Abstract: An object of the present invention is to provide an epoxy resin, an epoxy resin-containing composition, and a cured product which are excellent in flexibility. The present invention relates to an epoxy resin, which is a reaction product of an epoxy compound (A) and an acid-terminated polyester (B). In addition, the present invention relates to an epoxy resin-containing composition and a cured product obtained by using the epoxy resin.

Abstract: A fluorinated ether compound, a fluorinated ether composition and a coating liquid capable of forming a surface layer excellent in initial water/oil repellency, fingerprint stain removability, abrasion resistance, light resistance and chemical resistance, an article having a surface layer and a method for producing it are provided. The fluorinated ether compound is represented by A-O—(Rf1O)m-Q1(R1)b, wherein A is a C1-20, perfluoroalkyl group, Rf1 is a perfluoroalkylene group, m is an integer of from 2 to 500, (Rf1O)m a n d may consist of two or more types of Rf1O differing in the number of carbon atoms, Q1 is a (b+1) valent perfluorohydrocarbon group which may have a hydroxy group, R1 is a monovalent organic group having at least one hydrolyzable silyl group, b is an integer of at least 2, and the b R1 may be the same or different.

Abstract: A ground wire with optical fibers is disclosed. The ground wire includes twisted optical modules in the form of plastic tubes that accommodate freely placed optical fibers and water-blocking gel, wherein water-blocking tape applied to twisted optical modules, which are enclosed in a steel tube, coated with an aluminum sheath. The aluminum sheath is helically wrapped with lays of wire. The technical result is provided by increased air tightness of the optical core and permissible crushing stresses.

Abstract: To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

Abstract: The present invention relates to formulations containing at least one organic functional material and at least a first organic solvent, wherein said first organic solvent contains at least one epoxy-group as well as to electronic devices prepared by using these formulations.

Abstract: Disclosed are curable coating compositions, and methods of cathodic corrosion protection using the compositions. For example, a curable coating composition comprising a mixed salt of magnesium thiodialkanoate, and a method for applying the coating composition, which when applied onto a steel or other ferrous substrate provides an anticorrosive coating, effective for improving resistance to cathodic disbondment.

Abstract: It is to provide a more stable crystal polymorph of a clathrate compound consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane and 2-phenyl-4-methyl-5-hydroxymethylimidazole (molar ratio 1:2). A novel crystal polymorph of a clathrate compound, consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane and 2-phenyl-4-methyl-5-hydroxymethylimidazole (molar ratio 1:2) and has diffraction peaks at diffraction angles (2?) of 11.20°, 13.36°, 14.36°, 18.16°, 19.20°, 19.68°, 20.84°, 21.48°, 22.56°, 23.76° and 24.08° in a powder X-ray diffraction pattern as measured using a CuK? ray, can be obtained by, for example, further recrystallizing a crystal obtained by a conventionally known method or the like.

Abstract: A method of forming a semiconductor package includes depositing a passivation layer overlying a semiconductor substrate, wherein the semiconductor substrate includes a scribe line region positioned between a first chip region and a second chip region. The method further includes forming a bump overlying the passivation layer on at least one of the first chip region or the second chip region, wherein the bump comprises a copper pillar and a cap layer. The method further includes forming a groove passing through the passivation layer on the scribe line region, wherein the groove extends into the semiconductor substrate to expose a stepped sidewall of the semiconductor substrate. The method further includes applying a molding compound layer to cover the passivation layer and a lower portion of the bump and fill the groove. The method further includes singulating along the scribe line region.

Abstract: The invention relates to a coated reinforcement, to a method for producing the same and to the use thereof. In order to provide a coated reinforcement, in particular to be used for large surface area components, the coating of which can be applied easily and without difficultly substantially independently of the processing-relevant properties of the components of the resin mixture, it is proposed that the surface of the reinforcement has a coating made of a composition, the composition contains a mixture 1 of at least one resin, selected from the group consisting of epoxidized phenol novolacs, epoxidized cresol novolacs, polyepoxides based on bisphenol A, epoxidized fluorenone bisphenols and/or polyepoxides bases on bisphenol-F, and/or based on triglycidyl isocyanurates, epoxidized novolac and at least one component that accelerates the curing of the resin, and said mixture is subjected to a heat treatment, so that the mixture 1 is affixed to the surface of the reinforcement by fusing it thereon.

Abstract: A cured product obtainable by impregnating a glass cloth with an epoxy resin composition that is suitable for producing optical sheets. The epoxy resin composition includes a polyvalent carboxylic acid (A) represented by formula (I): wherein, R1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R1's, and represents an integer from 1 to 4; and P represents the following X: wherein there may be a plural number of R2's per ring, and R2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; and an epoxy resin (B) having an aliphatic cyclic structure in the molecule. The cured product has a refractive index at 25° C. of 1.51 or higher.

Abstract: A cured product obtainable by curing an epoxy resin composition that is suitable for producing optical sheets. The epoxy resin composition includes a polyvalent carboxylic acid (A) represented by formula (I): wherein, R1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R1's, and represents an integer from 1 to 4; and P represents the following X: wherein there may be a plural number of R2's per ring, and R2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; and an epoxy resin (B) having an aliphatic cyclic structure in the molecule.

