Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: A composition of matter, comprising: a chemically functionalized carboxylate-alumoxane that is functionalized with a chemically reactive substituent, and a reactive compound, wherein the chemically reactive substituent reacts with the reactive compound so as to link the carboxylate-alumoxane to the reactive compound and form a polymer matrix. The functional groups on the carboxylate-alumoxane can vary depending on the desired properties of the matrix. Also, the composition of matter may comprise a cross-linked matrix in which the cross-linked components consist of functionalized alumoxanes.

Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: 1

Abstract: The present invention relates to a highly branched polyamide oligomer of the general formula (I) as hereinabove defined, to the process for preparing and branched oligomers and to different uses thereof. As well known to the man skilled in the art, the implementations and efficacy of the different polyamide oligomers may vary, depending on their structure and valency (reactive groups composition). Polyamide oligomers may be used, for example, as epoxy hardeners in the preparation of thermosetting compositions, as thermoplastic hot melt adhesives, as adhesion promoters and many other suitable applications. The highly branched oligomers disclosed have been shown to be highly efficient, for example, as epoxy hardeners, inter alia, in the formation of glue, lacquer, enamel or sealant mixtures.

Abstract: An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamide curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. The cured epoxy composition has good flexibility. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamide and (c) a hydroxy-functional amine.

Abstract: An ester compound prepared by esterifying at least one OH group of a polyhydric phenol as a condensation product of a non-substituted or substituted resorcinol and a carbonyl compound with an organic carboxylic acid having 1 to 20 carbon atoms or a derivative thereof, which necessarily contain an organic carboxylic polyacid having 1 to 20 carbon atoms or a derivative thereof. The ester compound can be used as an epoxy resin curing agent affording a cured article having low dielectric constant, low moisture absorption and sufficient heat resistance.

Abstract: An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.

Abstract: A two-part adhesive is provided wherein the first part comprises a stable aqueous alkaline monohydroxylic phenolic resole resin solution containing a methylene donor such as oxazolidine or a methylolurea and the second part comprises a stable resorcinolic resin precondensate having a shortage of formaldehyde and optionally containing a catalyst such as an ester functional compound for the resole resin. The resin in each part exhibits viscosity stability of an unmodified resin until mixed with the other part wherein the methylene donor, of the first part catalyzes the resorcinolic resin of the second part and the catalyst, when used, of the second part catalyzes the monohydroxylic phenolic resole resin of the first part. The adhesive finds utility in the production of structural lignocellulosic panels.

Abstract: Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: A composition useful as an encapsulating material for photosemiconductor elements such as a photodetector or light emmitor comprises an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2):CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --Y.sub.1 (1)[CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --RCOO--].sub.m --Y.sub.2(2)wherein Y.sub.1 represents --H, --RCOOH, --COR' or --R'; R' is an alkyl group with not more than 30 carbon atoms; R is a divalent organic group; Y.sub.2 represents a metal atom having a valence of at least one; the mean value for x is from 8-200; and n is set such that the weight ratio of the repeating unit --CH.sub.2 --CH.sub.2 --O-- accounts for from 25-95% by weight based on the whole compound; and m is a positive integer corresponding to the valence of Y.sub.2.

Abstract: High solids coating compositions are made from organic solvent solutions of (A), the reaction product of (1) an epoxidized vegetable oil, (2) a diglycidyl ether of a dihydric phenol, and (3) a dihydric phenol, reacted with (B) an unsaturated fatty acid, and (C) an alkylacetoacetate.

Abstract: The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprises a phosphorus-containing compound of the formula I or II ##STR1## in which R1 and R2 are identical or different and are a straight-chain or branched alkyl radical of 1 to 8 carbon atoms, a cyclohexyl, cyclopentyl or aryl radical or an alkyl- or alkoxy-substituted alkyl radical of 1 to 18 carbon atoms, it also being possible for R1 and R2, together with the P atom, to form a ring, and m and n are 0 or 1, to a process for their preparation and to their use.

Abstract: Modified epoxy resins are obtained by reaction of an epoxy resin with up to one mol equivalent per epoxy group of an alkyl or alkenyl substituted, hydroxy substituted aromatic acid, especially by reaction of a bisphenol A based epoxy resin with an alkylated salicylic acid. Also are described a process for the production of such modified resins, curable compositions comprising the modified epoxy resin and products provided with the cured composition, especially in coating applications and civil engineering applications.

