Abstract: Provided is a process for producing a polyisocyanurate comprising: trimerizing an aliphatic polyisocyanate with a trimerization catalyst in the presence of a thermally decomposable acid at a molar ratio of acid to catalyst of from 0.1 to 10, wherein the polyisocyanurate has a greater pot life than the pot life of the polyisocyanurate not containing the thermally decomposable acid. Polyisocyanurates made according to the inventive process lengthen the pot life of pultrusion composite formulations made therefrom without affecting the reactivity of the formulations.

Abstract: A polycarbodiimide compound represented by the following general formula (1): wherein R1 and R3 are defined in the specification; R2 comprises a group represented by formula (i) or (ii) as defined in the specification; the proportion of the groups represented by the formula (i) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %, and the proportion of the groups represented by the formula (ii) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %; X1 and X2 each represent a group formed by the reaction of the organic compound and isocyanate, and X1 and X2 may be the same as or different from each other; and n represents an integer of 2 to 50.

Abstract: Polyurethane-polyisocyanurate compounds and processes for preparing polyurethane-polyisocyanurate compounds are disclosed herein. A process includes mixing component (a) polyisocyanate with component (b) a mixture obtainable by introducing an alkali metal or alkaline earth metal salt into a compound R—NH—CO—R containing urethane groups, where R is not hydrogen and is not COR, component (c) compounds containing one or more epoxide groups, component (d) one or more compounds having at least two isocyanate-reactive groups, comprising compounds having NH2 and/or primary OH groups, and component (e) optionally fillers and other additives, to form a reaction mixture, and reacting the reaction mixture to form the polyurethane-polyisocyanurate compound, wherein the molar amount of alkali metal and/or alkaline earth metal ions in the reaction mixture per mole of urethane group in component (b) is 0.0001 to 3.5 and the isocyanate index is greater than 150.

Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

Abstract: The latex polymer compositions of the present invention exhibit latent crosslinking properties. Latent crosslinking in the polymers takes advantage of the fast interaction between the anionic latex charge and the cationic charge associated with polyfunctional amine crosslinkers. Once the latex is coated onto a substrate, the volatile base evaporates and the groups react to form a crosslinked coating with improved wash-off properties.

Abstract: A light-shielding paint includes an epoxy group-containing compound, an inorganic fine particle, a coloring agent, and an amine curing agent. The ratio (A?/A) of the mass (A?) of the amine curing agent to the active hydrogen equivalent (A) of the amine curing agent and the ratio (E?/E) of the mass (E?) of the epoxy group-containing compound to the epoxy equivalent (E) of the epoxy group-containing compound satisfy 0.1?[(A?/A)/(E?/E)]?0.45.

Abstract: The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ?-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C).

Abstract: Stable polyisocyanate composition comprising a compound comprising a group having the structure —CO—NH—O— in such an amount that the ratio of the number of —CO—NH—CO— groups to the number of isocyanate groups is at most equal to 1. Curable composition comprising this polyisocyanate composition, lithium halide, urea and an epoxy resin.

Abstract: A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process.

Abstract: The object of the present invention is to provide carbon fiber material having high electrical conductivity at a low cost. A manufacturing method of carbon fiber material comprises a dispersion liquid preparation step, a centrifugal spinning step and a denaturation step. The dispersion liquid preparation step is a step in which dispersion liquid containing resin and carbon particles is prepared. The centrifugal spinning step is a step in which nonwoven fabric made of a carbon fiber precursor is formed from the dispersion liquid. The denaturation step is a step in which the carbon fiber precursor denatures into carbon fiber.

Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.

Abstract: A polyalkylene carbonate resin composition with interpenetrating network structure includes an aliphatic polycarbonate obtained through a reaction of carbon dioxide with at least one epoxide compound selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl or aryl, at least one compound selected from a polyol compound, an epoxy compound and an acryl compound, and a curing agent for polymerization or networking.

Abstract: The present invention relates to a process for the preparation of a hydroxy-amino polymer, comprising the steps: a) reacting an H-functional starter compound carrying at least one Zerewitinoff-active H atom with an unsaturated cyclic carboxylic acid anhydride to give a carboxyl-group-carrying prepolymer, b) reacting the carboxyl-group-carrying prepolymer with at least one epoxide compound to give a hydroxyl-group-carrying prepolymer, c) adding a primary amine and/or ammonia to the double bond of the hydroxyl-group-carrying prepolymer obtained according to step b) to give the hydroxy-amino polymer, wherein the ratio of the amount of carboxylic acid anhydride to the number of Zerewitinoff-active H atoms of the H-functional starter compound is so chosen that almost all the Zerewitinoff-active H atoms of the H-functional starter compound are reacted.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: Provided is a sealant for use in contact with a polyelectrolyte membrane; at least the sealant surface contacting the polyelectrolyte membrane is constituted of a resin composition containing a crystalline polyester resin as a main component; the resin composition has a storage elastic modulus at 40° C. of 2.5 MPa or more and 5 MPa or less; the resin composition further contains an epoxy resin and an isocyanate-based crosslinking agent; and the crystalline polyester resin is crosslinked with the isocyanate-based crosslinking agent.

Abstract: Stable polyisocyanate composition comprising a compound comprising a group having the structure —CO—NH—O— in such an amount that the ratio of the number of —CO—NH—CO— groups to the number of isocyanate groups is at most equal to 1. Curable composition comprising this polyisocyanate composition, lithium halide, urea and an epoxy resin.

Abstract: The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.

Abstract: A composition of matter suitable for use in extrusion coating applications is disclosed. The composition comprises a blend of particular LLDPE with particular LDPE. The LLDPE has the following characteristics: a density in the range of from 0.89 g/cc to 0.97 g/cc; an MWD less than 2.8; a melt index (I2) in the range of 4.0 to 25 g/10 min; a Comonomer Distribution Constant in the range of from greater than from 45 to 400; and a vinyl unsaturation of less than 0.12 vinyls per one thousand carbon atoms present in the backbone of the ethylene-based polymer composition. The LDPE has a melt index (I2) in the range of 0.1 to 15 g/10 min, and has a melt strength which satisfies the inequality: Log Melt strength (cN)>1.14?0.6×Log I2(g/10 min,190° C.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at ?40° C.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: A novel aluminum chelate latent curing agent that can cure a glycidyl ether epoxy compound at a lower temperature and more quickly than an aluminum chelate latent curing agent produced by emulsification and interfacial polymerization of a polyfunctional isocyanate in the presence of both a radical polymerizable monomer, such as divinyl benzene, and a radical polymerization initiator, is micro-encapsulated in a core-shell form, wherein an aluminum chelate curing agent and a cationic polymerizable compound are included in a capsule formed from an interfacial polymerization product of a polyfunctional isocyanate.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: The present invention provides highly fluorescent markers, made from a reactive polymer and an isocyanate, that fluoresce in the ultraviolet or near infrared region without being visible to the human eye at low concentrations in the fluid or article being marked. The molecular weight and fluorescence emission wavelength of these highly fluorescent marker compounds can be adjusted to provide a multitude of markers with unique fluorescence signatures.

Abstract: Partially hydrogenated bisphenol-A based polymers. Coating compositions for food or beverage containers and medical devices, including a partially hydrogenated bisphenol-A based polymer. Food or beverage containers and medical devices coated with partially hydrogenated bisphenol-A based polymers. Food or beverage containers and medical devices made from partially hydrogenated bisphenol-A based polymers.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.

Abstract: A process comprising contacting a) an epoxy resin; b) an adduct comprising at least one oxazolidone ring prepared from a multifunctional epoxy resin and an isocyanate compound; and c) an unsaturated acid to form a vinyl ester, is disclosed.

Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.

Abstract: A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Abstract: The present invention relates to polyurethanes obtainable via mixing of (a) polyisocyanate, (b) polymeric compounds having groups reactive toward isocyanates, (c) catalyst, (d) aliphatic hydrocarbon having from 2 to 15 carbon atoms and comprising at least one heteroatom selected from the group consisting of oxygen, nitrogen, and sulfur, and comprising at least one bromine and/or chlorine atom, (e) optionally blowing agent, (f) optionally chain extender and or crosslinking agent, and (g) optionally auxiliary and/or additives to give a reaction mixture and allowing the reaction mixture to complete its reaction to give the polyurethane, where the aliphatic hydrocarbon (d) comprises no phosphoric ester, polyphosphate, phosphonic ester, or phosphorous ester. The present invention further relates to a process for producing such polyurethanes, and to their use in the interior of conveyances.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: In one aspect, the present disclosure encompasses polymerization systems for the copolymerization of CO2 and epoxides comprising 1) a catalyst including a metal coordination compound having a permanent ligand set and at least one ligand that is a polymerization initiator, and 2) a chain transfer agent having two or more sites that can initiate polymerization. In a second aspect, the present disclosure encompasses methods for the synthesis of polycarbonate polyols using the inventive polymerization systems. In a third aspect, the present disclosure encompasses polycarbonate polyol compositions characterized in that the polymer chains have a high percentage of —OH end groups and a high percentage of carbonate linkages. The compositions are further characterized in that they contain polymer chains having an embedded polyfunctional moiety linked to a plurality of individual polycarbonate chains.

Abstract: An insulating varnish includes a polyamide-imide resin including a repeat unit represented by Formula (1) below derived from a synthesis reaction between a resin component (X) and a diisocyanate component (Y). The resin component (X) is derived from a synthesis reaction between a diamine component including aromatic diamines including g a divalent aromatic group (R) including three or more aromatic rings, and an acid component in the presence of an azeotrope solvent. The diisocyanate component (Y) includes a 2,4?-diphenylmethane diisocyanate (Y1) and a 4,4?-diphenylmethane diisocyanate (Y2). In Formula (1), R denotes the divalent aromatic group including three or more aromatic rings, and m and n denote an integer of from 1 to 99.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention provides highly fluorescent markers, made from a reactive polymer and an isocyanate, that fluoresce in the ultraviolet or near infrared region without being visible to the human eye at low concentrations in the fluid or article being marked. The molecular weight and fluorescence emission wavelength of these highly fluorescent marker compounds can be adjusted to provide a multitude of markers with unique fluorescence signatures.

Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.

Abstract: There is provided a novel dicyanatophenyl-based difunctional cyanate ester which is in a liquid form at ordinary temperature and can obtain a cured product having an excellent low thermal expansion rate. There is disclosed a cyanate ester compound represented by the following formula (I): (wherein R1 represents a hydrocarbon group having 2 to 20 carbon atoms).

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention provides highly fluorescent markers, made from a reactive polymer and an isocyanate, that fluoresce in the ultraviolet or near infrared region without being visible to the human eye at low concentrations in the fluid or article being marked. The molecular weight and fluorescence emission wavelength of these highly fluorescent marker compounds can be adjusted to provide a multitude of markers with unique fluorescence signatures.

Abstract: The present invention has its object to produce a highly reactive crystalline polyoxyalkylene polyol with a very high isotacticity at low cost, and provide polyurethane resins, and polyester resins which are excellent in sharp meltability. The present invention relates to a method for producing a crystalline polyoxyalkylene polyol having a number average molecular weight of 500 to 20,000 including performing ring-opening polymerization of an alkylene oxide (a) in the presence of a salen complex (B), the crystalline polyoxyalkylene polyol (A), and a polyurethane resin and a polyester resin produced by the crystalline polyoxyalkylene polyol (A).

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.

Abstract: A solid epoxy resin powder coating composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate.