Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

Abstract: A molding material including a melt-fabricable fluororesin and having a metal content of 100 ng/1 g or less as measured by an ashing method. Also disclosed is a tube made of the molding material.

Abstract: Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not limited to, at least one moisture scavenger, at least one adhesion promoter, at least one catalyst, at least one filler, at least one plasticizer, at least one antioxidant, or any combination thereof. In some embodiments, the adhesive formulation may exclude a low viscosity polymer. In some embodiments, the adhesive formulation may include a low viscosity polymer in no more than a specified amount. At least one method of using the adhesive formulation and at least one roofing system comprising the adhesive formulation are also described herein.

Abstract: The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.

Abstract: A glass fiber product comprises glass fibers treated with a coating composition comprising a synthetic resin and a mixture of an acetylene glycol or an ethylene oxide-propylene oxide block or random adduct thereof and a polyoxyalkylene alkyl ether having an HLB of 8 to 18 or a sulfur-containing surfactant.

Abstract: A composition for producing an organic insulator is provided which comprises an organic-inorganic hybrid material (as defined). The hybrid material shows high solubility in organic solvents and monomers, and superior adhesion to substrates. In addition, the hybrid material displays a high dielectric constant and a high degree of crosslinking. Based on these advantages, the composition comprising the organic-inorganic hybrid material can be utilized during the fabrication of various electronic devices by a wet process. A method for producing the organic insulator while utilizing the composition also is provided, as well as the resulting organic insulator, and an organic thin film transistor which incorporates the resulting insulating layer.

Abstract: Glass fiber-treating agent which includes: (A) 5-95% by weight of an acetylene glycol or an ethylene oxide and/or a propylene oxide adduct of an acetylene glycol; and (B) 5-95% by weight of a silicone surfactant which may be polyoxyalkylene-modified. The glass fiber-treating agent reduces dynamic and static surface tension and contact angle. The glass fiber-treating agent provides excellent wetting, penetration, and antifoaming properties when glass fibers are treated therewith.

Abstract: An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

Abstract: An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.

Abstract: The present invention provides a liquid crystal sealing composition and a liquid crystal display panel excellent in adhesion, moisture permeation resistance and heat resistance and superior for use in a sheet press heating bonding system. The liquid crystal sealing composition comprises (1) an alkoxysilyl group-containing modified epoxy resin obtained by de-alcohol condensation reaction of (a) an epoxy resin having at least one hydroxyl group in one molecule and (b) an alkoxysilyl group-containing compound, (2) a heat latent epoxy curing agent, (3) a filler having an average particle diameter of 0.1 to 10 ?m, and if necessary (4) an epoxy resin having at least 1.2 epoxy groups on average in one molecule, (5) an aprotic solvent having a boiling point in the range of 140 to 220° C., compatible with epoxy resin and inert to an epoxy group, and (6) other additives.

Abstract: A phenolic resin that increases its toughness by polydimethylsiloxane and a process of preparing the same is provided. Polydimethylsiloxane is added as a coupling agent in a ?-glycidoxypropyltrimethoxysilane-modified phenolic resin to improve the compatibility between polydimethylsiloxane and the phenolic resin. Then, tetraethoxysilane is added to conduct hydrolysis condensation and obtain tougher and thermally stable phenolic resin.

Abstract: A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.

Abstract: The polymeric composition for friction elements comprises a co-polymer between (I) a resin containing phenolic groups and a reticulation agent, and (II) an organopolysiloxane resin containing terminal silanol groups. A part at least of the phenolic groups is bound to the terminal silanol groups. A process of the preparation of the above polymeric composition may comprise the following steps: a) mixing (I) a resin containing the phenolic groups and the reticulation agent, (II) containing the terminal silanol groups, and (III) an epoxy resin or the epoxidisesd organopolysiloxane; b) curing the mixture for a period of time sufficient to complete substantially the reaction between the phenolic groups and the terminal silanol groups, c) post-heating the product obtained under b).

Abstract: A phenolic resin/silicone resin hybrid compound is obtained by effecting hydrolytic condensation of an organooxysilane in the co-presence of a phenolic resin. The hybrid compound is used as the base polymer in a resist for endowing a resist film with excellent adhesion to a metal substrate.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: A process for preparing silica-based organic-inorganic hybrid resin using sol-gel process. Phenol is used as catalyst to reduce the gel time of the sol-gel process and cyclosiloxane is used as modifier to increase the toughness of the resultant inorganic-organic hybrid resin.

