Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.

Abstract: A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).

Abstract: A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.

Abstract: A coating is a mixture of polybenzimidazole polymer and an epoxy. The coating may further include a primer underlying the coating. The coating may further include an adhesion promoter. A solution includes a polybenzimidazole polymer, an epoxy resin, an initiator, and a carrier solvent. The solution may further include a stabilizer and/or an adhesion promoter.

Abstract: The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: The invention relates to a thermally curable liquid resin composition intended for manufacturing abrasives that comprises at least one epoxy resin comprising at least two epoxy groups and at least one reactive diluent, said composition having a viscosity, at 25° C., less than or equal to 7000 mPa·s. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Abstract: Functionalized polymer matrix and/or reinforcement materials that are capable of a thermoreversible Diels-Alder reaction are useful for making composite materials. Also disclosed is a composite material which includes one or both of functionalized reinforcement materials and functionalized polymer matrix materials, as well as a method for repairing a composite material including the step of thermally treating the composite material at a temperature sufficient to react a functionality on one of the reinforcement material and the polymer matrix material with another functionality via a Diels-Alder reaction. A method of making a composite material including functionalizing one or both of a reinforcing material and a polymer matrix material with a first reactive group, providing a second reactive group capable of undergoing a Diels-Alder reaction with the first reactive group and reacting the first and second reactive groups to form a composite material, is also described.

Abstract: A urethane coating is formed by a reaction of a hydroxy-functional resin and a blocked isocyanate crosslinker. A method of catalyzing this reaction includes forming a polymeric ligand from the resin and/or the crosslinker. The method also includes incorporating a metal catalyst with the polymeric ligand to complex the metal catalyst with the polymeric ligand. The method further includes reacting resin and the crosslinker to form the urethane coating.

Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).

Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

Abstract: An one-part epoxy resin composition for the use of bonding of a coil which is preferable for impregnation of a motor and a generator for an automobile, especially of a drive motor-generator set for a hybrid car, which has superior storage stability and a cured resin of the composition has excellent adhesion properties, thermal stability, and reliability, are provided. The one-part epoxy resin composition of the present invention comprises (A) a bisphenol A type and/or F type epoxy resin which is in liquid form at room temperature, (B) methylnadic anhydride as a cycloaliphatic anhydride which is in liquid form at room temperature, and (C) a nitrogen-containing latent hardening accelerator.

Abstract: A block or graft copolymer including a thermoplastic resin segment and as an aliphatic polyester segment is provided. The copolymer can be used as a compatibilizer for a resin alloy comprising polylactic acid, which can reduce the consumption of petroleum raw materials.

Abstract: Provided are an epoxy resin curing agent having excellent properties and high gas barrier capability that epoxy resin has and, in addition thereto, capable of realizing good adhesiveness to polyester and aluminium; an epoxy resin composition containing the curing agent; an adhesive for lamination including the composition as the main ingredient thereof; and a laminate film, a multilayer wrapping material and a wrapping bag using the adhesive. The epoxy resin curing agent comprises a reaction product of the following (A), (B) and (C): (A) meta-xylylenediamine or para-xylylenediamine, (B) a polyfunctional compound having one acyl group and capable of forming an amide group moiety through reaction with a polyamine and forming an oligomer, (C) a metal (meth)acrylate salt with a divalent or more polyvalent metal.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: A polyoxyethylene derivative represented by the formula (1): wherein a whole molecular weight of the polyoxyethylene derivative is 500 to 160,000; n is 5 to 3650; L1, L2, and L3 each independently represent an alkylene group, a phenylene group, an ester bond, an amide bond, an ether bond, a urethane bond, a carbonate bond, a secondary amino group, or a combination thereof; X represents a functional group capable of reacting with a bio-related substance; Y represents a hydrophilic group having plural hydroxyl groups made from a residual group of xylitol or volemitol or a residual group of polyglycerin of trimer to 31-mer; Z represents a residual group of a compound having 2 to 5 active hydrogen atoms; b and c are as follows: 1?b?4, 1?c?4, and 2?b+c?5; and d and e each independently are 0 or 1.

