (A2) containing at least 2 alkenyl groups bonded to silicon atom per molecule and having a total alkenyl content of from 5.0 to 15.0 mmol/g; an organopolysiloxane (B) comprising an organopolysiloxane (B1) containing at least 2 silicon-bonded hydrogen atoms per molecule provided by siloxy units of the type (R2HSiO1/2)x where R is independently selected from hydrogen, an aliphatic a hydrocarbyl, an aromatic hydrocarbyl, or an organyl group and x?2; a platinum based catalyst (C); an inhibitor (D) selected from the group consisting of acetylenic alcohols and their derivatives; and a silica filler (E).

Abstract: A package structure of electronic modules includes two substrates and a sealing frame. The sealing frame comprises two first silicone frames, a second silicone frame and two crystalline interfaces. The sealing frame is disposed between and within the two substrates to form a space thereof. The sealing frame serves as an excellent moisture barrier of the package structure due to the intrinsic properties of silicone. Meanwhile, the silicone can withstand the corrosion of the polar solvents and/or the plasticizers. A manufacturing method of the package structure is disclosed in this invention as well.

Abstract: A process for taking a dental impression and/or conducting a dental retraction. The process includes the steps of: (a) providing a composition (A) having the consistency (a1), composition (A) including curable components, and a catalyst suitable to initiate or catalyze the curing of the curable components, composition (A) being contained in a device, (b) applying a portion (I) of composition (A) with a consistency (a2) into the sulcus of a tooth, (c) applying a portion (II) of composition (A) with a consistency (a1) in contact with composition (A) applied in step (b), (d) removing portion (I) together with portion (II) of composition (A) from the surface of the tooth, consistency (a2) being higher than consistency (a1).

Abstract: Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Abstract: Provided are: a crosslinked organopolysiloxane which has properties intermediate between a dimethylpolysiloxane oil and a gel-like crosslinked siloxane; and a method for producing the crosslinked organopolysiloxane. An oil-like organopolysiloxane which is produced by: adding a compound having a siloxane unit represented by formula (3) to a gel-like silicone, wherein the gel-like silicone is produced by a hydrosilylation reaction of an organopolysiloxane having an alkenyl group with an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom in the presence of a platinum-group metal catalyst; and then equilibrating the resultant product with an acid or alkali catalyst. R12SiO2/2??(3) (R1 represents a group selected from a monovalent hydrocarbon group having no aliphatic unsaturated bond and an alkenyl group represented by the formula: —(CH2)a—CH?CH2 (wherein a represents a numerical value of 0 to 6), and the average polymerization degree of formula (3) is 3 to 2,000.

Abstract: The disclosed embodiments include an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured product thereof is greater than A30 and less than A65. The composition comprises: (A1) solid 3D organopolysiloxane having an R13SiO1/2 unit and an SiO4/2 unit; (A2) liquid straight-chain organopolysiloxane having an R13SiO1/2 unit and an R22SiO2/2 unit; the mixing viscosity of component (A1) and (A2) is between 6,000 and 20,000 mPa·s; (B) liquid straight-chain polyorganohydrosiloxane having an R33SiO1/2 unit and an R42SiO2/2 unit; (C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group; (D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition. The composition of the present invention and the cured semiconductor component thereof have good heat resistance, good adhesiveness with aluminum having a mirror finish and ceramic substrate, and good resistance to humidity.

Abstract: Compositions and methods useful in treating dermatological disorders are described. The methods include applying to the skin a composition comprising a reactive reinforcing component and a cross-linking component, wherein the cross-linking component facilitates a reaction to form a film in situ on the skin.

Abstract: A curable organopolysiloxane composition and a semiconductor device are described. In a cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition includes: (A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.

Abstract: A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms are substantially only silicon atoms to which three oxygen atoms are bonded. The heat curing satisfies 5<a?b<20, in which “a cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 1,000 to 1,050 cm?1 of the silicone resin before the heat curing and “b cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 950 to 1,050 cm?1 of the silicone resin composition after the heat curing.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.

Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Abstract: The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided.

Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).

Abstract: Embolization, as well as related particles, compositions, and methods, are disclosed.