Abstract: The present invention relates to curable compositions that include a hydrazide functional material (a) represented by the following Formula (I), For Formula (I): n is 2; independently for each n, x is 0 or 1, y is 0 or 1, provided that the sum of x and y is 1; L1, independently for each n, is selected from a divalent hydrocarbyl group optionally interrupted with at least one of —O— and —S—; L2, independently for each n, is selected from a divalent hydrocarbyl group; and R1, independently for each n, is selected from hydrogen and hydrocarbyl. The curable compositions further include a reactant (b) that has at least two reactive groups that are reactive with and form covalent bonds with the hydrazide groups of the hydrazide functional material (a). The present invention also relates to curable powder coating compositions and curable adhesive compositions.

Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.

Abstract: It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4?-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct.

Abstract: It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).

Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.

Abstract: The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.

Abstract: An epoxy terminated prepolymer formed as a reaction product of a cycloaliphatic epoxide resin and an amine terminated polymeric polyol, and a catalyst that promotes the reaction of the cycloaliphatic epoxide resin and the aminated polyol. The epoxy terminated prepolymer and an anhydride hardener react to form an epoxy elastomer composition having a microphase separated morphology of hard particles, formed with the anhydride hardener reacted with the epoxy terminated prepolymer, dispersed in a soft continuous phase formed from polymeric polyol in the epoxy terminated prepolymer.

Abstract: A method for making a pressure sensitive adhesive comprising: (a) reacting (i) at least one dibasic acid or anhydride thereof with (ii) at least one epoxide having at least two epoxy groups, one diol or polyol, or one diamine at a stoichiometric molar excess of reactive carboxylic acid groups relative reactive epoxy groups, hydroxyl groups or amine groups to produce a thermoplastic prepolymer or oligomer capped with a carboxylic acid group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with a carboxylic acid group; and (b) curing the resulting carboxylic acid-capped prepolymer or oligomer with at least one polyfunctional epoxy to produce a pressure sensitive adhesive, wherein the polyfunctional epoxy is not an epoxidized vegetable oil.

Abstract: Bisanhydrohexitol derivatives having terminal mercapto groups are provided. Additionally, curable compositions that include these mercapto-containing bisanhydrohexitol derivatives, cured compositions prepared from the curable compositions, and articles containing the cured compositions are provided. More specifically, the curable compositions are epoxy-based formulations and the mercapto-containing bisanhydrohexitol derivatives function as curing agents for epoxy resins.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: A salicylic acid salt-containing liquid composition useful as an accelerator for a hardener includes a reaction product of (a) salicylic acid; and (b) at least one amine compound compatible with said salicylic acid such that the composition is in liquid form, the composition has a concentration of salicylic acid at from about 35 weight percent to about 55 weight percent, and the composition has a viscosity in the range of from about 500 mPas to about 20,000 mPa-s at 25° C.; a curable epoxy resin composition containing the salicylic acid salt-containing liquid composition accelerator; and a cured product made from the curable composition.

Abstract: There is provided a resist underlayer film having both heat resistance and etching selectivity. A composition for forming a resist underlayer film for lithography, comprising a reaction product (C) of an alicyclic epoxy polymer (A) with a condensed-ring aromatic carboxylic acid and monocyclic aromatic carboxylic acid (B). The alicyclic epoxy polymer (A) may include a repeating structural unit of Formula (1): (T is a repeating unit structure containing an alicyclic ring in the polymer main chain; and E is an epoxy group or an organic group containing an epoxy group). The condensed-ring aromatic carboxylic acid and monocyclic aromatic carboxylic acid (B) may include a condensed-ring aromatic carboxylic acid (B1) and a monocyclic aromatic carboxylic acid (B2) in a molar ratio of B1:B2=3:7 to 7:3. The condensed-ring aromatic carboxylic acid (B1) may be 9-anthracenecarboxylic acid and the monocyclic aromatic carboxylic acid (B2) may be benzoic acid.

Abstract: A polymerizable epoxy compound composition containing an anionic polymerization initiator which can be easily produced, can attain a high polymerization rate and a high degree of polymerization, and can realize an epoxy polymer having properties unobtainable so far, an improvement in cured polymer properties, etc.; and a method of polymerizing an epoxy compound. The composition is an anionically polymerizable composition comprising a monofunctional epoxy compound or a di- or more functional epoxy resin and a polymerization initiator, the polymerization initiator comprising the potassium or sodium salt of a monocarboxylic acid monomer. The method, which is for producing a polymer of epoxy compounds, comprises polymerizing a monofunctional epoxy compound or a di- or more functional epoxy resin by anionic polymerization with the aid of the potassium or sodium salt of a monocarboxylic acid monomer.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: Methods for forming high molecular weight chain-extended condensation polymers are disclosed. The methods include adding a chain extender during the polymerization process of a condensation polymer to provide a chain-extended condensation polymer, wherein the chain extender comprises a polymerization product of at least one epoxy-functional (meth)acrylic monomer, and at least one styrenic and/or (meth)acrylic monomer.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.

Abstract: A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R3 to R5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices.

Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.

Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound comprising, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Abstract: The present invention provides a curable resin composition which exhibits the following properties: excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.

Abstract: A method of accelerating a curing process in resin overflow systems for use in casting processes includes the step of adding a curing accelerator for the resin into the resin overflow system. In addition, a resin overflow container and a compartment with a curing accelerator for use in casting processes are provided.

Abstract: A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.

Abstract: To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof. An epoxy resin composition for optical3 sheets, the composition comprising a polyvalent carboxylic acid (A) represented by formula (I): (wherein, R1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R1's, and represents an integer from 1 to 4; and P represents any one of the following x, y and z): (wherein, there may be a plural number of R2's per ring, and R2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; y.

Abstract: The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.