Abstract: The present invention relates to new compounds based on cardanol based which can be used as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these 5 compositions, in particular in a potting process in electrical and electronic components and devices.

Abstract: The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5° C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.

Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: Improved adhesives are provided through the use of styrenic tetrablock or pentablock copolymers which have a reduced elastomeric behavior under the die-cutting conditions used in label production.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: wherein R's are the same or different and each represents a hydrogen atom or —R13—C6-10 aryl-(OR14)p, and the aryl group is optionally substituted with C1-6 alkyl group, in which R13 represents a C1-6 alkylene group or a phenylene —CH2— group optionally substituted with a hydroxy group, R14 represents a glycidyl group, and p is an integer of 1 or 2, provided that at least one R group is not a hydrogen atom; R1 represents a phenyl group or —N(R)2 group in which R is defined as above. The resin is produced from sequentially reacting melamine derivatives with aldehydes, phenolic compounds, and epihalohydrin.

Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: Disclosed is a phenol resin composition containing a specific triazines-modified novolak phenol resin comprising phenols, triazines and aldehydes, and a method for producing the triazines-modified novolak phenol resin comprising the steps of as a first step reaction, successively effecting processes (i), (ii) and (iii), wherein said process (i) is a process for adjusting a pH of a system of a mixture of phenols, triazines and aldehydes in a range of 5 to 10, said process (ii) is a process for reacting said mixture under the condition that the aldehydes are not volatilized and said process (iii) is a process for removing a reaction water in the system; then as a second step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the first step reaction; thereafter as a third step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the second step reaction; and further, depending upon a necessity, repeating the second st

Abstract: A resin composition useful as a binder is provided comprising a mixture of a formaldehyde-based resin with a resin substitute comprising the reaction product of an amine derivative chosen from melamine, glycolurile or their mixtures with 1 to 2 moles of a C.sub.1 to C.sub.8 dialkoxyethanal, the reaction product is mixed, preferably reacted, with a polyol.

Abstract: A two-part adhesive is provided wherein the first part comprises a stable aqueous alkaline monohydroxylic phenolic resole resin solution containing a methylene donor such as oxazolidine or a methylolurea and the second part comprises a stable resorcinolic resin precondensate having a shortage of formaldehyde and optionally containing a catalyst such as an ester functional compound for the resole resin. The resin in each part exhibits viscosity stability of an unmodified resin until mixed with the other part wherein the methylene donor, of the first part catalyzes the resorcinolic resin of the second part and the catalyst, when used, of the second part catalyzes the monohydroxylic phenolic resole resin of the first part. The adhesive finds utility in the production of structural lignocellulosic panels.

Abstract: This invention relates to a process for the preparation of self-crosslinking cationic paint binders which can be diluted with water after protonation and are based on modified aminoalkylation products of phenols; to the binders prepared by this process and to their use for formulating water-dilutable paints, in particular electrodeposition paints which can be deposited cathodically. The process is characterized in that an aminoalkylation product of a phenol containing at least one secondary amino group is reacted with epoxide compounds, and after temperature treatment, the reaction product is reacted with partly blocked isocyanate compounds. The process permits the use of blocking agents which allow stoving temperatures in the range of 130 to 150.degree. C.

Abstract: An adhesive having a content of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therefore, they are suitable for the manufacture of printed circuit boards having high thermal stability and peeling resistance.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: Self-crosslinking paint binders, particularly for the formulation of water-dilutable, cathodically depositable paints (CED-paints), are obtained through reaction of formaldehyde with the reaction product of aminoalkylation products of phenols carrying at least one NH-group and semi-blocked diisocyanates and their subsequent reaction with epoxy compounds. The binders, when cathodically deposited, cure rapidly at low stoving temperatures to provide hard, solvent-resistant coatings.

Abstract: This invention relates to an aqueous, acidic composition useful to deposit a corrosion inhibiting and adhesion promoting coating on a metal substrate and a method for doing same. The composition has a pH of between about 2 and about 6 and comprises water-soluble or water-dispersible metal-chelating o-hydroxybenzylamine compound, wherein the amine moiety contains pendant ethanol or propanol moiety.

Abstract: This invention relates to an aqueous composition useful to deposit a corrosion inhibiting and adhesion promoting coating on a corrodible metal substrate and a method for doing same. The composition has a pH of between about 2 and about 10 and comprises water-soluble or water-dispersible metal-chelating diphenolamine compounds.