Abstract: Radio-opaque biodegradable compositions are formed by modifying terminal groups of synthetic and natural biodegradable polymers such as polylactones with iodinated moieties. The biodegradable property of the compositions renders them suitable for use in medical field such as drug delivery, imaging. Compounds disclosed in this invention exist as neat liquid. Certain compositions disclosed in this invention form hydrophobic iodine rich domains when dissolved in water, such domains provide better contrasting properties as well as ability to dissolve hydrophobic bioactive drugs. Certain iodinated moieties disclosed in the invention are capable of cross linking natural proteins in situ in presence of suitable catalysts and co-catalysts.

Abstract: Improved mechanical properties of carbon nanotube (CNT)-reinforced polymer adhesive matrix nanocomposites are obtained by functionalizing the CNTs with a compound that bonds well to an epoxy matrix. The particles sufficiently improve mechanical properties of the nanocomposites, such as flexural strength and modulus.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.

Abstract: Disclosed is an improved coating composition for food containers that is resistant to high pH processing environments. The improved coating composition is based upon an epoxy-amino resin coating composition that has been modified with other components to improve its performance in high pH environments balanced with flexibility, formability and abrasion resistance. Typically, the coating composition includes an epoxy resin, an amino resin cross-linking agent, a blocked polyisocyanate and a saturated polyester.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.

Abstract: Disclosed is a curable formulation comprising a resin; all, or a substantial part, of which comprises one or more fatty acid esters, or their derivatives, obtained from plant oils. Due to the high viscosity of known curable resin materials, and in particular cationically photocurable and thermally curable resins epoxy resins, reactive diluents are conventionally added in order to reduce viscosity and render them suitable for certain methods of application, such as flexography and inkjet printing. However, if an excessive amount of reactive diluent is added to a formulation, the concentration of resin may be so low as to prevent a formulation from curing to form a cured, cross-linked material with acceptable properties. Thus the minimum viscosity of known formulations is limited by the amount of low viscosity reactive diluent which may be added to comparatively high viscosity resins.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: It is an object of the present invention to provide an epoxy resin curing agent which has a favorable pot life and good storage stability as a curing agent for epoxy resins and from which an epoxy resin cured product having good water resistance and hardness is obtained through curing. The present invention is an epoxy resin curing agent containing a secondary or tertiary branched thiol compound having a substituent on a carbon atom at the ?-position to a thiol group, and is also an epoxy resin composition comprising a polyvalent epoxy compound and the epoxy resin curing agent.

Abstract: The object of the invention is a new Sheet Molding Compound (SMC), Thick Molding Compound (TMC), or Bulk Molding Compound (BMC) comprising at thermosetting resin on the basis of renewable resources with which molded parts can be produced in a molding process at elevated temperature and pressure said process being suitable to produce molded parts in an industrial process.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.

Abstract: A composition of matter consisting of a stable solution containing a polymer derived from a solution of a polymer containing trace metals, the derived method comprising the steps of: (a) providing a polymer solution containing a polymer, a first solvent and trace metals; (b) passing said polymer solution through an acidic cation ion exchange material to remove said trace metals therefrom and thereby forming a polymer solution containing free acid radicals; (c) precipitating said polymer from said polymer solution of step b by contacting with a second solvent wherein the polymer is substantially insoluble therein; (d) filtering said solution and said second solvent to thereby form a solid polymer cake; and (e) contacting said cake from step d with sufficient quantities of additional said second solvent in order to remove free acid radicals there from.

Abstract: Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured adhesive compositions can be used as structural adhesives.

Abstract: The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.

Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a thiocyanate anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract: Partially hydrogenated bisphenol-A based polymers. Coating compositions for food or beverage containers and medical devices, including a partially hydrogenated bisphenol-A based polymer. Food or beverage containers and medical devices coated with partially hydrogenated bisphenol-A based polymers. Food or beverage containers and medical devices made from partially hydrogenated bisphenol-A based polymers.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: The present invention provides an amine based epoxy resin curing agent and an epoxy resin composition containing the curing agent. The epoxy resin composition has a high gas barrier performance, a long pot life, and utility as a coating material or an adhesive for laminates.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.

Abstract: A thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one polymeric glycidyl reactive diluent; and (c) a hardener; a process for producing the thermosettable resin composition; a cured product comprising the cured thermosettable composition; and a process for producing the cured resin thermoset product including (I) admixing (a) at least one thermosetting resin; (b) at least one polymeric glycidyl reactive diluent; and (c) a hardener; and (II) curing the mixture of step (I).

Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4?-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.