Abstract: The present disclosure relates to a chip-on-film bonding structure, a display module, and a terminal equipment. The chip-on-film bonding structure includes: a chip on film including a first pin, the first pin including a first end and a second end that are arranged to be opposite to each other; and a flexible circuit board including a second pin connected to the first pin, the second pin including a third end and a fourth end that are arranged to be opposite to each other; in which the first end and the third end overlap to form a first active contact region; and the second end and the fourth end respectively extend outward from two opposite sides of the first active contact region, to form a first exposed region at the second end and to form a second exposed region at the fourth end.

Abstract: A display apparatus includes a base substrate, a light emitting structure disposed on the base substrate, and a thin film encapsulation layer disposed on the light emitting structure and including at least one inorganic layer and at least one organic layer. The at least one inorganic layer includes a high density layer having a density of greater than or equal to about 2.0 g/cm3 and a low density layer having a density of less than about 2.0 g/cm3. The high density layer and the low density layer are in contact with each other.

Abstract: The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, wherein TA represents a tannic acid moiety, R1 represents an optionally substituted C1-C6 straight or branched alkyl, an optionally substituted C3-C6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

Abstract: The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.

Abstract: An article includes a substrate with two main faces defining two main surfaces separated by edges, the substrate carrying a functional coating deposited over at least a portion of a main surface and a temporary protective layer deposited over at least a portion of the coating. The temporary protective layer has a thickness of at least 1 micrometer. The temporary protective layer made of polyfuran resin is obtained from a liquid composition comprising furfuryl alcohol.

Abstract: A method and apparatus for manufacturing a carbon fiber. Pressure is applied to a filament to change a cross-sectional shape of the filament and create a plurality of distinct surfaces on the filament. The filament is converted into a graphitic carbon fiber having the plurality of distinct surfaces. A plurality of sizings is applied to the plurality of distinct surfaces of the graphitic carbon fiber in which the plurality of sizings includes at least two different sizings.

Abstract: The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.

Abstract: An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

Abstract: Provided are: an epoxy resin composition that gives a carbon fiber-reinforced composite material having excellent moldability, heat resistance, and mechanical properties such as tensile strength and compressive strength; and a prepreg. An epoxy resin composition containing at least the following constituent elements [A]-[D]. The epoxy resin composition contains 5-50 parts by mass of constituent element [A] and 20-95 parts by mass of constituent element [B], as well as 1-25 parts by mass of constituent element [C], relative to 100 parts by mass of the total amount of epoxy resin. Constituent element [A] is an epoxy resin having primarily two epoxy groups and one or more condensed polycyclic aromatic hydrocarbon skeletons within a repeating unit of a specific structure; [B] is a glycidylamine epoxy resin having three or more glycidyl groups in the molecule; [C] is a sulfone or imide thermoplastic resin; and [D] is an epoxy resin curing agent.

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.

Abstract: Provided are a naphtol-type calixarene compound having high solvent solubility, a method for producing the naphthol-type calixarene compound, a photosensitive composition that contains the naphthol-type calixarene compound and provides a coating having high thermal decomposition resistance, alkali developability, photosensitivity, and resolution, and a resist material and a coating each being made of the photosensitive composition. Specifically, provided is a naphthol-type calixarene compound including a molecular structure represented by general formula (1). [In the formula (1), R1 represents a hydrogen atom, an alkyl group, an alkoxy group, an optionally substituted aryl group, an optionally substituted aralkyl group, or a halogen atom, and a plurality of R1 may be the same or different from each other; R2 represents an optionally substituted alkyl group or an optionally substituted aryl group; and n represents an integer of 2 to 10].

Abstract: Described herein are liquid crystalline elastomer compositions comprising aromatic epoxy units crosslinked with alkylene diacid units having alkylene segments containing at least one methylene unit, and/or aromatic epoxy units crosslinked with polyphenolic units, wherein the aromatic epoxy units and alkylene diacid units and/or polyphenolic units are in a molar ratio that results in the liquid crystalline elastomer composition exhibiting a glass transition temperature (Tg) and a thermal stability of the liquid crystalline phase (Tlc) that make them particularly suitable as shape memory materials and for use in methods of additive manufacturing. Methods for producing these compositions and their use in additive manufacturing processes are also described.

Abstract: This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.

Abstract: The present invention relates to a method for manufacturing and/or treating thermally deformable reflective material, including steps for: providing a base material such as a plate material or a sheet material, arranging on the base material an adhesive layer in the form of a polymerizable monomer mixture, preferably a photoactivatable monomer mixture, positioning reflective particles on the monomer mixture, subjecting the monomer mixture to a curing process for providing a thermoplastic polymer mixture for the purpose of fixing the reflective particles relative to the base material.