Abstract: A process for producing self-crosslinking paint binders, water-soluble on protonation, based on the reaction product of aminoalkylation product carrying blocked isocyanate groups, NH-functional compounds, particularly of adducts of primary amines to diepoxy resins, and formaldehyde is described. The products produced according to the process are particularly suited for the formulation of high quality electrodeposition paints.

Abstract: Novel epoxidised phenol ethers of formula I ##STR1## are described wherein R.sup.1 denotes C.sub.1 -C.sub.20 alkyl, C.sub.5 -C.sub.9 cycloalkyl or C.sub.7 -C.sub.14 aralkyl, R.sup.2 has one of the meanings of R.sup.1 or is, in addition hydrogen or a radical or formula II ##STR2## R.sup.3 denotes C.sub.1 -C.sub.6 alkyl or halogen, R.sup.4 and R.sup.5 denotes hydrogen or C.sub.1 -C.sub.6 alkyl, R.sup.6 denotes hydrogen or methyl, m is 0, 1 or 2 and n is an integer from 0 to 30, with the proviso that at least two radicals, R.sup.2, must be epoxide groups of formula II. The compounds are especially suitable for encasing electronic components.

Abstract: The present invention relates to binders for cathodic electrocoating. These binders contain non-tertiary basic amino groups in addition to phenolic Mannich bases and consist of a mixture or precondensate of a polymer, polycondensate or polyadduct which has a mean molecular weight of 800 to 8,000 and a content of basic, primary and/or secondary amino groups of 0.8 to 8 equivalents per 1,000 molecular weight units and one or more phenolic Mannich bases prepared from one or more polynuclear polyphenols, formaldehyde or a formaldehyde donor and one or more secondary aliphatic amines, not more than one equivalent of a secondary amine and not more than 2 equivalents of formaldehyde being employed per equivalent of phenol for the preparation of component (B). These binders can be rendered water-dilutable by the addition of an acid and are suitable for the cathodic electrocoating of electrically conductive articles.

Abstract: A processor for the preparation of urea condensates and the preparation of heat-curable surface coatings.To prepare these urea condensates, primary di- and/or polyamine is reacted with urea, a secondary monoamine and a polyalcohol which contains certain groups at elevated temperatures and in the presence or absence of a catalyst, and the ammonia formed is separated off.These urea condensates are suitable as binder components in heat-curable surface coatings, in particular for heat-curable cathodic electrocoating finishes.

Abstract: Self-crosslinking paint binders, particularly for the formulation of water-dilutable, cathodically depositable paints (CED-paints), are obtained through reaction of formaldehyde with the reaction product of aminoalkylation products of phenols carrying at least one NH-group and semi-blocked diisocyanates and their subsequent reaction with epoxy compounds. The binders, when cathodically deposited, cure rapidly at low stoving temperatures to provide hard, solvent-resistant coatings.

Abstract: Method for manufacturing a conductive plastic of a defined conductivity by forming a polymer alloy. A polar or nonpolar insulating polymer and a polar or nonpolar conductive polymer are used for forming the polymer alloy. The two polymers are mixed together and they are homogeneously distributed within the polymer alloy.

Abstract: Hydroxyaromatic compounds are amido-alkylated or cyano-alkylated to form the corresponding compounds by:(a) heating said compounds with an alkylating agent in the presence of water and a catalyst, e.g., benzyltrimethylammonium chloride;(b) adding an alkaline agent, e.g., NaOH, to the heated mixture of (a); and(c) continuing to heat the resulting mixture until the corresponding amido- or cyano-alkylated compound is formed.Fully or partially amido-alkylated compositions are useful in the preparation of copolymers with epoxy resins.

Abstract: Binders useful for cathodic electrocoating are water-dilutable on addition of acid and comprise a mixture of(A) a polyadduct which carries basic nitrogen groups and contains groups of the formula (I) and/or (II) ##STR1## where R.sup.1 and R.sup.2 are hydrogen or methyl and R.sup.3 and R.sup.4 are alkyl or hydroxyalkyl or together are a 5- or 6-membered ring, and(B) a reaction product of a polyisocyanate and an olefinically unsaturated amine which carries a secondary amino group and a methacrylamide or methacrylate group.