Abstract: The present invention provides a curing agent for epoxy resin containing a siloxane-modified phenol resin (3) obtained by dealcoholization condensation reaction between a phenol resin (1) and a hydrolyzable alkoxysilane (2). The present invention further provides an epoxy resin composition comprising an epoxy resin and the above-mentioned curing agent for epoxy resin. The present invention further provides a method for preparing a siloxane-modified phenol resin (3) characterized by subjecting a phenol resin (1) and a hydrolyzable alkoxysilane (2) to dealcoholization condensation reaction.

Abstract: The present invention relates to a polypropylene resin composition and more particularly, to the polypropylene resin composition comprising a high crystalline polypropylene, an ethylene-&agr;-olefin elastomer, an inorganic filler, an organic peroxide and a crosslinking assistant. This polypropylene resin composition exhibits excellent scratch resistance, rigidity, heat resistance, and impact strength and thus, it can be suitable for automobile interior materials such as glove box, console, center crash pad and the like.

Abstract: The present invention discloses an epoxy resin composition with a non-halogen, non-phosphorus flame retardant, which comprises (a) 100 parts by weight of an epoxy resin; (b) 40-60 parts by weight of a phenolic novolac hardener; and (c) 5-60 parts by weight of a silica-novolac hybrid resin solution as a flame retardant.

Abstract: A curable coating composition is described comprising a carbamate functional material, a crosslinking agent and a hydroxyl functional polysiloxane component. Coatings prepared with this coating composition can be cured and coated with additional coating(s), providing good intercoat adhesion to the subsequent coating.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: A single pack siliconized epoxy coating has been discovered that requires neither heat nor mixing with a catalytic curing agent immediately prior to application. The coating is comprised of an epoxy resin, a silanol based polydimethylsiloxane, an amine functional silicone polymer, and a distilled fatty nitrile. After homogenous blending of the compound, the composition is stored in air tight containers with a shelf life of over two years.

Abstract: Higher generation radially layered copolymeric dendrimers having a hydrophilic poly(amidoamine) or a hydrophilic poly(propyleneimine) interior and a hydrophobic organosilicon exterior are prepared by first reacting a hydrophilic dendrimer having --NH.sub.2 surface groups with an organosilicon compound, and then hydrosilating the resulting copolymeric dendrimer with another organosilicon compound in the presence of a noble metal catalyst. In an alternate embodiment, the radially layered copolymeric dendrimers are prepared by reacting a hydrophilic dendrimer having --NH.sub.2 surface groups directly with an organosilicon dendron or organosilicon hyperbranched polymer.

Abstract: A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.

Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: This invention provides a thermosetting composition comprising (A) a compound (A-1) containing an epoxy group or groups and a reactive silicon group or groups as essential functional group components in the same molecule, or a mixture (A-2) of an epoxy group-containing compound and a reactive silicon group-containing compound, and (B) an organotin catalyst, a thermosetting composition comprising (A) a compound (A-3) containing (i) an epoxy group or groups, (ii) a reactive silicon group or groups and (iii) a hydroxyl group or groups and/or a carboxyl group or groups as essential functional group components in the same molecule, or a mixture (A-4) of at least two types of compounds, each compound containing at least one member selected from the class consisting of functional group components (i) to (iii), and all of the functional group components (i) to (iii) being present in said mixture, and (B) an organotin catalyst; and methods of forming a finish coat using these thermosetting compositions.

Abstract: Radially layered copoly-dendrimers having unusual surface properties and novel applications have been synthesized and characterized. These are the first copolymeric dendrimers composed of a hydrophilic poly(amidoamine) (PAMAM) interior with hydrophobic organosilicon surfaces. These dendrimers have been prepared by surface modifications of an ethylene diamine core PAMAM dendrimer with (3-acryloxypropyl)methyldimethoxysilane, (3-acryloxypropyl)bis(vinyldimethylsiloxy)methylsilane, (3-acryloxypropyl)tris(trimethylsiloxy)silane, chloromethyltrimethylsilane, and chloromethyldimethylvinylsilane, to varying degrees of surface coverage. The obtained products were characterized by .sup.1 H, .sup.13 C, and .sup.29 Si NMR, and by DSC and TGA. The dendrimers with less completely covered organosilicon surfaces are water soluble, and have considerable surface activity, the best of which lowered the surface tension of water to less than 30 mN/m.