Abstract: A curable composition and a permanent resist film made using this curable composition are provided. The composition dissolves well in solvents, gives coatings superior in alkali developability, thermal decomposition resistance, light sensitivity, and resolution, and is particularly suitable for the formation of permanent resist films. Specifically, the composition is a curable composition for permanent resist films and contains a phenolic hydroxyl-containing compound (A) that has a molecular structure represented by structural formula (1): (where R1 is hydrogen, alkyl, or aryl, and n is an integer of 2 to 10; R2 is alkyl, alkoxy, aryl, aralkyl, or halogen, and m is an integer of 0 to 4; if m is 2 or more, the plurality of R2s may be the same or different from one another, and may be bonded to either of the two aromatic rings in the naphthylene structure) and a photosensitizer (B1) or curing agent (B2).

Abstract: An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

Abstract: Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.

Abstract: Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming patterns using the hardmask composition. In the above Chemical Formula 1, A, A? , X, Y, I, m and n are the same as described in the detailed description.

Abstract: Disclosed are methods and compositions for cementing in a subterranean formation. A method comprises introducing a resin composition into a wellbore. The resin composition may comprise a resin, a napthol-based epoxy resin additive, and a hardening agent. The napthol-based epoxy resin additive may comprise two naphthalene functional groups and two epoxide functional groups.

Abstract: A high-aspect-ratio imprinted structure includes a first layer of cured layer material having a plurality of micro-channels imprinted in the first layer. Each micro-channel has micro-channel walls and a micro-channel bottom, the micro-channel bottom having distinct first and second portions. Deposited material is located on the micro-channel walls and not on the second portion of the micro-channel bottom.

Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

Abstract: The introduction of environmentally-friendly organic phosphorus group can not only maintain the original excellent properties of epoxy resins, but also meet the high flame-retarding requirements, and have the ability to improve the vitrification temperature (Tg), heat resistance and other characteristics of the material so that the curing system can be successfully applied to the electronic materials field which are light, thin, small and precise, the present disclosure provides a flame-retarding phosphor-containing phenol-formaldehyde novolac and the preparation method thereof, the use of the compound to react with the epoxy group of an epoxy resin to obtain an environmentally-friendly and high performing halogen-free cured flame retarding epoxy resin, and the compound can also be used for curing epoxy resins and gives a high flame-retarding effect.

Abstract: A golf ball 2 includes a spherical core 4, an adhesive layer 6 covering the core 4, and a cover 8 covering the adhesive layer 6. The core 4 includes a spherical center 10 and a mid layer 12 covering the center 10. The adhesive layer 6 is formed from an adhesive. The base polymer of the adhesive is a two-component curing type epoxy resin obtained by curing a bisphenol A type epoxy resin with a curing agent including a polyamine compound. The gel fraction of the adhesive is equal to or greater than 40% but equal to or less than 80%. The ratio of the epoxy equivalent to the amine active hydrogen equivalent in the adhesive is equal to or greater than 2.0/1.0 but equal to or less than 13.0/1.0. The amine active hydrogen equivalent of the curing agent is equal to or greater than 100 g/eq but equal to or less than 800 g/eq. In the adhesive, the proportion of water to the entire volatile component is equal to or greater than 90% by weight.

Abstract: A light-emitting device includes a light-emitting element, and a sealing material for sealing the light-emitting element. The sealing material includes a first layer including a radical polymerizable resin and a second layer including a non-radical polymerizable resin, the first layer being in contact with the light-emitting element and the second layer covering an upper surface of the first layer.

Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.

Abstract: In the fields of printed wiring boards and circuit boards, a good glass cloth-penetrating property is exhibited and prepreg appearance is excellent. A cured product thereof exhibits good heat resistance. A phenolic resin is a phosphorus-atom-containing phenolic resin that has phosphorus-atom-containing structural portions (i) represented by structural formula (Y1) or (Y2) below and alkoxymethyl groups (ii) in an aromatic nucleus of a phenolic compound: (In structural formulae (Y1) and (Y2), R1 to R4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). A ratio of the number of the alkoxymethyl groups (ii) relative to the total number of the phosphorus-atom-containing structural portions (i) and the alkoxymethyl groups (ii) is 5 to 20%.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).

Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: The invention provides a process for continuously producing a urethane (meth)acrylate, containing causing a mixed liquid of a compound (A) having a hydroxyl group and a (meth) acryloyl group and a compound (B) having an isocyanate group to pass continuously and densely through a tubular microchannel formed in a heat-conducting reaction device, and reacting the hydroxyl group of the compound (A) with the isocyanate group of the compound (B).

Abstract: A method of stabilizing a resorcinol-aldehyde resin comprises heating a resorcinol-aldehyde resin in the substantial absence of an acid or base catalyst at a temperature from about 130° C. to about 180° C. for a sufficient amount of time to render the resin stable in an aqueous solution, wherein the resorcinol-aldehyde resin prior to heating is a novolak resin. The stabilized resins have many useful applications. For example, they can be used to make aerogels and xerogels. They also can be used to make dipping solutions to improve the adhesion between rubber and tire cords in a tire, belt, or hose.

Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C?4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy resin composition having high phosphorus content because it includes the phosphorus-containing phenol novolac resin, thereby exhibiting superior flame retardancy and heat resistance.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.