Abstract: A polyorganosiloxane resin represented by the following general formula (5): (R3SiO1/2)l?(R2SiO2/2)m?(RSiO3/2)n?(SiO4/2)o? (5) wherein R is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group having 1 to 18 carbon atoms, and optionally having an oxygen, halogen, nitrogen or sulfur atom; l?, m? and o? are, independently of each other, an integer of from 0 to 10,000; n? is an integer of from 1 to 10,000; a total of l?, m? and n? is from 2 to 30,000; and at least one R is a hydrogen atom and at least one R is an —OX group in the molecule, wherein X is an alkyl group having 1 to 10 carbon atoms or an alkoxyalkyl group having 2 to 10 carbon atoms; and at least one hydrogen atom and at least one —OX group bond to one and the same silicon atom.

Abstract: An addition curable silicone emulsion release composition suitable for forming a releasable film having a high releasability to a pressure sensitive adhesives simultaneously with good adhesion to a plastic film substrate is provided. A release film prepared by coating and curing such composition on a plastic film is also provided. The good adhesion and the high releasability to acryl pressure sensitive adhesives are realized despite the low content of the organopolysiloxane containing a large amount of trifunctional siloxane units and alkenyl groups which had been used for realizing the adhesion. The addition curable silicone emulsion release composition is prepared by blending predetermined proportion of mixtures of high molecular weight organopolysiloxanes each containing an alkenyl group and phenyl group at particular ratio.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.

Abstract: An optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, the addition curing silicone resin composition having (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups per molecule and an aryl group, the organohydrogenpolysiloxane that contains 30 mol % or more of an HR2SiO0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.

Abstract: The invention relates to a transdermal therapeutic system which comprises a backing layer, an adhesive layer, a polymer layer and a removable protective layer. The adhesive layer is an organosiloxane layer and is anchored in the backing layer by siliconization.

Abstract: A light-conversion flexible polymer material consists of an organic silicone rubber (bi-component addition thermal vulcanizing liquid silicone rubber, 20.0-75.0%), a diluting agent (silicone oil, 10.0-20.0%), a luminescent material (one or more of aluminate, silicate, siliconitride and oxysulfide luminescent materials, 15.0-65.0%) and auxiliary. The polymer material can be bent randomly as required. The polymer material is made by mixing raw materials uniformly in a blending container, inpouring the obtained mixture into a mold and thermal-curing. The polymer material is used on the surface of a blue-light LED and the luminescent material in the light-conversion flexible polymer material can be excitated by light emitted from the blue light LED to give out light, which is combined with residual blue light into white light. The polymer material can be widely used in light-source devices such as lamp, nixie tube and backlight.

Abstract: One purpose is to provide a silicone resin composition which provides a cured product having a large Abbe's number and a high brightness. A silicone resin composition including (A-1) an organopolysiloxane having a three-dimensional crosslinked structure, at least two alkenyl groups, and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (A-2) a linear organopolysiloxane having alkenyl groups at at least both terminals of a molecular chain and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (B-1) a linear organohydrogen polysiloxane having at least one silphenylene skeleton in a molecular chain and hydrosilyl groups at least both terminals of the molecular chain, in an amount such that a ratio of the number of the hydrosilyl groups in component (B-1) to a total number of the alkenyl groups in components (A-1) and (A-2) is 0.5 to 2, and (C) a hydrosilylation catalyst in a catalytic amount.

Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.

Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.

Abstract: An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.

Abstract: A curable composition comprises (a) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polyorganosiloxane, fluorinated polyorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) a catalyst composition comprising (1) at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof, and (2) at least one Lewis acid; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.

Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.

Abstract: The invention relates to a composition for taking dental impressions, the composition comprising a siloxane component (A) comprising terminal vinyl groups, a siloxane component (B) comprising Si—H groups, a catalyst (C) being able to catalyze a curing reaction between components (A) and (B) and a silicone oil (D), wherein the silicone oil has a viscosity at 23 DEG C of at least about 600,000 mPa*s and is present in an amount from about 1 to about 20 wt.% with respect to the weight of the whole composition. The invention also relates to a method of producing such a composition and a method for adjusting the Shore hardness A of a composition.

Abstract: The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.

Abstract: Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

Abstract: Amphiphilic organosiloxane block copolymers and methods for making them are disclosed. The compositions incorporate an amphiphilic “linear” segment with a “resinous” segment. For example, a polyether (A) modified PDMS (B) with (AB)n architecture and polydiorganosiloxane with Si—H end-groups can be reacted with a phenyl silsesquioxane resin bearing vinyl functionality to form an amphiphilic resin-linear copolymer.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.