Abstract: Poly(alkylene dicarboxylate) polymers and copolymers having tetraalkyl- or trialkylammonium ion end groups and methods of synthesis, thereof. The methylene-containing copolymers, in general, adhere to glass and metals, including aluminum, iron, and copper. Poly(methylene-co-ethylene terephthalate) is a clear film useful in the protection of metals or glass from corrosion or scratching. Glass may be bound to glass or to metal using the polymers of the present invention or metal to metal seals may be made.

Abstract: Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Abstract: The present invention provides a low viscosity curable resin composition and coating composition containing the same which has a decreased solvent content. The coating composition provides a cured film having not only excellent acid resistance but also good weather resistance and mar resistance without an adverse effect to the environment. The curable resin composition comprises (a) a hydroxyl and carboxyl group containing silicone polymer, (b) a carboxyl and carboxylate group containing polymer, and (c) a hydroxyl and epoxy group containing polymer.

Abstract: The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), andn is 0 to 100, and m is 1 to 100.

Abstract: A curable composition which comprises (C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule, (D) an organic polymer having at least one alkenyl group in a molecule, and (E) a hydrosilylation catalyst has rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.

Abstract: An epoxy resin composition comprising (i) an epoxy resin, (ii) a phenolic curing agent, (iii) an organophosphorous curing agent, (iv) alumina, and (v) a separating means for separating the organophosphorous curing agent and the alumina, which may be a coating over the surfaces of the organophosphorous curing agent.

Abstract: A polymeric reaction product is disclosed that is a silylated polyamine-containing polymer having moieties from fatty acid moieties and/or chain extenders as difunctional organo moieties and free amine moieties and hydrolyzed and/or hydrolyzable organofunctional silane moieties and that is at least water dispersible. The reactants that produce this product are a polyamine-containing polymer with fatty acid moieties and free amine moieties and at least one amine-reactable organo functional alkoxysilane or its hydrolysis products. The former reactant results from the reaction of a polyamine-containing polymer with free amine moieties with fatty acids alone or in mixtures with other fatty acids and/or dimer acids. The polymeric reaction product is combined with a predominant amount of water to form a fiber treating formulation that can reside on the surface of one or more treated fibers.

Abstract: A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

Abstract: An epoxy resin molding material for sealing of electronic components comprising(A) an epoxy resin;(B) a phenolic compound;(C) a resin mixture obtained bydispersing, in a form of particulates, in a dispersion medium which is a portion or all of at least one of the epoxy resin and the phenolic compound, a mixture of a vinyl group-containing organopolysiloxane and a .tbd.SiH group-containing organopolysiloxane whose total volatile loss after heating at 105.degree. C. for three hours is not more than 3% by weight, and allowing the vinyl group-containing organopolysiloxane and the .tbd.SiH group-containing organopolysiloxane to react with each other and to cure; and(D) an inorganic filleris excellent in thermal shock resistance, soldering resistance, moisture resistance, thermal stability, moldability and marking properties.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.

Abstract: A 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane as an epoxy resin; a 1,1-bis(2,7-dihydroxy-1-naphthyl)alkane as an intermediate for said epoxy resin; a process for producing said intermediate comprising reacting 2,7-dihydroxy-1-naphthalene and an aldehyde; a process for producing said epoxy resin comprising reacting said intermediate and an epihalohydrin; and an epoxy resin composition comprising said epoxy resin and a curing agent. The epoxy resin has a low melt viscosity while exhibiting excellent heat resistance.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Abstract: A novel siloxane polymer having at least 1 mol % of a structural unit derived from a cyclic heat addition product between a diene compound of formula (I) or (II) and an olefin or acetylene compound of formula (III), (IV) or (V): ##STR1## and a positive working light-sensitive composition comprising the siloxane polymer.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance.

Abstract: A curable polyimide resin is blended with (a) an organic silicon compound having a functional group selected from an epoxy group and an amino group or (b) a copolymer of an aromatic polymer and an organic silicon compound. The resulting polyimide resin composition can be cured without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.