Abstract: The present invention relates to a process for the preparation of urea condensates and to their use.To prepare these urea condensates, a primary di and/or polyamine is reacted with urea, a secondary monoamine and if appropriate a polyalcohol at elevated temperatures in the presence or absence of catalysts, and the ammonia formed is separated off.These urea condensates are suitable as binder components in thermosetting surface coatings.

Abstract: Heat-curable mixtures containing (a) epoxy compounds having on average more than one 1,2-epoxy group per molecule, (b) monoimides or polyimides of specific unsaturated dicarboxylic acids of the formula I ##STR1## wherein A is an x-valent aromatic or aliphatic radical, R.sup.1 is hydrogen or methyl, and x is 1, 2 or 3, and (c) products of condensing specific phenols, specific amines and aldehydes or ketones in an acid medium.The novel curable mixtures have a long shelf life and give rise to moulded materials which are highly resistant to chemicals and resistant to boiling water.

Abstract: Binders useful for cathodic electrocoating are water-dilutable on addition of acid and comprise a mixture of(A) a polyadduct which carries basic nitrogen groups and contains groups of the formula (I) and/or (II) ##STR1## where R.sup.1 and R.sup.2 are hydrogen or methyl and R.sup.3 and R.sup.4 are alkyl or hydroxyalkyl or together are a 5- or 6-membered ring, and(B) a reaction product of a polyisocyanate and an olefinically unsaturated amine which carries a secondary amino group and a methacrylamide or methacrylate group.

Abstract: A water-insoluble curing agent for epoxy resins, made by mixing a major amount by weight of a water-insoluble propylene diamine chosen from the group consisting of the C.sub.8 to C.sub.20 fatty propylene diamines and the C.sub.12 to C.sub.15 ether propylene diamines with a minor amount by weight of a water-soluble polyamine suitable for rapid cure of epoxy resins, mixing the resulting mixture with a water-insoluble substituted phenol to give a water-insoluble reaction product, and then reacting said reaction product with formaldehyde. A novel cured epoxy resin is produced by reacting the agent with an uncured epoxy resin, and the reaction can be done in a wet environment or even under water.

Abstract: A new class of epoxy curing agents has been discovered that utilizes the monomer of (a) urea-formaldehyde, (b) phenol modified urea-formaldehyde, or (c) thiourea-formaldehyde as the center of a polyamine molecule. The ether monomers are reacted with conventional aliphatic, cycloaliphatic, and aromatic polyamines to split off alcohol and water-yielding urea-formaldehyde etc., polyamine epoxy curing agents. Epoxy resins can be readily cured and, with some curing agents, under water, giving new cured epoxy resins.

Abstract: A bath composition for cataphoretic electrocoating of conductive surfaces contains coating agents which have been rendered soluble or dispersible with acid, contain basic nitrogen groups and carry groups of the general formulae (1) and (11) ##STR1## and, optionally, also groups of the general formulae (III) and/or (IV) ##STR2## where R.sup.1 and R.sup.2 are each alkyl, hydroxyalkyl or alkoxyalkyl, R.sup.3 and R.sup.4 are each hydrogen or methyl, R.sup.5 and R.sup.6 are each hydrogen, alkyl or a divalent radical of a polymer molecule which is bonded to a phenol or phenol ether, n.sup.1 is 1, 2 or 3 and n.sup.2 is 1 or 2, and where the oxygen bonded to the phenyl radical is either in the form of the OH group or etherified.

Abstract: A process for the preparation of molded bodies and coatings which comprises reacting at least one epoxy compound containing more than one 1,2-epoxy group per molecule alone or in combination with at least one monoepoxide, with at least one substituted amine of formula ##STR1## which contains no free phenols and in which R.sup.1 is hydrogen or methyl,R.sup.2 is a radical of at least one of formulae ##STR2## and R.sup.

Abstract: A synthetic resin is in the form of a metal complex compound. The resin is the reaction product of:(a) Mannich bases which are free from epoxide groups; with(b) epoxide resins;wherein aliphatic hydroxyl groups originating from (a), (b), or a mixture thereof, are at least partially converted into urethane groups by reaction with partially blocked isocyanate, said Mannich bases (a) formed from components selected from:(a.sub.1) condensed phenols which are free from ether groups and contain at least two aromatic rings and at least two phenolic hydroxyl groups;(a.sub.2) condensed phenols which contain ether groups and contain at least two aromatic rings and at least two phenolic hydroxyl groups;(a.sub.5) formaldehyde or compounds which split off formaldehyde;(a.sub.3) secondary amines having at least one hydroxyalkyl group; and(a.sub.4) dialkylamines or dialkoxyalkylamines which do not contain free hydroxyl groups; or from the components:(a.sub.1) and (a.sub.2) with (a.sub.5) and (a.sub.3);(a.sub.1) with (a.sub.

Abstract: The production of amine resins having Mannich base groups which dissolve in water with the aid of a solubilizing acid is disclosed in which a dihydric phenolic organic compound, such as a bisphenol, is reacted in organic solvent medium with at least 3 moles of formaldehyde per mol of bisphenol to at least partially methylolate the bisphenol prior to other reactions. The at least partially methylolated product is then reacted with a stoichiometric deficiency of organic diepoxide, and then with monosecondary amine to provide Mannich base groups. The Mannich base-containing product is then reacted with additional epoxide-functional material.

Abstract: A polyadduct/polycondensate which is water-dilutable when protonated with an acid, and which contains basic nitrogen groups, the groups being of the general formula (I) ##STR1## and/or of the general formula (II) ##STR2## as well as of the formula (III) ##STR3## where R.sup.1 and R.sup.2 are hydrogen or methyl, R.sup.3 and R.sup.4 are hydrogen, alkyl or a radical bonded to a phenol or phenolether, R.sup.5 and R.sup.6 are alkyl, hydroxyalkyl or alkoxyalkyl or are linked to one another to form a 5-membered or 6-membered ring, R.sup.7 is a polydienyl radical, n.sup.1 = from 0.5 to 3 and n.sup.2 = from 0.05 to 1.0, and its method of preparation.The polyadduct/polycondensate can be used, for example, as a surface-coating binder for the cathodic electrocoating of metal articles.

Abstract: Resinous coating compositions can be expediently heat cured by phenol compounds containing at least two methylene amine groups which are conjugated with the aromatic alcohol group or phenol group. The hydroxyl group substantially increase the reactivity of the aminomethyl functionality whereby active hydrogen containing resins can be effectively cross-linked.

Abstract: Binder combinations for the formulation of cathodic paints comprising blends of epoxy resins as follows: (A) 40 to 80% by weight of reaction products of epoxy acrylates with basic monoisocyanates; (B) 5 to 30% by weight of reaction products of epoxy amine adducts with unsaturated monoisocyanates, and (C) an epoxy resin modified with a semi-ester of a dicarboxylic acid anhydride and an N-hydroxyalkyloxazolidin and an amine, rendered water soluble through neutralization of the basic groups. The binder combinations as defined have enhanced throwing power and improved stability of the paint tank.

Abstract: A polyadduct/polycondensate, which is water-dilutable when protonated with an acid, and which contains basic nitrogen groups, is obtained by polyaddition reaction of(A) Mannich bases obtained from monophenols and/or polyphenols, one or more secondary amines which contain one or more hydroxyalkyl groups, or a mixture of such a secondary amine with another secondary amine, and formaldehyde or a formaldehyde donor, with(B) an epoxy resin, the polyadduct/polycondensate of (A) and (B) containing groups, bonded to aromatic rings, of the formula (I) ##STR1## with or without groups of the general formula II ##STR2## where R.sup.1 is a polydienyl radical, R.sup.2 and R.sup.3 are hydrogen or methyl and R.sup.4 and R.sup.5 are alkyl, hydroxyalkyl or alkoxyalkyl or are linked to one another to form a 5-membered or 6-membered ring.The polyadduct/polycondensate can be used, for example, as a surface-coating binder for the cathodic electrocoating of metal articles.

Abstract: Storable, solid mixture of (a) a long-chain epoxide resin which is free from ester groups and has a high epoxide equivalent weight, (b) an epoxide resin which is free from ester groups, contains cyclic structure and two to three epoxide groups in the molecule and has a low epoxide equivalent weight, (c) a triphenol and (d) a curing accelerator and, if desired, a blowing agent. Laminates, foams, compression moulded articles and adhesive bonds which are stable to hydrolysis, resistant to heat distortion and flexible are obtained on heating.

Abstract: A laminate product and method of making the same involving a base material such as cellulose fibrous materials impregnated with a cured mixture of aniline, phenol, formaldehyde and epoxy resin, which laminate has electrical and mechanical properties with improved heat resistance over previous materials.