Mixed With Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom Patents (Class 525/481)
  • Patent number: 10527936
    Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: January 7, 2020
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Cheng-Chung Lee, Yeong-Tong Hwang, Shih-Hung Hsu, Shao-En Hwang
  • Patent number: 10466590
    Abstract: Provided are a naphtol-type calixarene compound having high solvent solubility, a method for producing the naphthol-type calixarene compound, a photosensitive composition that contains the naphthol-type calixarene compound and provides a coating having high thermal decomposition resistance, alkali developability, photosensitivity, and resolution, and a resist material and a coating each being made of the photosensitive composition. Specifically, provided is a naphthol-type calixarene compound including a molecular structure represented by general formula (1). [In the formula (1), R1 represents a hydrogen atom, an alkyl group, an alkoxy group, an optionally substituted aryl group, an optionally substituted aralkyl group, or a halogen atom, and a plurality of R1 may be the same or different from each other; R2 represents an optionally substituted alkyl group or an optionally substituted aryl group; and n represents an integer of 2 to 10].
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: November 5, 2019
    Assignee: DIC CORPORATION
    Inventor: Tomoyuki Imada
  • Patent number: 10407535
    Abstract: Described herein are liquid crystalline elastomer compositions comprising aromatic epoxy units crosslinked with alkylene diacid units having alkylene segments containing at least one methylene unit, and/or aromatic epoxy units crosslinked with polyphenolic units, wherein the aromatic epoxy units and alkylene diacid units and/or polyphenolic units are in a molar ratio that results in the liquid crystalline elastomer composition exhibiting a glass transition temperature (Tg) and a thermal stability of the liquid crystalline phase (Tlc) that make them particularly suitable as shape memory materials and for use in methods of additive manufacturing. Methods for producing these compositions and their use in additive manufacturing processes are also described.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: September 10, 2019
    Assignees: UT-BATTELLE, LLC, Washington State University
    Inventors: Yuzhan Li, Orlando Rios, Alexander Johs, Michael Richard Kessler
  • Patent number: 10287444
    Abstract: This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: May 14, 2019
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Wangsheng Fang, Wei Yao
  • Patent number: 10184047
    Abstract: The present invention relates to a method for manufacturing and/or treating thermally deformable reflective material, including steps for: providing a base material such as a plate material or a sheet material, arranging on the base material an adhesive layer in the form of a polymerizable monomer mixture, preferably a photoactivatable monomer mixture, positioning reflective particles on the monomer mixture, subjecting the monomer mixture to a curing process for providing a thermoplastic polymer mixture for the purpose of fixing the reflective particles relative to the base material.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: January 22, 2019
    Assignee: Codan B.V.
    Inventor: Robert Hilbrand Nicolaas Dam
  • Patent number: 10179828
    Abstract: A curable composition and a permanent resist film made using this curable composition are provided. The composition dissolves well in solvents, gives coatings superior in alkali developability, thermal decomposition resistance, light sensitivity, and resolution, and is particularly suitable for the formation of permanent resist films. Specifically, the composition is a curable composition for permanent resist films and contains a phenolic hydroxyl-containing compound (A) that has a molecular structure represented by structural formula (1): (where R1 is hydrogen, alkyl, or aryl, and n is an integer of 2 to 10; R2 is alkyl, alkoxy, aryl, aralkyl, or halogen, and m is an integer of 0 to 4; if m is 2 or more, the plurality of R2s may be the same or different from one another, and may be bonded to either of the two aromatic rings in the naphthylene structure) and a photosensitizer (B1) or curing agent (B2).
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: January 15, 2019
    Assignee: DIC Corporation
    Inventor: Tomoyuki Imada
  • Patent number: 9908988
    Abstract: An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: March 6, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Wei Liu, Xiaomei Song, Hongyu Chen, Yan Huang, Yu Zhang
  • Patent number: 9828457
    Abstract: Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: November 28, 2017
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Yusuke Sato, Seiji Kimoto
  • Patent number: 9823566
    Abstract: Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming patterns using the hardmask composition. In the above Chemical Formula 1, A, A? , X, Y, I, m and n are the same as described in the detailed description.
    Type: Grant
    Filed: May 8, 2013
    Date of Patent: November 21, 2017
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Yong-Woon Yoon, Sung-Jae Lee, Joon-Young Moon, You-Jung Park, Chul-Ho Lee, Youn-Jin Cho
  • Patent number: 9550933
    Abstract: Disclosed are methods and compositions for cementing in a subterranean formation. A method comprises introducing a resin composition into a wellbore. The resin composition may comprise a resin, a napthol-based epoxy resin additive, and a hardening agent. The napthol-based epoxy resin additive may comprise two naphthalene functional groups and two epoxide functional groups.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 24, 2017
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Jiten Chatterji, Gregory Robert Hundt
  • Patent number: 9519080
    Abstract: A high-aspect-ratio imprinted structure includes a first layer of cured layer material having a plurality of micro-channels imprinted in the first layer. Each micro-channel has micro-channel walls and a micro-channel bottom, the micro-channel bottom having distinct first and second portions. Deposited material is located on the micro-channel walls and not on the second portion of the micro-channel bottom.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 13, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventor: Ronald Steven Cok
  • Patent number: 9475970
    Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: October 25, 2016
    Assignee: GUANGDONG SHENGYI SCI. TECH CO., LTD.
    Inventors: Cuiming Du, Songgang Chai, Zhongqiang Yang
  • Patent number: 9359469
    Abstract: The introduction of environmentally-friendly organic phosphorus group can not only maintain the original excellent properties of epoxy resins, but also meet the high flame-retarding requirements, and have the ability to improve the vitrification temperature (Tg), heat resistance and other characteristics of the material so that the curing system can be successfully applied to the electronic materials field which are light, thin, small and precise, the present disclosure provides a flame-retarding phosphor-containing phenol-formaldehyde novolac and the preparation method thereof, the use of the compound to react with the epoxy group of an epoxy resin to obtain an environmentally-friendly and high performing halogen-free cured flame retarding epoxy resin, and the compound can also be used for curing epoxy resins and gives a high flame-retarding effect.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: June 7, 2016
    Assignee: Jiangsu Yoke Technology Co., Ltd
    Inventors: Qi Shen, Xu-Feng Li, Dong Zhao
  • Patent number: 9180345
    Abstract: A golf ball 2 includes a spherical core 4, an adhesive layer 6 covering the core 4, and a cover 8 covering the adhesive layer 6. The core 4 includes a spherical center 10 and a mid layer 12 covering the center 10. The adhesive layer 6 is formed from an adhesive. The base polymer of the adhesive is a two-component curing type epoxy resin obtained by curing a bisphenol A type epoxy resin with a curing agent including a polyamine compound. The gel fraction of the adhesive is equal to or greater than 40% but equal to or less than 80%. The ratio of the epoxy equivalent to the amine active hydrogen equivalent in the adhesive is equal to or greater than 2.0/1.0 but equal to or less than 13.0/1.0. The amine active hydrogen equivalent of the curing agent is equal to or greater than 100 g/eq but equal to or less than 800 g/eq. In the adhesive, the proportion of water to the entire volatile component is equal to or greater than 90% by weight.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: November 10, 2015
    Assignee: DUNLOP SPORTS CO. LTD.
    Inventor: Kazuhiko Isogawa
  • Patent number: 9123646
    Abstract: A light-emitting device includes a light-emitting element, and a sealing material for sealing the light-emitting element. The sealing material includes a first layer including a radical polymerizable resin and a second layer including a non-radical polymerizable resin, the first layer being in contact with the light-emitting element and the second layer covering an upper surface of the first layer.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: September 1, 2015
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Masakata Koseki, Yuichi Yano
  • Patent number: 8987355
    Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Yukiharu Yuzuriha
  • Publication number: 20150072583
    Abstract: In the fields of printed wiring boards and circuit boards, a good glass cloth-penetrating property is exhibited and prepreg appearance is excellent. A cured product thereof exhibits good heat resistance. A phenolic resin is a phosphorus-atom-containing phenolic resin that has phosphorus-atom-containing structural portions (i) represented by structural formula (Y1) or (Y2) below and alkoxymethyl groups (ii) in an aromatic nucleus of a phenolic compound: (In structural formulae (Y1) and (Y2), R1 to R4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). A ratio of the number of the alkoxymethyl groups (ii) relative to the total number of the phosphorus-atom-containing structural portions (i) and the alkoxymethyl groups (ii) is 5 to 20%.
    Type: Application
    Filed: February 20, 2013
    Publication date: March 12, 2015
    Inventors: Yoshiaki Murata, Takamitsu Nakamura, Koji Hayashi
  • Patent number: 8962712
    Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: February 24, 2015
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Nobuhito Ito, Kazuyoshi Yoneda, Masao Arima
  • Patent number: 8962773
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 24, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8927677
    Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Radhakrishnan Karunakaran, Rajesh Turakhia
  • Patent number: 8912295
    Abstract: It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: December 16, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Toshiaki Takeyama, Takeo Moro
  • Publication number: 20140322541
    Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: August 10, 2013
    Publication date: October 30, 2014
    Applicant: Elite Electronic Material (Kunshan) Co., Ltd
    Inventors: RONG-TAO WANG, LI-CHIH YU, YU-TE LIN, YI-JEN CHEN, WENJUN TIAN, ZIQIAN MA, WENFENG LU
  • Patent number: 8846856
    Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: September 30, 2014
    Assignee: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Patent number: 8841388
    Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: September 23, 2014
    Assignee: National Chung Hsing University
    Inventors: Ching-Hsuan Lin, Yu-Wei Tian
  • Patent number: 8829123
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 9, 2014
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8791214
    Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: July 29, 2014
    Assignee: DIC Corporation
    Inventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
  • Patent number: 8784711
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: July 22, 2014
    Assignee: Hutchinson
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8772424
    Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: July 8, 2014
    Assignee: ICL-IP America Inc.
    Inventors: Sergei V. Levchik, Andrew Mieczyslaw Piotrowski, Joseph Zilberman, Stephen J. Chaterpaul
  • Patent number: 8759551
    Abstract: The invention provides a process for continuously producing a urethane (meth)acrylate, containing causing a mixed liquid of a compound (A) having a hydroxyl group and a (meth) acryloyl group and a compound (B) having an isocyanate group to pass continuously and densely through a tubular microchannel formed in a heat-conducting reaction device, and reacting the hydroxyl group of the compound (A) with the isocyanate group of the compound (B).
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: June 24, 2014
    Assignee: DIC Corporation
    Inventors: Fumihiko Ishiyama, Takeshi Hizawa, Hideki Watanabe
  • Patent number: 8742033
    Abstract: A method of stabilizing a resorcinol-aldehyde resin comprises heating a resorcinol-aldehyde resin in the substantial absence of an acid or base catalyst at a temperature from about 130° C. to about 180° C. for a sufficient amount of time to render the resin stable in an aqueous solution, wherein the resorcinol-aldehyde resin prior to heating is a novolak resin. The stabilized resins have many useful applications. For example, they can be used to make aerogels and xerogels. They also can be used to make dipping solutions to improve the adhesion between rubber and tire cords in a tire, belt, or hose.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: June 3, 2014
    Assignee: Indspec Chemical Corporation
    Inventor: Theodore Harvey Dailey
  • Patent number: 8703882
    Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: April 22, 2014
    Assignee: National Chunghsing University
    Inventors: Ching-Hsuan Lin, Hung-Tse Lin, Sheng Lung Chang, Yu-Ming Hu
  • Patent number: 8653205
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C?4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: February 18, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Patent number: 8648154
    Abstract: This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy resin composition having high phosphorus content because it includes the phosphorus-containing phenol novolac resin, thereby exhibiting superior flame retardancy and heat resistance.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: February 11, 2014
    Assignee: Kolon Industries, Inc.
    Inventors: Ji Woong Kong, Sang Min Lee, Ick Kyung Sung
  • Patent number: 8642709
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 4, 2014
    Assignees: Henkel AG & Co. KGaA, Henkel US IP LLC
    Inventors: Pablo Walter, Mustapha Benomar, Stefen Kreiling, Angelika Troll, Rainer Schoenfeld, Timothy Walsh
  • Patent number: 8617930
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 8586699
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joesph Gan
  • Patent number: 8563661
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 22, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8541516
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8530604
    Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: September 10, 2013
    Assignee: GM Global Technology Operations LLC
    Inventor: Ingrid A. Rousseau
  • Patent number: 8523967
    Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: September 3, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs Technologie et Services S.A.S.
    Inventors: Alix Arnaud, Philippe Espiard, Sandrine Pozzolo
  • Patent number: 8518527
    Abstract: The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc.
    Type: Grant
    Filed: August 29, 2010
    Date of Patent: August 27, 2013
    Assignee: Guangdong Shengyi Sci. Tech Co., Ltd.
    Inventors: Yueshan He, Tao Cheng, Shiguo Su, Biwu Wang, Jie Li
  • Patent number: 8519065
    Abstract: A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: August 27, 2013
    Assignee: DIC Corporation
    Inventor: Yutaka Satou
  • Patent number: 8519067
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: August 27, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yosinori Nishitani
  • Publication number: 20130131285
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Application
    Filed: January 9, 2013
    Publication date: May 23, 2013
    Applicant: Dow Global Technologies LLC
    Inventor: Dow Global Technologies LLC
  • Publication number: 20130131215
    Abstract: There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.
    Type: Application
    Filed: July 19, 2011
    Publication date: May 23, 2013
    Applicant: DIC CORPORATION
    Inventor: Yutaka Satou
  • Patent number: 8445590
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: May 21, 2013
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Patent number: 8445605
    Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: May 21, 2013
    Assignee: Guangdong Shengyi Sci. Tech Co., Ltd
    Inventors: Yueshan He, Tao Cheng, Shiguo Su, Biwu Wang, Jie Li
  • Patent number: 8440781
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: May 14, 2013
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato
  • Patent number: 8440771
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: May 14, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8420749
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: April 16, 2013
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato