Abstract: A non-aqueous, solvent-free formulation for producing clear, transparent, heat-resistant elements, suitable for use as lenses in optoelectronic devices, consists essentially of an acidic, nonpolymerizing acrylic resin; THFA, DMA, HEMA, HBA, or an equivalent polymerizable diluent in which the acrylic resin is dissolved; and a free-radical photoinitiator.

Abstract: Catalysts useful for low-cure powder coating compositions are disclosed, having the structure (I): wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 12 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a —R2— when Z is nitrogen; a, b, and c are integers; each X is independently S, O, or N(R6); each R6 is independently hydrogen or an alkyl or aryl group having 1 to 12 carbon atoms; and P is a polymeric material.

Abstract: In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

Abstract: The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of these solventless reactive systems curable at room temperature.

Abstract: The present invention provides a golf ball having a marking that can be directly printed on the surface of golf ball body without undercoating treatment when printing the marking and has good appearance and excellent durability after repeated hitting. The present invention relates to a golf ball having a marking printed with an ink composition on the surface thereof, wherein the ink composition comprises epoxy resin having a terminal OH group, polyisocyanate curing agent and a coloring agent as essential components, and the curing agent comprises 25 to 35% by weight of isocyanurate polyisocyanate derived from hexamethylene diisocyanate, 25 to 35% by weight of biuret polyisocyanate derived from hexamethylene diisocyanate and 35 to 50% by weight of isocyanurate polyisocyanate derived from isophorone diisocyanate.

Abstract: A low viscosity blocked isocyanate solution can be made by reacting together a polymeric isocyanato compound and propylene glycol, or a polymeric primary or secondary amine and propyl carbonate. The resulting beta-hydroxypropyl urethane polymer can be combined with propylene glycol monomethyl ether as a reducing solvent to form a pourable high-solids solution with good flow properties at room temperature. The solution has lower viscosity than is obtained using ethylene glycol as a blocking agent or using several non-HAPS reducing solvents that are similar to propylene glycol monomethyl ether. The solution can readily be combined with electrodepositable paint ingredients to form a curable coating composition.

Abstract: The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl phenol and/or a carboxylic acid, a xylene-formaldehyde resin, and an amino group-containing compound.

Abstract: An environmentally preferred flock adhesive composition containing low molecular weight prepolymers of isocyanate terminated polyether and/or polyalkadiene polyols is disclosed. The prepolymers are free of residual volatile isocyanate (<1000 ppm) without blocking the isocyanate thereby providing favorable effects on viscosity, cure kinetics, and safety. The flock adhesive composition preferably contains an aromatic nitroso compound an epoxy novolak resin and a catalyst. The adhesive compositions can be made at high solids, with minimal co-solvent, while maintaining low viscosity, which is favorable to environmental regulations aimed at reducing solvent emissions. Furthermore, the solvents can be non-HAP and non-photochemically reactive. The adhesive composition can be utilized for the application of flocking fibers to various elastomer substrates.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.

Abstract: Polyurethane powder coating compositions containing uretdione groups and curing at low temperatures are provided, along with processes for preparing such compositions, and their use as powder coatings, wherein the compositions generally contain: A) a uretdione-containing powder coating hardener derived from aliphatic, (cyclo)aliphatic, cycloaliphatic or aromatic polyisocyanates and hydroxyl-containing compounds, and having a melting point from 40 to 130° C., a free NCO content of less than 5% by weight, and a uretdione content of 6-18% by weight; B) a hydroxyl-containing polymer having a melting point from 40 to 130° C., and an OH number between 20 and 200 mg KOH/gram, and C) a catalyst of the formula [NR1R2R3R4]+[R5]?, in which R1-R4 simultaneously, or independently of one another, are alkyl, aryl, aralkyl, heteroaryl or alkoxyalkyl radicals, and each R1-R4 is aromatic, linear or branched, unbridged or bridged with other radicals, R1-R4.

Abstract: This invention provides high solid paint compositions comprising as the basic components a hydroxyl-containing compound having a weight-average molecular weight of not more than 1,000 and a hydroxyl value of 200-800 mgKOH/g, and a polyisocyanate compound, and a process for forming multi-layered coating film using any of said compositions.

Abstract: A low VOC clear coat composition which comprises an epoxy compound, a melamine component and an aliphatic polyisocyanate having an average of 2 to 6 isocyanate functionalities, and optionally contains a catalyst (e.g., organotin catalysts, acid catalysts and combinations); a polyhydroxyl functional compound (e.g., polycarbonate polyol); or other additives (e.g., light absorbers and light stabilizers). Also disclosed is an article coated with the clear coat composition, a process of making the composition, and a process of applying the composition to, for example, an automobile body.

Abstract: A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups.

Abstract: A golf ball which is excellent in durability, sufficient to be used in a golf practice range, wherein the golf ball includes a core, a cover covering the core, and a mark printed on the surface of the cover, wherein: the cover is formed from a mixture of an ionomer and an epoxy group-containing polymer and the mark is printed with an ink containing a pigment, an isocyanate compound, and a base resin which is curable with the isocyanate compound.

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a polyolefin-graft-cyclic anhydride copolymer, and a reinforcing filler. The composition exhibits high stiffness while maintaining high impact strength.

Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.

Abstract: A high strength adhesive having a good impact strength at low temperatures, below 0° C., and at temperatures of 90° C. is provided. The adhesive comprises a copolymer having at least one glass transition temperature of −30° C. or lower having epoxy reactive end groups or a reaction product of the copolymer with a polyepoxide, a reaction product of a polyurethane prepolymer and a polyphenol or polyaminophenol and at least one epoxy resin.

Abstract: Hot melt coating composition, particularly suitable for low viscosity requiring application techniques, the composition having a Tg below 5° C., preferably below −20° C., and a viscosity below 2,000 mPa.s, preferably below 600 mPa.s, measured at 70° C. at a shear rate of 10 s−1. The composition includes at least one amorphous binder having a Tg below 5° C., preferably below −20° C., and/or at least one crystalline or semi-crystalline binder having a melting point or melting range below 150° C. The composition can be a one component system comprising an epoxy-functional resin, a polyamine having cyanamide groups, preferably dicyandiamide, and a blocked catalyst which is unblocked at an elevated temperature below the curing temperature. Alternatively, the composition may be one component of a two-component system based on isocyanate/polyol crosslinking.

Abstract: A dielectric resin composition comprising at least one type of epoxy resin and at least one type of cyanate ester which would react with said epoxy resin, together with a metal ion catalyst system, the ratio of the epoxy functional groups of said epoxy resin to the cyanate groups of said cyanate ester being in the range of from 1:0.8 to 1:1.4. Alternatively, a dielectric resin composition according to the invention may comprise a polyimide resin with side chain epoxy groups, a cyanate ester with two or more cyanate groups in the molecule, and a metal ion catalyst system. A multilayer circuit board having a multilayer structure comprising a core substrate and a required number of dielectric layers and wiring layers stacked alternately, wherein at least one of the dielectric layers is formed from a dielectric resin composition of the invention, is also disclosed.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.

Abstract: The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.

Abstract: The present invention provides a cationic paint composition which contains, as resin component, an amino group-containing epoxy resin obtained by making an epoxy resin having an epoxy equivalent of 300-2500 react with a hydroxyl group-containing carboxylic acid, which is prepared by allowing caprolactone to react to a hydroxyl group of a hydroxy monocarboxylic acid, and with an amino group-containing compound.

Abstract: The present invention provides a novel oxazolidone ring-containing epoxy resin suitable for use as a resin for a coated film having a structure of the formula: wherein R3 represents a residue excluding epoxy groups of diepoxide, X represents a residue excluding isocyanate groups of polyurethane diisocyanate, and n represents an integer of 1 to 5; and wherein X has a structure of the formula: wherein R1 represents a residue excluding isocyanate groups of diisocyanate, R2 represents a residue excluding hydroxyl groups of diol, and m represents an integer of 2 to 10.

Abstract: PEG and related polymer derivatives having weak, hydrolytically unstable linkages near the reactive end of the polymer are provided for conjugation to drugs, including proteins, enzymes, small molecules, and others. These derivatives provide a sufficient circulation period for a drug-PEG conjugate and then for hydrolytic breakdown of the conjugate and release of the bound molecule. In some cases, drugs that previously had reduced activity when permanently coupled to PEG can have therapeutically suitable activity when coupled to a degradable PEG in accordance with the invention. The PEG of the invention can be used to impart water solubility, size, slow rate of kidney clearance, and reduced immunogenicity to the conjugate. Controlled hydrolytic release of the bound molecule in the aqueous environment can then enhance the drug delivery system.

Abstract: The invention relates to a coating material containing a binding agent and a cross-linking agent as well as a thixotropic agent based on ureas and/or ureas derivatives, whereby the coating material additionally contains a wetting agent that improves the wettability of the thixtropic agent.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.

Abstract: A molded polyurethane body is obtainable by reacting: a) one or more aliphatic polyols having a molecular weight of 450 to 6000 g/mol and a hydroxyl value of 10 to 235; b) with aliphatic and/or cycloaliphatic diisocyanates in an equivalent ratio of diisocyanate to polyol of 1.2:1.0 to 16.0:1.0; c) with diols as chain lengthening agents having a molecular weight of 60 to 450 g/mol, the NCO index formed from the quotient, which is multiplied by 100, of the equivalent ratio of isocyanate groups to the sum of the hydroxyl groups of polyol and chain lengthening agents lying within a range of 90 to 105; and d) with an at least bifunctional reaction component, which is suitable for subsequent cross-linking.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: This application discloses a golf ball printing ink enabling printing a clear mark which is free of any void or pinhole and has superior impact resistance and scuffing resistance without the need for a primer coat, a golf ball printing method utilizing the ink, and a golf ball bearing thereon a mark printed with the ink. The ink includes an epoxy resin and a coloring agent, and preferably further includes an isocyanate compound as a curing agent.

Abstract: A method of treating reaction injection molded polyurethane, polyurethane/urea and polyurea polymers comprising exposing a reaction injection molded polyurethane, polyurethane/urea or polyurea polymer to an amount of infrared energy sufficient to increase the temperature of the polymer to at least 175° C., and then maintaining the temperature of the polymer at or above that temperature, for a time sufficient to increase the Gardner impact property, as measured using ASTMD-3029, when compared to the same polymer which has been heated to the same temperature and maintained thereat for the same time in a convection oven. The invention produces marked improvements in impact, heat sag and heat distortion temperature properties, and thus is particularly suited to rapid preparation of parts using a mass production conveyor and is particularly well-suited to preparation of parts which are to be subjected to later high temperature processes, such as the “E-coat” process.

Abstract: An aqueous resin composition comprising a polyepoxy compound represented by formula (I): wherein n represents a number of from 0.1 to 20; Z represents a single bond, an alkylidene group having 1 to 4 carbon atoms or a sulfone group; and X represents a hydrogen atom or a glycidyl group, provided that at least 10% of nX's represent a glycidyl group, and water.

Abstract: The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa·s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa·s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.

Abstract: A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.

Abstract: A thermosetting resin composition comprising: a polycarbodiimide obtained from organic polyisocyanates containing at least one kind of aromatic polyisocyanate, an epoxy resin, a curing agent for epoxy resin, and a rubber component, wherein the proportions of the individual components are 100 parts by weight of the polycarbodiimide, 30 to 150 parts by weight of the epoxy resin, 1.0 equivalent or less, relative to the epoxy resin, of the curing agent for epoxy resin, and 0.1 to 20 parts by weight of the rubber component which is, in a semi-cured state (a B-stage), free from resin cracking or powder detaching when bent and therefore easy to handle and, after curing, has good electrical properties and heat resistance.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being produced, and the first substrate being bonded to a second substrate in a second step by applying an increased temperature and pressure, as a combination of the following components: i) a thermoplastic polymer having a proportion of 25 to 95% by weight; and ii) at least one epoxy resin that is solid at room temperature and has a proportion of 5 to 75% by weight; and, if desired, iii) at least one pre-adduct of epoxy resins and polyamines that is solid at room temperature and has a proportion of at most 25% by weight, a physical bonding taking place when the adhesive powder is applied to the first substrate in the first step, and the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and bei

Abstract: The invention provides a polymer (a) having a polymer backbone having appended thereto at least one carbamate functional group, the polymer represented by randomly repeating units according to the formula: R1 represents H or CH3, R2 represents H, alkyl, or cycloalkyl, L represents a divalent linking group, A represents repeat units comprising at least one repeat unit having a pendant cationic salting group, x represents 10 to 90 weight %, and y represents 90 to 10 weight %. The invention further provides a cathodic electrocoat coating composition comprising an aqueous dispersion of a polymer (a) and (b) a compound having a plurality of functional groups that are reactive with said carbamate groups, wherein the repeat units A of polymer (a) having a pendant cationic salting group are salted with an acid.

Abstract: A formulation to produce urethane linkages reacts cyclocarbonate groups with diamines. Aliphatic polyhydroxyl precursor molecules are first epoxidized. The invention does not require complete epoxidation, as it makes use of the un-epoxidized hydroxyl groups of the precursor molecule. These hydroxyl groups are combined with isocyanate groups of prepolymer molecules to form urethane links. The use of prepolymers increases the networking, flexibility, and impact-resistance of the final product. The known formulations for amine hardeners also require complete carbonation of the epoxy groups to form reactive cyclocarbonate groups, which are reacted with diamines to form an amine hardener. In the proposed invention, both cyclocarbonate and epoxy groups are used to combine with the different diamine molecules by making use of the different reactivities of aliphatic, cycloaliphatic, and aromatic amine groups.

Abstract: The present invention provides a cationic resin composition capable of forming a cationically electrodepositable coating film which is excellent in corrosion resistance, an aptitude for the cationic electrodepositable coating of a rust preventive steel plate and in adhesion to substrate, which cationic resin composition is characterized by comprising the following components: (A) an amino group-containing epoxy resin which is prepared by adding an amino group-containing compound to an epoxy resin having an epoxy equivalent of 400 to 3000, (B) a polyol-modified amino group-containing epoxy resin which is prepared by making an epoxy resin having an epoxy equivalent of 180 to 2500 react with an amino group-containing compound and with a polyol compound obtained by adding caprolactone to a compound having plural active hydrogen groups, and (C) a blocked polyisocyanate curing agent, component (A) being 40 to 70% by weight, component (B) being 4 to 40% by weight, and component (C) being 10 to 40% by weight, base

Abstract: There is disclosed a resin composition for electrodeposition paint comprising (A) a resin containing hydroxyl group, and (B) a polyisocyanate compound blocked with an amidoalcohol having at least one amide bond and at least one alcoholic hydroxyl group in the molecule, excellent in storage stability and capable of forming a coating film excellent in low temperature curability.