Mixed With Carboxylic Acid- Or Derivative-containing Chemical Treating Agent Patents (Class 525/508)
  • Patent number: 9932436
    Abstract: The invention relates to a process for improving the stability of a base-modified alkylphenol-aldehyde resin (such as an amine-modified alkylphenol-aldehyde resin). The process comprises the step of reacting a base-modified alkylphenol-aldehyde resin with a salicylic acid to stabilize the base-modified alkylphenol-aldehyde resin. The invention also relates to a modified alkylphenol-aldehyde resin formed from the stabilizing process, and its use in a tackifier composition and rubber composition.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: April 3, 2018
    Assignee: SI GROUP, INC.
    Inventors: Timothy Edward Banach, John Morgan Whitney, Milan Knezevic, Todd Scott Makenzie
  • Patent number: 9013049
    Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Jun Okabe, Setsuko Oike
  • Patent number: 8883937
    Abstract: A cyclic compound represented by formula (1): wherein L, R1, R?, and m are as defined in the specification. The cyclic compound of formula (1) is highly soluble to a safety solvent, highly sensitive, and capable of forming resist patterns with good profile. Therefore, the cyclic compound is useful as a component of a radiation-sensitive composition.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: November 11, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Hiromi Hayashi
  • Patent number: 8784711
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: July 22, 2014
    Assignee: Hutchinson
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8772424
    Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: July 8, 2014
    Assignee: ICL-IP America Inc.
    Inventors: Sergei V. Levchik, Andrew Mieczyslaw Piotrowski, Joseph Zilberman, Stephen J. Chaterpaul
  • Patent number: 8642234
    Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: February 4, 2014
    Assignees: Taiyo Holdings Co., Ltd., Showa Denko K.K.
    Inventors: Nobuhito Ito, Masao Arima, Syouji Nishiguchi, Kouji Ogawa, Masayuki Kobayashi, Atsushi Sakamoto
  • Patent number: 8586699
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joesph Gan
  • Patent number: 8563661
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 22, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8440771
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: May 14, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8247517
    Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: August 21, 2012
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Michael Henningsen, Georg Degen, Matthias Maase, Manfred Doering, Ulrich Arnold
  • Patent number: 8206808
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: June 26, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • Patent number: 8198382
    Abstract: The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: June 12, 2012
    Assignee: Nitto Denko Corporation
    Inventor: Hiroshi Noro
  • Patent number: 8124716
    Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: February 28, 2012
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20120040291
    Abstract: There is provided a compositions of resist underlayer films for EUV lithography that is used in a production process of devices employing EUV lithography, that reduces adverse effects caused by EUV, and that has a beneficial effect on the formation of a favorable resist pattern; and a method for forming resist patterns using the composition of resist underlayer films for EUV lithography. A composition for forming a resist underlayer film for an EUV lithography process used in production of a semiconductor device, comprising a novolac resin containing a halogen atom. The novolac resin may include a cross-linkable group composed of an epoxy group, a hydroxy group, or a combination thereof. The halogen atom may be a bromine atom or an iodine atom. The novolac resin may be a reaction product of a novolac resin or an epoxidized novolac resin and a halogenated benzoic acid; or a reaction product of a glycidyloxy novolac resin and diiodosalicylic acid.
    Type: Application
    Filed: April 15, 2010
    Publication date: February 16, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Rikimaru Sakamoto, Takafumi Endo, Bangching Ho
  • Patent number: 8058362
    Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: November 15, 2011
    Assignee: National Chung Hsing University
    Inventors: Ching-Hsuan Lin, Yu Ming Hu, Hong Tze Lin
  • Publication number: 20100298505
    Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.
    Type: Application
    Filed: October 1, 2008
    Publication date: November 25, 2010
    Applicants: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRSIFS TECH. ET SERVICES, S.A.S.
    Inventors: Alix Arnaud, Philippe Espiard, Sandrine Pozzolo
  • Patent number: 7723444
    Abstract: An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: May 25, 2010
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Yoshihito Akiyama, Naoki Tomida
  • Patent number: 7704603
    Abstract: The present invention relates to a liquid resin intended more particularly for the sizing of mineral fibers which exhibits a dilutability in water at 20° C. at least equal to 1 000% and a level of free formaldehyde preferably of less than 0.4%, expressed as total weight of liquid, this resin being characterized in that it is composed essentially of condensates obtained from a phenolic compound, from formaldehyde and from an aminoalcohol according to the Mannich reaction. The invention also relates to a sizing composition including said resin, to the mineral fibers sized by means of this composition and to the products formed from the mineral fibers, in particular for thermal and/or sound insulation.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: April 27, 2010
    Assignee: Saint Gobain Isover
    Inventor: Serge Tetart
  • Patent number: 7622516
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Publication number: 20090275708
    Abstract: Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization. The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4?-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent.
    Type: Application
    Filed: July 10, 2006
    Publication date: November 5, 2009
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Kazunobu Kamiya
  • Publication number: 20090207723
    Abstract: An optical disc of the present invention includes at least a light reflection layer and a light transmission layer formed on a substrate, wherein recording and reading are performed by a laser beam through the light transmission layer, the light transmission layer is formed from a cured film of a ultraviolet-curable composition containing an epoxy acrylate resin obtained by reacting a half ester compound (A), which is obtained from a lactone-adduct of a hydroxyalkyl (meth)acrylate (a1) and a dibasic acid anhydride (a2), and an epoxy resin (B), and the film thickness of the light transmission layer is from 50 to 150 ?m.
    Type: Application
    Filed: May 18, 2007
    Publication date: August 20, 2009
    Applicant: DIC Corporation
    Inventor: Daisuke Ito
  • Patent number: 7495060
    Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: February 24, 2009
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Hiroshi Suzuki, Satoru Abe, Midori Aoki, legal representative, Izuo Aoki
  • Patent number: 7488784
    Abstract: The invention relates to novolac alkylphenol resins having a low level of free alkylphenol, a method for the production thereof, and the use thereof as tackifying resins and reinforcing resins for rubbers. The resins may be used advantageously in the production of tires.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: February 10, 2009
    Assignee: SI Group, Inc.
    Inventors: Didier Juhue, Jean-Marc Sage
  • Patent number: 7345101
    Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: March 18, 2008
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M. Nugent, Jr., Yves Le Disert, Laurent Deronne
  • Patent number: 7288606
    Abstract: A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: October 30, 2007
    Assignee: Osram GmbH
    Inventors: Klaus Höhn, Günter Waitl, Karlheinz Arndt
  • Patent number: 7186784
    Abstract: There are disclosed a phosphorus-containing carboxylic acid derivative which has a group containing phosphorus atom and has in its molecule, a group represented by the following formula (1): wherein R1, R2 and R3 are each hydrogen atom or a hydrocarbon group having 1 to 18 carbon atoms, and Y is oxygen atom or sulfur atom; a process for producing the derivative; and a flame retardant comprising the foregoing derivative as an effective ingredient. The present invention can provide the phosphorus-containing carboxylic acid derivative and a flame retardant which are each excellent in solubility in an organic solvent, compatibility with a variety of resins, stability and flame retardancy.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: March 6, 2007
    Assignee: NOF Corporation
    Inventors: Toshinobu Fujimura, Kazunori Waki, Koji Sato, Shiro Mibae
  • Patent number: 7151144
    Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a melaminic amino resin and a phenolic resin composition, wherein the phenolic resin composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a stable phenolic resin composition as well as wood based products obtained by the method or through the use of the adhesive system.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: December 19, 2006
    Assignee: Akzo Nobel N.V.
    Inventors: Salme Pirhonen, Benyahia Nasli-Bakir, Ingvar Lindh
  • Patent number: 7125917
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: October 24, 2006
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 7087664
    Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: August 8, 2006
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Toshiaki Hayashi, Katsuhiro Furuta
  • Patent number: 7009008
    Abstract: A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: March 7, 2006
    Assignee: Osram GmbH
    Inventors: Klaus Höhn, Günter Waitl, Karlheinz Arndt
  • Patent number: 7009009
    Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: March 7, 2006
    Assignee: Henkel Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods
  • Patent number: 6989412
    Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: January 24, 2006
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 6962744
    Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: November 8, 2005
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
  • Patent number: 6911503
    Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more hydroxyl functional groups or a compound obtained by esterification of the phenol compound or a mixture of these compounds, and the curing accelerator (C) is a salt of a phosphazenium compound represented by a formula (I): (wherein R1s each represent a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aryl or aralkyl group having 6 to 10 carbon atoms and may be all the same or different from one another; and Z? represents a halogen anion, hydroxy anion, alkoxy anion, aryloxy anion or carboxy anion).
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: June 28, 2005
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Sunao Maeda, Tatsuhiro Urakami, Tomoyuki Kawabata, Koutarou Suzuki, Tadahito Nobori
  • Patent number: 6893784
    Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) the carboxyl group-containing photosensitive resin mentioned above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: May 17, 2005
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Noboru Kohiyama, Shigeru Ushiki
  • Patent number: 6828391
    Abstract: Use, as modifier resin for rubber mixtures, of novolaks ABC plastified with terpene-type olefinically unsaturated natural substances C, where the ratio of the molar amount of the phenol or phenol derivative B and the molar amount of the natural substance C in the modified novolak is from 1:6 to 6:1, process for increasing the tear propagation resistance and reducing the compression set of rubber vulcanizates by adding these modifier resins to rubber mixtures, and components molded from vulcanizates thus prepared.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: December 7, 2004
    Assignee: Solutia Germany GmbH & Co. KG
    Inventors: Thomas Burkhart, Siegfried Wallenwein
  • Patent number: 6815491
    Abstract: A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a polyolefin-graft-cyclic anhydride copolymer, and a reinforcing filler. The composition exhibits high stiffness while maintaining high impact strength.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: November 9, 2004
    Assignee: General Electric
    Inventors: Adeyinka Adedeji, Thomas J. Hartle, John C. Haylock
  • Patent number: 6794481
    Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H&Brketopenst;O—Y&Brketclosest;a&Parenopenst;O—X—O&Parenclosest;&Brketopenst;Y—O&Brketclosest;bH  (1) HO—X—OH  (2) Y—OH  (3) wherein —X— is represented by the formula (2′),  and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: September 21, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
  • Patent number: 6784260
    Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: August 31, 2004
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Michael Teruki Takemori
  • Patent number: 6734275
    Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a urea based amino resin and a hardener composition, wherein the hardener composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a hardener composition as well as wood based products obtained by the method or through the use of the adhesive system.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: May 11, 2004
    Assignee: Akzo Nobel N.V.
    Inventors: Salme Pirhonen, Benyahia Nasli-Bakir, Ingvar Lindh
  • Patent number: 6713571
    Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: March 30, 2004
    Assignee: Nitto Denki Corporation
    Inventor: Katsumi Shimada
  • Patent number: 6667078
    Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: December 23, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Katsumi Shimada, Yutaka Aoki
  • Patent number: 6653371
    Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: November 25, 2003
    Inventors: Barry E. Burns, Harry Woolfson, Paul Malone, Jonathan Wigham
  • Patent number: 6613839
    Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: September 2, 2003
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, John P. Everett
  • Patent number: 6599993
    Abstract: A powder coating composition that includes at least about 9% by weight, based on total vehicle weight, of a branched carboxylic acid-functional polyester having a number average molecular weight of from about 425 to about 1050 and at least one vehicle component reactive with carboxylic acid groups comprising an epoxy-functional material, produces a matte, textured coating.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: July 29, 2003
    Assignee: BASF Corporation
    Inventors: William C. Norris, Josef Rademacher
  • Patent number: 6586498
    Abstract: An ink jet ink composition comprising from about 0.5% to about 30% by weight of a pigment, a carrier and a dispersant, the dispersant comprising an anionic derivative of an ethoxylated alkylphenol-formaldehyde resin, the ratio of dispersant:pigment being from about 0.1:1 to about 5:1.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: July 1, 2003
    Assignee: Eastman Kodak Company
    Inventors: David Erdtmann, Alan R. Pitt, Ian M. Newington
  • Patent number: 6576718
    Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: June 10, 2003
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Michael Teruki Takemori
  • Patent number: 6555602
    Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: April 29, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Tadaaki Harada, Toshitsugu Hosokawa
  • Patent number: 6538048
    Abstract: An ink jet printing method, comprising the steps of: A) providing an ink jet printer that is responsive to digital data signals; B) loading the printer with ink jet recording elements; C) loading the printer with an ink jet ink composition comprising from about 0.5% to about 30% by weight of a pigment, a carrier and a dispersant, the dispersant comprising an anionic derivative of an ethoxylated alkylphenol-formaldehyde resin, the ratio of dispersant:pigment being from about 0.1:1 to about 5:1; and D) printing on the ink jet recording element using the ink jet ink in response to the digital data signals.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: March 25, 2003
    Assignee: Eastman Kodak Company
    Inventors: David Erdtmann, Ian M. Newington, Alan R. Pitt
  • Patent number: 6469109
    Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: October 22, 2002
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Youichi Ueda, Yasuhiro Endo, Mitsuhiro Shibata, Kaori Yamasaki