Abstract: Disclosed are novel crosslinked polymers derived from methylol phenols and maleic acid species, and methods of synthesizing these macromolecules. Polyesters and chromandicarboxylic groups are the dominant linkages in the structure of general formula: ##STR1## R is H or a spacing group between aromatics, R.sub.1 is an aldehyde substituent, R.sub.2 a spacing group belonging to multihidric alcohols, a maleyl grouping, and n a whole number either 0 or 1.

Abstract: A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

Abstract: The invention relates to a phosphorus-modified epoxy resin having an epoxide value of from 0.05 to 0.6 mol/100 g comprising structural units derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphorus-containing dicarboxylic acids or phosphorus-containing carboxylic anhydrides,to a process for their preparation and to their use.

Abstract: The present invention relates to a liquid resin composition comprising (1) a liquid epoxy resin, (2) a particular ester curing agent, and (3) a curing accelerator. This epoxy resin composition can provide a cured resin with excellent heat resistance and water resistance, which is particularly useful for encapsulation, casting and adhesion.

Abstract: A coating composition is described comprising, in an aqueous medium:A) a resin having a plurality of primary amine groups, andB) a curing agent having a plurality of cyclic carbonate groups.

Abstract: The invention relates to a process for preparing soluble and/or meltable phosphorus-modified epoxy resins, which comprises reacting a polyepoxide compound having at least 2 epoxide groups per molecule with carboxyl-containing phosphinic or phosphonic acids.

Abstract: The invention provides for a process for the preparation of an advanced resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

Abstract: A carboxyl-containing phenolic resin represented by the formula: ##STR1## where n is 0 to 100, the phenolic units of the resin being directly bonded to one another through positions ortho or para to the OZ group; Z is selected from the group consisting of H and the residue of a mono or dianhydride, said mono or dianhydride having been reacted with a hydroxy group of a phenolic resin; and Y is present at a position meta or para to the OZ group and is selected from the group consisting of an alkyl group, a halogen atom, an aryl group, a phenylalkyl group, an alkyl group, a carboxyl group of the formula--COOR where R is H, an alkyl group or a phenylalkyl group, an alkoxy group, an aryloxy group, and an amino group of the formula--NR.sub.1 R.sub.2 where R.sub.1 and R.sub.2 are the same or different and represent H or an alkyl group.

Abstract: The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched alkyl, cycloalkyl, aryl or alkylaryl group having 1 to 18 carbon atoms or is hydrogen, and R' is a linear or branched alkylene, cycloalkylene, arylene or alkylarylene group having 1 to 18 carbon atoms, to a process for their preparation and to their use.

Abstract: Modified epoxy resins are obtained by reaction of an epoxy resin with up to one mol equivalent per epoxy group of an alkyl or alkenyl substituted, hydroxy substituted aromatic acid, especially by reaction of a bisphenol A epoxy resin with an alkylated salicylic acid. Also are described a process for the production of such modified resins, curable compositions comprising the modified epoxy resin and products provided with the cured composition, especially in coating applications and civil engineering applications.

Abstract: An increase in the molecular weight of a polyamide or recycled polyamide, essentially without crosslinking, can be achieved by blending said polyamide with a polyfunctional epoxy resin and a sterically hindered hydroxyphenylalkylphosphonic acid ester or half-ester and heating the blend to above the melting point (or the glass transition temperature) of the polyamide, in the absence of a catalyst of the type used in the polymerization of polyamides.

Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.

Abstract: A composition which provides polyamide substrates with resistance to staining by acid dyes comprising(A) carboxylic acid-containing stain-resist polymers selected from:(i) methacrylic acid polymers, or(ii) hydrolyzed copolymers of maleic anhydride with ethylenically unsaturated aromatics, alpha-olefins, alkyl vinyl ethers or alkyl allyl ethers or(iii) mixtures of (i) and (ii),and(B) resole condensates prepared by reacting bis(hydroxyphenyl)sulfone which contains no sulfonate or carboxylate groups with formaldehyde in the presence of an alkali metal hydroxide, at a bis(hydroxyphenyl)sulfone resole resin:carboxylic acid-containing stain-resist polymer weight ratio in the range between about 1:20 and 2.5:1.0 is disclosed.

Abstract: A coating composition applied to a substrate, the composition containing a solids content of at least about 65 percent by weight and including a polyanhydride having more than one non-cyclic moiety, a co-reactant resin such as a glycidyl (meth)acrylate-containing polymer, and a latent catalyst, wherein the equivalent ratio of epoxy to anhydride groups is from about 0.8:1 to 1.3:1.

Abstract: A coating composition applied to a substrate wherein the composition contains a solids content of at least about 65 percent by weight and includes a polyanhydride having more than one non-cyclic anhydride moiety, a glycidyl groups-containing oligomer, a catalyst and a surfactant or flow-control agent.

Abstract: Permanent aqueous marker inks are provided which include surfactant, a pigment, a film-forming polymer, and water. The surfactant may be a combination of a hydrocarbon, preferably an alkylphenol ethyoxylate and a fluorocarbon, or it may be a silicone.

Abstract: A process for preparing binder-coated fiber-glass products employs as a binder aqueous polymer systems comprising a nitrogenous formaldehyde resin such as a urea-extended alkaline phenol/formaldehyde resole together with an acidic polyacrylate which cocure to form a thermoset polymer while synergistically reducing ammonia emissions which normally occur during cure of the nitrogenous formaldehyde resin. The polymer system may be used in applications other than fiberglass where reduced emissions are desired.

Abstract: A hyperbranched macromolecule of polyester type comprising a central monomeric or polymeric nucleus and at least one generation of a branching chain extender having at least three reactive sites of which at least one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and at least one is a carboxyl or terminal epoxide group. The nucleus is an epoxide compound having at least one reactive epoxide group. Optionally, the macromolecule comprises at least one generation consisting of at least one spacing chain extender having two reactive sites of which one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and one is a carboxyl or terminal epoxide group. The macromolecule may be terminated by means of at least one chain stopper.

Abstract: A binder resin composition, a curing agent composition, a caking additive composition, a kit, a casting mold composition and a process for manufacturing a casting mold are disclosed, wherein a metallic compound containing a metallic element belonging to Group IB to VIII of the Periodic Table is utilized. The compositions are useful for the production of a sand mold for casting, having an excellent strength, from reclaimed sand, in a self-hardening or gas hardening mold process. The casting mold according to the present invention, which is manufactured in the presence of a metallic compound containing a metallic element belonging to Group IB to VIII of the Perioidic Table has excellent strength.

Abstract: A coating composition with a solids content of at least about 65% by weight comprises a polyanhydride having more than one non-cyclic anhydride moiety, a co-reactant resin such as a glycidyl (meth)acrylate-containing polymer and a latent catalyst wherein the equivalent ratio of epoxy to anhydride is from about 0.8:1 to 1.3:1.

Abstract: A coating composition with a solids content of at least about 65% by weight comprises a polyanhydride having more than one non-cyclic anhydride moiety, a glycidyl groups-containing oligomer, a catalyst and a surfactant or flow-control agent.

Abstract: The present invention discloses novolacs and thermosets thereof containing mesogenic moieties. Certain of said novolacs and thermosets thereof exhibit nonlinear optical properties upon orientation.

Abstract: The invention relates to a substantially solventless curable resin composition, in particular for the fabrication of prepregs, which contains more than 45% by weight of substances which are solid at ambient temperature at least or at lower temperature, and which, in addition to comprising customary modifiers, comprises solid epoxy resins or a mixture of liquid and solid epoxy resins, at least one initiator which is sensitive to UV radiation for the polymerisation of the epoxy resins and has the formula I ##STR1## wherein a and b are each independently of the other 1 or 2, R.sup.1 ist a .pi.-arene, R.sup.2 is a .pi.-arene, an indenyl anion or a cyclopentadienyl anion, [X].sup..crclbar. is an anion [LQ.sub.m ].sup..crclbar.

Abstract: Anti-reflective coatings and methods for forming these anti-reflective coatings are disclosed that have a polymer chemistry and optical characteristics suitable for suppressing the light that reflects off a circuit substrate during a photolithographic process. These anti-reflective coatings include a phenolic polymer material and an epoxide-containing polymer material that can be combined in a select proportion to form a thermally curable polymeric anti-reflective coating. The select proportions of the combined materials tailors the optical characteristic of the anti-reflective coating to attenuate energy about a select range of wavelengths.

Abstract: A polyalkylmethacrylate co-polymer of polyhydroxystyrene has been found to be an ideal blending partner in a novolak photoresist composition. The preferred co-polymer is poly(p-hydroxystyrene)-co-(methyl methacrylate). The co-polymer is fully miscible with novolaks and has a high thermal stability (>150.degree. C.).

Abstract: In a process for crosslinking a polymer, a .beta.-dicarbonyl functionality is present as a reactive diluent and/or as a reactive solvent and/or on a crosslinking entity. The .beta.-difunctional compound reacts with formaldehyde which is either released during the crosslinking reaction (or otherwise present) whereby less formaldehyde is released, than would otherwise be released. The formaldehyde which reacts with the .beta.-dicarbonyl compound is either incorporated into the crosslinked polymer network or released in the form of a reaction product which is not as harmful to the environment as the unreacted formaldehyde. The process enables the reduction of formaldehyde release during crosslinking to levels otherwise unobtainable. Furthermore, the process enables a reduction in the amount of organic solvent utilized.

Abstract: Novel polymeric compositions are provided for polyamide fibers or fibers having terminal amino groups that impart stain resistance and are resistant to discoloration.

Abstract: A process for the manufacture of a stain resistant carpet by melt mixing a fiber forming synthetic polyamide with a compound, being capable to react with an amino group, to form a homogeneous polymer melt into fibers, tufting the fibers into a backing to form a carpet and treating the carpet with polymethacrylic acid, copolymers of polymethacrylic acid, a mixture of polymethacrylic acid and a sulfonated aromatic formaldehyde condensation product, and a reaction product of the polymerization or copolymerization of methacrylic acid in the presence of a sulfonated aromatic formaldehyde condensation product.

Abstract: A composition for imparting stain resistance to polyamide substrates comprising a sulfonated fatty composition and sulfonated hydroxyaromatic formaldehyde condensation polymer. A method for making the stain treatment composition, a method for treating polyamide substrates with the composition, and the resulting stain resistant polyamide materials are also disclosed. Suitable sulfonated hydroxyaromatic formaldehyde condensation polymers include sulfonated phenol formaldehyde condensation polymer and sulfonated dihydroxy diphenyl formaldehyde condensate polymer. Suitable sulfonated fatty compositions include sulfonated oleic acid and marine oil.

Abstract: The invention relates to an ester cured no-bake foundry binder system preferably comprising as separate components (a) an aqueous basic solution of a phenolic resole resin; and (b) a hardener comprising (i) a polyphenol resin, and (ii) a liquid ester. Alternatively, the polyphenol resin can be used as a separate component. The foundry binder systems produce foundry shapes with improved tensile strengths when compared to foundry shapes which are prepared from foundry binder systems which do not contain a polyphenol resin.

Abstract: Anhydride compounds which contain at least one rodlike mesogenic moiety and at least two anhydride groups per molecule, wherein each of said aromatic anhydride groups is linked to the mesogen via an ester linkage are prepared. These anhydride compounds are useful in curing epoxy resins to provide the cured products with one or more improved properties.

Abstract: A binder mixture containing lignin or lignins with reactive groups and phenol-novolac in a weight ratio of 95:5 to 50:50 useful for the production of non-woven fabrics and wood fiber materials.

Abstract: The present invention is directed to a phenolic resin composition suitable for use in bonding refractory materials, such as sand, in the production of foundry moulds and cores and also in treating subterranean formations. The phenolic resin composition comprises an esterified phenolic compound, a phenolic novolak resin and a base, which will react to provide final cure in the presence of water or other polar solvent. The composition, once reacted, will bond granular refractory materials. The esterified phenolic compound contains at least one esterified methylol group positioned ortho or para to a phenolic hydroxyl group or an esterified phenolic hydroxyl group. Included within the invention are anhydrous precursors to the reactive phenolic resin composition and also foundry moulding compositions which incorporate the reactive phenolic resin compositions. Other embodiments of the invention include methods for making foundry moulds and cores and methods for curing the reactive phenolic resin composition.

Abstract: Novel polymeric compositions are provided for polyamide fibers or fibers having terminal amino groups that impart stain resistance and are resistant to discoloration.